CN212810242U - Chip positioning device - Google Patents

Abstract

The utility model relates to a chip positioning device, which comprises a positioning cavity test table cavity for placing a chip; a movable plate provided with a positioning structure; the driving mechanism comprises a sliding piece, a push rod is fixedly connected to the sliding piece, and the push rod is connected with the movable plate; the chip closed cavity stop block is arranged on the test board and is positioned in front of the movable plate; the chip opening cavity adjusting block is arranged on the side, back to the movable plate, of the push rod, and the chip closing cavity stop block is adjustably arranged on the test board. The positioning structure on the movable plate pushes the chip and tightly presses the chip to the inner wall of the positioning cavity, so that positioning errors are avoided, and meanwhile, the movable plate is accurately positioned by the chip closing cavity stop block and two sides of the push rod driven plate, so that the movable plate and the test table realize accurate positioning of the chip; and the chip opening cavity regulating block can regulate the error receiving range, thereby being capable of adapting to chips with errors of different degrees.

Description

Chip positioning device

Technical Field

The utility model relates to a chip test field especially relates to a chip positioning device who advances line location to the chip among chip test sorting process.

Background

The chip testing and sorting machine is equipment for carrying, positioning, testing and sorting chips. In the testing process, a chip with low position precision needs to be placed in a test socket cavity which needs to be accurately positioned, so that the chip needs to be pre-positioned. In the pre-positioning mechanism in the prior art, most of chips slide into the pre-positioning cavity by virtue of chamfers at the edges of the cavity, so that the error rate is high, and particularly, the alarm frequency is high for the chips with small sizes; the existing individual positioning mechanism is subjected to error absorption treatment, but the debugging is very troublesome, the stability is very low, and frequent correction is needed.

SUMMERY OF THE UTILITY MODEL

In view of the above, there is a need for a chip positioning device capable of accommodating chips with different position placement errors and accurately positioning the chips.

A chip positioning apparatus, comprising: the test bench is provided with a positioning cavity for placing a chip; the movable plate is configured to move back and forth relative to the test bench and is provided with a positioning structure, the positioning structure pushes the chip to the inner wall of the positioning cavity when the movable plate moves forwards, and the positioning structure is far away from the inner wall of the positioning cavity when the movable plate moves backwards; the driving mechanism comprises a sliding piece capable of outputting linear motion, a push rod is fixedly connected to the sliding piece, and the push rod is connected with the movable plate; the chip closed cavity stop block is arranged on the test board and is positioned in front of the movable plate; the chip opening cavity adjusting block is located on one side, back to the movable plate, of the push rod, and the chip closing cavity stopping block is adjustably arranged on the test board along the direction far away from the push rod.

According to the chip positioning device, the positioning structure on the movable plate pushes the chip and tightly presses the chip to the inner wall of the positioning cavity, so that positioning errors are avoided, and meanwhile, the movable plate is accurately positioned by the chip closing cavity stop block and the two sides of the push rod driven plate, so that the chip is accurately positioned; and the chip opening cavity adjusting block is arranged for adjusting the error receiving range, so that the chip can adapt to the chips with errors of different degrees.

In one embodiment, the positioning cavity comprises a first wall arranged along the X direction and a second wall arranged along the Y direction, and an insertion opening is formed between the first wall and the second wall; the movable plate is configured to drive the chip to move back and forth along the diagonal direction of the positioning cavity, and the positioning structure comprises a first positioning block used for pushing the chip to the first wall and a second positioning block used for pushing the chip to the second wall when the movable plate moves forwards; and when the sliding piece moves, the movable plate is driven to move back and forth.

In one embodiment, the chip closed cavity stop block is provided with a first limit surface and a second limit surface which are perpendicular to each other; the movable plate is provided with a first outer side face and a second outer side face which are perpendicular to each other, and an angular bisector of an included angle between the first outer side face and the second outer side face is superposed with an angular bisector of an included angle between the first limiting face and the second limiting face and is parallel to a diagonal line of the positioning cavity.

In one embodiment, the die closed cavity stop block is removably coupled to the test station.

In one embodiment, a guide structure is arranged between the test platform and the movable plate, and the guide direction of the guide structure is parallel to the diagonal direction of the positioning cavity.

In one embodiment, the moving direction of the sliding part is parallel to the diagonal direction of the positioning cavity.

In one embodiment, a kidney-shaped groove is arranged on the chip opening cavity adjusting block, and the length direction of the kidney-shaped groove is parallel to the diagonal direction of the positioning cavity; the chip positioning device further comprises a fixing piece which penetrates through the kidney-shaped groove and is detachably connected with the test board, and the fixing piece fixes the chip opening cavity adjusting block to the test board.

In one embodiment, a buffer is further disposed on a side of the push rod adjacent to the movable plate.

In one embodiment, one end of the push rod is pivotally connected to the movable plate.

In one embodiment, one end of the push rod comprises a first baffle and a second baffle which are arranged at intervals, and a first through hole and a second through hole are respectively formed in the first baffle and the second baffle; the movable plate is provided with a connecting part, and the connecting part is provided with a connecting hole, wherein the connecting part is clamped between the first baffle and the second baffle; the pivot passes through first baffle, connecting portion and second baffle in proper order.

In one embodiment, the driving mechanism is a cylinder, and the sliding member is a piston rod of the cylinder.

In one embodiment, the number of the positioning cavities is multiple, the number of the positioning structures is multiple, and the plurality of the positioning cavities and the plurality of the positioning structures correspond to each other one to one.

Drawings

Fig. 1 is a schematic view of an overall structure of a chip positioning device according to an embodiment of the present invention.

Fig. 2 is a top view of the chip positioning device shown in fig. 1.

Fig. 3 is an exploded view of the chip positioning device shown in fig. 1.

Fig. 4 is a schematic structural view of the chip positioning device shown in fig. 1 after a movable plate is removed.

Fig. 5 is a top view of the structure shown in fig. 4.

The relevant elements in the figures are numbered correspondingly as follows:

100. a chip positioning device; 10. a test bench; 101. a table body; 102. a cavity plate; 110. positioning the cavity; 111. a first wall; 112. a second wall; 120. an insertion opening; 20. a movable plate; 210. a positioning structure; 211. a first positioning block; 212. a second positioning block; 220. a connecting portion; 221. connecting holes; 230. a first outer side; 240. a second outer side; 30. a drive mechanism; 310. a slider; 320. a push rod; 321. a first baffle plate; 322. a second baffle; 330. a buffer; 340. a pivot; 40. a chip closed cavity stop block; 410. a first stopper; 411. a first limiting surface; 420. a second stopper; 421. a second limiting surface; 50. a chip opening cavity adjusting block; 510. a kidney-shaped groove; 520. a fixing member; 60. and a guide structure.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

The following describes preferred embodiments of the present invention with reference to the accompanying drawings.

An embodiment of the utility model provides a chip positioner for fix a position the chip in chip sorting test process. The chip described herein includes, but is not limited to, a BGA chip. As shown in fig. 1 to 5, the chip positioning apparatus 100 includes a test stage 10, and a movable plate 20, a driving mechanism 30, a chip closing cavity stopper 40, and a chip opening cavity adjustment block 50 provided on the test stage 10.

The test table 10 is provided with a positioning cavity 110 for placing a chip (not shown). Specifically, as shown in fig. 3, the test bench 10 includes a bench 101 and a cavity plate 102 disposed on the bench 101, wherein a positioning cavity 110 is disposed on the cavity plate 102.

The movable plate 20 is movably assembled to the test stand 10 and is configured to be movable back and forth with respect to the test stand 10. The movable plate 20 is provided with a positioning structure 210 for pressing the chip toward the inner wall of the positioning cavity 110. In this embodiment, the movement of the positioning structure 210 of the movable plate 20 toward the inner wall of the positioning cavity 110 is defined as the forward movement of the movable plate 20, and vice versa, the backward movement of the movable plate 20. The positioning structure 210 pushes the chip toward the inner wall of the positioning cavity 110 when the movable plate 20 moves forward; when the movable plate 20 moves backward, the positioning structure 210 is away from the inner wall of the positioning cavity 110 so as to take out the chip or place a new chip.

In the specific setting, one or more positioning cavities 110 are arranged on the test bench 10; one or more positioning structures 210 are disposed on the movable plate 20, and the number of the positioning structures 210 corresponds to the number of the positioning cavities 110. Specifically, the positioning cavities 110 are arranged in an array, and the positioning structures 210 are also arranged in an array. By the above means, the positioning of one or more chips on the test stand 10 can be performed simultaneously.

The driving mechanism 30 includes a slider 310 outputting a linear motion, and a push rod 320 is fixedly connected to the slider 310, wherein the push rod 320 is connected to the movable plate 20, and the push rod 320 drives the movable plate 20 to move along a diagonal direction of the positioning cavity 110 when the slider 310 moves. The specific type of the driving mechanism 30 is not limited, and may be a pneumatic cylinder or a linear motor. The drive mechanism 30 may also be located at a suitable location other than the test station 10, so long as it is capable of driving the movement of the movable plate 20 relative to the test station 10.

In order to precisely position the chip in the positioning cavity 110, a chip closing cavity stopper 40 is further provided on the test stand 10 in front of the movable plate 20 in the moving direction of the movable plate 20. The die closing cavity stopper 40 serves to position the movable plate 20 when the movable plate 20 moves forward. When the chip positioning device 100 is used to position a chip, the positioning structure 210 on the movable plate 20 pushes the chip and presses the chip against the inner wall of the positioning cavity 110 to position the chip; meanwhile, the chip closing cavity stop block 40 and the push rod 320 precisely position the movable plate 20 from both sides of the movable plate 20, so that the movable plate 20 and the test table 10 precisely position the chip.

Further, in order to adapt to chips with different placement errors, in this embodiment, the test bench 10 is further provided with a chip opening cavity adjusting block 50 with an adjustable position along a direction away from the push rod 320. The die opening cavity adjusting block 50 is disposed on a side of the push rod 320 opposite to the movable plate 20 to abut against the push rod 320 to limit the backward movement of the push rod 320. The position adjustment mode of the chip opening cavity adjusting block 50 is not limited, for example, the chip opening cavity adjusting block 50 may have a plurality of mounting positions on the test board 10, and the position adjustment may be realized by changing the mounting positions of the chip opening cavity adjusting block 50; it is also possible to provide a clamping mechanism, such as a mechanical gripper, which can change the position of the object to be clamped, and the clamping mechanism moves the die opening cavity adjusting block 50 to change the position on the test table 10.

When the chip is positioned by the chip positioning device 100, the push rod 320 moves backward to move the positioning structure 210 on the movable plate 20 away from the positioning cavity 110 so as to place the chip. Since the position of the chip opening cavity adjusting block 50 is adjustable, the size of the space between the positioning structure 210 and the inner wall of the positioning cavity 110 can be changed by making the chip opening cavity adjusting block 50 far away from or close to the push rod 320, so that the chip opening cavity adjusting block can adapt to chips with different placement errors. Specifically, the further the die opening cavity adjustment block 50 is from the pushrod 320, the greater the positional placement error of the adjustable die. In this embodiment, the adjustment of the error range can be realized by adjusting the position of the chip opening cavity adjusting block 50, and the error receiving range of the design has higher stability and does not need to be repeatedly corrected.

In the chip positioning device 100 of the above embodiment, the positioning structure 210 on the movable plate 20 pushes the chip and presses the chip against the inner wall of the positioning cavity 110, so as to avoid positioning errors, and meanwhile, the chip closing cavity stop block 40 and the push rod 320 accurately position the movable plate 20 from two sides of the movable plate 20, so that the movable plate 20 and the test board 10 accurately position the chip; and a chip opening cavity adjusting block 50 is provided to adjust an error receiving range so that it can be adapted to chips having errors of different degrees.

Referring to fig. 1 and 4, in some embodiments, the positioning cavity 110 includes a first wall 111 disposed along the X direction, a second wall 112 disposed along the Y direction, and an insertion opening 120 is formed between the first wall 111 and the second wall 112. In other words, the first wall 111 and the second wall 112 are perpendicular to each other. In particular, one end of the first wall 111 is connected to one end of the second wall 112, which together form an L-shaped structure. One end of the first wall 111 and one end of the second wall 112 may be spaced apart.

The movable plate 20 is configured to move the positioning structure 210 thereon back and forth in a diagonal direction of the positioning cavity 110. The diagonal line of the positioning cavity 110 refers to a bisector a of an angle between the first wall 111 and the second wall 112, and the diagonal direction of the positioning cavity 110 extends along the bisector a. As shown in fig. 1, 3 and 4, the positioning structure 210 includes a first positioning block 211 for pushing the chip toward the first wall 111 and a second positioning block 212 for pushing the chip toward the second wall 112 when the movable plate 20 moves forward, so that the first positioning block 211, the second positioning block 212, the first wall 111 and the second wall 112 position the chip from four sides of the chip. Specifically, the first positioning block 211 and the second positioning block 212 are perpendicular to each other, wherein the first positioning block 211 is parallel to the first wall 111, and the second positioning block 212 is parallel to the second wall 112, when the movable plate 20 moves forward, the first positioning block 211 gradually approaches the first wall 111, and the second positioning block 212 gradually approaches the second wall 112.

When the sliding member 310 moves, the movable plate 20 is driven to move, so that the positioning structures 210 on the movable plate 20 move along the diagonal direction of the positioning cavities 110, and thus the chips move along the diagonal direction of the positioning cavities 110. Specifically, in one implementation, the moving direction of the sliding member 310 may be set to be parallel to the diagonal direction of the positioning cavity 110. In another implementation, a guide structure 60 may be disposed between the movable plate 20 and the test bench 10, and a guide direction of the guide structure 60 is parallel to a diagonal direction of the positioning cavity 110. In another embodiment, the above two modes may be used in combination.

In the above chip positioning device, the first positioning block 211 and the second positioning block 212 push the chip to move along the diagonal direction of the positioning cavity 110 from the two adjacent sides of the chip, and after the chip touches the first wall 111 and the second wall 112 when entering the positioning cavity 110 from the insertion opening 120, the chip is gradually guided to the right position in the advancing process under the limit of the first wall 111 and the second wall 112.

As shown in fig. 1, 3 and 4, the chip closed cavity stop block 40 has a first stop surface 411 and a second stop surface 421 perpendicular to each other; the movable plate 20 is provided with a first outer side surface 230 and a second outer side surface 240 perpendicular to each other, wherein a bisector C of an included angle between the first outer side surface 230 and the second outer side surface 240 coincides with a bisector B of an included angle between the first limiting surface 411 and the second limiting surface 421, and is parallel to a diagonal line a of the positioning cavity 110. Through the above-mentioned means, when the first outer side surface 230 abuts against the first positioning surface 411 during the forward movement of the movable plate 20 along the diagonal direction of the positioning cavity 110, the second outer side surface 240 also abuts against the second positioning surface, so that the chip-closed cavity stop block 40 can accurately position the movable plate 20 from two directions.

Specifically, a first block 410 and a second block 420 are respectively disposed on two adjacent sides of the testing platform 10, wherein a first limiting surface 411 is disposed on a side of the first block 410 facing the movable plate 20, and a second limiting surface 421 is disposed on a side of the second block 420 facing the movable plate 20.

On the basis of the above embodiment, the chip closed cavity stopper 40 is detachably connected to the test stage 10. When the chip closed cavity stop block 40 is specifically arranged, the chip closed cavity stop block 40 is detachably fixed on the test bench 10, so that the chip positioning position and the chip positioning precision can be adjusted by replacing the chip closed cavity stop block 40 with different sizes. Specifically, when the sizes of the die cavity closing stop blocks 40 are different and the end positions of the movable plate 20 in the advancing process are different, the pressing degree of the positioning structures 210 on the die is different, and the positioning positions and the positioning accuracy of the die are different.

In the embodiment of the present invention, two elements can be detachably connected, and it can be understood that two elements are assembled in a modular manner, and one of the elements can be replaced as required without destructively disassembling the element. In particular, the chip-closing cavity stop block 40 is assembled with the test table 10 in a modular manner, and can be replaced as needed without destructive disassembly. In other embodiments, the chip-closing cavity stop block 40 may be disposed on the testing table 10 in a non-detachable manner. In a preferred embodiment, when the die closing cavity stop block 40 includes the first stop 410 and the second stop 420, the first stop 410 and the second stop 420 are detachably connected to the testing table 10.

In some embodiments, as shown in fig. 1, a guide structure 60 is disposed between the test stand 10 and the movable plate 20, and a guide direction of the guide structure 60 is parallel to a diagonal direction of the positioning cavity 110. The type of guide structure 60 is not limited, as it may be a linear guide; or may be a structure of a guide groove and a guide post which are matched with each other, that is, one of the test stand 10 and the movable plate 20 is provided with a guide groove arranged along a diagonal direction of the positioning cavity 110, and the other is provided with a guide post matched with the guide groove.

In the above chip positioning device, the guide structure 60 between the test table 10 and the movable plate 20 is used to realize the forward and backward movement of the movable plate 20 along the diagonal direction of the positioning cavity 110, which has higher stability and reliability, and has less limitation on the movement direction of the sliding member 310, for example, the sliding direction of the sliding member 310 may be set to be parallel to the diagonal direction of the positioning cavity 110, or may have an included angle. Further, since the movable plate 20 moves back and forth along the diagonal direction of the positioning cavity 110 and does not depend on the moving direction of the sliding member 310, the requirement on the accuracy of the linear movement of the sliding member 310 is low, and the cost is greatly reduced no matter an air cylinder or a linear motor is adopted.

On the basis of the above embodiments, in some embodiments, the movement direction of the slider 310 is parallel to the diagonal direction of the positioning cavity 110, and the direction of the thrust of the slider 310 on the movable plate 20 through the push rod 320 is parallel to the diagonal direction of the positioning cavity 110, so that the movable plate 20 can be moved more efficiently and with less energy consumption.

As shown in fig. 2, in some embodiments, the chip opening cavity adjusting block 50 is provided with a kidney-shaped slot 510, and the length direction of the kidney-shaped slot 510 is parallel to the diagonal direction of the positioning cavity 110; the chip positioning device 100 further includes a fixing member 520 passing through the kidney 510 and detachably connected to the test stand 10, the fixing member 520 fixing the chip open cavity adjustment block 50 to the test stand 10.

Specifically, the kidney-shaped groove 510 penetrates the chip open cavity adjustment block 50, and the length direction thereof is parallel to the diagonal direction of the positioning cavity 110. The fixing member 520 is a screw or a bolt. When the position of the die opening cavity adjusting block 50 needs to be adjusted, the fixing member 520 is loosened, the die opening cavity adjusting block 50 is moved to the proper position, and then the fixing member 520 is fastened again.

In order to reduce the impact on the chip when the movable plate 20 moves forward, as shown in fig. 1 and 2, in some embodiments, a buffer 330 is further disposed on a side of the push rod 320 close to the movable plate 20. The buffer 330 can make the movement of the push rod 320 more gradual, prevent the moving plate 20 from generating rigid impact on the chip, and prevent the chip from being worn when being positioned. The damper 330 may be embodied as a hydraulic damper, a spring damper, or a polyurethane damper.

Further, the push rod 320 is connected with the damper 330. When the push rod 320 moves forward, the buffer 330 can immediately play a role of buffering, and the chip is protected throughout the whole positioning process.

Referring to fig. 1 and 4, in some embodiments, the push rod 320 is pivotally connected to the moving plate 20 via a pivot 340. When the push rod 320 starts to move the movable plate 20, the push rod 320 and the movable plate 20 can rotate relatively, so that the pushing error of the slider 310 of the driving mechanism 30 can be absorbed.

Specifically, one end of the push rod 320 is rotatably coupled to the moving plate 20 through a pivot 340. One end of the push rod 320 comprises a first baffle 321 and a second baffle 322 which are arranged at an interval up and down, and the first baffle 321 and the second baffle 322 are respectively provided with a first through hole (not numbered) and a second through hole (not numbered). The movable plate 20 has a connection part 220, and the connection part 220 has a connection hole 221. When movable plate 20 is coupled to push rod 320, coupling portion 220 is interposed between first stopper 321 and second stopper 322, and pivot shaft 340 passes through first stopper 321, coupling portion 220, and second stopper 322 in this order, thereby rotatably coupling push rod 320 to movable plate 20. First baffle 321 and second baffle 322 support movable plate 20 from the upper and lower both sides of connecting portion 220 spacing, avoid movable plate 20 to rock in the back-and-forth movement process.

As shown in fig. 1, in some embodiments, the driving mechanism 30 is embodied as a pneumatic cylinder, and the sliding member 310 is a piston rod of the pneumatic cylinder. The driving mechanism 30 adopts a pneumatic driving device, and has the advantages of simple structure, light weight, simple installation and maintenance and the like.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. A chip positioning apparatus, comprising:

the test bench is provided with a positioning cavity for placing a chip;

the movable plate is configured to move back and forth relative to the test bench and is provided with a positioning structure, the positioning structure pushes the chip to the inner wall of the positioning cavity when the movable plate moves forwards, and the positioning structure is far away from the inner wall of the positioning cavity when the movable plate moves backwards;

the driving mechanism comprises a sliding piece capable of outputting linear motion, a push rod is fixedly connected to the sliding piece, and the push rod is connected with the movable plate;

the chip closed cavity stop block is arranged on the test board and is positioned in front of the movable plate;

the chip opening cavity adjusting block is located on one side, back to the movable plate, of the push rod, and the chip closing cavity stopping block is adjustably arranged on the test board along the direction far away from the push rod.

2. The chip positioning device according to claim 1, wherein the positioning cavity comprises a first wall arranged along an X direction and a second wall arranged along a Y direction, and an insertion opening is formed between the first wall and the second wall;

the movable plate is configured to drive the chip to move back and forth along the diagonal direction of the positioning cavity, and the positioning structure comprises a first positioning block used for pushing the chip to the first wall and a second positioning block used for pushing the chip to the second wall when the movable plate moves forwards;

and when the sliding piece moves, the movable plate is driven to move back and forth.

3. The chip positioning device according to claim 2, wherein the chip closed cavity stop block has a first limit surface and a second limit surface perpendicular to each other; the movable plate is provided with a first outer side face and a second outer side face which are perpendicular to each other, and an angular bisector of an included angle between the first outer side face and the second outer side face is superposed with an angular bisector of an included angle between the first limiting face and the second limiting face and is parallel to a diagonal line of the positioning cavity.

4. The die positioning apparatus according to any of claims 1 to 3, wherein the die closing cavity stopper is detachably connected to the test stage.

5. The chip positioning device according to claim 2, wherein a guide structure is disposed between the test platform and the movable plate, and a guide direction of the guide structure is parallel to a diagonal direction of the positioning cavity.

6. The chip positioning device according to claim 2 or 5, wherein the moving direction of the slide member is parallel to a diagonal direction of the positioning cavity.

7. The chip positioning device according to claim 2, wherein the chip open cavity adjusting block is provided with a kidney-shaped slot, and the length direction of the kidney-shaped slot is parallel to the diagonal direction of the positioning cavity; the chip positioning device further comprises a fixing piece which penetrates through the kidney-shaped groove and is detachably connected with the test board, and the fixing piece fixes the chip opening cavity adjusting block to the test board.

8. The die-positioning apparatus according to claim 1, wherein a bumper is further provided on a side of the push rod adjacent to the movable plate.

9. The die positioning apparatus of claim 1, wherein one end of said pusher is pivotally connected to said movable plate.

10. The chip positioning device according to claim 9, wherein one end of the push rod comprises a first baffle and a second baffle which are arranged at intervals, and the first baffle and the second baffle are respectively provided with a first through hole and a second through hole; the movable plate is provided with a connecting part, and the connecting part is provided with a connecting hole, wherein the connecting part is clamped between the first baffle and the second baffle; the pivot passes through first baffle, connecting portion and second baffle in proper order.

Images