CN213715264U

CN213715264U - Chip positioning device

Info

Publication number: CN213715264U
Application number: CN202022229005.5U
Authority: CN
Inventors: 史赛; 张磊
Original assignee: Suzhou HYC Technology Co Ltd
Current assignee: Suzhou HYC Technology Co Ltd
Priority date: 2020-10-09
Filing date: 2020-10-09
Publication date: 2021-07-16
Anticipated expiration: 2030-10-09

Abstract

The utility model relates to a chip positioning device, include: a test bench; a movable plate configured to be movable relative to the test stand; the first positioning module is arranged on the test board and is adjustable in position; the second positioning module is connected to the movable plate and is adjustable in position, and the first positioning module and the second positioning module jointly form a positioning cavity for placing a chip; and the output end of the driving mechanism is connected to the movable plate and drives the second positioning module to move along the diagonal direction of the positioning cavity so as to be close to or far away from the first positioning module and further position the chip in the positioning cavity. The utility model discloses well first location module position is adjustable, and when chip size changed, the central point after the chip location of equidimension not can be realized to the position of corresponding first location module of regulation puts the same to need not to adjust testing arrangement's procedure and tool, can improve efficiency of software testing.

Description

Chip positioning device

Technical Field

The utility model relates to a chip test field especially relates to a chip positioning device.

Background

Chip positioning is a fundamental step in the production test of chips. Taking a chip testing and sorting machine as an example, the chip testing and sorting machine is a device for carrying, positioning, testing and sorting chips. The carrying mechanism carries the chip to the chip positioning device firstly, and the chip positioning device positions the chip and then the test equipment tests the chip. The existing chip positioning device generally adopts a mode that a fixed part is matched with a movable part, and the movable part pushes a chip to be abutted against the fixed part to complete the positioning of the chip. Since the chip has various sizes, the chip positioning device also needs to be able to position chips with different sizes, generally by adjusting the moving distance of the movable portion. Although this method can position different chips, the position of the fixing part is fixed, so the center position of the chips with different sizes is different after positioning, and in the testing process, the program and the jig of the testing device are generally based on the center position of the chip, so the program and the jig need to be adjusted after the center position of the chip is changed, and thus the complicated adjustment is needed when testing the chips with different sizes, and the testing efficiency is reduced.

Disclosure of Invention

The to-be-solved technical problem of the utility model is to provide a chip positioning device, fix a position the chip and guarantee that the central point after the chip location of unidimensional is the same.

The technical scheme of the utility model is that: a chip positioning apparatus, comprising: a test bench; a movable plate configured to be movable relative to the test stand; the first positioning module is arranged on the test board and is adjustable in position; the second positioning module is connected to the movable plate and is adjustable in position, and the first positioning module and the second positioning module jointly form a positioning cavity for placing a chip; and the output end of the driving mechanism is connected to the movable plate and drives the second positioning module to move along the diagonal direction of the positioning cavity so as to be close to or far away from the first positioning module and further position the chip in the positioning cavity.

Preferably, the first positioning module comprises a first wall and a second wall, and the first wall and the second wall respectively correspond to two adjacent side edges of the chip so as to limit the chip from different directions.

Preferably, the first positioning module further comprises a positioning block for bearing the first wall and the second wall, and the positioning block is detachably connected with the test board.

Preferably, the second positioning module comprises: the third wall and the fourth wall correspond to two adjacent side edges of the chip respectively so as to limit the chip from different directions.

Preferably, the second positioning module adopts an insert block, the insert block is provided with a positioning hole, and the third wall and the fourth wall are arranged at two adjacent inner walls of the positioning hole or coincide with the two adjacent inner walls of the positioning hole.

Preferably, the shape of the positioning hole is matched with that of the positioning cavity, and the size of the positioning hole is larger than that of the positioning cavity.

Preferably, the drive mechanism includes: the driving part, with push rod and the buffer that the output of driving part is connected, wherein, driving part and buffer set up in the both sides of push rod relatively, the tip of push rod with the movable plate passes through the pivot and rotates and be connected.

Preferably, the test device further comprises a chip opening cavity adjusting block arranged on the test board, wherein the chip opening cavity adjusting block is arranged on the test board on one side of the push rod, and the position of the chip opening cavity adjusting block is adjustable, so that the position of the push rod is limited.

Preferably, a first stop block and a second stop block are respectively arranged on two adjacent side edges of the test board so as to limit the movable board from different directions.

Preferably, a guide structure is arranged between the test board and the movable board, and the guide direction of the guide structure is parallel to the diagonal direction of the positioning cavity.

The utility model has the advantages that:

1. the utility model discloses utilize actuating mechanism to drive the movable plate and then drive the second and fix a position the module and be close to first positioning module and fix a position the chip in the die cavity to the location, wherein first positioning module position is adjustable, when chip size changes, the position of the first positioning module of corresponding regulation, central point after can realizing not unidimensional chip location puts the same to need not to adjust testing arrangement's procedure and tool, the operation that positioning device needs when having reduced chip size change can improve efficiency of software testing.

2. The position of second location module on the movable plate is adjustable, and the size of location die cavity can be changed to the first location module adjusting position of cooperation, can increase the utility model discloses the size variation range of the chip that is suitable for.

Drawings

Fig. 1 is a schematic view of an overall structure of a chip positioning device according to an embodiment of the present invention.

Fig. 2 is a top view of the chip positioning device shown in fig. 1.

Fig. 3 is an exploded view of the chip positioning device shown in fig. 1.

Fig. 4 is a schematic structural view of the chip positioning device shown in fig. 1 after a movable plate is removed.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

The following describes preferred embodiments of the present invention with reference to the accompanying drawings.

As shown in fig. 1 to 4, the present invention provides a chip positioning apparatus, including a test table 1 and a movable plate 2, the movable plate 2 being configured to be movable with respect to the test table 1; the first positioning module 11 is arranged on the test board 1 and is adjustable in position; the second positioning module 21 is connected to the movable plate 2 and is adjustable in position, and the first positioning module 11 and the second positioning module 21 jointly form a positioning cavity 3 for placing a chip; and the output end of the driving mechanism is connected to the movable plate 2 and drives the second positioning module 21 to move along the diagonal direction of the positioning cavity 3 so as to be close to or far away from the first positioning module 11 and further position the chip in the positioning cavity 3.

The utility model discloses in, 11 adjustable positions of first locating module, when chip size changes, the central point after the chip location of not unidimensional is put the same in the position of corresponding first locating module 11 of regulation to need not to adjust testing arrangement's procedure and tool, the operation that the locating device needs when having reduced chip size change can improve efficiency of software testing.

And, the position of second location module 21 on movable plate 2 is adjustable, and the cooperation first location module 11 adjusting position can change the size of location die cavity 3, can increase the utility model discloses the size variation range of the chip that is suitable for.

Specifically, the first positioning module 11 includes a first wall 111 and a second wall 112, and the first wall 111 and the second wall 112 respectively correspond to two adjacent sides of the chip, so as to limit the chip from different directions. The second positioning module 21 includes a third wall 211 and a fourth wall 212, and the third wall 211 and the fourth wall 212 respectively correspond to two adjacent sides of the chip so as to limit the chip from different directions.

When the movable plate 2 approaches the first positioning module 11, the third wall 211 and the fourth wall 212 respectively abut against two sides of the chip, so that the chip is pushed toward the first wall 111 and the second wall 112 of the first positioning module 11 until the other two sides of the chip also abut against the first wall 111 and the second wall 112, respectively, thereby completing the positioning of the chip.

Specifically, the first positioning module 11 further includes a positioning block 113 for carrying the first wall 111 and the second wall 112, and the positioning block 113 is detachably connected to the testing table 1.

In an embodiment, the chip positioning device is configured with a plurality of first positioning modules 11, in the first positioning modules 11 with different specifications, the positions of the first wall 111 and the second wall 112 on the positioning block 113 are different, the positioning block 113 is detachably connected with the test board 1 at a fixed position, and the positions of the first wall 111 and the second wall 112 can be changed by replacing the first positioning modules 11 with different specifications, so as to realize position adjustment of the first positioning modules 11.

In another embodiment, the test bench 1 is provided with a plurality of mounting positions for connecting with the positioning blocks 113, and the positions of the first wall 111 and the second wall 112 can be changed by changing the mounting positions of the positioning blocks 113 on the test bench 1, so as to adjust the position of the first positioning module 11.

When the chip size changes, the positions of the first wall 111 and the second wall 112 are changed to keep the center of the chip unchanged after the chip is positioned.

Obviously, the manner of adjusting the position of the first positioning module 11 is not limited to the above-described specific embodiment.

Specifically, the second positioning module 21 employs an insert, the insert is provided with a positioning hole, and the third wall 211 and the fourth wall 212 are disposed at two adjacent inner walls of the positioning hole or coincide with the two adjacent inner walls of the positioning hole. Correspondingly, the movable plate 2 is provided with a block hole, and the second positioning module 21 is embedded into the movable plate 2 during installation. The shape of the positioning hole is matched with that of the positioning cavity 3, and the size of the positioning hole is larger than that of the positioning cavity 3, so that the process of placing the chip into the positioning cavity 3 is prevented from being influenced.

In one embodiment, the second positioning modules 21 with multiple specifications are configured, in the second positioning modules 21 with different specifications, the sizes and/or positions of the positioning holes are different, so the positions of the inner walls of the positioning holes are different, so the positions of the third wall 211 and the fourth wall 212 are different, and the positions of the third wall 211 and the fourth wall 212 can be changed by replacing the second positioning modules 21 with different specifications, so that the position adjustment of the second positioning modules 21 is realized.

The second positioning module 21 in the form of an embedded block is convenient to disassemble and assemble, and the chip has the characteristic of light weight because the positioning object is the chip, and the chip cannot bear overlarge external force, so that the second positioning module 21 is small in stress in the positioning process, and the disassembly and assembly of the embedded block cannot be influenced.

The size of the positioning cavity 3 can be changed by adjusting the position of the second positioning module 21 in cooperation with the adjustment of the position of the first positioning module 11. When the size of the chip is changed within a certain range and the chip carrying mechanism can always place the chip into the positioning cavity 3, the position of the second positioning module 21 does not need to be adjusted. However, when the size of the chip is larger than the range, since a certain position error exists when the chip is placed in the chip carrying mechanism, the position of the second positioning module 21 needs to be adjusted to increase the area of the positioning cavity 3, so that the positioning cavity 3 can place a chip with a larger area.

In addition, because the chip size is smaller, the stroke of the movable plate 2 is generally smaller, and when the chip size is too small, the stroke of the movable plate 2 may not be enough to enable the second positioning module 21 to push the chip to the first positioning module 11, and at this time, the area of the positioning cavity 3 may be smaller by changing and adjusting the position of the second positioning module 21, that is, the second positioning module 21 is closer to the first positioning module 11, so as to ensure that the stroke of the movable plate 2 is enough to complete the positioning of the smaller chip.

In one embodiment, the driving mechanism comprises a driving member 5, a push rod 8 connected to an output end of the driving member 5, and a damper 6, wherein the driving member 5 and the damper 6 are oppositely disposed at both sides of the push rod 8, and an end of the push rod 8 is pivotally connected to the movable plate 2.

The push rod 8 is hinged with the movable plate 2, so that the propelling error of the driving piece 5 can be absorbed. The buffer mechanism 6 can decelerate the moving plate 2 when the moving plate advances, so that the moving speed of the moving plate 2 is changed from fast to slow in the chip positioning process, and the impact of the second positioning module 21 on the chip is relieved.

The damper mechanism 6 is particularly suitable when the drive element 5 is a non-servo drive such as an air cylinder.

In another embodiment, the driving mechanism may also use a servo motor as the driving member 5, and the servo motor may control the speed variation of the advancing of the movable plate 2, so that the buffering mechanism 6 may not be provided.

Specifically, be equipped with chip open type chamber regulating block 7 on testboard 1, chip open type chamber regulating block 7 sets up on testboard 1 of push rod 8 one side, and the position is adjustable to carry on spacingly to the position of push rod 8.

When the push rod 8 is abutted against the chip opening cavity adjusting block 7, the area of the positioning cavity 3 is opened to the maximum for placing a chip. Because the chip carrying mechanism has a certain position error when putting the chip into the positioning cavity 3, and the position errors of different chip carrying mechanisms are different, the maximum area of the positioning cavity 3 can be changed by changing the position of the chip opening cavity adjusting block 7, thereby adapting to the chips with different degrees of position errors.

Specifically, two adjacent sides of the testing platform 1 are respectively provided with a first stopper 41 and a second stopper 42 to limit the movable plate 2 from different directions.

When the driving member 5 is an air cylinder or the like, the first stopper 41 and the second stopper 42 may limit the end position of the movement of the movable plate 2, thereby determining the end position of the second positioning module 21. The first stopper 41 and the second stopper 42 are detachable, and the end positions of the movable plate 2 are changed by replacing the first stopper 41 and the second stopper 42, thereby positioning chips having different sizes.

The driving member 5 may also be a servo motor, and the stroke of the movable plate 2 is controlled by the servo motor, and the first stopper 41 and the second stopper 42 may play a role of protection.

Specifically, be equipped with guide structure 9 between testboard 1 and the movable plate 2, guide structure 9's direction is parallel with the diagonal direction of location die cavity 3. The type of guide structure 9 is not limited, as it may be a linear guide; or the test board 1 and the movable board 2 are provided with guide grooves arranged along the diagonal direction of the positioning cavity 3, and the other is provided with guide columns matched with the guide grooves.

Utilize guide structure 9 between testboard 1 and the movable plate 2 to realize that movable plate 2 moves back and forth along the diagonal direction of location die cavity 3, have higher stability and reliability, it is less to the motion direction restriction of slider 8, for example the slip direction of slider 8 can set up to be parallel with the diagonal direction of location die cavity 3, also can have the contained angle. Further, because the movable plate 2 does not depend on the motion direction of the sliding part 8 in the front-back motion along the diagonal direction of the positioning cavity 3, the requirement on the precision of the linear motion of the sliding part 8 is low, and the cost is greatly reduced no matter a cylinder or a linear motor is adopted.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A chip positioning apparatus, comprising:

a test bench;

a movable plate configured to be movable relative to the test stand;

the first positioning module is arranged on the test board and is adjustable in position;

the second positioning module is connected to the movable plate and is adjustable in position, and the first positioning module and the second positioning module jointly form a positioning cavity for placing a chip;

and the output end of the driving mechanism is connected to the movable plate and drives the second positioning module to move along the diagonal direction of the positioning cavity so as to be close to or far away from the first positioning module and further position the chip in the positioning cavity.

2. The apparatus of claim 1, wherein the first positioning module comprises a first wall and a second wall, and the first wall and the second wall respectively correspond to two adjacent sides of the chip so as to limit the chip from different directions.

3. The apparatus according to claim 2, wherein the first positioning module further comprises a positioning block for carrying the first wall and the second wall, and the positioning block is detachably connected to the testing table.

4. The chip positioning device according to claim 1 or 2, wherein the second positioning module comprises: the third wall and the fourth wall correspond to two adjacent side edges of the chip respectively so as to limit the chip from different directions.

5. The chip positioning device according to claim 4, wherein the second positioning module comprises an insert having a positioning hole, and the third wall and the fourth wall are disposed at or coincident with two adjacent inner walls of the positioning hole.

6. The chip positioning device according to claim 5, wherein the shape of the positioning hole matches the shape of the positioning cavity and the size of the positioning hole is larger than the positioning cavity.

7. The chip positioning apparatus according to claim 1, wherein the driving mechanism comprises: the driving part, with push rod and the buffer that the output of driving part is connected, wherein, driving part and buffer set up in the both sides of push rod relatively, the tip of push rod with the movable plate passes through the pivot and rotates and be connected.

8. The apparatus according to claim 7, further comprising a die opening cavity adjusting block disposed on the testing table, wherein the die opening cavity adjusting block is disposed on the testing table on one side of the push rod and is adjustable in position so as to limit the position of the push rod.

9. The apparatus according to claim 1, wherein the testing table has a first stop and a second stop disposed on two adjacent sides thereof for limiting the moving plate from different directions.

10. The chip positioning device according to claim 1, wherein a guide structure is disposed between the test platform and the movable plate, and a guide direction of the guide structure is parallel to a diagonal direction of the positioning cavity.