CN212778799U - Heat superconducting heat transfer plate and heat sink - Google Patents
Heat superconducting heat transfer plate and heat sink Download PDFInfo
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- CN212778799U CN212778799U CN202020514010.8U CN202020514010U CN212778799U CN 212778799 U CN212778799 U CN 212778799U CN 202020514010 U CN202020514010 U CN 202020514010U CN 212778799 U CN212778799 U CN 212778799U
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Abstract
The utility model provides a heat superconducting heat transfer plate and radiator, include: a heat-dissipating substrate and a thermal superconducting heat transfer plate; the heat superconducting heat transfer plate comprises a heat conduction plate with a composite plate type structure, a heated area positioned on one side edge of the heat conduction plate, a condensation heat dissipation area positioned on the surface of the heat conduction plate and a non-pipeline blank area; the condensation heat dissipation area is positioned above the non-pipeline blank area, a heat dissipation pipeline is formed in the heat conduction plate of the condensation heat dissipation area, and the heat dissipation pipeline is filled with heat transfer working medium. The utility model arranges normal mutually communicated heat dissipation pipelines near the main heat source position, and the lower part of the main heat source position is a blank non-pipeline area, thereby reducing the consumption of heat transfer working medium as much as possible on the premise of not influencing heat conduction so as to reduce the cost and weight of the heat superconducting heat transfer plate; meanwhile, the heat transfer quality is reduced, the starting and circulating speed of the heat transfer working medium in the heat superconducting plate is increased, the temperature difference between the upper part and the lower part of the heat superconducting plate is reduced, and the heat dissipation capacity and efficiency are improved.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to a heat superconducting heat transfer plate and radiator.
Background
Along with the rapid development of the 5G communication technology, the integration level of power components is higher and higher, the power density is higher and higher, and in addition to the miniaturization, light weight, high heat flow density, device temperature equalization and other various requirements of products, the existing all-aluminum sheet gear shaping radiator or die-casting radiator is large in size and heavier, and meanwhile, the defects of uneven heat dissipation and low heat dissipation efficiency exist, so that the heat dissipation requirement of 5G communication base station equipment cannot be met.
The heat superconducting heat transfer technology comprises a phase change heat transfer technology which is characterized in that a working medium is filled in a closed and mutually communicated micro-channel system and the heat superconducting heat transfer is realized through the evaporation and condensation phase change of the working medium; or the phase change suppression (PCI) heat transfer technology of high-efficiency heat transfer is realized by controlling the microstructure state of the working medium in a closed system, namely, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed in the heat transfer process, and the consistency of the microstructure of the working medium is achieved on the basis. Due to the rapid heat conduction characteristic of the heat superconducting technology, the equivalent heat conduction coefficient can reach more than 4000W/m ℃, and the temperature equalization of the whole heat superconducting heat transfer plate can be realized.
The heat superconducting fin radiator is formed by using heat superconducting heat transfer plates as radiating fins, and mainly comprises a radiator base plate and a plurality of heat superconducting heat transfer plates arranged on the radiator base plate, wherein a heat source is arranged on the other plane of the radiator base plate. The heat of the heat source is conducted to the plurality of radiating fins through the substrate, and then is radiated to the surrounding environment through the radiating fins. The heat superconducting heat transfer plate is of a thin plate structure, so that the heat conduction rate is high, the size is small, the weight is light, the fin efficiency is high, and the fin efficiency is not changed along with the height of the fin, so that the heat superconducting heat transfer plate is widely applied to heat dissipation of 5G base station equipment.
At present, the structure of a heat superconducting heat transfer plate on a 5G base station equipment radiator is shown in figure 1, a hexagonal honeycomb pipeline 11 structure is mostly adopted, and a heat transfer working medium 12 is filled in the hexagonal honeycomb pipeline 11. Because the radiator is vertically installed for use, when the main heat source 13a of the radiator is positioned at the upper part of the radiator (the auxiliary heat source 13b is positioned at the lower part of the radiator), the liquid level height of the heat transfer working medium filled in the heat superconducting heat transfer plate is required to be at the main heat source accessory (the lower end is not lower than the installation position of the main heat source), and then the heat of the main heat source can be led out and dissipated in time. Therefore, the filling amount of the heat transfer working medium is required to be large, the cost and the weight of the heat superconducting heat transfer plate are increased, unnecessary waste is caused, and meanwhile, the main heat source is arranged at the upper part, and the heat transfer working medium in the liquid zone at the lower part of the heat superconducting heat transfer plate cannot participate in heat transfer circulation, so that the lower part temperature is low, the temperature difference between the upper part and the lower part is large, and the heat dissipation efficiency is reduced.
Therefore, how to solve the problems of high cost, heavy weight, large temperature difference between the top and bottom, poor heat dissipation effect, etc. has become one of the problems to be solved urgently by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a thermal superconducting heat transfer plate and a heat sink, which are used for solving the problems of high cost, heavy weight, large temperature difference between the upper and lower parts, poor effect of the heat sink, etc. in the prior art.
To achieve the above and other related objects, the present invention provides a thermal superconducting heat transfer plate, comprising at least:
the heat conducting plate is of a composite plate type structure and comprises a heated area, a condensation heat dissipation area and a non-pipeline blank area, wherein the heated area is positioned at one side edge of the heat conducting plate;
the condensation heat dissipation area is located above the non-pipeline blank area, a heat dissipation pipeline is formed in a heat conduction plate of the condensation heat dissipation area, and a heat transfer working medium is filled in the heat dissipation pipeline.
Optionally, the non-pipeline blank area is a whole heat conducting plate of a composite plate type structure without pipelines.
Optionally, the non-pipe blank area includes at least two non-pipe sub-blank areas, a first connecting pipe and a second connecting pipe; all the non-pipeline sub-blank areas are sequentially arranged from top to bottom; the first connecting pipelines are arranged on two sides of each non-pipeline sub-blank area and are in through connection with the heat dissipation pipelines in the condensation heat dissipation area; the second connecting pipeline is arranged between the non-pipeline sub blank areas, and two ends of the second connecting pipeline are respectively communicated with the first connecting pipelines on two sides of each non-pipeline sub blank area.
More optionally, the extending direction of the second connecting pipelines is oblique to the side edge of the heat conducting plate, and one end of each second connecting pipeline, which is close to the heated area, is lower than one end of each second connecting pipeline, which is far away from the heated area.
More optionally, a sum of areas of the non-pipe sub blank regions in the non-pipe blank regions is greater than a sum of areas of the first connecting pipe and the second connecting pipe.
Optionally, the heat dissipation pipeline of each condensation heat dissipation area is in a shape of a hexagonal honeycomb, a circular honeycomb, a quadrilateral honeycomb, a plurality of U-shapes connected in series end to end, a diamond shape, a triangle, a circular ring shape, a criss-cross mesh, or any combination of more than one of the above.
Optionally, the heat conducting plate of the heated region is of a folded edge structure.
More optionally, the heat conducting plate is a phase change suppression heat dissipating plate or a phase change heat dissipating plate.
More optionally, the position of the condensation heat dissipation area corresponds to the installation position of the main heat source.
To achieve the above and other related objects, the present invention also provides a heat sink, comprising at least:
a heat-dissipating substrate and a plurality of the thermal superconducting heat transfer plates;
grooves which are arranged at intervals are arranged on the first surface of the heat dissipation substrate, the heated areas of the heat superconducting heat transfer plates are inserted into the grooves in a one-to-one correspondence mode, and the heat superconducting heat transfer plates extend in the vertical direction;
and a heat source pasting area is arranged on the second surface of the heat dissipation substrate.
Optionally, the first surface is disposed opposite the second surface.
More optionally, the heat source pasting area includes a first pasting area and a second pasting area, the position of the first pasting area corresponds to the condensation heat dissipation area, and the position of the second pasting area corresponds to the non-pipeline blank area.
As described above, the utility model discloses a heat superconducting heat transfer plate and radiator has following beneficial effect:
the utility model discloses a heat superconducting heat transfer plate sets up the normal heat dissipation pipeline that communicates each other near main heat source position, is the non-pipeline region of blank (or set up a small amount of pipelines in non-pipeline region periphery, and the middle part leaves the blank region of great area) in main heat source position lower part to this under the prerequisite that does not influence heat conduction, reduces the quantity of heat transfer working medium as far as possible, so that reduce heat superconducting heat transfer plate's cost and weight; meanwhile, the heat transfer quality is reduced, the starting and circulating speed of the heat transfer working medium in the heat superconducting plate is increased, the temperature difference between the upper part and the lower part of the heat superconducting plate is reduced, and the heat dissipation capacity and efficiency are improved.
The utility model discloses a radiator adopts above-mentioned heat superconducting heat transfer plate, fixes on the heat dissipation base plate through connecting, welding, expanding joint and connected modes such as cogs, constitutes the radiator that is used for communication base station equipment or power supply unit to solve the heat dissipation problem that the power device that generates heat is located radiator upper portion and avoid appearing local high temperature phenomenon, improve the radiating efficiency and the heat-sinking capability of whole radiator.
Drawings
Fig. 1 is a schematic diagram illustrating the principle of the prior art that the heat superconducting heat transfer plate has the problems of high cost, heavy weight, large temperature difference between the top and the bottom, and poor heat dissipation effect.
Fig. 2 is a schematic view showing a structure of a thermal superconducting heat transfer plate according to the present invention.
Fig. 3 is a schematic view showing a partially enlarged structure of the thermal superconducting heat transfer plate according to the present invention.
Fig. 4 is a schematic view showing another structure of the heat transfer plate for thermal superconducting according to the present invention.
Fig. 5 is a schematic view showing still another structure of the heat transfer plate for thermal superconducting according to the present invention.
Fig. 6 is a schematic view showing still another structure of the heat transfer plate for thermal superconducting according to the present invention.
Fig. 7 is a schematic structural diagram of the heat sink of the present invention.
Fig. 8 is a partially enlarged schematic view illustrating the connection between the heat superconducting heat transfer plate and the heat dissipation substrate in the heat sink according to the present invention.
Description of the element reference numerals
11 hexagonal honeycomb pipeline
12 Heat transfer working fluid
13a main heat source
13b secondary heat source
2 heat superconducting heat transfer plate
211 heated region
212 condensation heat dissipation area
213 non-pipe blank area
213a non-pipe sub-blank area
213b first connecting line
213c second connecting line
22 heat radiation pipeline
23 Heat transfer working Medium
3 Heat dissipation substrate
4a main heat source
4b secondary heat source
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
Please refer to fig. 2 to 8. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the invention in a schematic manner, and only the components related to the invention are shown in the drawings rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, quantity and proportion of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.
Example one
As shown in fig. 2, the present embodiment provides a thermal superconducting heat transfer plate 2, the thermal superconducting heat transfer plate 2 including:
the heat conduction plate comprises a heated area 211 positioned on one side edge of the heat conduction plate, a condensation heat dissipation area 212 positioned on the surface of the heat conduction plate and a non-pipeline blank area 213; the condensation heat dissipation area 212 is located above the non-pipeline blank area 213, a heat dissipation pipeline 22 is formed in the heat conduction plate of the condensation heat dissipation area 212, and the closed pipeline 22 is filled with a heat transfer working medium 23.
As shown in fig. 2, the heat-conducting plate is a composite plate structure. The heat conducting plate comprises at least two layers of plates, and the number of the plates can be set according to actual needs, which is not described in detail herein. As an example, the heat-conducting plate achieves heat transfer based on a thermal superconducting heat transfer technology; one heat superconducting technology is a phase-change heat transfer technology in which the heat transfer working medium is filled in a sealed and mutually communicated micro-channel system (i.e., the heat dissipation pipeline 22 in this embodiment), and heat superconducting heat transfer is realized through evaporation or condensation phase change of the heat transfer working medium; the other heat superconducting technology is a phase transition suppression (PCI) heat transfer technology which realizes high-efficiency heat transfer by the state of the heat transfer working medium microstructure in a micro-channel system, namely boiling of the liquid heat transfer working medium (or condensation of the gaseous heat transfer working medium) is suppressed in the heat transfer process, and the consistency of the heat transfer working medium microstructure is achieved on the basis.
As shown in fig. 2, one side edge of the heat conducting plate is a heated area 211, and in this embodiment, the heated area 211 is located at the left side edge of the heat conducting plate. As an example, the heated region 211 is a folded edge structure, and in practical use, the structure of the heated region 211 is not limited, and heat conduction can be achieved.
As shown in fig. 2, a heat dissipation pipeline 22 is formed in the heat conduction plate of the condensation heat dissipation area 212, the heat dissipation pipeline 22 is a pipeline formed by a protrusion of a plate located on the outer side in the composite plate structure, and the heat dissipation pipeline 22 may be prepared by a single-sided inflation or double-sided inflation process, which is not described herein again. The shape of the heat dissipation pipeline 22 in the condensation heat dissipation area 212 includes, but is not limited to, hexagonal honeycomb, circular honeycomb, quadrilateral honeycomb, a plurality of U-shapes connected end to end in series, diamond, triangle, circular ring, criss-cross mesh, or any combination of more than one of them, in this embodiment, hexagonal honeycomb is used. As an example, as shown in fig. 2, the length of the condensation heat dissipation area 212 in the vertical direction on the side close to the heat receiving area 211 covers (corresponds to a large length value) or substantially covers (corresponds to a large length value) the length of the area where the main heat source 4a (the heat source is used for explaining the principle of the heat superconducting heat transfer plate of the present embodiment and is not included in the heat superconducting heat transfer plate) in the vertical direction.
As shown in fig. 2, the heat transfer medium 23 is disposed in the heat dissipation pipeline 22, for example, the upper liquid level of the heat transfer medium 23 may be substantially equal to the upper end of the main heat source 4a, and in actual use, the charging amount of the heat transfer medium 23 may be set according to actual needs. By way of example, the heat transfer working medium 23 is a fluid, preferably, the heat transfer working medium 23 may be a gas or a liquid or a mixture of a gas and a liquid, and more preferably, in the present embodiment, the heat transfer working medium 23 is a mixture of a liquid and a gas.
As shown in fig. 2, the non-pipe blank area 213 is disposed below the condensation heat dissipation area 212, and in the present embodiment, the non-pipe blank area 213 includes at least two non-pipe sub-blank areas 213a, a first connection pipe 213b and a second connection pipe 213 c. The non-pipe sub-empty regions 213a are arranged in order from top to bottom. The first connecting pipes 213b are disposed at two sides of each non-pipe sub-empty area 213a, and are connected to the heat dissipation pipes 22 in the condensation heat dissipation area 212; as an example, the first connecting pipes 213b located at both sides of each non-pipe sub-empty area 213a are double-row pipes (which can be configured as multiple rows of pipes, but not limited to this embodiment). The second connecting pipe 213c is disposed between the non-pipe sub-empty regions 213a, and two ends of the second connecting pipe 213c are respectively connected to the first connecting pipes 213b on two sides of the non-pipe sub-empty regions 213 a; the heat dissipation pipeline, the first connecting pipeline and the second connecting pipeline are communicated to form a closed pipeline. Therefore, the number of pipelines at the lower part of the heat superconducting heat transfer plate can be reduced as much as possible, so that the filling amount of the heat transfer working medium is reduced, the starting rate is increased, the cost is reduced, and meanwhile, the temperature difference between the upper part and the lower part of the heat superconducting plate is reduced by considering the heat dissipation of the auxiliary heat source 4b and the circulating flow of the working medium in the heat dissipation pipeline.
By way of example, the second connecting pipes 213c extend obliquely to the lateral sides of the heat conductive plate, and one end of each second connecting pipe 213c adjacent to the heated region 211 is lower than one end thereof away from the heated region 211. As shown in fig. 2, the second connecting pipe 213c extends in the left-right direction and is in a strip structure, and the second connecting pipe 213c is sequentially inclined upward from left to right, so that the heat transfer working medium 23 can flow back to a side (near the heat source) close to the heated region 211; the second connection pipe 213c includes a plurality of pipes, thereby providing a plurality of return paths, each of which has a uniform inclination direction.
As an example, the sum of the areas of the non-pipe sub blank regions 213a in the non-pipe blank regions 213 is larger than the sum of the areas of the first connecting pipe 213b and the second connecting pipe 213 c. In practical applications, the area ratio of the hollow area of the non-pipe blank area 213 to the connecting pipe can be set according to the heat dissipation requirement, which is not limited by the embodiment.
The heat superconducting heat transfer plate of the present embodiment is provided with a condensation heat dissipation area 212 and a non-pipeline blank area 213, wherein the condensation heat dissipation area 212 corresponds to the main heat source 4a with a large power, and the non-pipeline blank area 213 corresponds to the auxiliary heat source 4b with a relatively small power, so that on the basis of ensuring the heat dissipation efficiency of the main heat source 4a, the cost and the weight of the heat superconducting heat transfer plate are reduced, and the problems of large upper and lower temperature difference and poor heat dissipation effect are avoided. As shown in fig. 3, during operation, the main heat source 4a at the upper part conducts heat to the condensing and heat-dissipating area 212 near the main heat source, the heat transfer working medium 23 in the heat-dissipating pipeline 22 of the condensing and heat-dissipating area 212 is heated and then changes phase to vaporize, changes into steam flowing upwards to fill the area of the upper heat-dissipating pipeline 22, and condenses into liquid after exchanging heat with the outside, the condensed liquid flows downwards along the pipeline and then flows to the vicinity of the main heat source 4a, and because the main heat source 4a has higher temperature, the condensed liquid near the main heat source 4a evaporates and changes into gas to be condensed and dissipated to the upper part, and the circulation is such that the heat is continuously conducted to various parts of the superconducting heat transfer plate to dissipate heat, and the condensed liquid participates in the phase-change heat-conducting cycle. As the heat transfer working medium 23 in the heat dissipation pipeline 22 at the main heat source 4a is heated and evaporated, the generated vapor bubbles and the liquid phase are mixed into a gas-liquid two-phase mixture and flow upwards together, and the liquid close to the lower part of the main heat source 4a side flows upwards to supplement the liquid working mass reduced due to evaporation, so that the heat transfer working medium in the connecting pipeline at the lower part of the heat superconducting heat transfer plate flows. Meanwhile, the secondary heat source 4b at the lower part can also heat and vaporize the heat transfer working medium, and the circulation rate of the liquid working medium is accelerated, so that the temperature difference of the upper part and the lower part of the heat superconducting heat transfer plate is reduced, and the temperature uniformity and the heat dissipation capacity of the heat superconducting heat transfer plate are improved.
Example two
As shown in fig. 4, the present embodiment provides a thermal superconducting heat transfer plate 2, which is different from the first embodiment in that the first connecting pipes 213b on both sides of each non-pipe sub-empty area 213a are changed from double-row pipes to single-row pipes, so that the area of each non-pipe sub-empty area 213a can be increased, the filling amount of the heat transfer working medium 23 can be further reduced, the cost can be reduced, and the starting rate of the heating superconducting heat transfer plate can be increased.
EXAMPLE III
As shown in fig. 5, the present embodiment provides a thermal superconducting heat transfer plate 2, which is different from the second embodiment in that the number of the second connecting pipes 213c is reduced, so that the number of the non-pipe sub-empty areas 213a is reduced to two, the number of the pipes is further reduced, the filling amount of the heat transfer medium 23 is reduced, the cost is reduced, and the start-up rate of the thermal superconducting heat transfer plate is increased.
EXAMPLE III
As shown in fig. 6, the present embodiment provides a thermal superconducting heat transfer plate 2, which is different from the first and second embodiments in that the non-pipe blank area 213 is a whole heat transfer plate with a composite plate structure without pipes, so as to further reduce the filling amount of the heat transfer medium 23, reduce the cost, and increase the start-up rate of the thermal superconducting heat transfer plate.
Since the power of the secondary heat source 4b is relatively small compared to the primary heat source 4a, the heat dissipation requirement can be satisfied even if no heat dissipation pipe is provided in the non-pipe blank region 213. In practical use, the non-pipe blank area 213 may not have a heat source, and is not limited to this embodiment.
Example four
As shown in fig. 7 and 8, the utility model provides a heat sink, the heat sink includes:
the heat-conducting plate comprises a heat-radiating base plate 3 and a plurality of heat-conducting plates 2, wherein grooves which are arranged at intervals are arranged on the first surface of the heat-radiating base plate 3, heated areas of the heat-conducting plates 2 are inserted into the grooves in a one-to-one correspondence manner, and the heat-conducting heat-; a heat source attaching region is provided on the second surface of the heat dissipation substrate 3.
Specifically, in the present embodiment, the heat dissipation substrate 3 is a flat structure, a first surface of the heat dissipation substrate 3 is provided with a groove (not shown in the figure) for inserting each thermal superconducting heat transfer plate 2, and a second surface is provided with a heat source attaching area for mounting a heat generating device. As an example, the first surface is disposed opposite the second surface. The heat generating device includes, but is not limited to, a power device. The grooves extend along a first direction on the surface of the heat dissipation substrate 3 and are arranged at intervals along a second direction, and the first direction is perpendicular to the second direction; in the embodiment, each groove is perpendicular to the surface of the heat dissipation substrate 3, and in practical use, each groove may also be inclined by a certain angle compared to the surface of the heat dissipation substrate 3, and the perpendicular direction is only used for indicating a direction trend, and does not mean that an included angle of 90 degrees is formed with the horizontal plane in a strict sense, which is not limited in the embodiment.
As an example, a sintered wick heat pipe (not shown) is buried in the heat dissipation substrate 3. The sintering core heat pipe is a sintering powder pipe core which is formed by sintering metal powder with a certain mesh number on the inner wall of a metal pipe and is integrated with the pipe wall, the metal powder sintered on the inner wall of the metal pipe forms a liquid absorption core capillary structure, so that the sintering core heat pipe has higher capillary suction force, the heat conduction direction of the sintering core heat pipe is not influenced by gravity, the evaporation heat absorption and condensation heat release are strengthened by the sintering liquid absorption core capillary structure, the heat conduction capability and the transmission power of the heat pipe are greatly improved, and the sintering core heat pipe has larger axial equivalent heat conduction coefficient (which is hundreds times to thousands times of copper). The sintering core heat pipe is embedded in the heat dissipation substrate 3, so that heat generated by a heating device arranged on the surface of the heat dissipation substrate 3 can be quickly diffused to other positions of the heat dissipation substrate 3, the heat distribution on the heat dissipation substrate 3 is uniform, and the heat dissipation efficiency and the heat dissipation capacity of the radiator are effectively improved.
Specifically, the heated area 211 of each thermal superconducting heat transfer plate 2 is vertically (or may have a certain inclination, not limited to this embodiment) inserted into the groove, and each thermal superconducting heat transfer plate 2 is fixedly connected to the heat sink substrate 3 through a mechanical extrusion process, a heat-conducting glue bonding process, or a brazing welding process, so as to increase the bonding strength as much as possible, reduce the bonding thermal resistance, and improve the heat dissipation capability and efficiency of the heat sink.
As an example, the heat source attaching area includes a first attaching area and a second attaching area, a position of the first attaching area corresponds to the condensation heat dissipation area, and a position of the second attaching area corresponds to the non-pipeline blank area. In practical use, only the first attaching area may be provided, or a plurality of attaching areas may be provided, which is not limited to this embodiment.
The working principle of the radiator described in this embodiment is as follows: the heat generated when the heat source on the surface of the heat radiator base plate 3 works is quickly transferred to the whole heat radiator base plate 3 through the sintering core heat pipe, the heat radiator base plate 3 quickly transfers the heat to each heat superconducting heat transfer plate 2, the heat transfer working medium in the heat dissipation pipeline 22 in each heat superconducting heat transfer plate 2 quickly transfers the heat to the surface of the whole heat superconducting heat transfer plate 2, and then the heat is taken away by the air flow flowing through the gap of the heat superconducting heat transfer plates 2. The working principle of each heat transfer plate 2 is not described in detail herein.
To sum up, the utility model provides a heat superconducting heat transfer plate and radiator, include: a heat dissipation substrate and a plurality of thermal superconducting heat transfer plates. The heat superconducting heat transfer plate comprises a heat conduction plate with a composite plate type structure, wherein the heat conduction plate comprises a heated area positioned on one side edge of the heat conduction plate, a condensation heat dissipation area positioned on the surface of the heat conduction plate and a non-pipeline blank area; the condensation heat dissipation area is located above the non-pipeline blank area, a heat dissipation pipeline is formed in a heat conduction plate of the condensation heat dissipation area, and a heat transfer working medium is filled in the heat dissipation pipeline. The utility model discloses a heat superconducting heat transfer plate sets up the normal heat dissipation pipeline that communicates each other near main heat source position, is the non-pipeline region of blank (or set up a small amount of pipelines in non-pipeline region periphery, and the middle part leaves the blank region of great area) in main heat source position lower part to this under the prerequisite that does not influence heat conduction, reduces the quantity of heat transfer working medium as far as possible, so that reduce heat superconducting heat transfer plate's cost and weight; meanwhile, the heat transfer quality is reduced, the starting and circulating speed of the heat transfer working medium in the heat superconducting plate is increased, the temperature difference between the upper part and the lower part of the heat superconducting plate is reduced, and the heat dissipation capacity and efficiency are improved. The utility model discloses a radiator adopts above-mentioned heat superconducting heat transfer plate, fixes on the heat dissipation base plate through connecting, welding, expanding joint and connected modes such as cogs, constitutes the radiator that is used for communication base station equipment or power supply unit to solve the heat dissipation problem that the power device that generates heat is located radiator upper portion and avoid appearing local high temperature phenomenon, improve the radiating efficiency and the heat-sinking capability of whole radiator. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (12)
1. A thermally superconducting heat transfer plate, characterized in that it comprises at least:
the heat conducting plate is of a composite plate type structure and comprises a heated area, a condensation heat dissipation area and a non-pipeline blank area, wherein the heated area is positioned at one side edge of the heat conducting plate;
the condensation heat dissipation area is located above the non-pipeline blank area, a heat dissipation pipeline is formed in a heat conduction plate of the condensation heat dissipation area, and a heat transfer working medium is filled in the heat dissipation pipeline.
2. A thermally superconducting heat transfer plate according to claim 1, wherein: the non-pipeline blank area is a whole heat-conducting plate with a composite plate structure without pipelines.
3. A thermally superconducting heat transfer plate according to claim 1, wherein: the non-pipeline blank area comprises at least two non-pipeline sub-blank areas, a first connecting pipeline and a second connecting pipeline; all the non-pipeline sub-blank areas are sequentially arranged from top to bottom; the first connecting pipelines are arranged on two sides of each non-pipeline sub-blank area and are in through connection with the heat dissipation pipelines in the condensation heat dissipation area; the second connecting pipeline is arranged between the non-pipeline sub blank areas, and two ends of the second connecting pipeline are respectively communicated with the first connecting pipelines on two sides of each non-pipeline sub blank area.
4. A heat transfer plate according to claim 3, wherein: the extending direction of the second connecting pipelines is oblique to the side edge of the heat conducting plate, and one end, close to the heated area, of each second connecting pipeline is lower than one end, far away from the heated area, of each second connecting pipeline.
5. A heat transfer plate according to claim 3, wherein: the sum of the areas of the non-pipeline sub-blank areas in the non-pipeline blank areas is larger than the sum of the areas of the first connecting pipeline and the second connecting pipeline.
6. A thermally superconducting heat transfer plate according to claim 1, wherein: the shape of the heat dissipation pipeline of each condensation heat dissipation area is hexagonal honeycomb, circular honeycomb, quadrilateral honeycomb, a plurality of U-shapes, rhombuses, triangles, circular rings, criss-cross nets connected in series end to end or any combination of more than one of the U-shapes, the rhombuses, the triangles, the circular rings and the criss-cross nets.
7. A thermally superconducting heat transfer plate according to claim 1, wherein: the heat conducting plate of the heated area is of a folded edge structure.
8. A heat superconducting heat transfer plate according to any one of claims 1 to 7, wherein: the heat conducting plate is a phase change suppressing heat radiating plate or a phase change heat radiating plate.
9. A thermally superconducting heat transfer plate according to claim 8, wherein: the position of the condensation heat dissipation area corresponds to the installation position of the main heat source.
10. A heat sink, characterized in that it comprises at least:
a heat-dissipating substrate and a plurality of heat-superconducting heat transfer plates according to any one of claims 1 to 9;
grooves which are arranged at intervals are arranged on the first surface of the heat dissipation substrate, the heated areas of the heat superconducting heat transfer plates are inserted into the grooves in a one-to-one correspondence mode, and the heat superconducting heat transfer plates extend in the vertical direction;
and a heat source pasting area is arranged on the second surface of the heat dissipation substrate.
11. The heat sink of claim 10, wherein: the first surface is disposed opposite the second surface.
12. The heat sink according to claim 10 or 11, wherein: the heat source pasting area comprises a first pasting area and a second pasting area, the position of the first pasting area corresponds to the condensation heat dissipation area, and the position of the second pasting area corresponds to the non-pipeline blank area.
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| CN202020514010.8U CN212778799U (en) | 2020-04-09 | 2020-04-09 | Heat superconducting heat transfer plate and heat sink |
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| CN202020514010.8U CN212778799U (en) | 2020-04-09 | 2020-04-09 | Heat superconducting heat transfer plate and heat sink |
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