CN212759753U - QFP chip outward appearance visual inspection system - Google Patents
QFP chip outward appearance visual inspection system Download PDFInfo
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- CN212759753U CN212759753U CN202020895897.XU CN202020895897U CN212759753U CN 212759753 U CN212759753 U CN 212759753U CN 202020895897 U CN202020895897 U CN 202020895897U CN 212759753 U CN212759753 U CN 212759753U
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Abstract
The utility model discloses a QFP chip outward appearance visual detection system, including defeated material mechanism, first detection mechanism, second detection mechanism, sorting mechanism and control processing mechanism, control processing mechanism includes first proximity sensor, second proximity sensor, dual-core DSP processing module, first ARM control module, second ARM control module and third ARM control module, first ARM control module control first detection mechanism examines the chip just, second ARM control module control second detection mechanism rechecks the chip, dual-core DSP processing module is used for right first detection mechanism and second detection mechanism's testing result carries out analysis processes. The utility model provides a QFP chip outward appearance visual detection system carries out analysis processes after the preliminary examination and the reinspection to the chip and compares and finally judges, and degree of automation is high, improves the accurate nature and the stability that detect.
Description
Technical Field
The utility model relates to a visual inspection technical field, concretely relates to QFP chip outward appearance visual detection system.
Background
After the packaging process, the QFP chip in the integrated circuit must be inspected to ensure the quality of the chip. And the detection link is mainly used for carrying out electrical property test and chip appearance detection on the packaged chip. The appearance defects of the chip directly affect the quality of the product and the smooth proceeding of the subsequent process links of IC manufacturing. Therefore, chip appearance inspection is of great importance in the IC manufacturing industry.
The existing QFP chip detection technology generally only detects a chip once, and because the QFP chip has many and dense pins, the detection error is larger and is not accurate enough.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a QFP chip outward appearance visual detection system carries out the primary importance and rechecks to the chip, and carries out contrast after the analysis process with the result of rechecking and finally judges, and degree of automation is high, improves the accurate nature and the stability that detect.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a QFP chip appearance visual inspection system comprises a material conveying mechanism, a first detection mechanism, a second detection mechanism, a material sorting mechanism and a control processing mechanism, wherein the first detection mechanism and the second detection mechanism are respectively arranged at two ends of the material conveying mechanism, the material sorting mechanism is arranged at the other side of the second detection mechanism, a velometer for detecting the conveying speed of a chip is arranged on the material conveying mechanism, the control processing mechanism comprises a first proximity sensor, a second proximity sensor, a dual-core DSP processing module, a first ARM control module, a second ARM control module and a third ARM control module, the first proximity sensor is arranged on the first detection mechanism and used for detecting the position of the chip to be detected and sending a detection signal to the first ARM control module, and the first ARM control module controls the first detection mechanism to carry out primary inspection on the chip, the second proximity sensor is arranged at a position, used for detecting a retest chip, on the second detection mechanism, and sends a detection signal to the second ARM control module, the second ARM control module controls the second detection mechanism to retest the chip, the dual-core DSP processing module is used for analyzing and processing detection results of the first detection mechanism and the second detection mechanism and sending the analysis and processing results to the third ARM control module, and the third ARM control module is also used for controlling the sorting mechanism.
Preferably, the first detection mechanism includes a first driving component, a first CCD camera, a first image acquisition card and a first annular light source, the first driving component drives the first CCD camera to perform initial acquisition on a chip image, and transmits an initial acquisition result to the first image acquisition card, and the first image acquisition card sends the initial acquisition image data to the dual-core DSP processing module for analysis and processing.
Preferably, first drive assembly includes first lead screw track, first lead screw slip table, first servo controller, first servo motor and first telescopic cylinder, first servo controller drives through controlling first servo motor first lead screw slip table is in remove on the first lead screw track, first servo controller respectively with first ARM control module and tester electricity are connected, first telescopic cylinder sets up be used for driving on the first lead screw slip table first CCD camera is flexible from top to bottom.
Preferably, the second detection mechanism includes a second driving component, a second CCD camera, a second image acquisition card and a first annular light source, the second driving component drives the second CCD camera to perform re-acquisition on chip images, and transmits re-acquired images to the second image acquisition card, and the second image acquisition card sends the re-acquired image data to the dual-core DSP processing module for analysis processing.
Preferably, the second drive assembly includes second lead screw track, second lead screw slip table, second servo controller, second servo motor and the flexible cylinder of second, second servo controller drives through controlling second servo motor the second lead screw slip table is in remove on the second lead screw track, second servo controller respectively with second ARM control module and tester electricity are connected, the flexible cylinder of second sets up be used for driving on the second lead screw slip table the second CCD camera is flexible from top to bottom.
Preferably, the sorting mechanism comprises an optical fiber sensor and an electric suction nozzle, the optical fiber sensor is used for detecting the position of a chip which is detected, and the electric suction nozzle is used for sucking unqualified chips through the combined control of the optical fiber sensor and the third ARM control module.
Preferably, the dual-core DSP module is a BF561 type DSP, and the first ARM control module, the second ARM control module, and the third ARM control module are TMS320DM642 type chips.
After the technical scheme is adopted, compared with the background art, the utility model, have following advantage:
the utility model relates to a QFP chip outward appearance visual detection system carries out the primary inspection and recheck through first detection mechanism and second detection mechanism to the chip, and will examine and carry out the contrast after the result of rechecking carries out analysis processes finally judges with the result of rechecking, sends the judged result to the mechanism of choosing and proposes unqualified chip, and degree of automation is high, improves accurate nature and the stability that detects.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the first detection mechanism of the present invention;
FIG. 3 is a schematic structural view of a second detecting mechanism of the present invention;
fig. 4 is a block diagram of the control circuit of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are all based on the orientation or position relationship shown in the drawings, and are only for convenience of description and simplification of the present invention, but do not indicate or imply that the device or element of the present invention must have a specific orientation, and thus, should not be construed as limiting the present invention.
Examples
Please refer to fig. 1, fig. 2, fig. 3 and fig. 4, the utility model discloses a QFP chip outward appearance visual inspection system, including defeated material mechanism 1, first detection mechanism 2, second detection mechanism 3, sorting mechanism 4 and control processing mechanism 5, first detection mechanism 2 and second detection mechanism 3 set up respectively at defeated material mechanism 1 both ends, and the 3 opposite sides of second detection mechanism are equipped with sorting mechanism 4, are equipped with speedometer 11 that is used for detecting chip conveying speed on the defeated material mechanism 1.
The control processing mechanism comprises a first proximity sensor 51, a second proximity sensor 52, a dual-core DSP processing module, a first ARM control module, a second ARM control module and a third ARM control module, wherein the first proximity sensor 51 is arranged on the first detection mechanism 2 and used for detecting the position of a chip to be detected and sending a detection signal to the first ARM control module, the first ARM control module controls the first detection mechanism 2 to perform primary detection on the chip, the second proximity sensor 52 is arranged on the second detection mechanism 3 and used for detecting the position of a retested chip and sending the detection signal to the second ARM control module, the second ARM control module controls the second detection mechanism 3 to perform retest on the chip, the dual-core DSP processing module is used for comparing and judging whether the detection results of the first detection mechanism 2 and the second detection mechanism 3 are qualified after analysis processing, and sending the analysis processing result to the third ARM control module, the third ARM control module is also used for controlling the sorting mechanism 4 to reject unqualified products.
The first detection mechanism 2 comprises a first driving component 21, a first CCD camera 22, a first image acquisition card and a first annular light source 23, the first driving component 21 drives the first CCD camera 22 to primarily acquire chip images, a primary acquisition result is transmitted to the first image acquisition card, and the first image acquisition card transmits primary acquisition image data to the dual-core DSP processing module for analysis and processing.
The first driving assembly 21 includes a first screw rod track 211, a first screw rod sliding table 212, a first servo controller 213, a first servo motor 214 and a first telescopic cylinder 215, the first servo controller 213 drives the first screw rod sliding table 212 to move on the first screw rod track 211 by controlling the first servo motor 214, the first servo controller 213 is electrically connected with the first ARM control module and the tester 11 respectively, the moving speed of the first screw rod sliding table is controlled to be synchronous with the speed of the material conveying mechanism 1, and the first telescopic cylinder 214 is arranged on the first screw rod sliding table 212 and used for driving the first CCD camera 22 to extend up and down.
The second detection mechanism 3 comprises a second driving component 31, a second CCD camera 32, a second image acquisition card and a first annular light source 33, the second driving component 31 drives the second CCD camera 32 to perform re-acquisition on the chip image, and transmits the re-acquired image data to the second image acquisition card, and the second image acquisition card transmits the re-acquired image data to the dual-core DSP processing module for analysis and processing.
The second driving assembly 31 includes a second screw rail 311, a second screw sliding table 312, a second servo controller 313, a second servo motor 314 and a second telescopic cylinder 315, the second servo controller 313 drives the second screw sliding table 312 to move on the second screw rail 311 by controlling the second servo motor 314, the second servo controller 313 is electrically connected with the second ARM control module and the tester 11 respectively, the moving speed of the second screw sliding table is controlled to be synchronous with the speed of the feeding mechanism 1, and the second telescopic cylinder 314 is arranged on the second screw sliding table 312 and used for driving the second CCD camera 32 to extend and retract up and down.
The sorting mechanism 4 comprises an optical fiber sensor 41 and an electric suction nozzle 42, the optical fiber sensor 41 is used for detecting the position of a chip which is detected, and the electric suction nozzle 42 is used for sucking unqualified chips through the combined control of the optical fiber sensor 41 and a third ARM control module.
In this implementation, the dual-core DSP module is a BF561 type DSP, and the first ARM control module, the second ARM control module, and the third ARM control module are TMS320DM642 type chips.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (7)
1. The utility model provides a QFP chip outward appearance visual inspection system, is including defeated material mechanism, first detection mechanism, second detection mechanism, select material mechanism and control processing mechanism, first detection mechanism and second detection mechanism set up respectively defeated material mechanism both ends, just second detection mechanism opposite side is equipped with select material mechanism, its characterized in that: a velometer for detecting the conveying speed of the chip is arranged on the conveying mechanism, the control processing mechanism comprises a first proximity sensor, a second proximity sensor, a dual-core DSP processing module, a first ARM control module, a second ARM control module and a third ARM control module, the first proximity sensor is arranged on the first detection mechanism and used for detecting the position of the chip to be detected and sending a detection signal to the first ARM control module, the first ARM control module controls the first detection mechanism to perform initial detection on the chip, the second proximity sensor is arranged on the second detection mechanism and used for detecting the position of the retest chip and sending the detection signal to the second ARM control module, the second ARM control module controls the second detection mechanism to perform retest on the chip, the dual-core DSP processing module is used for analyzing and processing the detection results of the first detection mechanism and the second detection mechanism, and sending the analysis processing result to the third ARM control module, wherein the third ARM control module is also used for controlling the sorting mechanism.
2. The visual inspection system for the appearance of QFP chip as claimed in claim 1, wherein: the first detection mechanism comprises a first driving assembly, a first CCD camera, a first image acquisition card and a first annular light source, the first driving assembly drives the first CCD camera to primarily acquire a chip image and transmit a primary acquisition result to the first image acquisition card, and the first image acquisition card sends primary acquisition image data to the dual-core DSP processing module for analysis and processing.
3. The visual inspection system for the appearance of QFP chip as claimed in claim 2, wherein: first drive assembly includes first lead screw track, first lead screw slip table, first servo controller, first servo motor and first telescopic cylinder, first servo controller is through controlling the drive of first servo motor first lead screw slip table is in remove on the first lead screw track, first servo controller respectively with first ARM control module and tester electricity are connected, first telescopic cylinder sets up be used for driving on the first lead screw slip table first CCD camera is flexible from top to bottom.
4. The visual inspection system for the appearance of QFP chip as claimed in claim 1, wherein: the second detection mechanism comprises a second driving component, a second CCD camera, a second image acquisition card and a first annular light source, the second driving component drives the second CCD camera to perform repeated acquisition on chip images, the repeated acquired images are transmitted to the second image acquisition card, and the second image acquisition card sends the repeated acquired image data to the dual-core DSP processing module for analysis and processing.
5. The visual inspection system for the appearance of QFP chip as claimed in claim 4, wherein: the second drive assembly comprises a second lead screw track, a second lead screw sliding table, a second servo controller, a second servo motor and a second telescopic cylinder, the second servo controller is driven by controlling the second servo motor to move on the second lead screw track, the second servo controller is respectively connected with a second ARM control module and a tester electrically, and the second telescopic cylinder is arranged on the second lead screw sliding table and used for driving the second CCD camera to stretch up and down.
6. The visual inspection system for the appearance of QFP chip as claimed in claim 1, wherein: the sorting mechanism comprises an optical fiber sensor and an electric suction nozzle, the optical fiber sensor is used for detecting the position of a chip which is detected, and the electric suction nozzle is used for sucking unqualified chips through the combined control of the optical fiber sensor and a third ARM control module.
7. The visual inspection system for the appearance of QFP chip as claimed in claim 1, wherein: the dual-core DSP module is a BF561 type DSP, and the first ARM control module, the second ARM control module and the third ARM control module are TMS320DM642 type chips.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020895897.XU CN212759753U (en) | 2020-05-25 | 2020-05-25 | QFP chip outward appearance visual inspection system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020895897.XU CN212759753U (en) | 2020-05-25 | 2020-05-25 | QFP chip outward appearance visual inspection system |
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| CN212759753U true CN212759753U (en) | 2021-03-23 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114273242A (en) * | 2021-11-30 | 2022-04-05 | 张大为 | Intelligent manufacturing defective product quick sorting device |
| CN114750510A (en) * | 2022-04-29 | 2022-07-15 | 道恩周氏(青岛)复合包装材料有限公司 | Defect marking and automatic removing method, system, equipment and medium |
| CN115026021A (en) * | 2022-04-25 | 2022-09-09 | 广州市力驰微电子科技有限公司 | Sorting device for power chip production and operation method |
| CN117531731A (en) * | 2024-01-09 | 2024-02-09 | 深圳市华拓半导体技术有限公司 | IGBT chip detection method and device, equipment and storage medium |
-
2020
- 2020-05-25 CN CN202020895897.XU patent/CN212759753U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114273242A (en) * | 2021-11-30 | 2022-04-05 | 张大为 | Intelligent manufacturing defective product quick sorting device |
| CN114273242B (en) * | 2021-11-30 | 2024-05-28 | 创益(广东)智能设备有限公司 | Intelligent manufacturing defective product quick sorting device |
| CN115026021A (en) * | 2022-04-25 | 2022-09-09 | 广州市力驰微电子科技有限公司 | Sorting device for power chip production and operation method |
| CN115026021B (en) * | 2022-04-25 | 2023-08-25 | 广州市力驰微电子科技有限公司 | Sorting device for power chip production and operation method |
| CN114750510A (en) * | 2022-04-29 | 2022-07-15 | 道恩周氏(青岛)复合包装材料有限公司 | Defect marking and automatic removing method, system, equipment and medium |
| CN114750510B (en) * | 2022-04-29 | 2024-02-02 | 道恩周氏(青岛)复合包装材料有限公司 | Defect marking and automatic eliminating method, system, equipment and medium |
| CN117531731A (en) * | 2024-01-09 | 2024-02-09 | 深圳市华拓半导体技术有限公司 | IGBT chip detection method and device, equipment and storage medium |
| CN117531731B (en) * | 2024-01-09 | 2024-04-05 | 深圳市华拓半导体技术有限公司 | IGBT chip detection method and device, equipment and storage medium |
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