CN117531731B - IGBT chip detection method and device, equipment and storage medium - Google Patents

IGBT chip detection method and device, equipment and storage medium Download PDF

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Publication number
CN117531731B
CN117531731B CN202410027450.3A CN202410027450A CN117531731B CN 117531731 B CN117531731 B CN 117531731B CN 202410027450 A CN202410027450 A CN 202410027450A CN 117531731 B CN117531731 B CN 117531731B
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detection
module
igbt
igbt chip
rechecking
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CN117531731A (en
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罗炜桓
罗建华
龙志斌
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Shenzhen Huatuo Semiconductor Technology Co ltd
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Shenzhen Huatuo Semiconductor Technology Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/361—Processing or control devices therefor, e.g. escort memory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers

Abstract

The application relates to the technical field of image processing and discloses a detection method of an IGBT chip, which is applied to a detection device of the IGBT chip and comprises a feeding module, a detection module, a cache module and a blanking module; the method comprises the following steps: when the feeding module detects the IGBT chips placed by the detection personnel, the feeding module conveys the IGBT chips to the detection module; the detection module collects and stores detection images of the IGBT chips, judges whether the IGBT chips are qualified or not by identifying the detection images of the IGBT chips so as to generate detection results, and conveys the detected IGBT chips to the cache rechecking module; the buffer rechecking module conveys the qualified IGBT chips to the blanking module under the condition that the IGBT chips are qualified; and the blanking module conveys the qualified IGBT chips to the material taking position. In the application, the automatic identification of the image on the surface of the IGBT chip is realized, and the detection efficiency of the surface of the IGBT chip is improved. The application also discloses a detection device and equipment of the IGBT chip and a storage medium.

Description

IGBT chip detection method and device, equipment and storage medium
Technical Field
The present disclosure relates to the field of image processing technologies, and in particular, to a method and apparatus for detecting an IGBT chip, a device, and a storage medium.
Background
IGBTs (insulated gate bipolar transistors) combine the advantages of power transistors and power field effect transistors. Since surface defects of the IGBT chip (such as substrate cracks of the chip, irregularities of the chip surface, and surface dirt of the chip) affect the performance of the IGBT chip, surface defect detection is required in the production process of the IGBT chip.
At present, in the production process of the IGBT chip, related technologies generally use a microscope to collect images of the IGBT chip by a detector, and determine whether defects exist on the surface of the IGBT chip by checking the images of the IGBT chip so as to detect the surface defects of the IGBT chip. However, in the related art, a manner of manually checking the image of the IGBT chip to detect whether the surface of the IGBT chip has a defect is adopted, so that the detection efficiency is low.
It should be noted that the information disclosed in the foregoing background section is only for enhancing understanding of the background of the present application and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview, and is intended to neither identify key/critical elements nor delineate the scope of such embodiments, but is intended as a prelude to the more detailed description that follows.
The embodiment of the disclosure provides a method, a device, equipment and a storage medium for detecting a chip, which can realize automatic detection of the surface of an IGBT chip so as to improve the detection efficiency of the surface of the IGBT chip.
In a first aspect, an embodiment of the present disclosure provides a method for detecting an IGBT chip, which is applied to a device for detecting an IGBT chip, where the device includes: the device comprises a feeding module, a detection module, a cache rechecking module and a discharging module; the method comprises the following steps:
when the feeding module detects the IGBT chips placed by the detection personnel, the feeding module conveys the IGBT chips to the detection module;
the detection module collects and stores detection images of the IGBT chips, judges whether the IGBT chips are qualified or not by identifying the detection images of the IGBT chips so as to generate detection results, and conveys the detected IGBT chips to the cache rechecking module;
the buffer rechecking module conveys the qualified IGBT chips to the blanking module under the condition that the IGBT chips are qualified;
and the blanking module conveys the qualified IGBT chips to the material taking position.
Optionally, the detection module is integrated with a 2D camera and a 3D camera; the detection module gathers the detection image of IGBT chip, includes: and acquiring detection images of the IGBT chip through a 2D camera and a 3D camera respectively.
Optionally, the detecting module stores a detected image of the IGBT chip, including: the detection module identifies the identification of the IGBT chip; and the detection module carries out association storage on the identification, the detection image and the detection result of the IGBT chip.
Optionally, the cache rechecking module is integrated with a code reader, a microscope and a display device, and the code reader, the microscope and the display device are arranged at the rechecking position; in the case of failure of the IGBT chip, the method further includes: the buffer memory rechecking module conveys the unqualified IGBT chips to a rechecking position; positioning the defect position of the unqualified IGBT chip by a microscope, and collecting a reinspection image of the defect position of the unqualified IGBT chip; the cache rechecking module recognizes the identification of the failed IGBT chip through the code reader, acquires the detection image of the failed IGBT chip from the detection module according to the identification of the IGBT chip, and displays the detection image of the failed IGBT chip through the display equipment, so that a detector rechecks the failed IGBT chip based on the detection image of the failed IGBT chip displayed by the display equipment and the rechecking image of the failed IGBT chip defect position acquired by the microscope, and generates a rechecking result.
Optionally, the cache rechecking module obtains a detection image of the failed IGBT chip from the detection module according to the identification of the IGBT chip, including: the cache rechecking module sends an image acquisition request to the detection module; the image acquisition request carries an identification of the unqualified IGBT chip; the detection module responds to the image acquisition request, and transmits the detection image of the unqualified IGBT chip to the cache rechecking module according to the association relation between the identification of the IGBT chip and the detection image.
Optionally, after generating the recheck result, the method further includes: and the buffer memory rechecking module conveys the rechecked IGBT chips to the blanking module so that the blanking module conveys the rechecked IGBT chips to the material taking position.
Optionally, after generating the recheck result, the method further includes: the cache rechecking module acquires the detection result of the unqualified IGBT chip from the detection module according to the identification of the IGBT chip, and judges whether the rechecking result and the detection result of the unqualified IGBT chip are the same; if the detection results are different, the cache rechecking module modifies the detection results into rechecking results and sends rechecking images of the unqualified IGBT chips to the detection module; the detection module iteratively trains the image recognition model through the rechecked images of the unqualified IGBT chips so as to update an algorithm library of the image recognition model in the detection module.
In a second aspect, an embodiment of the present disclosure provides a detection apparatus for an IGBT chip, where the apparatus includes a feeding module, a detection module, a buffer rechecking module, and a discharging module; wherein:
the feeding module is used for conveying the IGBT chips to the detection module when detecting the IGBT chips placed by the detection personnel;
the detection module is used for collecting and storing detection images of the IGBT chips, judging whether the IGBT chips are qualified or not by identifying the detection images of the IGBT chips so as to generate detection results, and conveying the detected IGBT chips to the cache rechecking module;
the buffer memory rechecking module is used for conveying the qualified IGBT chips to the blanking module under the condition that the IGBT chips are qualified;
and the blanking module is used for conveying the qualified IGBT chips to the material taking position.
Optionally, the detection module is integrated with a 2D camera and a 3D camera; the detection module is specifically used for: and acquiring detection images of the IGBT chip through a 2D camera and a 3D camera respectively.
Optionally, the detection module is specifically configured to: identifying an identification of the IGBT chip; and the detection module carries out association storage on the identification, the detection image and the detection result of the IGBT chip.
Optionally, the cache rechecking module is integrated with a code reader, a microscope and a display device, and the code reader, the microscope and the display device are arranged at the rechecking position; the cache rechecking module is also used for: under the condition that the IGBT chip is unqualified, the buffer memory rechecking module conveys the unqualified IGBT chip to a rechecking position; positioning the defect position of the unqualified IGBT chip by a microscope, and collecting a reinspection image of the defect position of the unqualified IGBT chip; the cache rechecking module recognizes the identification of the failed IGBT chip through the code reader, acquires the detection image of the failed IGBT chip from the detection module according to the identification of the IGBT chip, and displays the detection image of the failed IGBT chip through the display equipment, so that a detector rechecks the failed IGBT chip based on the detection image of the failed IGBT chip displayed by the display equipment and the rechecking image of the failed IGBT chip defect position acquired by the microscope, and generates a rechecking result.
Optionally, the cache rechecking module is further configured to: the cache rechecking module sends an image acquisition request to the detection module; the image acquisition request carries an identification of the unqualified IGBT chip; the detection module responds to the image acquisition request, and transmits the detection image of the unqualified IGBT chip to the cache rechecking module according to the association relation between the identification of the IGBT chip and the detection image.
Optionally, the cache rechecking module is further configured to: after the re-inspection result is generated, the buffer re-inspection module conveys the re-inspected IGBT chips to the blanking module, so that the blanking module conveys the re-inspected IGBT chips to the material taking position.
Optionally, after generating the rechecking result, the cache rechecking module is further configured to: according to the identification of the IGBT chip, a detection result of the unqualified IGBT chip is obtained from the detection module, and whether the re-detection result and the detection result of the unqualified IGBT chip are the same is judged; if the detection results are different, the cache rechecking module modifies the detection results into rechecking results and sends rechecking images of the unqualified IGBT chips to the detection module; the detection module iteratively trains the image recognition model through the rechecked images of the unqualified IGBT chips so as to update an algorithm library of the image recognition model in the detection module.
In a third aspect, an embodiment of the present disclosure provides an electronic device, including a processor and a memory storing program instructions, where the processor is configured to execute the method for detecting an IGBT chip according to the first aspect when the program instructions are executed.
In a fourth aspect, an embodiment of the present disclosure provides a storage medium storing program instructions, where the program instructions execute, when executed, the method for detecting an IGBT chip according to the first aspect.
The detection method, the detection device, the detection equipment and the detection storage medium for the IGBT chip provided by the embodiment of the disclosure can realize the following technical effects:
when the IGBT chip needs to be detected, a detector can place the IGBT chip to the feeding module, the feeding module conveys the IGBT chip to the detecting module, the detecting module collects the detecting image of the IGBT chip, and whether the IGBT chip is qualified or not can be judged by identifying the detecting image of the IGBT chip so as to generate the detecting result of the IGBT chip. The detection module also conveys the IGBT chips after the image acquisition to the buffer rechecking module, and the buffer rechecking module conveys the qualified IGBT chips to the blanking module. And the blanking module conveys the qualified IGBT chips to a material taking position so that a detector can take the IGBT chips after detection at the material taking position. In the embodiment of the disclosure, when the IGBT chip is detected, the automatic identification of the surface image of the IGBT chip is realized, so that the detection efficiency of the surface of the IGBT chip is improved.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which like reference numerals refer to similar elements, and in which:
fig. 1 is a front view of a detection device of an IGBT chip provided by an embodiment of the disclosure;
fig. 2 is a top view of a detection device of an IGBT chip according to an embodiment of the disclosure;
fig. 3 is a flowchart of a method for detecting an IGBT chip according to an embodiment of the disclosure;
fig. 4 is a flowchart of another method for detecting an IGBT chip according to an embodiment of the disclosure;
fig. 5 is a schematic diagram of an electronic device according to an embodiment of the disclosure.
Detailed Description
So that the manner in which the features and techniques of the disclosed embodiments can be understood in more detail, a more particular description of the embodiments of the disclosure, briefly summarized below, may be had by reference to the appended drawings, which are not intended to be limiting of the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawing.
The terms first, second and the like in the description and in the claims of the embodiments of the disclosure and in the above-described figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe embodiments of the present disclosure. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
The term "plurality" means two or more, unless otherwise indicated.
In the embodiment of the present disclosure, the character "/" indicates that the front and rear objects are an or relationship. For example, A/B represents: a or B.
The term "and/or" is an associative relationship that describes an object, meaning that there may be three relationships. For example, a and/or B, represent: a or B, or, A and B.
The term "corresponding" may refer to an association or binding relationship, and the correspondence between a and B refers to an association or binding relationship between a and B.
Surface defects of the IGBT chip (for example, defects such as substrate cracks of the chip, uneven surfaces of the chip, and surface dirt of the chip) affect the performance of the IGBT chip, and surface defect detection is required in the production process of the IGBT chip.
In the related art, a inspector usually collects images of the IGBT chip by using a microscope, and determines whether a surface of the IGBT chip has a defect by checking the images of the IGBT chip, so as to detect the surface defect of the IGBT chip. However, in the related art, a manner of manually checking the image of the IGBT chip to detect whether the surface of the IGBT chip has a defect is adopted, so that the detection efficiency is low.
In view of this, the embodiments of the present disclosure provide a method, an apparatus, a device, and a storage medium for detecting an IGBT chip, where when detecting an IGBT chip, the apparatus for detecting an IGBT chip may automatically identify an image of the surface of the IGBT chip, without a detection person observing the image of the surface of the IGBT chip through a microscope, to determine whether the surface of the IGBT chip has a defect, thereby improving the detection efficiency of the surface of the IGBT chip.
Referring to fig. 1 and fig. 2, an embodiment of the disclosure provides a detection apparatus for an IGBT chip, where the apparatus includes a feeding module 1, a detection module 2, a buffer review module 3, and a discharging module 4.
In the embodiment of the disclosure, when detecting the IGBT chips, the IGBT chips to be detected are transported and circulated in the detection device according to the sequence of "feeding module 1-detection module 2-buffer review module 3-discharging module 4".
In the embodiment of the disclosure, the detection module 2 is integrated with a 2D camera and a 3D camera, and images of the IGBT chip are acquired through the 2D camera and the 3D camera respectively in the process of detecting the IGBT chip by the detection module 2. The 2D camera collects plane images of the IGBT chips from two dimensions, and the 3D camera collects images of the IGBT chips from three dimensions, so that the images of the IGBT chips more clearly reflect the conditions of the surfaces of the IGBT chips. In addition, the detection module 2 is integrated with an image recognition model, which may be an image recognition algorithm model.
In the embodiment of the disclosure, the buffer review module 3 is further integrated with a code reader, a microscope and a display device, and the code reader, the microscope and the review display device are arranged at the review position. The code reader is used for reading the identification of the IGBT chip at the rechecking position, the microscope is used for automatically positioning the defect position of the unqualified IGBT chip at the rechecking position, and the display equipment is used for displaying the detection result of the IGBT chip to a detector and displaying the image of the IGBT chip to the detector.
Based on the detection device of the IGBT chip shown in fig. 1 and fig. 2, the embodiment of the disclosure provides a detection method of the IGBT chip, and in combination with the detection device shown in fig. 3, the method includes:
s31, when the IGBT chips placed by the detection personnel are detected by the feeding module, the IGBT chips are conveyed to the detection module by the feeding module.
S32, the detection module collects and stores detection images of the IGBT chip.
S33, the detection module judges whether the IGBT chip is qualified or not by identifying the detection image of the IGBT chip so as to generate a detection result.
S34, the detection module conveys the detected IGBT chips to the cache rechecking module.
And S35, the buffer rechecking module conveys the qualified IGBT chips to the blanking module under the condition that the IGBT chips are qualified.
S36, conveying the IGBT chips without defects to a material taking position by the blanking module.
In the embodiment of the disclosure, when the IGBT chip needs to be detected, a detector can place the IGBT chip to the feeding module, the feeding module conveys the IGBT chip to the detecting module, the detecting module collects the detecting image of the IGBT chip, and whether the IGBT chip is qualified or not can be judged by identifying the detecting image of the IGBT chip so as to generate the detecting result of the IGBT chip. The detection module also conveys the IGBT chips after the image acquisition to the buffer rechecking module, and the buffer rechecking module conveys the qualified IGBT chips to the blanking module. And the blanking module conveys the qualified IGBT chips to a material taking position so that a detector can take the IGBT chips after detection at the material taking position. By adopting the detection method of the IGBT chip, which is provided by the embodiment of the disclosure, the pattern on the surface of the IGBT chip is automatically identified when the IGBT chip is detected, so that the detection efficiency of the surface of the IGBT chip is improved.
Optionally, the detecting module collects a detection image of the IGBT chip, including: and acquiring detection images of the IGBT chip through a 2D camera and a 3D camera respectively. Therefore, the method and the device realize that the images of the IGBT chips are acquired respectively from the two-dimensional dimension and the three-dimensional dimension, so that the images of the IGBT chips more clearly reflect the condition of the surfaces of the IGBT chips.
Optionally, in an embodiment of the present disclosure, in order to distinguish between the detection images and the detection results of different IGBT chips, when the detection module stores the detection images of the IGBT chips, the detection module identifies the identity of the IGBT chips, and stores the identity of the IGBT chips, the detection images, and the detection results in an associated manner.
In this embodiment, since the two-dimensional codes of different IGBT chips are different, the identification of the IGBT chip may be the two-dimensional code of the IGBT chip. Of course, the numbers of different IGBT chips are also different, and the identification of the IGBT chip may also be the number of the IGBT chip. After the detection module recognizes the detection images of the IGBT chips, the images and the detection results of the IGBT chips are required to be stored, and then the detection images and the detection results of the IGBT chips can be better distinguished through the identification of the IGBT chips by carrying out association storage on the identification, the detection images and the detection results of the IGBT chips.
Optionally, in the case that the IGBT chip is not qualified, the buffer rechecking module may convey the failed IGBT chip to the rechecking position. And the microscope at the recheck position can locate the defect position of the failed IGBT chip and collect the recheck image of the defect position of the failed IGBT chip. The cache rechecking module recognizes the identification of the failed IGBT chip through the code reader, acquires the detection image of the failed IGBT chip from the detection module according to the identification of the IGBT chip, and displays the detection image of the failed IGBT chip through the display equipment, so that a detector rechecks the failed IGBT chip based on the detection image of the failed IGBT chip displayed by the display equipment and the rechecking image of the failed IGBT chip defect position acquired by the microscope, and generates a rechecking result.
In this embodiment, when the IGBT chip is not acceptable, it is described that a defect exists on the surface of the IGBT chip. Aiming at the IGBT chips with defects on the surfaces, detection personnel can manually compare the detection images of the unqualified IGBT chips detected by the detection module with the reinspection images of the defect positions of the unqualified IGBT chips acquired by a microscope, and reinspection of the unqualified IGBT chips is realized, so that the detection precision of the surfaces of the IGBT chips is ensured.
Optionally, the cache rechecking module obtains a detection image of the failed IGBT chip from the detection module according to the identification of the IGBT chip, including: the cache rechecking module sends an image acquisition request to the detection module; the image acquisition request carries an identification of the unqualified IGBT chip; the detection module responds to the image acquisition request, and transmits the detection image of the unqualified IGBT chip to the cache rechecking module according to the association relation between the identification of the IGBT chip and the detection image.
In this embodiment, the buffer rechecking module identifies the identity of the IGBT chip through the code reader, and requests the detection module for the detection image of the IGBT chip based on the identity of the IGBT chip, so that the detection module can transmit the detection image corresponding to the IGBT chip to the buffer rechecking module according to the correspondence between the identity of the IGBT chip and the detection image. Therefore, the situation that the cache rechecking module acquires the image abnormality of the IGBT chip from the detection module is avoided.
Optionally, after the re-inspection of the failed IGBT chip is completed, the buffer re-inspection module transfers the re-inspected IGBT chip to the blanking module, so that the blanking module transfers the re-inspected IGBT chip to the material taking position.
Optionally, after the re-inspection of the failed IGBT chip is finished, the cache re-inspection module acquires the detection result of the failed IGBT chip from the detection module according to the identification of the IGBT chip, and judges whether the re-inspection result and the detection result of the failed IGBT chip are the same; if the detection results are different, the cache rechecking module modifies the detection results into rechecking results and sends rechecking images of the unqualified IGBT chips to the detection module; the detection module iteratively trains the image recognition model through the rechecked images of the unqualified IGBT chips so as to update an algorithm library of the image recognition model in the detection module.
In this embodiment, after the re-inspection of the failed IGBT chip is completed, if the re-inspection result of the failed IGBT chip is qualified, it is indicated that the detection result of the IGBT chip by the detection module is incorrect, or that the detection of the IGBT chip by the detection module is not comprehensive enough. At this time, the buffer rechecking module can modify the detection result into a rechecking result, so that the detection device of the whole IGBT chip outputs a correct detection result. In addition, after the detection result is modified, the image recognition model of the detection module can be iteratively trained through the rechecked image of the unqualified IGBT chip so as to update an algorithm library of the image recognition model in the detection module. Therefore, the detection algorithm in the detection module is perfected, and the detection accuracy of the detection module is improved. In addition, when the image recognition model of the detection module is subjected to iterative training, a training process can be manually intervened. For example, the detection module may further acquire a training condition preset by a user, and perform iterative training by combining the training condition and the review image.
As shown in fig. 4, the embodiment of the present disclosure provides another method for detecting IGBT chips, which is described from the perspective of batch detecting a plurality of IGBT chips, and the method is applied to the apparatus for detecting IGBT chips of the above embodiment, and includes:
s41, when the feeding module detects a plurality of IGBT chips placed by a detector, the feeding module splits the IGBT chips and conveys the IGBT chips to the detection module.
S42, the detection module respectively collects images of all the IGBT chips through the 2D camera and the 3D camera, and identifies the identification of each IGBT chip.
S43, the detection module judges whether each IGBT chip is qualified or not by identifying the detection image of each IGBT chip so as to generate a detection result of each IGBT chip.
S44, the detection module conveys each detected IGBT chip to the cache rechecking module, and the identification, the detection image and the detection result of the IGBT chip are stored in a correlated mode.
S45, the buffer rechecking module conveys the qualified IGBT chips to the blanking module under the condition that the IGBT chips are qualified.
S461, the buffer rechecking module conveys the unqualified IGBT chips to the rechecking position under the condition that the IGBT chips are unqualified and the image recognition is completed by the plurality of IGBT chips.
S462, positioning the defect position of the unqualified IGBT chip by a microscope of the buffer memory rechecking module, and collecting rechecking images of the defect position of the unqualified IGBT chip.
S463, the cache rechecking module recognizes the identification of the unqualified IGBT chip through the code reader.
S464, the cache rechecking module sends an image acquisition request to the detection module according to the identification of the IGBT chip; the image acquisition request carries the identification of the unqualified IGBT chip.
S465, the detection module responds to the image acquisition request and transmits the detection image of the unqualified IGBT chip to the cache rechecking module according to the association relation between the identification of the IGBT chip and the detection image.
And S466, the cache rechecking module displays the detection image of the failed IGBT chip through the display equipment, so that a inspector rechecks the failed IGBT chip based on the detection image of the failed IGBT chip displayed by the display equipment and the rechecked image of the failed IGBT chip defect position acquired by the microscope, and a rechecking result is generated.
S47, the cache rechecking module acquires the detection result of the unqualified IGBT chip from the detection module according to the identification of the IGBT chip, and judges whether the rechecking result and the detection result of the unqualified IGBT chip are the same.
S48, under the condition that the rechecking result and the detection result of the unqualified IGBT chip are different, the cache rechecking module modifies the detection result into a rechecking result and sends the rechecking image of the unqualified IGBT chip to the detection module.
S49, the detection module iteratively trains the image recognition model through the retest image of the unqualified IGBT chip so as to update an algorithm library of the image recognition model in the detection module.
S50, the buffer memory rechecking module conveys the IGBT chips subjected to rechecking to the blanking module.
S51, conveying the IGBT chips after detection to a material taking position by the blanking module.
By adopting the detection method of the IGBT chips, batch detection of the IGBT chips is realized when the surfaces of a plurality of IGBT chips are detected, and the detection efficiency of the surfaces of the IGBT chips is further improved.
As shown in connection with fig. 5, an embodiment of the present disclosure provides an electronic device 500 including a processor (processor) 100 and a memory (memory) 101. Optionally, the electronic device 500 may also include a communication interface (Communication Interface) 102 and a bus 103. The processor 100, the communication interface 102, and the memory 101 may communicate with each other via the bus 103. The communication interface 102 may be used for information transfer. The processor 100 may call logic instructions in the memory 101 to perform the method of detecting IGBT chips of the above-described embodiments.
Further, the logic instructions in the memory 101 described above may be implemented in the form of software functional units and may be stored in a computer readable storage medium when sold or used as a stand alone product.
The memory 101 is a computer readable storage medium that can be used to store a software program, a computer executable program, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure. The processor 100 executes the functional application and the data processing by executing the program instructions/modules stored in the memory 101, that is, implements the method for detecting the IGBT chip in the above-described embodiment.
The memory 101 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, at least one application program required for a function; the storage data area may store data created according to the use of the terminal device, etc. Further, the memory 101 may include a high-speed random access memory, and may also include a nonvolatile memory.
Embodiments of the present disclosure provide a storage medium storing computer-executable instructions configured to perform the above-described method of detecting an IGBT chip.
The storage medium may be a transitory computer readable storage medium or a non-transitory computer readable storage medium.
Embodiments of the present disclosure may be embodied in a software product stored on a storage medium, including one or more instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of a method according to embodiments of the present disclosure. And the aforementioned storage medium may be a non-transitory storage medium including: a plurality of media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or a transitory storage medium.
The above description and the drawings illustrate embodiments of the disclosure sufficiently to enable those skilled in the art to practice them. Other embodiments may involve structural, logical, electrical, process, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. Moreover, the terminology used in the present application is for the purpose of describing embodiments only and is not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a," "an," and "the" (the) are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, when used in this application, the terms "comprises," "comprising," and/or "includes," and variations thereof, mean that the stated features, integers, steps, operations, elements, and/or components are present, but that the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof is not precluded. Without further limitation, an element defined by the phrase "comprising one …" does not exclude the presence of other like elements in a process, method or apparatus comprising such elements. In this context, each embodiment may be described with emphasis on the differences from the other embodiments, and the same similar parts between the various embodiments may be referred to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method sections disclosed in the embodiments, the description of the method sections may be referred to for relevance.
Those of skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. The skilled artisan may use different methods for each particular application to achieve the described functionality, but such implementation should not be considered to be beyond the scope of the embodiments of the present disclosure. It will be clearly understood by those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, which are not repeated herein.
In the embodiments disclosed herein, the disclosed methods, articles of manufacture (including but not limited to devices, apparatuses, etc.) may be practiced in other ways. For example, the apparatus embodiments described above are merely illustrative, and for example, the division of the units may be merely a logical function division, and there may be additional divisions when actually implemented, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. In addition, the coupling or direct coupling or communication connection shown or discussed with each other may be through some interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form. The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to implement the present embodiment. In addition, each functional unit in the embodiments of the present disclosure may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. In the description corresponding to the flowcharts and block diagrams in the figures, operations or steps corresponding to different blocks may also occur in different orders than that disclosed in the description, and sometimes no specific order exists between different operations or steps. For example, two consecutive operations or steps may actually be performed substantially in parallel, they may sometimes be performed in reverse order, which may be dependent on the functions involved. Each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

Claims (8)

1. A method for detecting an IGBT chip, the method being applied to a detection device for an IGBT chip, the device comprising: the device comprises a feeding module, a detection module, a cache rechecking module and a discharging module; the cache rechecking module is integrated with a code reader, a microscope and display equipment, and the code reader, the microscope and the display equipment are arranged at the rechecking position; the method comprises the following steps:
when the feeding module detects the IGBT chips placed by the detection personnel, the feeding module conveys the IGBT chips to the detection module;
the detection module collects and stores detection images of the IGBT chips, judges whether the IGBT chips are qualified or not by identifying the detection images of the IGBT chips so as to generate detection results, and conveys the detected IGBT chips to the cache rechecking module; wherein, detection module stores the detection image of IGBT chip, includes: the detection module recognizes the identification of the IGBT chip and stores the identification, the detection image and the detection result of the IGBT chip in an associated manner;
the buffer rechecking module conveys the qualified IGBT chips to the blanking module under the condition that the IGBT chips are qualified; the blanking module conveys qualified IGBT chips to a material taking position;
the buffer memory rechecking module conveys the unqualified IGBT chips to a rechecking position under the condition that the IGBT chips are unqualified; positioning the defect position of the unqualified IGBT chip by a microscope, and collecting a reinspection image of the defect position of the unqualified IGBT chip; the cache rechecking module recognizes the identification of the failed IGBT chip through the code reader, acquires the detection image of the failed IGBT chip from the detection module according to the identification of the IGBT chip, and displays the detection image of the failed IGBT chip through the display equipment, so that a detector rechecks the failed IGBT chip based on the detection image of the failed IGBT chip displayed by the display equipment and the rechecking image of the failed IGBT chip defect position acquired by the microscope, and generates a rechecking result.
2. The method of claim 1, wherein the detection module is integrated with a 2D camera and a 3D camera; the detection module gathers the detection image of IGBT chip, includes:
and acquiring detection images of the IGBT chip through a 2D camera and a 3D camera respectively.
3. The method of claim 1, wherein the cache rechecking module obtains a detection image of the failed IGBT chip from the detection module according to the identification of the IGBT chip, comprising:
the cache rechecking module sends an image acquisition request to the detection module; the image acquisition request carries an identification of the unqualified IGBT chip;
the detection module responds to the image acquisition request, and transmits the detection image of the unqualified IGBT chip to the cache rechecking module according to the association relation between the identification of the IGBT chip and the detection image.
4. The method of claim 1, wherein after generating the review result, the method further comprises:
and the buffer memory rechecking module conveys the rechecked IGBT chips to the blanking module so that the blanking module conveys the rechecked IGBT chips to the material taking position.
5. The method of claim 1, wherein after generating the review result, the method further comprises:
the cache rechecking module acquires the detection result of the unqualified IGBT chip from the detection module according to the identification of the IGBT chip, and judges whether the rechecking result and the detection result of the unqualified IGBT chip are the same;
if the detection results are different, the cache rechecking module modifies the detection results into rechecking results and sends rechecking images of the unqualified IGBT chips to the detection module;
the detection module iteratively trains the image recognition model through the rechecked images of the unqualified IGBT chips so as to update an algorithm library of the image recognition model in the detection module.
6. The device is characterized by comprising a feeding module, a detection module, a cache rechecking module and a discharging module; the cache rechecking module is integrated with a code reader, a microscope and display equipment, and the code reader, the microscope and the display equipment are arranged at the rechecking position; wherein:
the feeding module is used for conveying the IGBT chips to the detection module when detecting the IGBT chips placed by the detection personnel;
the detection module is used for collecting and storing detection images of the IGBT chips, judging whether the IGBT chips are qualified or not by identifying the detection images of the IGBT chips so as to generate detection results, and conveying the detected IGBT chips to the cache rechecking module; when the detection module stores the detection image of the IGBT chip, the detection module is specifically used for: identifying the identification of the IGBT chip, and carrying out association storage on the identification, the detection image and the detection result of the IGBT chip;
the buffer memory rechecking module is used for conveying the qualified IGBT chips to the blanking module under the condition that the IGBT chips are qualified; the blanking module is used for conveying qualified IGBT chips to a material taking position;
the buffer memory rechecking module is also used for conveying the failed IGBT chips to the rechecking position under the condition that the IGBT chips are failed; positioning the defect position of the unqualified IGBT chip by a microscope, and collecting a reinspection image of the defect position of the unqualified IGBT chip; the cache rechecking module recognizes the identification of the failed IGBT chip through the code reader, acquires the detection image of the failed IGBT chip from the detection module according to the identification of the IGBT chip, and displays the detection image of the failed IGBT chip through the display equipment, so that a detector rechecks the failed IGBT chip based on the detection image of the failed IGBT chip displayed by the display equipment and the rechecking image of the failed IGBT chip defect position acquired by the microscope, and generates a rechecking result.
7. An electronic device comprising a processor and a memory storing program instructions, characterized in that the processor is configured to perform the method of detecting an IGBT chip according to any one of claims 1 to 5 when running the program instructions.
8. A storage medium storing program instructions that, when executed, perform the method of detecting an IGBT chip according to any one of claims 1 to 5.
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