CN212752226U - Resonator with thermistor - Google Patents

Resonator with thermistor Download PDF

Info

Publication number
CN212752226U
CN212752226U CN202022017524.5U CN202022017524U CN212752226U CN 212752226 U CN212752226 U CN 212752226U CN 202022017524 U CN202022017524 U CN 202022017524U CN 212752226 U CN212752226 U CN 212752226U
Authority
CN
China
Prior art keywords
thermistor
substrate
base plate
pad
resonator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202022017524.5U
Other languages
Chinese (zh)
Inventor
李小菊
谢俊超
赖强波
刘龙泽
张剑锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interquip Electronics Shenzhen Co ltd
Shenzhen Shenshan Special Cooperation Zone Yingdali Electronic Technology Co ltd
Original Assignee
Interquip Electronics Shenzhen Co ltd
Shenzhen Shenshan Special Cooperation Zone Yingdali Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interquip Electronics Shenzhen Co ltd, Shenzhen Shenshan Special Cooperation Zone Yingdali Electronic Technology Co ltd filed Critical Interquip Electronics Shenzhen Co ltd
Priority to CN202022017524.5U priority Critical patent/CN212752226U/en
Application granted granted Critical
Publication of CN212752226U publication Critical patent/CN212752226U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

The utility model relates to a take thermistor's syntonizer, including first pad, second pad, thermistor structure, first base plate, third base plate, base, oscillator and upper cover, first pad is fixed in the one side of first base plate, and the thermistor structure is fixed in the another side of first base plate, and third base plate a side lid fits the thermistor structurally, and the second pad is fixed to the another side of third base plate, and on the upper cover lid fitted the base, the oscillator is fixed in between base and the upper cover. The substrate and the thermistor are processed together, so that the whole processing procedure of the thermistor resonator is reduced, the processing time of the thermistor resonator is shortened, equipment and materials required by assembling the thermistor are omitted, and the dropping loss cost of the thermistor in the subsequent process can be reduced.

Description

Resonator with thermistor
Technical Field
The utility model belongs to the technical field of the syntonizer, especially, relate to take thermistor's syntonizer.
Background
With the development of electronic technology, more and more applications require that the temperature frequency deviation characteristic of the quartz crystal is smaller, and the resonator with the thermistor is accepted by the market due to lower production cost and high temperature characteristic precision. The conventional resonator structure with a thermistor is generally that a groove is formed in the bottom of a substrate, a welding pad for welding the thermistor is arranged in the groove, and the substrate and a metal shell are sealed and welded to form a cavity for accommodating a vibrator to form a quartz crystal resonator. The structure needs to be added with a thermistor assembly process, namely, after the crystal is assembled, the thermistor is assembled, solder paste is needed when the thermistor is assembled, and chip mounter equipment needs to be added to place the thermistor in a substrate groove. Appearance inspection equipment is needed after the welding of the thermistor to detect whether the welding of the thermistor meets the requirements, and the processing method consumes more time and materials.
Disclosure of Invention
The utility model provides a take thermistor's syntonizer for solve among the prior art unable high-efficient processing take thermistor's technical problem.
The utility model discloses a take thermistor's syntonizer, including resonance monomer and base plate subassembly, base plate subassembly includes first pad, second pad, thermistor structure, first base plate and third base plate, first pad is fixed in the one side of first base plate, the thermistor structure is fixed in the another side of first base plate, third base plate a side lid fits the thermistor is structural, the another side of third base plate is fixed the second pad, the resonance monomer welds on first pad or second pad.
Preferably, the resonance unit comprises an upper cover, a vibrator and a base, the upper cover covers the base, and the vibrator is fixed between the base and the upper cover.
Preferably, the thermistor structure includes a first circuit board and a thermistor integrated on the first circuit board, and the first circuit board is fixed to one surface of the first substrate.
Preferably, the resonator further includes a second substrate, the second substrate is disposed between the first substrate and the third substrate, and the second substrate is provided with an opening through which the thermistor can extend.
Preferably, the first substrate and the second substrate are fixedly connected through a first conductive connecting piece.
Preferably, the second substrate and the third substrate are fixedly connected through a second conductive connecting member.
Preferably, the first substrate, the second substrate and the third substrate are made of a ceramic material or an acetylene material.
From the aforesaid the embodiment of the utility model provides a can know, the thermistor syntonizer of this scheme forms the base plate subassembly through directly printing thermistor between first base plate and third base plate, then with the resonance monomer welding that has processed alone together to form the syntonizer of taking thermistor. The base plate subassembly of this scheme forms with the independent processing respectively of resonance monomer, and the setting of first pad and second pad can also make things convenient for the welding of resonance monomer on arbitrary pad. The scheme completes the processing of the substrate and the thermistor together, reduces the whole processing procedure of the thermistor resonator, shortens the processing time of the thermistor resonator, saves equipment and materials required by the thermistor assembly, and can also reduce the dropping loss cost of the thermistor in the subsequent process.
Drawings
In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is an exploded view of a thermistor resonator according to the present invention.
Description of the main element symbols:
10. a first substrate; 20. a second substrate; 30. a third substrate; 40. a first pad; 50. a second pad; 60. a thermistor structure; 70. a base; 80. a vibrator; 90. an upper cover; 601. a first circuit board; 602. a thermistor.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the drawings in the embodiments of the present invention are combined to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, the utility model discloses a take syntonizer of thermistor 602, including base plate subassembly and resonance monomer, the base plate subassembly includes first pad 40, second pad 50, thermistor structure 60, first base plate 10 and third base plate 30, the resonance monomer includes base 70, oscillator 80 and upper cover 90, first pad 40 is fixed in the one side of first base plate 10, thermistor structure 60 is fixed in the another side of first base plate 10, third base plate 30 a side lid fits on thermistor structure 60, the fixed second pad 50 of another side of third base plate 30, upper cover 90 covers on base 70, oscillator 80 is fixed in between base 70 and the upper cover 90.
Compared with the prior art, the thermistor 602 resonator of the present embodiment forms a substrate assembly by directly printing the thermistor 602 between the first substrate 10 and the third substrate 30, and then welding the substrate assembly with the separately processed resonance unit, thereby forming a resonator with a thermistor. The base plate subassembly of this scheme forms with the single processing alone respectively of resonance, and the setting of first pad 40 and second pad 50 can also make things convenient for the welding of resonance monomer on arbitrary pad. The scheme completes the processing of the substrate and the thermistor 602 together, reduces the whole processing procedure of the thermistor 602 resonator, shortens the processing working hours of the thermistor 602 resonator, saves equipment and materials required by the assembly of the thermistor 602, and can also reduce the dropping loss cost of the thermistor 602 in the subsequent process.
The structure is that a substrate assembly with heat sensitivity is processed separately, as shown in the left part of the figure 1, and the processed structure has bonding pads on two sides; the resonance single body is also processed separately, as shown in the right part of fig. 1, the vibrator 80 is fixed on the base 70, the upper cover 90 covers the base 70 to form an independent resonance single body, and then the resonance single body is integrally fixed on the first bonding pad or the second bonding pad; after these two parts all processed alone, weld the syntonizer to taking the thermosensitive base plate on, can realize this novel structure, the benefit of this scheme lies in that two parts process alone, detect alone, use to detect qualified monomer rewelding, reducible material yield loss.
In the present embodiment, the thermistor structure 60 includes a first circuit board 601 and a thermistor 602 integrated on the circuit board, and the circuit board is fixed on one side of the first substrate 10. The thermistor 602 is electrically connected to the first circuit board 601, the first circuit board 601 is electrically connected to the conductive connecting member of the first substrate 10, the first substrate 10 is electrically connected to the second substrate 20 through the conductive connecting member, and the processing material of the thermistor 602 includes: two or more metal oxides of manganese, copper, silicon, cobalt, iron, nickel, zinc, etc. are fully mixed to form slurry. In this embodiment, the thermistor 602 is printed on the first circuit board 601, and then sintered to form the thermistor 602 with desired characteristics.
In this embodiment, the resonator further includes a second substrate 20, the second substrate 20 is disposed between the first substrate 10 and the third substrate 30, and the second substrate 20 is formed with an opening for the thermistor 602 to extend out. The thermistor 602 protrudes from the first circuit board 601, and the opening is formed to prevent the thermistor 602 from being crushed or damaged.
In the present embodiment, the first substrate 10 and the second substrate 20 are fixedly connected by a first conductive connecting member. The second substrate 20 and the third substrate 30 are fixedly connected by a second conductive connecting member. The first substrate 10, the second substrate 20 and the third substrate 30 are all provided with through holes for connecting the upper and lower surfaces, and the conductive connecting members are arranged in the through holes, so that the connection of the upper and lower surfaces can be realized, and the connection between the substrates can also be realized.
In this embodiment, the first substrate 10, the second substrate 20, and the third substrate 30 are made of a ceramic material or an electro-carbide material. The first substrate 10, the second substrate 20, and the third substrate 30 are generally made of a semiconductor made of ceramic or carbide, and the upper cover 90 is generally made of metal or ceramic.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
Above is the description to the technical scheme that the utility model provides, to technical personnel in the field, according to the utility model discloses the thought of embodiment all has the change part on concrete implementation and range of application, to sum up, this description content should not be understood as the restriction of the utility model.

Claims (7)

1. The utility model provides a take resonator of thermistor, its characterized in that, includes resonance monomer and base plate subassembly, base plate subassembly includes first pad, second pad, thermistor structure, first base plate and third base plate, first pad is fixed in the one side of first base plate, the thermistor structure is fixed in the another side of first base plate, third base plate one side lid fits the thermistor is structural, the another side of third base plate is fixed the second pad, the resonance monomer welds on first pad or second pad.
2. The resonator with the thermistor according to claim 1, wherein the resonance unit includes an upper cover, a vibrator, and a base, the upper cover is covered on the base, and the vibrator is fixed between the base and the upper cover.
3. The thermistor resonator of claim 1, characterized in that the thermistor structure comprises a first circuit board and a thermistor integrated on the first circuit board, the first circuit board being fixed to one side of the first substrate.
4. The resonator with the thermistor according to claim 3, further comprising a second substrate disposed between the first substrate and the third substrate, the second substrate having an opening for the thermistor to protrude.
5. The thermistor resonator of claim 4, characterized in that the first substrate and the second substrate are fixedly connected by a first conductive connection.
6. The thermistor resonator of claim 4, characterized in that the second substrate and the third substrate are fixedly connected by a second conductive connection.
7. The resonator with the thermistor according to claim 4, characterized in that the first substrate, the second substrate and the third substrate are made of a ceramic material or an electro-carbide material.
CN202022017524.5U 2020-09-15 2020-09-15 Resonator with thermistor Active CN212752226U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022017524.5U CN212752226U (en) 2020-09-15 2020-09-15 Resonator with thermistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022017524.5U CN212752226U (en) 2020-09-15 2020-09-15 Resonator with thermistor

Publications (1)

Publication Number Publication Date
CN212752226U true CN212752226U (en) 2021-03-19

Family

ID=74991573

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022017524.5U Active CN212752226U (en) 2020-09-15 2020-09-15 Resonator with thermistor

Country Status (1)

Country Link
CN (1) CN212752226U (en)

Similar Documents

Publication Publication Date Title
JP2004166230A (en) Piezoelectric oscillator and portable telephone and electronic device using it
CN100581053C (en) Ceramic package, assembled substrate, and manufacturing method therefor
JP2000049560A (en) Crystal oscillator
CN212752226U (en) Resonator with thermistor
JP3525076B2 (en) Surface mount type temperature compensated crystal oscillator
CN101777883A (en) All-metal material packaged type quartz-crystal resonator and preparation process thereof
JP2000353919A (en) Surface mounted crystal oscillator
CN212785291U (en) Resonator with thermistor
CN212969584U (en) Resonator with thermistor
US6452460B2 (en) Surface mounting quartz-crystal oscillator
JPH08250615A (en) Ceramic package for semiconductor chip
CN212785290U (en) Resonator with thermistor
CN112087210B (en) Thermistor resonator and manufacturing method thereof
CN211457100U (en) Quartz resonator base with built-in thermistor
JP2000349555A (en) Surface mount crystal oscillator
JP2000134037A (en) Surface mount crystal oscillator
CN220421788U (en) Ultrathin quartz crystal resonator
JP4847804B2 (en) Piezoelectric vibrator
CN212909454U (en) Resonator convenient to seal welding
JP2851745B2 (en) Electronic component storage package
CN214014203U (en) Tuning fork packaging body and tuning fork resonator
CN214959470U (en) Quartz resonator base structure
CN220553992U (en) Quartz crystal resonator with high stability of impedance change
JPH0645468A (en) Package for storing electronic part
JP7120941B2 (en) Substrate for RFID tag, RFID tag and RFID system

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant