CN112087210B - Thermistor resonator and manufacturing method thereof - Google Patents
Thermistor resonator and manufacturing method thereof Download PDFInfo
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- CN112087210B CN112087210B CN202010967001.9A CN202010967001A CN112087210B CN 112087210 B CN112087210 B CN 112087210B CN 202010967001 A CN202010967001 A CN 202010967001A CN 112087210 B CN112087210 B CN 112087210B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 172
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000007787 solid Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 15
- 239000013078 crystal Substances 0.000 description 8
- 239000010453 quartz Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000003466 welding Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 206010057040 Temperature intolerance Diseases 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0407—Temperature coefficient
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention relates to a thermistor resonator and a manufacturing method thereof, wherein the thermistor resonator comprises a first substrate, a second substrate, a first bonding pad, a thermistor structure, a vibrator and an upper cover, wherein the bonding pad is covered on the first substrate, the first substrate is electrically connected with the second substrate through a conductive connecting piece, the thermistor structure is covered between the first substrate and the second substrate, the upper cover is covered on the second substrate, and the vibrator is fixed between the upper cover and the second substrate. The thermistor resonator of the invention completes the processing of the substrate and the thermistor together, reduces the whole processing procedure of the thermistor resonator, shortens the processing time of the thermistor resonator, saves equipment and materials required by assembling the thermistor, and can also reduce the cost of the dropping loss of the thermistor in the subsequent process.
Description
Technical Field
The invention belongs to the technical field of resonators, and particularly relates to a thermistor resonator and a manufacturing method thereof.
Background
With the development of electronic technology, more and more applications require that the temperature characteristics of quartz crystals can be more accurate, and resonators with thermistors are accepted by the market due to lower production cost and high temperature characteristic accuracy. The bottom of a base is usually provided with a groove, a welding pad for welding the thermistor is arranged in the groove, and the base and a metal shell are sealed and welded to form a cavity for accommodating a vibrator to form a quartz crystal resonator. The structure needs to be added with a thermistor assembly process, namely, after the crystal is assembled, the thermistor is assembled, solder paste is needed when the thermistor is assembled, and chip mounter equipment needs to be added to place the thermistor in a base groove. Appearance inspection equipment is needed after the welding of the thermistor to detect whether the welding of the thermistor meets the requirements, and the processing method consumes more time and materials.
Disclosure of Invention
The invention provides a thermistor resonator and a manufacturing method thereof, which are used for solving the technical problem that the resonator with a thermistor cannot be efficiently processed in the prior art.
The invention discloses a thermistor resonator in a first aspect, which comprises a first substrate, a second substrate, a first bonding pad, a thermistor structure, a vibrator and an upper cover, wherein the bonding pad is covered on the first substrate, the first substrate is electrically connected with the second substrate through a conductive connecting piece, the thermistor structure is covered between the first substrate and the second substrate, the upper cover is covered on the second substrate, and the vibrator is fixed between the upper cover and the second substrate.
Preferably, the resonator further includes a third substrate, the third substrate is a hollow frame structure, the third substrate is disposed between the second substrate and the upper cover, and the second substrate, the third substrate and the upper cover enclose a cavity for accommodating the oscillator.
Preferably, the resonator further includes a third substrate, a second pad, and a base, where the third substrate is a solid plate structure, the base and the pad cover the third substrate, the base and the upper cover enclose a cavity for accommodating the oscillator, and the base is welded to the first pad or the second pad.
Preferably, the resonator further includes a glue dispensing member and a second circuit board, and the glue dispensing member and the second circuit board are printed on the second substrate.
Preferably, the thermistor structure includes a first circuit board and a thermistor integrated on the first circuit board, the first circuit board is fixed on the first substrate or the second substrate, and a resistor display hole for accommodating the thermistor is formed in the first substrate or the second substrate.
The second aspect of the present invention discloses a method for manufacturing a thermistor resonator, which is used for manufacturing the thermistor resonator, and includes:
s1, forming a first pad on the first surface of the first substrate;
s2, forming a thermistor structure on the second surface of the first substrate;
s3, fixing a second substrate on the second surface of the first substrate through a conductive connecting piece;
and S4, fixing a vibrator on the second substrate and covering the second substrate with a cover to form the thermistor resonator.
Preferably, in step S2, the method includes:
s21, forming a resistance display hole on the second substrate, and printing a first circuit board on the second surface of the first substrate;
and S22, printing a thermistor on the first circuit board through a thermistor processing material, and enabling the thermistor to extend into the resistor display hole.
Preferably, in step S3, the method includes:
s31, respectively punching holes at corresponding positions of the first substrate and the second substrate, filling metal slurry into the holes, and sintering to form a conductive connecting hole;
and S32, realizing the conductive fixation of the first substrate and the second substrate by using the positions of the conductive connecting holes on the first substrate and the positions of the conductive connecting holes on the second substrate as corresponding standards.
Preferably, after step S3, the method further includes:
and S5, fixing a third substrate on the second substrate through a conductive connecting piece, wherein the third substrate is of a hollow frame structure or a solid plate structure, and the upper cover covers the third substrate.
Preferably, after step S3, the method further includes:
and S6, printing a dispensing piece and a second circuit board on the second substrate, wherein the vibrator is fixed on the dispensing piece and the second circuit board.
It can be seen from the above embodiments of the present invention that the thermistor is directly printed between the first substrate and the second substrate to form the base, and then the vibrator is mounted between the base and the upper cover to form the resonator with the thermistor.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a thermistor resonator according to a fourth embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a thermistor resonator according to a first embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a thermistor resonator according to a second embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a thermistor resonator according to a third embodiment of the invention;
FIG. 5 is a schematic flow diagram of a thermistor resonator according to the present invention.
Description of the main element symbols:
10. a first substrate; 20. a second substrate; 30. a third substrate; 301. a fourth substrate; 40. a first pad; 50. a second pad; 60. a thermistor structure; 70. dispensing a glue piece; 80. a vibrator; 90. an upper cover; 601. a first circuit board; 602. a thermistor; 701. a second circuit board.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention discloses a thermistor 602 resonator, which comprises a first substrate 10, a second substrate 20, a first bonding pad 40, a thermistor structure 60, a vibrator 80 and an upper cover 90, wherein the bonding pad covers the first substrate 10, the first substrate 10 is electrically connected with the second substrate 20 through a conductive connecting piece, the thermistor structure 60 covers the first substrate 10 and the second substrate 20, the upper cover 90 covers the second substrate 20, and the vibrator 80 is fixed between the upper cover 90 and the second substrate 20.
Compared with the prior art, the thermistor 602 resonator of the invention forms the base by directly printing the thermistor 602 between the first substrate 10 and the second substrate 20, and then the vibrator 80 is arranged between the base and the upper cover 90, thereby forming the resonator with the thermistor 602.
In the embodiment, the thermistor structure 60 includes a first circuit board 601 and a thermistor 602 integrated on the first circuit board 601, the first circuit board 601 is fixed on the first substrate 10 or the second substrate 20, and a resistor display hole for accommodating the thermistor 602 is formed on the first substrate 10 or the second substrate 20.
The thermistor 602 is electrically connected to the first circuit board 601, the first circuit board 601 is electrically connected to the conductive connector of the first substrate 10, the first substrate 10 is electrically connected to the second substrate 20 through the conductive connector, and the second substrate 20 is electrically connected to the vibrator 80, so that the electrical connection relationship between the thermistor 602 and the vibrator 80 and the first pad 40 is realized.
The resonator of the present invention further includes a third substrate 30, and the third substrate 30 has a hollow frame structure or a solid plate structure. When the third substrate 30 is a hollow frame structure, the first embodiment and the second embodiment can be implemented; when the third substrate 30 is a solid plate-type structure, the third embodiment and the fourth embodiment can be realized.
Specifically, referring to fig. 2, in the first embodiment of the present invention, the third substrate 30 is a hollow frame structure, the second substrate 20, the third substrate 30 and the upper cover 90 enclose a cavity for accommodating the vibrator 80, the first circuit board 601 is fixed on the second substrate 20, and the first substrate 10 is provided with a resistor display hole, so as to ensure that the thermistor 602 can normally extend out and be prevented from being squeezed, and simultaneously, the bottom of the thermistor 602 can be viewed, so that the thermistor 602 can be conveniently detected from the bottom.
Referring to fig. 3, unlike the first embodiment, the first circuit board 601 of the second embodiment is fixed on the first substrate 10, the second substrate 20 is provided with a resistor display hole, the thermistor 602 extends from the second substrate 20, and before the upper cover 90 is mounted, the thermistor 602 is in an internal visible structure, which can also facilitate the detection, as shown in fig. 3.
Specifically, referring to fig. 4, in the third embodiment of the present invention, the third substrate 30 is a solid plate structure, the first circuit board 601 is fixed on the first substrate 10, the resistor display hole is formed on the second substrate 20, the thermistor 602 protrudes from the second substrate 20, and the thermistor 602 is invisible due to the shielding of the third substrate 30, so as to form a hidden resonator, and at this time, the fourth substrate 301 in the form of a hollow frame structure is further disposed on the third substrate 30, so as to accommodate the vibrator 80, as shown in fig. 4.
Referring to fig. 1, in the first, second and third embodiments, the resonator further includes a dispensing element 70 and a second circuit board 702, and the dispensing element 70 and the second circuit board 702 are printed on the second substrate 20. The adhesive dispensing member 70 and the second circuit board 702 are used for electrically connecting the thermistor 602 and the vibrator 80, so that the performance of the resonator can be more stable.
Unlike the first embodiment, the third substrate 30 of the fourth embodiment is a solid plate structure, and the resonator further includes a base 81 and a second pad 50. The base 81 and the cover 90 enclose a cavity for accommodating the vibrator 80 and form a resonance unit, and the second pad 50 covers the surface of the third substrate 30. The first pads 40, the second pads 50, the thermistor structure 60, the first substrate 10, the second substrate 20, and the third substrate 30 are combined to form a substrate assembly, as shown in fig. 1. The structure is that a substrate assembly with heat sensitivity is processed separately, as shown in the left part of the figure 1, and the processed structure has bonding pads on two sides; the resonance single body is also processed separately, as shown in the right part of fig. 1, the vibrator 80 is fixed on the base 81, the upper cover 90 covers the base 81 to form an independent resonance single body, and then the resonance single body is integrally fixed on the first bonding pad or the second bonding pad; after these two parts all processed alone, weld the syntonizer to taking the thermosensitive base plate on, can realize this novel structure, the benefit of this scheme lies in that two parts process alone, detect alone, use to detect qualified monomer rewelding, reducible material yield loss.
Referring to fig. 5, a second aspect of the present invention discloses a method for manufacturing a thermistor 602 resonator, which is used for manufacturing the thermistor 602 resonator, and includes:
s1, forming first pads 40 on the first surface of the first substrate 10;
specifically, the first pads 40 are formed by printing a metal paste on the first substrate 10, and the second pads 50 are formed by the same method.
S2, forming a thermistor structure 60 on the second surface of the first substrate 10; in this embodiment, the thermistor structure 60 is not limited to be printed on the first substrate 10, and may also be printed on the second substrate 20.
The method specifically comprises the following steps:
s21, forming a resistance display hole on the second substrate 20, and printing the first circuit board 601 on the second surface of the first substrate 10; the first circuit board 601 is also printed on the first substrate 10 using a metal paste.
S22, the thermistor 602 is printed on the first circuit board 601 by using the processing material of the thermistor 602, and the thermistor 602 is inserted into the resistor display hole.
The thermistor 602 processing materials useful in the present invention include: two or more metal oxides of manganese, copper, silicon, cobalt, iron, nickel, zinc, etc. are fully mixed to form slurry. In this embodiment, the thermistor 602 is printed on the first circuit board 601, and then sintered to form the thermistor 602 with desired characteristics.
S3, fixing the second substrate 20 on the second surface of the first substrate 10 through the conductive connection; the second substrate 20 and the third substrate 30 are also electrically connected by a conductive connection.
The method specifically comprises the following steps:
s31, respectively punching holes at corresponding positions of the first substrate 10 and the second substrate 20, filling metal slurry into the holes, and sintering to form a conductive connecting hole;
s32, fixing the first substrate 10 and the second substrate 20 by using the positions of the conductive connection holes on the first substrate 10 and the positions of the conductive connection holes on the second substrate 20 as corresponding standards.
The conductive connection hole may be a hollow tubular structure or a solid cylindrical structure, as long as the conductive connection of the upper and lower surfaces of the first substrate 10 and the electrical connection between the substrates can be achieved.
After step S3, the method further includes:
the third substrate 30 is fixed on the second substrate 20 by a conductive connecting member, wherein the third substrate 30 is a hollow frame structure or a solid plate structure, and the upper cover 90 covers the third substrate 30.
When the third substrate 30 is a frame structure, the thermistor 602 protrudes from the second substrate 20, and the thermistor 602 is an internal visible structure before the upper cover 90 is mounted. When the third substrate 30 is a solid plate structure, the thermistor 602 cannot be seen, thereby forming a hidden resonator.
If the third substrate 30 is a solid plate structure, after step S5, the method further includes: the second pad 50 is formed on the third substrate 30. And welding the quartz crystal resonator through the second bonding pad 50 to form the resonator with the thermistor. The structure is that the substrate with the thermistor is processed separately, and after the substrate is processed, the substrate is of a structure with welding pads on two sides; the quartz crystal resonator is also processed separately, as shown in the right part of the figure 1, the quartz crystal resonator component part is shown, 70 is a base 81 of the resonator, 80 is a vibrator, and 90 is an upper cover of the quartz crystal resonator; after these two parts are all processed alone, weld the quartz crystal syntonizer to taking thermistor's base plate on, can realize this novel structure, the benefit is that two parts are processed alone, detects alone, uses to detect qualified monomer rewelding, reducible material yield loss.
In order to stably fix the vibrator 80 without using the second bonding pad, it is necessary to further print a dispensing member 70 on the second substrate 20, and to electrically connect the vibrator 80 to other components through the second circuit board 701, as shown in fig. 2 to 4.
S4, vibrator 80 is fixed to second substrate 20, and cover 90 is closed, thereby forming thermistor 602 resonator.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to the related descriptions of other embodiments.
In view of the above description of the technical solutions provided by the present invention, those skilled in the art will recognize that there may be variations in the technical solutions and the application ranges according to the concepts of the embodiments of the present invention, and in summary, the content of the present specification should not be construed as limiting the present invention.
Claims (6)
1. A thermistor resonator is characterized by comprising a first substrate, a second substrate, a first bonding pad, a thermistor structure, a vibrator and an upper cover, wherein the first bonding pad covers the first surface of the first substrate, the second surface of the first substrate is electrically connected with the second substrate through a conductive connecting piece, the thermistor structure covers between the first substrate and the second substrate, the upper cover is arranged on the second substrate, and the vibrator is fixed between the upper cover and the second substrate;
the resonator further comprises a third substrate, a second bonding pad and a base, wherein the third substrate is of a solid plate type structure, the base and the second bonding pad are covered on the third substrate, and a cavity for accommodating the oscillator is formed by the base and the upper cover in a surrounding mode; the first bonding pad, the second bonding pad, the thermistor structure, the first substrate, the second substrate, and the third substrate are combined to form a substrate assembly; the vibrator is fixed on the base, and the upper cover covers the base to form a resonance single body; the resonance unit is welded on the substrate assembly and forms the thermistor resonator;
the second substrate is provided with a resistor display hole for accommodating the thermistor conveniently, and the resonance unit is positioned on the second bonding pad.
2. A thermistor resonator according to claim 1, characterized in that the thermistor structure comprises a first circuit board and a thermistor integrated on the first circuit board, the first circuit board being fixed on the first or second substrate.
3. A method of manufacturing a thermistor resonator for use in manufacturing a thermistor resonator according to claim 1 or 2, comprising:
s1, forming a first pad on the first surface of the first substrate;
s2, forming a thermistor structure on the second surface of the first substrate;
and S3, fixing a second substrate on the second surface of the first substrate through a conductive connecting piece.
4. The method of manufacturing a thermistor resonator according to claim 3, characterized by comprising, in step S2:
s21, forming a resistance display hole on the second substrate, and printing a first circuit board on the second surface of the first substrate;
and S22, printing a thermistor on the first circuit board through a thermistor processing material, and enabling the thermistor to extend into the resistor display hole.
5. The method of manufacturing a thermistor resonator according to claim 3, characterized by comprising, in step S3:
s31, respectively punching holes at corresponding positions of the first substrate and the second substrate, filling metal slurry into the holes, and sintering to form a conductive connecting hole;
and S32, realizing the conductive fixation of the first substrate and the second substrate by using the positions of the conductive connecting holes on the first substrate and the positions of the conductive connecting holes on the second substrate as corresponding standards.
6. The method of manufacturing a thermistor resonator according to claim 3, further comprising after step S3:
and S5, fixing a third substrate on the second substrate through a conductive connecting piece, wherein the third substrate is of a solid plate type structure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010967001.9A CN112087210B (en) | 2020-09-15 | 2020-09-15 | Thermistor resonator and manufacturing method thereof |
| PCT/CN2020/118045 WO2022056953A1 (en) | 2020-09-15 | 2020-09-27 | Thermistor resonator and manufacturing method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010967001.9A CN112087210B (en) | 2020-09-15 | 2020-09-15 | Thermistor resonator and manufacturing method thereof |
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| CN112087210A CN112087210A (en) | 2020-12-15 |
| CN112087210B true CN112087210B (en) | 2022-09-09 |
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| JP2004320417A (en) * | 2003-04-16 | 2004-11-11 | Toyo Commun Equip Co Ltd | Temperature compensated piezoelectric oscillator |
| JP5339681B2 (en) * | 2007-02-21 | 2013-11-13 | 日本電波工業株式会社 | Surface mount crystal unit |
| JP6618675B2 (en) * | 2014-07-30 | 2019-12-11 | セイコーエプソン株式会社 | Vibrating device, electronic device, and moving object |
| CN208353307U (en) * | 2018-06-04 | 2019-01-08 | 台晶(宁波)电子有限公司 | A kind of thermo-responsive resonator of multi-layer ceramics metal sintering |
| CN211457101U (en) * | 2020-03-10 | 2020-09-08 | 杭州鸿星电子有限公司 | Quartz resonator base with external thermistor |
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| WO2022056953A1 (en) | 2022-03-24 |
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