CN211457100U - Quartz resonator base with built-in thermistor - Google Patents
Quartz resonator base with built-in thermistor Download PDFInfo
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- CN211457100U CN211457100U CN202020287423.7U CN202020287423U CN211457100U CN 211457100 U CN211457100 U CN 211457100U CN 202020287423 U CN202020287423 U CN 202020287423U CN 211457100 U CN211457100 U CN 211457100U
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Abstract
The utility model relates to a quartz resonator technical field, concretely relates to quartz resonator base of built-in thermistor, include: the back surface and the side wall of the substrate are provided with conductive grooves, conductive circuits communicated with an inner electrode, an outer electrode and a middle electrode are printed, the front surface of the substrate is provided with two layers, a first groove is arranged on the upper layer, a second groove is arranged on the lower layer, the first groove is used for mounting a quartz wafer, and the second groove is used for mounting the thermistor; the cover plate is covered on the substrate and forms a cavity with the substrate; and the seal welding ring is arranged at the joint of the substrate and the cover body and is used for packaging the quartz resonator base. The utility model not only reduces the whole thickness of the product, but also simplifies the base structure, so that the product is more miniaturized; and meanwhile, the distance between the thermistor and the quartz wafer is further shortened, and the frequency stability of the product is improved.
Description
Technical Field
The utility model relates to a quartz resonator technical field especially relates to a quartz resonator base of built-in thermistor.
Background
The quartz product is an indispensable electronic component as the heart of the current electronic equipment, the navigation receiving terminal basically uses a temperature compensation crystal oscillator or a thermosensitive crystal resonator, and the rapid development of the current 5G mobile phone, a driving auxiliary system, an automatic driving automobile and the like inevitably brings a large amount of market demands of the products in the future. The global supply quantity of temperature compensation crystal oscillator products used for the navigation and positioning functions of the high-precision temperature compensation crystal oscillator is short, and the price of the temperature compensation crystal oscillator is expensive; for this reason, manufacturers tend to develop a multifunctional integrated circuit, which uses only one heat-sensitive crystal resonator, and replaces the conventional crystal and crystal oscillator, and in order to adapt to the market, the quartz resonator is specially developed by our company.
On the other hand, the trend of short, short and light is always the development direction of quartz products, the current mainstream market sizes of crystal resonators are 2.5 × 2.0mm thermosensitive crystals and 2.0 × 1.6mm thermosensitive crystals, in order to adapt to the development direction in the future, i choose to design a smaller-size 1.6 × 1.2mm thermosensitive crystal resonator, the core part of the thermosensitive crystal resonator is a quartz wafer and a thermistor, and the mounting base is one of the most important components, and the design and manufacture of the base are particularly important.
The existing quartz resonator with the built-in thermistor has a more complex base structure, smaller distribution space and stricter mechanical wiring among layers, so that the processing technology is more complex, the thicknesses of the layers are easily uneven after the layers are stacked, and the phenomena of air leakage and bubbling are easily caused after packaging, so that the quartz resonator has high requirements on the technology, the temperature, the equipment and the like, and the product yield is lower.
Disclosure of Invention
In order to solve the technical problem, the utility model provides a quartz resonator base of built-in thermistor.
The utility model provides a technical problem can adopt following technical scheme to realize:
a quartz resonator base with a built-in thermistor, comprising:
the back surface and the side wall of the substrate are provided with conductive grooves, conductive circuits communicated with an inner electrode, an outer electrode and a middle electrode are printed, the front surface of the substrate is provided with a first layer and a second layer, a first groove is formed in the first layer, a second groove is formed in the second layer, the first groove is used for mounting a quartz wafer, and the second groove is used for mounting the thermistor;
the cover plate is covered on the substrate and forms a cavity with the substrate;
and the seal welding ring is arranged at the joint of the outer ring of the substrate and the cover plate.
Preferably, the inner electrode is disposed in the first groove, the middle electrode is disposed in the second groove, and the outer electrode is disposed on the back surface of the substrate.
Preferably, the conductive groove on the back surface of the substrate is disposed at a corner of the substrate, and the conductive groove on the sidewall of the substrate is disposed on a sidewall edge of the substrate.
Preferably, the internal electrode comprises a first positive electrode and a first negative electrode which are set at intervals, and the first positive electrode and the first negative electrode are correspondingly connected with the two electrodes of the quartz wafer.
Preferably, the middle electrode comprises a second positive electrode and a second negative electrode, and the second positive electrode and the second negative electrode are arranged in the second groove and connected with the thermistor.
Preferably, the outer electrode includes a plurality of pads distributed in a corner matrix, and the pads include at least a first pad, a second pad, a third pad and a fourth pad.
Preferably, the substrate is provided with a plurality of through holes for connecting the inner electrode and the outer electrode.
Preferably, the seal welding ring is provided with the through hole for connecting the cover plate with the outer electrode.
Preferably, the first positive electrode is connected with the third bonding pad through the conductive circuit, the through hole and the conductive groove, the first negative electrode is connected with the first bonding pad through the through hole and the conductive groove, the second positive electrode is connected with the fourth bonding pad through the conductive circuit and the conductive groove, the second negative electrode is connected with the second bonding pad through the conductive circuit and the conductive groove, and the second bonding pad is communicated with the cover plate through the conductive groove and the through hole.
Preferably, the quartz resonator base is packaged by adopting seam edge rolling welding.
The beneficial effects are that:
the utility model directly arranges the grooves for mounting the quartz wafer and the thermistor on the substrate, thereby not only reducing the overall thickness of the product and simplifying the structure of the base, but also making the product more miniaturized; further shorten thermistor and quartz chip's distance simultaneously, improve the frequency stability of product, just the utility model discloses electrical property is good, rational in infrastructure, workable.
Drawings
Fig. 1 is a structural diagram of a quartz resonator base with a built-in thermistor according to the present invention;
FIG. 2 is a diagram of a base structure according to an embodiment of the present invention;
FIG. 3 is a diagram of a back structure of a base according to an embodiment of the present invention;
FIG. 4 is a structural view of a seal ring according to an embodiment of the present invention;
fig. 5 is a structural diagram of the front layout of the inner electrodes according to an embodiment of the present invention;
FIG. 6 is a structural diagram of the reverse arrangement of the inner electrode according to an embodiment of the present invention;
fig. 7 is a front view of a substrate according to an embodiment of the present invention;
FIG. 8 is a schematic view of a reverse side of a substrate according to an embodiment of the present invention;
fig. 9 is a diagram illustrating a distribution structure of pads according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
The present invention will be further described with reference to the accompanying drawings and specific embodiments, but the present invention is not limited thereto.
Referring to fig. 1-3, the present invention provides a structure diagram of a quartz resonator base with a built-in thermistor 5, including:
the substrate comprises a substrate 1, wherein conductive grooves 13 are formed in the back surface and the side wall of the substrate 1, conductive circuits 14 communicated with an inner electrode 7, an outer electrode 8 and a middle electrode 9 are printed, a first layer and a second layer are arranged on the front surface of the substrate 1, a first groove 11 is formed in the first layer, a second groove 12 is formed in the second layer, the first groove 11 is used for mounting a quartz wafer 4, and the second groove is used for mounting a thermistor 5;
the cover plate 2 is arranged on the substrate 1, and forms a cavity with the substrate 1 after being packaged, so that the quartz crystal sealing design is completed;
a seal welding ring 3 arranged at the joint of the outer ring of the base plate 1 and the cover plate 2,
specifically, since the grooves for mounting the quartz wafer 4 and the thermistor 5 are directly formed in the front surface of the substrate 1, the overall thickness of the product is reduced, the structure of the base is simplified, and the product is more miniaturized; meanwhile, the distance between the thermistor 5 and the quartz wafer 4 is further shortened, and the frequency stability of the product is improved.
Referring to fig. 4, the sealing ring 3 is disposed at the joint of the outer ring of the substrate 1 and the cover 2, and can be used for edge rolling and sealing the cover 2 and the substrate 1, and can also be used as a cavity for mounting a quartz resonator.
Referring to fig. 5 to 8, the internal electrode 7 is disposed in the first groove 11; the middle electrode 8 is arranged in the second groove 12; the external electrode 9 is disposed on the back surface of the substrate 1; the conductive connecting lines are arranged at the corners of the substrates as much as possible.
Specifically, the inner electrode 7 is provided with an inner electrode boss for matching with the conductive adhesive 6 to mount the quartz wafer 4.
Further, the conductive groove 13 on the back surface of the substrate 1 is disposed at the corner of the substrate 1, and the conductive groove 13 on the sidewall of the substrate 1 is disposed on the sidewall edge of the substrate 1.
Specifically, the conductive grooves 13 are disposed on the sidewall edges of the substrate 1 and at the corners of the substrate 1, so that the material usage space and cost can be reduced, and the product can be more miniaturized.
Further, the internal electrode 7 includes a first positive electrode 71 and a first negative electrode 72 that are set at an interval, and the first positive electrode 71 and the first negative electrode 72 are correspondingly connected to the two electrodes of the quartz wafer 4.
Specifically, the first positive electrode 71 and the first negative electrode 72 are correspondingly connected with the two electrodes of the quartz wafer 4, so that the quartz wafer 4 is conducted with the whole circuit, and the quartz wafer 4 can perform the functions thereof.
Further, the middle electrode 8 includes a second positive electrode 81 and a second negative electrode 82, and the second positive electrode 81 and the second negative electrode 82 are disposed in the second groove 12 and connected to the thermistor 5.
Specifically, the second positive electrode 81 and the second negative electrode 82 are disposed in the second groove 12 and connected to the thermistor 5, so that the thermistor 5 is electrically connected to the entire circuit and functions as the thermistor 5.
In the preferred embodiment of the present invention, the thermistor 5 and the quartz chip 4 are layered inside the cavity, so as to shorten the distance between the thermistor 5 and the quartz chip 4 and improve the frequency stability of the product.
Further, the outer electrode 9 includes a plurality of pads distributed in a corner matrix, and the pads include at least a first pad 91, a second pad 92, a third pad 93 and a fourth pad 94.
Referring to fig. 9, the first pad 91, the second pad 92, the third pad 93 and the fourth pad 94 are disposed at corners of the substrate 1 and distributed in a matrix, which is beneficial for leading out and connecting electrodes, and reduces the problems of signal interference between electrodes.
Further, the substrate 1 is provided with a plurality of through holes 10 for connecting the inner electrodes 7 with the outer electrodes 9.
Referring to fig. 4, a structure diagram of the sealing ring according to an embodiment of the present invention is shown, and the sealing ring 3 is provided with a through hole 10 for connecting the cover plate 2 with the outer electrode 92.
Specifically, the substrate 1 and the seal welding ring 3 are provided with through holes 10 for guiding connection lines of electrodes, so that connection operation between circuits is facilitated.
Further, the first positive electrode 71 is connected to the third pad 93 through the conductive trace 14, the through hole 10 and the conductive groove 13, the first negative electrode 72 is connected to the first pad 91 through the through hole 10 and the conductive groove 13, the second positive electrode 81 is connected to the fourth pad 94 through the conductive trace 14 and the conductive groove 13, the second negative electrode 82 is connected to the second pad 92 through the conductive trace 14 and the conductive groove 13, and the second pad 92 is communicated with the cover plate 2 through the conductive groove 13 and the through hole 10.
Specifically, each electrode is led out through the through hole 10 for connection with an external device, and the second pad 92 is communicated with the cover plate 2 through the conductive groove 13 and the through hole 10, thereby playing a role of shielding.
Further, the quartz resonator base is packaged by adopting seam edge rolling welding, and the sealing welding material is designed to be an iron-cobalt-nickel kovar material.
Specifically, the product is packaged by adopting a seam edge rolling welding packaging process, and the packaging material is made of an iron-cobalt-nickel kovar material and is matched with the metal cover plate 2 to realize packaging.
Further, the substrate 1 is made of ceramic.
In conclusion, the groove for mounting the quartz wafer and the thermistor is directly arranged on the substrate, so that the overall thickness of the product is reduced, the structure of the base is simplified, and the product is more miniaturized; further shorten thermistor and quartz chip's distance simultaneously, improve the frequency stability of product, just the utility model discloses electrical property is good, rational in infrastructure, workable.
The above description is only an example of the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and those skilled in the art should be able to realize the equivalent alternatives and obvious variations of the present invention.
Claims (10)
1. A quartz resonator base with a built-in thermistor, comprising:
the back surface and the side wall of the substrate are provided with conductive grooves, conductive circuits communicated with an inner electrode, an outer electrode and a middle electrode are printed, the front surface of the substrate is provided with a first layer and a second layer, a first groove is formed in the first layer, a second groove is formed in the second layer, the first groove is used for mounting a quartz wafer, and the second groove is used for mounting the thermistor;
the cover plate is covered on the substrate and forms a cavity with the substrate;
and the seal welding ring is arranged at the joint of the outer ring of the substrate and the cover plate.
2. The quartz resonator base with a built-in thermistor according to claim 1, characterized in that the inner electrode is disposed in the first recess, the middle electrode is disposed in the second recess, and the outer electrode is disposed on the back surface of the substrate.
3. The quartz resonator base with a built-in thermistor according to claim 1, characterized in that the conductive grooves on the back surface of the substrate are arranged at the corners of the substrate, and the conductive grooves on the side walls of the substrate are arranged on the side wall edges of the substrate.
4. The quartz resonator base with a built-in thermistor according to claim 1, wherein the internal electrode comprises a first positive electrode and a first negative electrode which are arranged at intervals, and the first positive electrode and the first negative electrode are correspondingly connected with the two electrodes of the quartz wafer.
5. A quartz resonator base with a built-in thermistor according to claim 4, characterized in that the middle electrode comprises a second positive electrode and a second negative electrode, and the second positive electrode and the second negative electrode are arranged in the second groove and connected with the thermistor.
6. The quartz resonator base of claim 5, wherein the outer electrode comprises a plurality of pads arranged in a corner matrix, and the pads comprise at least a first pad, a second pad, a third pad and a fourth pad.
7. The quartz resonator base with a built-in thermistor according to claim 6, characterized in that the substrate is provided with a plurality of through holes for connecting the inner electrode and the outer electrode.
8. A thermistor built-in quartz resonator base according to claim 7, characterized in that the sealing ring is provided with the through-hole for connecting the cover plate to the external electrode.
9. The quartz resonator base with a built-in thermistor according to claim 8, wherein the first positive electrode is connected to the third pad through the conductive trace, the through hole and the conductive groove, the first negative electrode is connected to the first pad through the through hole and the conductive groove, the second positive electrode is connected to the fourth pad through the conductive trace and the conductive groove, the second negative electrode is connected to the second pad through the conductive trace and the conductive groove, and the second pad is communicated with the cover plate through the conductive groove and the through hole.
10. The quartz resonator base with a built-in thermistor according to claim 1, characterized in that the quartz resonator base is encapsulated by using a seam edge bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020287423.7U CN211457100U (en) | 2020-03-10 | 2020-03-10 | Quartz resonator base with built-in thermistor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020287423.7U CN211457100U (en) | 2020-03-10 | 2020-03-10 | Quartz resonator base with built-in thermistor |
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| CN211457100U true CN211457100U (en) | 2020-09-08 |
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| CN202020287423.7U Active CN211457100U (en) | 2020-03-10 | 2020-03-10 | Quartz resonator base with built-in thermistor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114505629A (en) * | 2022-03-15 | 2022-05-17 | 哈尔滨工业大学 | Electrode substrate fixing device for welding hemispherical harmonic oscillator and electrode substrate |
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2020
- 2020-03-10 CN CN202020287423.7U patent/CN211457100U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114505629A (en) * | 2022-03-15 | 2022-05-17 | 哈尔滨工业大学 | Electrode substrate fixing device for welding hemispherical harmonic oscillator and electrode substrate |
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Address after: No. 2880, Moganshan Road, Liangzhu street, Yuhang District, Hangzhou, Zhejiang 310000 Patentee after: Hongxing Technology (Group) Co.,Ltd. Address before: No. 2880, Moganshan Road, Liangzhu street, Yuhang District, Hangzhou, Zhejiang 310000 Patentee before: HANGZHOU HOSONIC ELECTRONICS Co.,Ltd. |