CN212695136U - A arrange chip machine for integrated circuit encapsulation - Google Patents
A arrange chip machine for integrated circuit encapsulation Download PDFInfo
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- CN212695136U CN212695136U CN202021584911.0U CN202021584911U CN212695136U CN 212695136 U CN212695136 U CN 212695136U CN 202021584911 U CN202021584911 U CN 202021584911U CN 212695136 U CN212695136 U CN 212695136U
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- electric push
- push rod
- fixing
- rod
- plate
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Abstract
The utility model discloses a arrange mascerating machine for integrated circuit encapsulation, including supporting mechanism, still including fixed establishment, the row's piece mechanism that is used for fixed circuit board, fixed establishment installs on the supporting mechanism, arrange the piece mechanism and install the supporting mechanism top. The utility model discloses a set up fixed establishment, the roof subassembly can be ejecting from fixed frame with the circuit board that processing finishes, so make collecting of circuit board more convenient, through setting up row piece mechanism, electric suction cup can adsorb the chip of different grade type, is applicable to the row piece encapsulation of multiple integrated circuit chip, so improved the practicality of device.
Description
Technical Field
The utility model relates to an integrated circuit processing technology field especially relates to a row mascerating machine for integrated circuit encapsulation.
Background
An integrated circuit is a microelectronic device or component. The transistor, resistor, capacitor and inductor elements and wiring required in a circuit are interconnected together by a certain process, and are manufactured on a small semiconductor wafer or a plurality of small semiconductor wafers or medium substrates, and then are packaged in a package to form the micro-structure with the required circuit function. During the packaging process of the integrated circuit, a chip arranging machine is needed to place the chips on the circuit board at corresponding positions one by one.
The existing sheet arranging machine has the following problems to be solved:
1. the processed circuit board is placed in the fixing frame and is difficult to take out;
2. only a single type of chip can be grabbed, and the using effect is poor.
SUMMERY OF THE UTILITY MODEL
It is an object of the present invention to provide a die bonder for integrated circuit packages to solve the above problems.
The utility model discloses a following technical scheme realizes above-mentioned purpose:
a chip arranging machine for integrated circuit packaging comprises a supporting mechanism, a fixing mechanism for fixing a circuit board and a chip arranging mechanism, wherein the fixing mechanism is installed on the supporting mechanism, and the chip arranging mechanism is installed above the supporting mechanism;
the supporting mechanism comprises a supporting plate, a supporting rod, a bottom plate and an anti-skid pad, wherein the supporting rod is fixed below the supporting plate, the bottom plate is fixed below the supporting rod, and the anti-skid pad is arranged below the bottom plate;
the fixing mechanism comprises a fixing frame and a top plate assembly, and the top plate assembly is arranged on the fixing frame;
the slide arranging mechanism comprises an adjusting box, a motor, a threaded rod, a moving block, a moving rod, a first fixed block, a second electric push rod, a second fixed block, a third electric push rod, a mounting plate and an electric suction disc, wherein the motor is fixed to the front of the adjusting box, the threaded rod is installed inside the adjusting box, the moving block is installed outside the threaded rod, the moving block is fixed above the moving block, the moving rod is installed above the first fixed block, the second electric push rod is installed on the side face of the first fixed block, the second electric push rod is far away from one end of the first fixed block, the second fixed block is installed below the third electric push rod, the mounting plate is fixed below the third electric push rod, and the electric suction disc is installed below the mounting plate.
Preferably, the top plate assembly comprises a fixing frame, a first electric push rod and a lifting plate, the first electric push rod is installed above the fixing frame, the lifting plate is installed above the first electric push rod, the first electric push rod is connected with the fixing frame through bolts, and the lifting plate is welded with the first electric push rod.
Preferably, the top plate assembly comprises a first electric push rod, a lifting plate, fixing rods and fixing plates, the fixing rods are arranged above the fixing plates, the number of the fixing rods is four, the first electric push rod is arranged between the fixing rods, the lifting plate is arranged above the first electric push rod, the fixing rods are welded to the fixing plates, and the first electric push rod is connected with the fixing plates through bolts.
Preferably, the support rod is welded with the support plate, the bottom plate is welded with the support rod, and the non-slip mat is bonded with the bottom plate.
Preferably, the thickness of the fixing frame is 3cm, and the fixing frame is cuboid.
Preferably, the motor is connected with the adjusting box through a bolt, the moving block is connected with the threaded rod through a thread, the moving rod is welded with the moving block, the first fixed block is welded with the moving rod, the second fixed block is welded with the second electric push rod, and the mounting plate is welded with the third electric push rod.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. by arranging the fixing mechanism, the top plate assembly can eject the processed circuit board out of the fixing frame, so that the circuit board is more convenient to collect;
2. through setting up row piece mechanism, electric chuck can adsorb the chip of different grade type, is applicable to the row piece encapsulation of multiple integrated circuit chip, so has improved the practicality of device.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic diagram of a first structure of a die bonder for integrated circuit packages according to the present invention;
fig. 2 is a second structural diagram of a die bonder for integrated circuit packages according to the present invention;
fig. 3 is a schematic diagram of a first internal structure of a chip mounter for integrated circuit packaging according to the present invention;
fig. 4 is a schematic diagram of a second internal structure of a chip mounter for integrated circuit packaging according to the present invention;
fig. 5 is a schematic diagram of a left-side view internal structure of a regulating box in a chip arranging machine for packaging integrated circuits according to the present invention.
The reference numerals are explained below:
1. a support mechanism; 101. a support plate; 102. a support bar; 103. a base plate; 104. a non-slip mat; 2. a fixing mechanism; 201. a fixing frame; 202. a top plate assembly; 2021. a fixed mount; 2022. a first electric push rod; 2023. a lifting plate; 2024. fixing the rod; 2025. a fixing plate; 3. a sheet arranging mechanism; 301. an adjusting box; 302. a motor; 303. a threaded rod; 304. a moving block; 305. a travel bar; 306. a first fixed block; 307. a second electric push rod; 308. a second fixed block; 309. a third electric push rod; 310. mounting a plate; 311. an electric suction cup.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be further explained with reference to the accompanying drawings:
example 1
As shown in fig. 1, fig. 3 and fig. 5, a die bonder for integrated circuit packaging includes a supporting mechanism 1, a fixing mechanism 2 for fixing a circuit board, and a die bonder 3, wherein the fixing mechanism 2 is installed on the supporting mechanism 1, and the die bonder 3 is installed above the supporting mechanism 1;
the supporting mechanism 1 comprises a supporting plate 101, a supporting rod 102, a bottom plate 103 and a non-slip mat 104, wherein the supporting rod 102 is fixed below the supporting plate 101, the bottom plate 103 is fixed below the supporting rod 102, and the non-slip mat 104 is arranged below the bottom plate 103;
the fixing mechanism 2 comprises a fixing frame 201 and a top plate assembly 202, wherein the fixing frame 201 is provided with the top plate assembly 202;
the disc discharging mechanism 3 comprises an adjusting box 301, a motor 302, a threaded rod 303, a moving block 304, a moving rod 305, a first fixed block 306, a second electric push rod 307, a second fixed block 308, a third electric push rod 309, a mounting plate 310 and an electric suction disc 311, wherein the motor 302 is fixed on the front portion of the adjusting box 301, the threaded rod 303 is installed inside the adjusting box 301, the moving block 304 is installed on the outer side of the threaded rod 303, the moving rod 305 is fixed above the moving block 304, the first fixed block 306 is installed above the moving rod 305, the second electric push rod 307 is installed on the side surface of the first fixed block 306, the second fixed block 308 is installed at one end, far away from the first fixed block 306, of the second electric push rod 307, the third electric push rod 309 is installed below the second fixed block 308, the mounting plate 310 is fixed below the third electric push.
The top plate assembly 202 comprises a fixed frame 2021, a first electric push rod 2022 and a lifting plate 2023, the first electric push rod 2022 is installed above the fixed frame 2021, the lifting plate 2023 is installed above the first electric push rod 2022, the first electric push rod 2022 is connected with the fixed frame 2021 through bolts, and the lifting plate 2023 is welded with the first electric push rod 2022; the supporting rod 102 is welded with the supporting plate 101, the bottom plate 103 is welded with the supporting rod 102, and the non-slip mat 104 is bonded with the bottom plate 103; the thickness of the fixing frame 201 is 3cm, and the shape is a cuboid; the motor 302 is connected with the adjusting box 301 through a bolt, the moving block 304 is connected with the threaded rod 303 through a thread, the moving rod 305 is welded with the moving block 304, the first fixing block 306 is welded with the moving rod 305, the second fixing block 308 is welded with the second electric push rod 307, and the mounting plate 310 is welded with the third electric push rod 309.
In the above structure: when the device is used, a chip is placed at a proper position on the supporting plate 101, a circuit board to be packaged is placed in the fixing frame 201, the circuit board is limited and fixed by the fixing frame 201, the motor 302 drives the threaded rod 303 to rotate, the threaded rod 303 drives the moving block 304 to move, the moving block 304 drives the electric suction cup 311 to move back and forth through the moving rod 305, the second electric push rod 307 stretches and drives the electric suction cup 311 to move left and right, the electric suction cup 311 is moved above the corresponding chip, the third electric push rod 309 extends to drive the electric suction cup 311 to descend, the electric suction cup 311 descends to adsorb and fix the chip, similarly, the motor 302 and the second electric push rod 307 cooperate to move the electric suction cup 311 to a corresponding position, the third electric push rod 309 extends to drive the electric suction cup 311 to descend, the electric suction cup 311 is powered off when descending to a certain height, the chip, the chip arrangement operation is completed in this way by multiple cycles, after the circuit board is packaged, the first electric push rod 2022 extends to drive the lifting plate 2023 to ascend, so that the lifting plate 2023 ascends to eject the packaged circuit board in the fixing frame 201, and the fixing frame 2021 effectively supports and fixes the first electric push rod 2022 in the operation process.
Example 2
As shown in fig. 2, 4 and 5, the difference between the embodiment 2 and the embodiment 1 is that the fixing frame 2021 is replaced by a fixing rod 2024 and a fixing plate 2025, and the fixing rod 2024 and the fixing plate 2025 cooperate to effectively support and fix the first electric push rod 2022 during operation.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.
Claims (6)
1. A chip arranging machine for integrated circuit packaging, comprising a support mechanism (1), characterized in that: the circuit board fixing device is characterized by further comprising a fixing mechanism (2) used for fixing a circuit board and a piece arranging mechanism (3), wherein the fixing mechanism (2) is installed on the supporting mechanism (1), and the piece arranging mechanism (3) is installed above the supporting mechanism (1);
the supporting mechanism (1) comprises a supporting plate (101), a supporting rod (102), a bottom plate (103) and a non-slip mat (104), wherein the supporting rod (102) is fixed below the supporting plate (101), the bottom plate (103) is fixed below the supporting rod (102), and the non-slip mat (104) is arranged below the bottom plate (103);
the fixing mechanism (2) comprises a fixing frame (201) and a top plate assembly (202), wherein the top plate assembly (202) is arranged on the fixing frame (201);
the disc arranging mechanism (3) comprises an adjusting box (301), a motor (302), a threaded rod (303), a moving block (304), a moving rod (305), a first fixed block (306), a second electric push rod (307), a second fixed block (308), a third electric push rod (309), a mounting plate (310) and an electric sucker (311), wherein the motor (302) is fixed at the front part of the adjusting box (301), the threaded rod (303) is installed inside the adjusting box (301), the moving block (304) is installed on the outer side of the threaded rod (303), the moving rod (305) is fixed above the moving block (304), the first fixed block (306) is installed above the moving rod (305), the second electric push rod (307) is installed on the side surface of the first fixed block (306), and the second fixed block (308) is installed at one end, far away from the first fixed block (306), of the second electric push rod (307), the third electric push rod (309) is installed below the second fixing block (308), the mounting plate (310) is fixed below the third electric push rod (309), and the electric suction cup (311) is installed below the mounting plate (310).
2. The die bonder for integrated circuit packages of claim 1, wherein: the top plate assembly (202) comprises a fixed frame (2021), a first electric push rod (2022) and a lifting plate (2023), the first electric push rod (2022) is installed above the fixed frame (2021), the lifting plate (2023) is installed above the first electric push rod (2022), the first electric push rod (2022) is connected with the fixed frame (2021) through bolts, and the lifting plate (2023) is welded with the first electric push rod (2022).
3. The die bonder for integrated circuit packages of claim 1, wherein: the top plate assembly (202) comprises a first electric push rod (2022), a lifting plate (2023), four fixing rods (2024) and a fixing plate (2025), wherein the fixing rods (2024) are installed above the fixing plate (2025), the number of the fixing rods (2024) is four, the first electric push rod (2022) is arranged between the four fixing rods (2024), the lifting plate (2023) is installed above the first electric push rod (2022), the fixing rods (2024) are welded with the fixing plate (2025), and the first electric push rod (2022) is connected with the fixing plate (2025) through bolts.
4. The die bonder for integrated circuit packages of claim 1, wherein: the supporting rod (102) is welded with the supporting plate (101), the bottom plate (103) is welded with the supporting rod (102), and the non-slip mat (104) is bonded with the bottom plate (103).
5. The die bonder for integrated circuit packages of claim 1, wherein: the thickness of the fixing frame (201) is 3cm, and the fixing frame is cuboid.
6. The die bonder for integrated circuit packages of claim 1, wherein: the motor (302) is connected with the adjusting box (301) through a bolt, the moving block (304) is connected with the threaded rod (303) through a thread, the moving rod (305) is welded with the moving block (304), the first fixing block (306) is welded with the moving rod (305), the second fixing block (308) is welded with the second electric push rod (307), and the mounting plate (310) is welded with the third electric push rod (309).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021584911.0U CN212695136U (en) | 2020-08-04 | 2020-08-04 | A arrange chip machine for integrated circuit encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021584911.0U CN212695136U (en) | 2020-08-04 | 2020-08-04 | A arrange chip machine for integrated circuit encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212695136U true CN212695136U (en) | 2021-03-12 |
Family
ID=74901377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021584911.0U Expired - Fee Related CN212695136U (en) | 2020-08-04 | 2020-08-04 | A arrange chip machine for integrated circuit encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212695136U (en) |
-
2020
- 2020-08-04 CN CN202021584911.0U patent/CN212695136U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210312 Termination date: 20210804 |
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| CF01 | Termination of patent right due to non-payment of annual fee |