CN112271148A - Packaging device applicable to chips with different sizes for chip manufacturing - Google Patents
Packaging device applicable to chips with different sizes for chip manufacturing Download PDFInfo
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- CN112271148A CN112271148A CN202011146481.9A CN202011146481A CN112271148A CN 112271148 A CN112271148 A CN 112271148A CN 202011146481 A CN202011146481 A CN 202011146481A CN 112271148 A CN112271148 A CN 112271148A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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Abstract
The invention discloses a packaging device suitable for chips with different sizes for chip manufacturing. According to the invention, the chip placing mechanism is arranged, the top plate or the ejector rod is used for ejecting the placing plate, the placing plates with different sizes can be replaced, so that the device can be used for packaging chips with different sizes, the pin placing mechanism is arranged, the front and back movement of the placing rod is controlled by the motor, the stability of the placing rod in the use process is ensured while the movement is convenient, the shell can be stably adsorbed and fixed by the cooperation of the vacuum pump, the hose and the sucker through the arrangement of the adsorption mechanism, and the shell can be effectively prevented from falling off in the packaging process.
Description
Technical Field
The invention relates to the technical field of chip manufacturing, in particular to a packaging device which is used for manufacturing chips and is suitable for chips with different sizes.
Background
Chips, also known as microcircuits, microchips. Integrated circuits refer to silicon chips containing integrated circuits, which are small and often part of a computer or other electronic device. After the invention of the transistor is produced in large quantities, various solid semiconductor components such as diodes, transistors and the like are used in large quantities, and the functions and roles of the vacuum tube in the circuit are replaced. By the middle and late 20 th century, semiconductor manufacturing technology advances, making integrated circuits possible. It is a great advance that integrated circuits can integrate a very large number of micro-transistors into a single small chip, as opposed to manually assembling the circuits using individual discrete electronic components.
The packaging device is needed in the process of manufacturing the chip, and the existing packaging device has the following problems to be solved:
1. chips with different sizes cannot be packaged, and the practicability is poor;
2. in order to facilitate the forward and backward movement of the placing rod, the sliding rail and the sliding block are adopted to drive the placing rod to move forward and backward, so that the stability of the placing rod in the using process cannot be ensured;
3. the housing is easily removed during the packaging process, which may cause damage to the chip.
Disclosure of Invention
The present invention is directed to solving the above problems and providing a packaging device for chip manufacturing suitable for chips of different sizes.
The invention realizes the purpose through the following technical scheme:
a packaging device suitable for chips of different sizes for chip manufacturing comprises a moving mechanism, a storage mechanism, a placing mechanism and a collecting mechanism, wherein the storage mechanism is arranged above the moving mechanism;
the moving mechanism comprises an installation rod and a moving wheel, and the moving wheel is installed below the installation rod;
the storage mechanism comprises a storage box, a box door, a groove and a pull plate, wherein the box door is arranged at the front part of the storage box, the groove is formed in the box door, and the pull plate is fixed on the groove;
the placing mechanism comprises a first supporting rod and a placing disc, and the placing disc is fixed above the first supporting rod;
the collecting mechanism comprises a supporting table, a clamping groove, a clamping block and a collecting box, wherein the clamping groove is formed in the supporting table, the collecting box is arranged above the supporting table, and the clamping block is fixed on the collecting box;
the chip placing mechanism comprises a second supporting rod, a limiting component, a placing plate and a limiting block, wherein the limiting component is arranged above the second supporting rod, the placing plate is arranged on the limiting component, and the limiting block is fixed on the placing plate;
the pin placing mechanism comprises two adjusting boxes, motors, lead screws, moving sleeves, moving rods, placing seats, fixing bolts, mounting blocks and placing rods, the motors are fixed at the rear parts of the adjusting boxes, the lead screws are mounted on the motors, the moving sleeves are mounted on the outer sides of the lead screws, the moving rods are fixed above the moving sleeves, the placing seats are fixed at one ends, far away from the moving sleeves, of the moving rods, the fixing bolts are mounted on the placing seats, the mounting blocks are arranged on the inner sides of the placing seats, and the placing rods are fixed between the two mounting blocks;
the adsorption mechanism comprises a bent rod, an installation plate, a vacuum pump, a hose and a sucker, wherein the installation plate is fixed at one end of the bent rod, the vacuum pump is fixed above the installation plate, the hose is installed on the vacuum pump, and the sucker is installed below the hose.
Preferably, the limiting assembly comprises a first transverse plate, a threaded sleeve, a threaded rod, a knob, a top plate and a first limiting seat, the threaded sleeve is fixed on the first transverse plate, the threaded rod is installed on the inner side of the threaded sleeve, the knob is fixed below the threaded rod, the top plate is fixed above the threaded rod, the first limiting seat is fixed above the first transverse plate, the threaded sleeve is welded with the first transverse plate, the threaded rod is connected with the threaded sleeve through threads, the knob is welded with the threaded rod, the top plate is welded with the threaded rod, and the first limiting seat is welded with the first transverse plate.
Preferably, spacing subassembly includes the second diaphragm, the spacing seat of second, the lifting groove, the lifter, the connecting block, the lift post, the ejector pin, second diaphragm top is fixed with the spacing seat of second, be provided with the lifting groove on the spacing seat of second, lifting groove internally mounted has the lifter, the lifter both ends are fixed with the connecting block, one side that the lifter was kept away from to the connecting block is fixed with the lift post, the lifter top is fixed with the ejector pin, the spacing seat of second welds with the second diaphragm, connecting block and lifter welding, the lift post welds with the connecting block, ejector pin and lifter welding.
Preferably, the moving wheel is rotatably connected to the mounting rod.
Preferably, the box door is connected with the storage box through a hinge, and the pull plate is welded with the box door.
Preferably, the placing plate is welded with the first supporting rods, and the number of the first supporting rods is four.
Preferably, the fixture blocks are welded with the collecting box, and the number of the fixture blocks is four.
Preferably, the limiting blocks are welded with the placing plate, the number of the limiting blocks is four, and the limiting blocks are uniformly distributed on the outer side of the placing plate.
Preferably, the motor passes through bolted connection with the regulating box, and the carriage release lever welds with the removal cover, places seat and carriage release lever welding, puts pole and installation piece welding.
Preferably, the mounting plate is welded with the bent rod, and the vacuum pump is connected with the mounting plate through a bolt.
Compared with the prior art, the invention has the following beneficial effects:
1. by arranging the chip placing mechanism and ejecting the placing plate by using the top plate or the ejector rod, the placing plates with different sizes can be replaced, so that the device can package chips with different sizes;
2. by arranging the pin placing mechanism, the front and back movement of the placing rod is controlled by a motor, so that the placing rod is convenient to move and the stability of the placing rod in the using process is ensured;
3. through setting up the adsorption apparatus structure, vacuum pump, hose and sucking disc cooperate jointly and can carry out stable absorption fixedly to the shell, so can effectively avoid the shell to drop at the in-process of encapsulation.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a first structure of a packaging device for manufacturing chips, which is suitable for chips with different sizes according to the present invention;
FIG. 2 is a second structural diagram of a packaging device for manufacturing chips suitable for different sizes according to the present invention;
FIG. 3 is a first front view of an internal structure of a packaging device for manufacturing chips suitable for different sizes according to the present invention;
FIG. 4 is a second front view of an internal structure of a packaging device for manufacturing chips suitable for different sizes according to the present invention;
FIG. 5 is an enlarged first front view of the inner structure of the position limiting component of the packaging device for manufacturing chips and suitable for chips with different sizes;
FIG. 6 is an enlarged second front view of the inner structure of the position limiting component of the packaging device for manufacturing chips and suitable for chips with different sizes;
FIG. 7 is a schematic diagram of a collection box of the packaging device for manufacturing chips suitable for different sizes according to the present invention;
FIG. 8 is a schematic diagram of the top view internal structure of the conditioning box of the packaging device for manufacturing chips suitable for different chip sizes according to the present invention;
fig. 9 is an enlarged view of the packaging device for manufacturing chips according to the invention, which is suitable for chips of different sizes.
The reference numerals are explained below:
1. a moving mechanism; 101. mounting a rod; 102. a moving wheel; 2. a storage mechanism; 201. a storage box; 202. a box door; 203. a groove; 204. pulling a plate; 3. a placement mechanism; 301. a first support bar; 302. placing a tray; 4. a collection mechanism; 401. a support table; 402. a card slot; 403. a clamping block; 404. a collection box; 5. a chip placement mechanism; 501. a second support bar; 502. a limiting component; 50201. a first transverse plate; 50202. a threaded sleeve; 50203. a threaded rod; 50204. a knob; 50205. a top plate; 50206. a first limiting seat; 50207. a second transverse plate; 50208. a second limiting seat; 50209. a lifting groove; 50210. a lifting rod; 50211. connecting blocks; 50212. a lifting column; 50213. a top rod; 503. placing the plate; 504. a limiting block; 6. a pin placing mechanism; 601. an adjusting box; 602. a motor; 603. a lead screw; 604. moving the sleeve; 605. a travel bar; 606. a placing seat; 607. fixing the bolt; 608. mounting blocks; 609. placing the rod; 7. an adsorption mechanism; 701. bending a rod; 702. mounting a plate; 703. a vacuum pump; 704. a hose; 705. and (4) sucking discs.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The invention will be further described with reference to the accompanying drawings in which:
example 1
As shown in fig. 1, 3, 5, 7, 8, and 9, a packaging apparatus for manufacturing chips and suitable for chips of different sizes includes a moving mechanism 1, a storage mechanism 2, a placing mechanism 3, and a collecting mechanism 4, wherein the storage mechanism 2 is installed above the moving mechanism 1, the placing mechanism 3 is installed above the storage mechanism 2, the collecting mechanism 4 is installed on the storage mechanism 2, the chip placing mechanism 5 for placing chips, a pin placing mechanism 6, and an adsorbing mechanism 7 are also included, the chip placing mechanism 5 is arranged between the placing mechanism 3 and the collecting mechanism 4, the pin placing mechanism 6 is arranged above the chip placing mechanism 5, and the adsorbing mechanism 7 is installed above the pin placing mechanism 6;
the moving mechanism 1 comprises a mounting rod 101 and a moving wheel 102, wherein the moving wheel 102 is mounted below the mounting rod 101;
the storage mechanism 2 comprises a storage box 201, a box door 202, a groove 203 and a pull plate 204, wherein the box door 202 is installed at the front part of the storage box 201, the groove 203 is formed in the box door 202, and the pull plate 204 is fixed on the groove 203;
the placing mechanism 3 comprises a first supporting rod 301 and a placing disc 302, wherein the placing disc 302 is fixed above the first supporting rod 301;
the collecting mechanism 4 comprises a support table 401, a clamping groove 402, a clamping block 403 and a collecting box 404, wherein the clamping groove 402 is arranged on the support table 401, the collecting box 404 is arranged above the support table 401, and the clamping block 403 is fixed on the collecting box 404;
the chip placing mechanism 5 comprises a second support rod 501, a limiting component 502, a placing plate 503 and a limiting block 504, wherein the limiting component 502 is arranged above the second support rod 501, the placing plate 503 is arranged on the limiting component 502, and the limiting block 504 is fixed on the placing plate 503;
the pin placing mechanism 6 comprises two adjusting boxes 601, two motors 602, two lead screws 603, two moving sleeves 604, two moving rods 605, a placing seat 606, two fixing bolts 607, two mounting blocks 608 and two placing rods 609, the motors 602 are fixed at the rear part of the adjusting boxes 601, the lead screws 603 are mounted on the motors 602, the moving sleeves 604 are mounted on the outer sides of the lead screws 603, the moving rods 605 are fixed above the moving sleeves 604, the placing seats 606 are fixed at one ends of the moving rods 605 far away from the moving sleeves 604, the fixing bolts 607 are mounted on the placing seats 606, the mounting blocks 608 are arranged on the inner sides of the placing seats 606, and the placing rods 609 are fixed between the two mounting blocks 608;
the adsorption mechanism 7 comprises an elbow rod 701, an installation plate 702, a vacuum pump 703, a hose 704 and a suction cup 705, wherein the installation plate 702 is fixed at one end of the elbow rod 701, the vacuum pump 703 is fixed above the installation plate 702, the hose 704 is installed on the vacuum pump 703, and the suction cup 705 is installed below the hose 704.
The limiting assembly 502 comprises a first transverse plate 50201, a threaded sleeve 50202, a threaded rod 50203, a knob 50204, a top plate 50205 and a first limiting seat 50206, wherein the first transverse plate 50201 is fixedly provided with the threaded sleeve 50202, the threaded rod 50203 is installed on the inner side of the threaded sleeve 50202, the knob 50204 is fixedly arranged below the threaded rod 50203, the top plate 50205 is fixedly arranged above the threaded rod 50203, the first limiting seat 50206 is fixedly arranged above the first transverse plate 50201, the threaded sleeve 50202 is welded with the first transverse plate 50201, the threaded rod 50203 is in threaded connection with the threaded sleeve 50202, the knob 50204 is welded with the threaded rod 50203, the top plate 50205 is welded with the threaded rod 50203, and the first limiting seat 50206 is welded with the first transverse plate 50201; the moving wheel 102 is rotatably connected with the mounting rod 101; the box door 202 is connected with the storage box 201 through a hinge, and the pull plate 204 is welded with the box door 202; the placing disc 302 is welded with the first supporting rods 301, and the number of the first supporting rods 301 is four; the fixture blocks 403 are welded with the collecting box 404, and the number of the fixture blocks 403 is four; the limiting blocks 504 are welded with the placing plates 503, the number of the limiting blocks 504 is four, and the limiting blocks are uniformly distributed on the outer sides of the placing plates 503; the motor 602 is connected with the adjusting box 601 through bolts, the moving rod 605 is welded with the moving sleeve 604, the placing seat 606 is welded with the moving rod 605, and the placing rod 609 is welded with the mounting block 608; the mounting plate 702 is welded to the bent rod 701, and the vacuum pump 703 is connected to the mounting plate 702 by bolts.
In the above structure: when the device is used, a chip is placed in a hollow groove on a placing plate 503, when pin wires need to be installed, a motor 602 drives a lead screw 603 to rotate, the lead screw 603 drives a moving sleeve 604 to move, the moving sleeve 604 drives a placing rod 609 to move through a moving rod 605, the placing rod 609 is moved to a proper position to perform pin wire installation operation, when packaging is needed, a sucker 705 is aligned to a shell, a vacuum pump 703 vacuumizes the sucker 705 through a hose 704, so that the shell is stably fixed on the sucker 705, packaging operation can be performed, when the placing plate 503 with different sizes needs to be replaced, a knob 50204 is rotated, the knob 50204 drives a threaded rod 50203 to rotate, the threaded rod 50203 ascends under the action of a threaded sleeve 50202, the threaded rod 50203 drives a top plate 50205 to ascend, the top plate 05 ascends to eject the placing plate 503 out of a first limit seat 50206, the placing plate 503 with different sizes can be replaced, and when the placing rod 609 needs to be replaced, the mounting block 608 is separated from the placement base 606 by removing the fixing bolt 607, and the placement rod 609 can be replaced with a new one.
Example 2
As shown in fig. 2, 4, 6, 7, 8, and 9, embodiment 2 is different from embodiment 1 in that a first transverse plate 50201, a threaded sleeve 50202, a threaded rod 50203, a knob 50204, a top plate 50205, and a first limit seat 50206 are replaced by a second transverse plate 50207, a second limit seat 50208, a lifting groove 50209, a lifting rod 50210, a connecting block 50211, a lifting column 50212, and a top rod 50213, when a placing plate 503 with a different size needs to be replaced, the lifting column 50212 drives the lifting rod 50210 to ascend, the lifting rod 50210 drives the top rod 50213 to ascend, the top rod 50213 ascends to push the placing plate 503 out of the second limit seat 50208, and thus the placing plate 503 with a different size can be replaced.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (10)
1. The utility model provides a packaging hardware that is applicable to not unidimensional chip for chip manufacturing, includes moving mechanism, storing mechanism, placement machine constructs, collects the mechanism, and storing mechanism is installed to the moving mechanism top, and placement machine constructs the top and installs the mechanism, is provided with collection mechanism, its characterized in that in the storing mechanism: the device also comprises a chip placing mechanism for placing a chip, a pin placing mechanism and an adsorption mechanism, wherein the chip placing mechanism is arranged between the placing mechanism and the collecting mechanism, the pin placing mechanism is arranged above the chip placing mechanism, and the adsorption mechanism is arranged above the pin placing mechanism;
the chip placing mechanism comprises a second supporting rod, a limiting component, a placing plate and a limiting block, wherein the limiting component is arranged above the second supporting rod, the placing plate is arranged on the limiting component, and the limiting block is fixed on the placing plate;
the pin placing mechanism comprises two adjusting boxes, motors, lead screws, moving sleeves, moving rods, placing seats, fixing bolts, mounting blocks and placing rods, the motors are fixed at the rear parts of the adjusting boxes, the lead screws are mounted on the motors, the moving sleeves are mounted on the outer sides of the lead screws, the moving rods are fixed above the moving sleeves, the placing seats are fixed at one ends, far away from the moving sleeves, of the moving rods, the fixing bolts are mounted on the placing seats, the mounting blocks are arranged on the inner sides of the placing seats, and the placing rods are fixed between the two mounting blocks;
the adsorption mechanism comprises a bent rod, an installation plate, a vacuum pump, a hose and a sucker, wherein the installation plate is fixed at one end of the bent rod, the vacuum pump is fixed above the installation plate, the hose is installed on the vacuum pump, and the sucker is installed below the hose.
2. The packaging device for manufacturing chips suitable for chips of different sizes as claimed in claim 1, wherein: the limiting assembly comprises a first transverse plate, a threaded sleeve, a threaded rod, a knob, a top plate and a first limiting seat, the threaded sleeve is fixed on the first transverse plate, the threaded rod is installed on the inner side of the threaded sleeve, the knob is fixed below the threaded rod, the top plate is fixed above the threaded rod, the first limiting seat is fixed above the first transverse plate, the threaded sleeve is welded with the first transverse plate, the threaded rod is in threaded connection with the threaded sleeve, the knob is welded with the threaded rod, the top plate is welded with the threaded rod, and the first limiting seat is welded with the first transverse plate.
3. The packaging device for manufacturing chips suitable for chips of different sizes as claimed in claim 1, wherein: spacing subassembly include the second diaphragm, the spacing seat of second, the lifting groove, the lifter, the connecting block, the lift post, the ejector pin, second diaphragm top is fixed with the spacing seat of second, be provided with the lifting groove on the spacing seat of second, lifting groove internally mounted has the lifter, the lifter both ends are fixed with the connecting block, one side that the lifter was kept away from to the connecting block is fixed with the lift post, the lifter top is fixed with the ejector pin, the spacing seat of second and second diaphragm welding, connecting block and lifter welding, the lift post welds with the connecting block, ejector pin and lifter welding.
4. The packaging device for manufacturing chips suitable for chips of different sizes as claimed in claim 1, wherein: the moving mechanism comprises an installation rod and a moving wheel, the moving wheel is installed below the installation rod, and the moving wheel is rotatably connected with the installation rod.
5. The packaging device for manufacturing chips suitable for chips of different sizes as claimed in claim 1, wherein: the storage mechanism comprises a storage box, a box door, a groove and a pull plate, the box door is installed at the front of the storage box, the groove is formed in the box door, the pull plate is fixed in the groove, the box door is connected with the storage box through a hinge, and the pull plate is welded with the box door.
6. The packaging device for manufacturing chips suitable for chips of different sizes as claimed in claim 1, wherein: the placing mechanism comprises a first supporting rod and a placing disc, the placing disc is fixed above the first supporting rod and welded with the first supporting rod, and the number of the first supporting rods is four.
7. The packaging device for manufacturing chips suitable for chips of different sizes as claimed in claim 1, wherein: the collecting mechanism comprises a supporting table, clamping grooves, clamping blocks and a collecting box, the clamping grooves are formed in the supporting table, the collecting box is arranged above the supporting table, the clamping blocks are fixed on the collecting box, the clamping blocks are welded with the collecting box, and the number of the clamping blocks is four.
8. The packaging device for manufacturing chips suitable for chips of different sizes as claimed in claim 1, wherein: the limiting blocks are welded with the placing plate, the number of the limiting blocks is four, and the limiting blocks are uniformly distributed on the outer side of the placing plate.
9. The packaging device for manufacturing chips suitable for chips of different sizes as claimed in claim 1, wherein: the motor is connected with the adjusting box through a bolt, the moving rod is welded with the moving sleeve, the placing seat is welded with the moving rod, and the placing rod is welded with the mounting block.
10. The packaging device for manufacturing chips suitable for chips of different sizes as claimed in claim 1, wherein: the mounting plate is welded with the bent rod, and the vacuum pump is connected with the mounting plate through bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011146481.9A CN112271148A (en) | 2020-10-23 | 2020-10-23 | Packaging device applicable to chips with different sizes for chip manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011146481.9A CN112271148A (en) | 2020-10-23 | 2020-10-23 | Packaging device applicable to chips with different sizes for chip manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112271148A true CN112271148A (en) | 2021-01-26 |
Family
ID=74341283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011146481.9A Withdrawn CN112271148A (en) | 2020-10-23 | 2020-10-23 | Packaging device applicable to chips with different sizes for chip manufacturing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112271148A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114360631A (en) * | 2022-03-17 | 2022-04-15 | 江苏华存电子科技有限公司 | Detection equipment with positioning adsorption structure for storage chip |
-
2020
- 2020-10-23 CN CN202011146481.9A patent/CN112271148A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114360631A (en) * | 2022-03-17 | 2022-04-15 | 江苏华存电子科技有限公司 | Detection equipment with positioning adsorption structure for storage chip |
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Application publication date: 20210126 |
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