CN212625523U - Monocrystalline silicon packaging equipment for semiconductor wafer processing - Google Patents
Monocrystalline silicon packaging equipment for semiconductor wafer processing Download PDFInfo
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- CN212625523U CN212625523U CN202021836611.7U CN202021836611U CN212625523U CN 212625523 U CN212625523 U CN 212625523U CN 202021836611 U CN202021836611 U CN 202021836611U CN 212625523 U CN212625523 U CN 212625523U
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- semiconductor wafer
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- monocrystalline silicon
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Abstract
The utility model provides a monocrystalline silicon encapsulation equipment for semiconductor wafer processing belongs to semiconductor packaging technical field. The monocrystalline silicon packaging equipment for processing the semiconductor wafer comprises a glue dispenser body, a conveyor, a rotating mechanism and a discharging mechanism. The point gum machine body includes mount, frame, first electric guide rail, second electric guide rail, base, electric putter and some gluey syringe needle, base fixed mounting in frame upper portion, electric putter fixed mounting in first electric guide rail removes the end, some gluey syringe needle fixed mounting in the electric putter output, the conveyer rotate connect in frame one side, slewing mechanism includes the carousel, rotates motor and fixed axle, the fixed slot has evenly been seted up to the carousel. The device can carry out continuous operation through setting up carousel and conveyer in point gum machine body lower part, improves machining efficiency when being convenient for the work piece goes up unloading.
Description
Technical Field
The utility model relates to a semiconductor package technical field particularly, relates to a monocrystalline silicon encapsulation equipment for semiconductor wafer processing.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous process of the wafer is cut into small chips after scribing process, then the cut chips are pasted on the corresponding small island of the substrate (lead frame) frame by glue, and then the bonding pads of the chips are connected to the corresponding pins of the substrate by utilizing superfine metal (gold tin copper aluminum) wires or conductive resin to form the required circuit; and then packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, carrying out finished product testing after packaging, generally carrying out the processes of inspection, testing, packaging and the like, and finally warehousing and shipping.
Currently, a dispenser is generally used for a semiconductor package. The existing semiconductor packaging dispenser is inconvenient to feed and discharge, cannot continuously operate and is low in efficiency.
SUMMERY OF THE UTILITY MODEL
In order to compensate the above deficiency, the utility model provides a monocrystalline silicon encapsulation equipment for semiconductor wafer processing aims at improving the inconvenient and unable continuous operation's of unloading on the semiconductor packaging point gum machine problem.
The utility model discloses a realize like this:
the utility model provides a monocrystalline silicon encapsulation equipment for semiconductor wafer processing includes point gum machine body, conveyer, slewing mechanism and unloading mechanism.
The glue dispenser body comprises a fixing frame, a rack, a first electric guide rail, a second electric guide rail, a base, an electric push rod and a glue dispensing needle head, wherein the first electric guide rail is fixedly installed on the upper portion of the fixing frame, the fixing frame is fixedly installed on the movable end of the second electric guide rail, the second electric guide rail is fixedly installed on the upper portion of the base, the base is fixedly installed on the upper portion of the rack, the electric push rod is fixedly installed on the movable end of the first electric guide rail, and the glue dispensing needle head is fixedly installed on the output end of the electric push rod. The conveyer is rotatably connected to one side of the rack. The rotating mechanism comprises a turntable, a rotating motor and a fixed shaft, fixed grooves are uniformly formed in the turntable, the fixed shaft is fixedly connected to the rack, the turntable is rotatably connected to the fixed shaft, and the rotating motor is fixedly installed on the lower portion of the turntable. The blanking mechanism is fixedly arranged on the upper part of the fixed shaft.
In an embodiment of the present invention, the frame is rotatably connected to a roller, and the outer surface of the roller is slidably connected to a conveyor belt.
The utility model discloses an in the embodiment, frame one side fixed mounting has conveyor motor, conveyor motor output fixed connection in the roller.
The utility model discloses an in one embodiment, two pass through between the roller the conveyer belt transmission is connected, frame both sides fixed mounting has the baffle.
The utility model discloses an in one embodiment, the baffle is located the conveyer belt both sides, carousel bottom side fixedly connected with ring gear.
The utility model discloses an in the embodiment, it has bevel gear to rotate motor output fixed mounting, bevel gear with the ring gear meshing transmission.
The utility model discloses an in the embodiment, unloading mechanism includes cylinder and vacuum chuck, cylinder output fixedly connected with vacuum chuck, fixed axle upper end fixed mounting has the mounting bracket.
The utility model discloses an in one embodiment, cylinder fixed mounting in the mounting bracket, cylinder output end fixed mounting has vacuum generator.
In an embodiment of the present invention, the vacuum generator output end is fixedly connected to the vacuum chuck, and the vacuum chuck is located on the upper portion of the fixing groove.
In an embodiment of the present invention, the turntable is rotatably connected to the frame, and the turntable is located on the upper portion of the conveyor belt.
The utility model has the advantages that: the utility model discloses a monocrystalline silicon encapsulation equipment is used in processing of semiconductor wafer that above-mentioned design obtained, during the use, the fixed slot is seted up to the carousel, carry the work piece to the fixed slot in through the conveyer, it rotates to rotate the motor drive carousel, the work piece rotates along with the fixed slot, the fixed slot rotates to some syringe needle lower part of gluing, it removes to the processing region to glue the syringe needle through first electronic guide rail and the electronic guide rail of second, it pushes down to process to glue the syringe needle through electric putter with some, the carousel rotates and removes the work piece after the processing is accomplished, remove the work piece to the conveyer through unloading mechanism, carry to next manufacturing procedure, the device is through setting up carousel and conveyer in point gum machine body lower part, can carry out the continuity of operation, improve machining efficiency when being convenient for the work piece on.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a monocrystalline silicon packaging apparatus for semiconductor wafer processing according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an embodiment of the present invention providing a first viewing angle;
fig. 3 is a schematic structural diagram of an embodiment of the present invention providing a second viewing angle;
fig. 4 is a schematic structural diagram of a rotating mechanism according to an embodiment of the present invention.
In the figure: 100-a dispenser body; 110-a fixed mount; 120-a frame; 130-a first motorized rail; 150-a second motorized track; 160-a base; 170-electric push rod; 180-dispensing needle heads; 200-a conveyor; 210-a conveying motor; 220-a conveyor belt; 250-a roller; 260-a baffle; 300-a rotation mechanism; 310-a turntable; 311-fixed slots; 318-a ring gear; 330-rotating motor; 340-bevel gears; 350-a fixed shaft; 500-a blanking mechanism; 510-a cylinder; 520-a mounting frame; 530-vacuum chuck; 550-vacuum generator.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Examples
Referring to fig. 1-4, the present invention provides a technical solution: a monocrystalline silicon packaging device for processing a semiconductor wafer comprises a dispenser body 100, a conveyor 200, a rotating mechanism 300 and a blanking mechanism 500.
The dispenser body 100 is fixedly mounted on one side of the conveyor 200, the rotating mechanism 300 is rotatably connected to the conveyor 200, the blanking mechanism 500 is fixedly connected to the rotating mechanism 300, the dispenser body 100 is used for packaging monocrystalline silicon, the conveyor 200 is used for conveying workpieces, the rotating mechanism 300 is used for transferring the workpieces from the conveyor 200 to the lower portion of the dispenser body 100, and the blanking mechanism 500 is used for blanking the workpieces from the rotating mechanism 300.
Referring to fig. 1-3, the dispenser body 100 includes a fixing frame 110, a frame 120, a first electric rail 130, a second electric rail 150, a base 160, an electric push rod 170, and a dispensing needle 180, the first electric rail 130 is fixedly installed on the upper portion of the fixing frame 110, the first electric rail 130 is fixed to the fixing frame 110 by bolts, the fixing frame 110 is fixedly installed on the movable end of the second electric rail 150, the fixing frame 110 is fixed to the movable end of the second electric rail 150 by bolts, so that the movable end of the second electric rail 150 drives the fixing frame 110 to move, the second electric rail 150 is fixedly installed on the upper portion of the base 160, the second electric rail 150 is fixed to the upper portion of the base 160, the base 160 is fixedly installed on the upper portion of the frame 120, the base 160 is fixedly welded to the upper portion of the frame 120, the electric push rod 170 is fixedly installed on the movable end of, the end is removed to first electronic guide rail 130 of being convenient for drives electric putter 170 and removes, and point glue syringe needle 180 fixed mounting is in electric putter 170 output, and point glue syringe needle 180 bolt fastening is in electric putter 170 output, and electric putter 170 of being convenient for drives point glue syringe needle 180 and carries out the up-and-down motion, conveniently carries out the operation of point glue.
Referring to fig. 1-3, a conveyor 200 is rotatably connected to one side of a frame 120, the frame 120 is rotatably connected to rollers 250, a conveyor belt 220 is slidably sleeved on an outer surface of each roller 250, a conveyor motor 210 is fixedly mounted on one side of the frame 120, the conveyor motor 210 is bolted to one side of the frame 120, an output end of the conveyor motor 210 is fixedly connected to the rollers 250, the two rollers 250 are in transmission connection through the conveyor belt 220, baffles 260 are fixedly mounted on two sides of the frame 120, the baffles 260 are bolted to two sides of the frame 120 and are used for preventing a workpiece from dropping and guiding the movement of the workpiece, the baffles 260 are located on two sides of the conveyor belt 220, the output end of the conveyor motor 210 drives the rollers 250.
Referring to fig. 1, 3 and 4, the rotating mechanism 300 includes a rotating plate 310, a rotating motor 330 and a fixed shaft 350, the rotating plate 310 is uniformly provided with fixed slots 311, the fixed shaft 350 is fixedly connected to the frame 120, the fixed shaft 350 is welded and fixed to the frame 120, the rotating plate 310 is rotatably connected to the fixed shaft 350 through a bearing, the rotating motor 330 is fixedly installed at the lower portion of the rotating plate 310, the rotating motor 330 is bolted to the frame 120, the bottom side of the rotating plate 310 is fixedly connected with a gear ring 318, the gear ring 318 is welded and fixed to the bottom side of the rotating plate 310, the output end of the rotating motor 330 is fixedly installed with a bevel gear 340, the bevel gear 340 is in meshing transmission with the gear ring 318 through the output end of the rotating motor 330, the bevel gear 340 is in meshing transmission with, the turntable 310 is rotatably connected to the frame 120, and a half of the turntable 310 is positioned on the upper portion of the conveyor belt 220 to facilitate the movement of the workpiece.
Referring to fig. 1 and 4, the discharging mechanism 500 includes a cylinder 510 and a vacuum chuck 530, the vacuum chuck 530 is fixedly connected to an output end of the cylinder 510, a mounting frame 520 is fixedly mounted on an upper end of the fixing shaft 350, the mounting frame 520 is welded and fixed to an upper end of the fixing shaft 350, the cylinder 510 is fixedly mounted on the mounting frame 520, the cylinder 510 is bolted to the mounting frame 520, a vacuum generator 550 is fixedly mounted to an output end of the cylinder 510, an output end of the vacuum generator 550 is fixedly connected to the vacuum chuck 530, the vacuum chuck 530 is clamped and fixed to an output end of the vacuum generator 550, and the vacuum chuck 530 is located on an upper portion of the.
Specifically, the working principle of the monocrystalline silicon packaging equipment for processing the semiconductor wafer is as follows: when the glue dispensing machine works, the rotary table 310 is provided with a fixed groove 311, the output end of the conveying motor 210 drives the roller 250 to rotate, the roller 250 drives the conveying belt 220 to convey a workpiece, the baffle 260 stops the workpiece from falling off and guides the workpiece to move, the conveyor 200 conveys the workpiece into the fixed groove 311, the output end of the rotating motor 330 drives the bevel gear 340 to rotate, the bevel gear 340 is meshed with the gear ring 318 for transmission to drive the rotary table 310 to rotate, the fixed groove 311 drives the workpiece to move to the outside of the conveying belt 220 for glue dispensing processing, the workpiece rotates along with the fixed groove 311, the fixed groove 311 rotates to the lower part of the glue dispensing needle head 180, the glue dispensing needle head 180 is moved to a processing area through the first electric guide rail 130 and the second electric guide rail 150, the moving end of the first electric guide rail 130 drives the electric push rod 170 to move, the dispensing needle head 180 is pressed down by the electric push rod 170 for processing, the turntable 310 rotates to move the workpiece after the processing is finished, the vacuum chuck 530 is in contact with the workpiece, and the vacuum suction operation is performed on the workpiece through the output end of the vacuum generator 550, so that the workpiece is conveniently moved onto the conveyor 200 and conveyed to the next processing procedure.
It should be noted that the specific model specifications of the first electric rail 130, the second electric rail 150, the electric push rod 170, the conveying motor 210, the rotating motor 330, and the vacuum generator 550 need to be determined according to the actual specification of the device, and the specific model selection calculation method adopts the prior art in the field, and therefore, detailed description is omitted.
The power supply and the principle of the first motor-driven rail 130, the second motor-driven rail 150, the motor-driven push bar 170, the conveying motor 210, the rotating motor 330, and the vacuum generator 550 will be apparent to those skilled in the art and will not be described in detail herein.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A single crystal silicon packaging device for processing a semiconductor wafer is characterized by comprising
The dispensing machine comprises a dispensing machine body (100), wherein the dispensing machine body (100) comprises a fixed frame (110), a rack (120), a first electric guide rail (130), a second electric guide rail (150), a base (160), an electric push rod (170) and a dispensing needle head (180), the first electric guide rail (130) is fixedly installed on the upper portion of the fixed frame (110), the fixed frame (110) is fixedly installed at the moving end of the second electric guide rail (150), the second electric guide rail (150) is fixedly installed on the upper portion of the base (160), the base (160) is fixedly installed on the upper portion of the rack (120), the electric push rod (170) is fixedly installed at the moving end of the first electric guide rail (130), and the dispensing needle head (180) is fixedly installed at the output end of the electric push rod (170);
the conveyor (200), the said conveyor (200) is connected to one side of the said framework (120) rotatably;
the rotating mechanism (300) comprises a rotating disc (310), a rotating motor (330) and a fixed shaft (350), fixed grooves (311) are uniformly formed in the rotating disc (310), the fixed shaft (350) is fixedly connected to the rack (120), the rotating disc (310) is rotatably connected to the fixed shaft (350), and the rotating motor (330) is fixedly arranged on the lower portion of the rotating disc (310);
and the blanking mechanism (500), wherein the blanking mechanism (500) is fixedly arranged on the upper part of the fixed shaft (350).
2. The monocrystalline silicon packaging device for processing the semiconductor wafer is characterized in that the machine frame (120) is rotatably connected with a roller (250), and the outer surface of the roller (250) is sleeved with the conveying belt (220) in a sliding manner.
3. The monocrystalline silicon packaging device for processing the semiconductor wafer is characterized in that a conveying motor (210) is fixedly installed on one side of the machine frame (120), and the output end of the conveying motor (210) is fixedly connected to the roller (250).
4. The monocrystalline silicon packaging device for processing the semiconductor wafer is characterized in that the two rollers (250) are in transmission connection through the conveyer belt (220), and baffles (260) are fixedly arranged on two sides of the rack (120).
5. The single crystal silicon packaging equipment for processing the semiconductor wafer is characterized in that the baffle plates (260) are positioned at two sides of the conveying belt (220), and a gear ring (318) is fixedly connected to the bottom side of the turntable (310).
6. The single crystal silicon packaging equipment for processing the semiconductor wafer is characterized in that a bevel gear (340) is fixedly installed at the output end of the rotating motor (330), and the bevel gear (340) is in meshing transmission with the gear ring (318).
7. The monocrystalline silicon packaging device for processing the semiconductor wafer is characterized in that the blanking mechanism (500) comprises an air cylinder (510) and a vacuum chuck (530), the vacuum chuck (530) is fixedly connected to the output end of the air cylinder (510), and a mounting frame (520) is fixedly mounted at the upper end of the fixed shaft (350).
8. The single crystal silicon packaging device for processing the semiconductor wafer is characterized in that the air cylinder (510) is fixedly arranged on the mounting frame (520), and the output end of the air cylinder (510) is fixedly provided with the vacuum generator (550).
9. The apparatus for packaging a semiconductor wafer processing monocrystalline silicon as claimed in claim 8, wherein an output end of the vacuum generator (550) is fixedly connected to the vacuum chuck (530), and the vacuum chuck (530) is located at an upper portion of the fixing groove (311).
10. The single crystal silicon packaging apparatus for semiconductor wafer processing as claimed in claim 2, wherein the turntable (310) is rotatably connected to the frame (120), and a half of the turntable (310) is located at an upper portion of the conveyor belt (220).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021836611.7U CN212625523U (en) | 2020-08-28 | 2020-08-28 | Monocrystalline silicon packaging equipment for semiconductor wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021836611.7U CN212625523U (en) | 2020-08-28 | 2020-08-28 | Monocrystalline silicon packaging equipment for semiconductor wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212625523U true CN212625523U (en) | 2021-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021836611.7U Active CN212625523U (en) | 2020-08-28 | 2020-08-28 | Monocrystalline silicon packaging equipment for semiconductor wafer processing |
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| Country | Link |
|---|---|
| CN (1) | CN212625523U (en) |
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- 2020-08-28 CN CN202021836611.7U patent/CN212625523U/en active Active
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