CN214452174U - Chip braider - Google Patents
Chip braider Download PDFInfo
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- CN214452174U CN214452174U CN202023215800.5U CN202023215800U CN214452174U CN 214452174 U CN214452174 U CN 214452174U CN 202023215800 U CN202023215800 U CN 202023215800U CN 214452174 U CN214452174 U CN 214452174U
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Abstract
The utility model provides a pair of chip braider, which comprises a frame, chip feeding mechanism, chip transfer mechanism, heat-seal mechanism and detection mechanism, the frame top is equipped with the workstation, chip feeding mechanism installs on the workstation, be equipped with the delivery track that spanes the frame left and right sides on the workstation, place the carrier band in the delivery track, feed mechanism installs in the delivery track rear side, delivery track's top is equipped with heat-seal mechanism, detection mechanism installs the right side at heat-seal mechanism, chip transfer mechanism installs the chip that is used for taking on the chip feeding mechanism in feed mechanism one side, chip feeding mechanism includes the support frame, install the stacker on the support frame, the support frame is fixed on the workstation, the stacker below is equipped with pushing equipment and is used for the propelling movement to place the material pipe in the stacker, pushing equipment sliding connection is on the support frame. The utility model provides a pair of chip braider adopts automatic feeding to carry and braid heat-seal packing, has reduced manual operation, improves production efficiency.
Description
Technical Field
The utility model relates to the technical field of mechanical equipment, specifically a chip braider.
Background
In chip manufacturing process, in order to make the production manufacturing of resistance chip adapt to automated production operation, generally can carry out the braid earlier to the chip and handle, often need unpack the integrated circuit chip that has packed and place after the material loading and take in the braid, be about to the chip is in turn taken in the braid by the adhesion, can arrange a plurality of chips through the braid and adhere on corresponding production tool or location cardboard like this for subsequent chip processing operation of being convenient for. The traditional chip braiding operation is manually operated, the manual braiding operation is high in production efficiency, and the distance between each chip and the braid has large deviation, so that certain influence is brought to subsequent chip processing operation, and processing defective products are easily produced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip braider to solve the technical problem in the background art.
In order to achieve the above object, the present invention provides the following technical solutions:
a chip braider comprises a frame, a chip feeding mechanism, a chip transferring mechanism, a heat sealing mechanism and a detection mechanism, wherein a workbench is arranged above the frame, the chip feeding mechanism is arranged on the workbench, a conveying track stretching across the left side and the right side of the frame is arranged on the workbench, a carrier tape is placed in the conveying track, the feeding mechanism is arranged on the rear side of the conveying track, the heat sealing mechanism is arranged above the conveying track, the detection mechanism is arranged on the right side of the heat sealing mechanism, the chip transferring mechanism is arranged on one side of the chip feeding mechanism and used for taking chips on the chip feeding mechanism, the chip feeding mechanism comprises a support frame and a stacking frame arranged on the support frame, the support frame is fixed on the workbench, a material pushing assembly is arranged below the stacking frame and used for pushing material tubes placed in the stacking frame, and the material pushing assembly is connected to the support frame in a sliding manner, the utility model discloses a chip conveying device, including support frame, chip conveying mechanism, material taking component, material taking pipe, the feed guide rail that the slope set up is installed to one side of support frame, the bottom of feed guide rail is at chip conveying mechanism's rear side, the top of feed guide rail is equipped with gets the material subassembly and is used for taking the material pipe, chip conveying mechanism establishes in the bottom of feed guide rail and in conveying track's top.
The material pushing assembly comprises a material pushing plate and a material pushing cylinder, wherein a material containing groove for containing a material pipe is formed in the material pushing plate, the material containing groove penetrates through the front end and the rear end of the material pushing plate, the material pushing cylinder is fixed on the supporting frame, and the material pushing cylinder drives the material pushing plate to move along the X-axis direction.
The feed guide rail includes mounting panel and feed slide rail, the feed slide rail is fixed on the mounting panel, the mounting panel slope is fixed, the one end and the support frame fixed connection of mounting panel, the other end and the workstation fixed connection of mounting panel, be equipped with the slide in the feed slide rail and be used for carrying the chip, the below of feed slide rail is equipped with first material subassembly of ending, first material subassembly of ending includes that first flitch and the first material cylinder of ending, first material cylinder of ending is installed on the mounting panel, first flitch and the first material cylinder drive of ending are connected, first material board of ending inserts in the slide, the bottom of feed slide rail is equipped with the silo and communicates with each other with the slide, the discharge gate position of going up the silo is equipped with and keeps off the material subassembly and prevent the chip landing.
Get the material subassembly and include the U-shaped supporting seat and get the material cylinder, the supporting seat includes support arm and under bracing arm, it fixes in the mounting panel below to get the material cylinder, the under bracing arm rotation connection of linking arm and supporting seat is passed through in the drive shaft of getting the material cylinder, the one end and the under bracing arm fixed connection of linking arm, its other end through the pivot with get the material cylinder and rotate and be connected, it is rotatory along the pivot to get material cylinder drive supporting seat, it installs the material subassembly of pressing in the top of going up the support arm, press the material subassembly including pressing the material cylinder and pressing the material piece, press the material cylinder to fix on the upper bracing arm, press the material piece to press the material cylinder below and press the material cylinder drive to be connected, it is spacing to be equipped with pressing the material groove on the material piece and be used for carrying out the pressfitting to the material pipe.
One side of pushing away the material subassembly is equipped with the several cushion, the cushion just protrudes the scraping wings outside in the scraping wings below, the cushion with get material subassembly position corresponding, support frame one side is equipped with the case that gathers materials, the case that gathers materials and cushion are in the same one side of support frame.
Keep off material subassembly below and be equipped with the defective products slide rail, the defective products slide rail communicates with each other with the feed slide rail, it includes striker plate and keeps off the material cylinder to keep off the material subassembly, the striker plate is between defective products slide rail and feed slide rail, striker plate and fender material cylinder drive connection, keep off material cylinder and mounting panel fixed connection.
The chip transfer mechanism comprises a fixed seat, a rotary table, a driving motor and a moving material assembly, wherein the fixed seat is installed on the working table, the driving motor is fixed above the fixed seat and is connected with the rotary table in a driving mode, the moving material assembly comprises a moving material connecting seat and a suction nozzle, the suction nozzle is fixed on one side of the moving material connecting seat and above the conveying track, the other side of the moving material connecting seat is connected with the rotary table in a rotating mode through a first connecting shaft, a sliding block assembly is arranged above the moving material connecting seat and comprises a sliding rail and a sliding block, the sliding rail is fixedly connected with the moving material connecting seat, and a second connecting shaft is arranged on the sliding block and is connected with the fixed seat in a rotating mode.
The heat-seal mechanism comprises a heat-seal mounting plate, the heat-seal mounting plate is fixed on the workbench, a hot-press component and a film conveying component are mounted on the heat-seal mounting plate and used for carrying out heat-seal on the carrier band, and the conveying track penetrates through the hot-press component.
The detection mechanism comprises a detection supporting seat and a CCD camera, the CCD camera is fixed above the workbench through the detection supporting seat, and the detection supporting seat is fixed above the heat-seal mounting plate.
Compared with the prior art, the utility model provides a pair of chip braider adopts automatic feeding to carry and braid heat-seal packing, still is equipped with the defective products slide rail and selects the collection to detecting bad product, makes the chip obtain better screening, ensures the off-the-shelf qualification rate of carrier band, has reduced manual operation, improves production efficiency.
Drawings
FIG. 1: a schematic diagram of a three-dimensional structure of a chip braider;
FIG. 2: a front view of the heat sealing mechanism and the detection mechanism;
FIG. 3: a schematic three-dimensional structure diagram of the chip feeding mechanism;
FIG. 4: a top view of the chip feeding mechanism;
FIG. 5: a schematic three-dimensional structure diagram of the pushing assembly;
FIG. 6: a schematic three-dimensional structure of the feeding guide rail;
FIG. 7: fig. 6 is an enlarged view at a;
FIG. 8: a schematic view of a three-dimensional structure of the material taking assembly;
FIG. 9: the chip transfer mechanism has a schematic three-dimensional structure.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Specific example 1: referring to fig. 1 to 9, in an embodiment of the present invention, a chip braider includes a frame 1, a chip feeding mechanism 3, a chip transferring mechanism 12, a heat sealing mechanism 16, and a detecting mechanism 13, a worktable 2 is disposed above the frame 1, the chip feeding mechanism 3 is mounted on the worktable 2, a conveying rail 14 spanning the left and right sides of the frame 1 is disposed on the worktable 2, a carrier tape is disposed in the conveying rail 14, and a conveying mechanism 15 of the carrier tape is disposed on one side of the conveying rail 14 for putting the carrier tape and collecting a carrier tape finished product.
The chip feeding mechanism 3 is arranged on the rear side of the conveying rail 14, the heat sealing mechanism 16 is arranged above the conveying rail 14, the detection mechanism 13 is arranged on the right side of the heat sealing mechanism 16, the chip transfer mechanism 12 is arranged on one side of the chip feeding mechanism 3 and used for taking chips on the chip feeding mechanism 3, the chip feeding mechanism 3 comprises a support frame 4 and a stacking frame 5 arranged on the support frame 4, the support frame 4 is fixed on the workbench 2, a material pushing assembly 6 is arranged below the stacking frame 5 and used for pushing material pipes placed in the stacking frame 5, the material pushing assembly 6 is connected on the support frame 4 in a sliding manner, a feeding guide rail 9 which is arranged in an inclined manner is arranged on one side of the support frame 4, the bottom end of the feeding guide rail 9 is arranged on the rear side of the chip transfer mechanism 12, and a material taking assembly 8 is arranged at the top end of the feeding guide rail 9 and used for taking the material pipes, the chip transfer mechanism 12 is provided at the bottom end of the supply guide 9 above the conveying rail 14.
The pushing assembly 6 comprises a pushing plate 602 and a pushing cylinder 601, the pushing plate 602 is provided with an object placing groove 602-1 for placing a material tube, the object placing groove 602-1 penetrates through the front end and the rear end of the pushing plate 602, the pushing cylinder 601 is fixed on the support frame 4, and the pushing cylinder 601 drives the pushing plate 602 to move along the X-axis direction. The material pushing plate 602 is arranged below the stacking rack 5 and used for receiving the material pipe falling from the stacking rack 5 and then moving the material pipe towards the material taking assembly 8 to convey the material pipe.
The feeding guide rail 9 comprises a mounting plate 901 and a feeding slide rail 902, the feeding slide rail 902 is fixed on the mounting plate 901, the mounting plate 901 is fixed in an inclined manner, one end of the mounting plate 901 is fixedly connected with the support frame 4, the other end of the mounting plate 901 is fixedly connected with the workbench 2, a slide 902-1 is arranged in the feeding slide rail 902 and used for conveying chips, a first material stopping assembly 903 is arranged below the feeding slide rail 902, the first material stopping assembly 903 comprises a first material stopping plate 903-2 and a first material stopping cylinder 903-1, the first material stopping cylinder 903-1 is arranged on the mounting plate 901, the first material stopping plate 903-2 is in driving connection with the first material stopping cylinder 903-1, the first material stopping plate 903-2 is inserted into the slide 902-1, a feeding groove 902-2 communicated with the slide 902-1 is arranged at the bottom end of the feeding slide rail 902, and a material blocking assembly 904 is arranged at the discharge hole of the feeding trough 902-2 to prevent the chip from sliding down. The material taking assembly 8 takes the material pipe and then pours the chips in the material pipe into the slide 902-1 along the material supply slide 902 to convey the chips.
The material taking assembly 8 comprises a U-shaped supporting seat 801 and a material taking cylinder 802, the supporting seat 801 comprises an upper supporting arm 801-1 and a lower supporting arm 801-2, the material taking cylinder 802 is fixed below an installation plate 901, a driving shaft of the material taking cylinder 802 is rotatably connected with the lower supporting arm 801-2 of the supporting seat 801 through a connecting arm 803, one end of the connecting arm 803 is fixedly connected with the lower supporting arm 801-2, the other end of the connecting arm is rotatably connected with the material taking cylinder 802 through a rotating shaft 804, the material taking cylinder 802 drives the supporting seat 801 to rotate along the rotating shaft, a material pressing assembly 805 is installed above the upper supporting arm 801-1, the material pressing assembly 805 comprises a material pressing cylinder 805-1 and a material pressing block 805-2, the material pressing cylinder 805-1 is fixed on the upper supporting arm 801-1, the material pressing block 805-2 is in driving connection with the material pressing cylinder 805-1 below the material pressing cylinder 805-1, the pressing block 805-2 is provided with a pressing groove 805-2-1 matched with the shape of the material pipe for pressing and limiting the material pipe. When material taking operation is performed, the material taking cylinder 802 pulls the connecting arm 803 downwards, the connecting arm 803 rotates along the rotating shaft, so that the supporting seat 801 is driven to rotate towards the direction of the workbench 2, the lower supporting arm 801-2 rotates to one side of the material pushing plate 602 to receive a material pipe sent from the material pushing plate 602, the material pressing cylinder 805-1 drives the material pressing block 805-2 to move downwards, the material pipe is pressed between the material pressing block 805-2 and the lower supporting arm 801-2, the supporting seat 801 resets, and a chip in the material pipe is poured into the slide 902-1 on the material supplying slide 902.
One side of pushing away material subassembly 6 is equipped with two cushion 7 and is used for placing empty material pipe, cushion 7 is in pushing away material board 602 below and the protrusion pushing away material board 602 outside, cushion 7 with get material subassembly 8 position corresponding, support frame 4 one side is equipped with the workbin 11 that gathers materials and is used for empty material pipe to collect, workbin 11 and cushion 7 are in the same one side of support frame 4. After all the chips in the material pipe are poured into the slide 902-1, the supporting seat 801 drives the material pipe to rotate to the position above the cushion block 7, the material pipe is placed on the cushion block 7, at this time, the material pushing plate 602 moves towards the material taking assembly 8, the empty material pipe placed on the cushion block 7 is simultaneously retreated to the material collecting box 11 while the material pushing plate 602 moves, the material pipe on the material pushing plate 602 is transferred to the material taking assembly 8, and the material pipe reciprocates to perform the next conveying action.
A defective product sliding rail 10 is arranged below the material blocking assembly 904, the defective product sliding rail 10 is communicated with the feeding sliding rail 902, the material blocking assembly 904 comprises a material blocking plate 904-2 and a material blocking cylinder 904-1, the material blocking plate 904-2 is arranged between the defective product sliding rail 10 and the feeding sliding rail 902, the material blocking plate 904-2 is in driving connection with the material blocking cylinder 904-1, and the material blocking cylinder 904-1 is fixedly connected with the mounting plate 901. A defective product collecting box can be placed at the bottom end of the defective product slide rail 10 for collecting defective products.
The chip transfer mechanism 12 comprises a fixed seat 1201, a rotating disc 1203, a driving motor 1202 and a material transfer assembly 1204, the fixed seat 1201 is mounted on the workbench 2, the driving motor 1202 is fixed above the fixed seat 1201 and is in driving connection with the rotating disc 1203, the material transfer assembly 1204 comprises a material transfer connecting seat 1204-1 and a suction nozzle 1204-2, the suction nozzle 1204-2 is fixed on one side of the material transfer connecting seat 1204-1 and above the conveying track 14, the other side of the material transfer connecting seat 1204-1 is in rotating connection with the rotating disc 1203 through a first connecting shaft, a slide block assembly 1205 is arranged above the material transfer connecting seat 1204-1, the slide block assembly 1205 comprises a slide rail and a slide block, the slide rail is fixedly connected with the material transfer connecting seat 1204-1, the slide block is provided with a second 1206 connecting shaft which is in rotating connection with the fixed seat 1201, and one end of the second connecting shaft 1206 is fixedly connected with the slide block, the other end of the rotating shaft is rotatably connected with the fixed seat 1201, and the driving motor 1202 drives the rotating disc 1203 to rotate, so that the suction nozzle 1204-2 on the fixed seat 1201 is driven to reciprocate between the conveying rail 14 and the feeding trough 902-2 on the feeding slide rail 902, and chips in the feeding trough 902-2 are adsorbed and then transferred to the conveying carrier tape.
The heat-seal mechanism 16 comprises a heat-seal mounting plate 1601, the heat-seal mounting plate 1601 is fixed on the workbench 2, a hot-press component 1603 and a film conveying component 1602 are mounted on the heat-seal mounting plate 1601 and used for heat-sealing the carrier tape, and the conveying track 14 passes through the hot-press component 1603.
The detection mechanism 13 comprises a detection support base 1301 and a CCD camera 1302, the CCD camera 1302 is fixed above the workbench 2 through the detection support base 1301, and the detection support base 1301 is fixed above the heat-seal mounting plate 1601. When the detection mechanism 13 detects that the chips in the carrier tape storage grid are unqualified, the feeding slide rail 902 stops conveying new chips, the feeding groove 902-2 is vacant, the braid conveying mechanism carries out reverse conveying on the carrier tape, the carrier tape storage grid of the unqualified chip at the chip detection mechanism 13 is returned to the suction nozzle 1204-2, the suction nozzle 1204-2 sucks the unqualified chip on the carrier tape and places the unqualified chip in the feeding groove 902-2, after the unqualified chip is placed in the feeding groove 902-2, the material baffle 904-2 at the discharge port of the feeding groove 902-2 moves downwards to communicate the feeding groove 902-2 with the defective product slide rail 10, the chips in the feeding groove 902-2 slide rail 10 slide downwards to the defective product collection box for collection, the material baffle 904-2 resets, the feeding slide rail feeds the chips in the feeding groove 902-2 again, the suction nozzle 1204-2 places a new chip into the empty pocket of the carrier tape, which is reset to forward feed.
The working process is as follows: the material pipe with the chips is stacked on the stacking frame 5, the material pipe on the stacking frame 5 is conveyed singly through the material pushing plate 602, the material taking assembly 8 takes the material pipe to pour the chips into the material feeding slide rails 902, the chips slide down into the material feeding grooves 902-2 one by one through the slide rails 902-1 and the material stopping assembly to take the single chips, the suction nozzles 1204-2 suck and convey the single chips in the material feeding grooves 902-2 into the storage lattices of the carrier tape to be placed, the chips are detected through the detection mechanism 13, the carrier tape is subjected to heat-sealing packaging after being detected to be correct, if defective products are detected, the heat-sealing mechanism 16 stops working, the carrier tape is conveyed in the direction, the suction nozzles 1204-2 take the chips and then fall into the defective product slide rails 10, and the carrier tape is conveyed in the forward direction again, so that the operation is repeated.
Compared with the prior art, the utility model provides a pair of chip braider adopts automatic feeding to carry and braid heat-seal packing, still is equipped with the defective products slide rail and selects the collection to detecting bad product, makes the chip obtain better screening, ensures the off-the-shelf qualification rate of carrier band, has reduced manual operation, improves production efficiency.
It is obvious to a person skilled in the art that the invention is not restricted to details of the foregoing exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. A chip braider is characterized in that: the automatic chip stacking machine comprises a machine frame, a chip feeding mechanism, a chip transferring mechanism, a heat sealing mechanism and a detection mechanism, wherein a workbench is arranged above the machine frame, the chip feeding mechanism is arranged on the workbench, a conveying track stretching across the left side and the right side of the machine frame is arranged on the workbench, a carrier tape is arranged in the conveying track, the feeding mechanism is arranged on the rear side of the conveying track, the heat sealing mechanism is arranged above the conveying track, the detection mechanism is arranged on the right side of the heat sealing mechanism, the chip transferring mechanism is arranged on one side of the chip feeding mechanism and used for taking chips on the chip feeding mechanism, the chip feeding mechanism comprises a support frame and a material stacking frame arranged on the support frame, the support frame is fixed on the workbench, a material pushing assembly is arranged below the material stacking frame and used for pushing material pipes arranged in the material stacking mechanism, and the material pushing assembly is connected on the support frame in a sliding manner, the utility model discloses a chip conveying device, including support frame, chip conveying mechanism, material taking component, material taking pipe, the feed guide rail that the slope set up is installed to one side of support frame, the bottom of feed guide rail is at chip conveying mechanism's rear side, the top of feed guide rail is equipped with gets the material subassembly and is used for taking the material pipe, chip conveying mechanism establishes in the bottom of feed guide rail and in conveying track's top.
2. The chip taping machine of claim 1, wherein: the material pushing assembly comprises a material pushing plate and a material pushing cylinder, wherein a material containing groove for containing a material pipe is formed in the material pushing plate, the material containing groove penetrates through the front end and the rear end of the material pushing plate, the material pushing cylinder is fixed on the supporting frame, and the material pushing cylinder drives the material pushing plate to move along the X-axis direction.
3. The chip taping machine of claim 1, wherein: the feed guide rail includes mounting panel and feed slide rail, the feed slide rail is fixed on the mounting panel, the mounting panel slope is fixed, the one end and the support frame fixed connection of mounting panel, the other end and the workstation fixed connection of mounting panel, be equipped with the slide in the feed slide rail and be used for carrying the chip, the below of feed slide rail is equipped with first material subassembly of ending, first material subassembly of ending includes that first flitch and the first material cylinder of ending, first material cylinder of ending is installed on the mounting panel, first flitch and the first material cylinder drive of ending are connected, first material board of ending inserts in the slide, the bottom of feed slide rail is equipped with the silo and communicates with each other with the slide, the discharge gate position of going up the silo is equipped with and keeps off the material subassembly and prevent the chip landing.
4. The chip taping machine of claim 1, wherein: get the material subassembly and include the U-shaped supporting seat and get the material cylinder, the supporting seat includes support arm and under bracing arm, it fixes in the mounting panel below to get the material cylinder, the under bracing arm rotation connection of linking arm and supporting seat is passed through in the drive shaft of getting the material cylinder, the one end and the under bracing arm fixed connection of linking arm, its other end through the pivot with get the material cylinder and rotate and be connected, it is rotatory along the pivot to get material cylinder drive supporting seat, it installs the material subassembly of pressing in the top of going up the support arm, press the material subassembly including pressing the material cylinder and pressing the material piece, press the material cylinder to fix on the upper bracing arm, press the material piece to press the material cylinder below and press the material cylinder drive to be connected, it is spacing to be equipped with pressing the material groove on the material piece and be used for carrying out the pressfitting to the material pipe.
5. The chip taping machine of claim 2, wherein: one side of pushing away the material subassembly is equipped with the several cushion, the cushion just protrudes the scraping wings outside in the scraping wings below, the cushion with get material subassembly position corresponding, support frame one side is equipped with the case that gathers materials, the case that gathers materials and cushion are in the same one side of support frame.
6. The chip taping machine of claim 3, wherein: keep off material subassembly below and be equipped with the defective products slide rail, the defective products slide rail communicates with each other with the feed slide rail, it includes striker plate and keeps off the material cylinder to keep off the material subassembly, the striker plate is between defective products slide rail and feed slide rail, striker plate and fender material cylinder drive connection, keep off material cylinder and mounting panel fixed connection.
7. The chip taping machine of claim 1, wherein: the chip transfer mechanism comprises a fixed seat, a rotary table, a driving motor and a moving material assembly, wherein the fixed seat is installed on the working table, the driving motor is fixed above the fixed seat and is connected with the rotary table in a driving mode, the moving material assembly comprises a moving material connecting seat and a suction nozzle, the suction nozzle is fixed on one side of the moving material connecting seat and above the conveying track, the other side of the moving material connecting seat is connected with the rotary table in a rotating mode through a first connecting shaft, a sliding block assembly is arranged above the moving material connecting seat and comprises a sliding rail and a sliding block, the sliding rail is fixedly connected with the moving material connecting seat, and a second connecting shaft is arranged on the sliding block and is connected with the fixed seat in a rotating mode.
8. The chip taping machine of claim 1, wherein: the heat-seal mechanism comprises a heat-seal mounting plate, the heat-seal mounting plate is fixed on the workbench, a hot-press component and a film conveying component are mounted on the heat-seal mounting plate and used for carrying out heat-seal on the carrier band, and the conveying track penetrates through the hot-press component.
9. The chip taping machine of claim 7, wherein: the detection mechanism comprises a detection supporting seat and a CCD camera, the CCD camera is fixed above the workbench through the detection supporting seat, and the detection supporting seat is fixed above the heat-seal mounting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023215800.5U CN214452174U (en) | 2020-12-28 | 2020-12-28 | Chip braider |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023215800.5U CN214452174U (en) | 2020-12-28 | 2020-12-28 | Chip braider |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214452174U true CN214452174U (en) | 2021-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202023215800.5U Active CN214452174U (en) | 2020-12-28 | 2020-12-28 | Chip braider |
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| CN (1) | CN214452174U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115249511A (en) * | 2022-08-01 | 2022-10-28 | 深圳市芯岛智能装备有限公司 | Multifunctional automatic testing machine for DDRSDRAM memory chip |
-
2020
- 2020-12-28 CN CN202023215800.5U patent/CN214452174U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115249511A (en) * | 2022-08-01 | 2022-10-28 | 深圳市芯岛智能装备有限公司 | Multifunctional automatic testing machine for DDRSDRAM memory chip |
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