CN212625510U

CN212625510U - Cleaning mechanism and grinding machine

Info

Publication number: CN212625510U
Application number: CN202021897113.3U
Authority: CN
Inventors: 吴俊�; 向宏阳
Original assignee: Chnchip Engineering Co ltd
Current assignee: Chnchip Engineering Co ltd
Priority date: 2020-09-02
Filing date: 2020-09-02
Publication date: 2021-02-26
Anticipated expiration: 2030-09-02

Abstract

The utility model relates to the technical field of wafer preparation, in particular to a cleaning mechanism and a grinding machine with the same, the cleaning mechanism of the utility model comprises an air blowing component and a cleaning platform, wherein the cleaning table is provided with a mounting plate connected with the first rotary driving mechanism, the periphery of the mounting plate is provided with a baffle plate, the baffle plate is provided with a water spray gun, and the water spray gun faces the center of the mounting plate, the grinded wafer is blown off abrasive dust attached to the lower surface of the wafer by the air blowing assembly when being transferred to the cleaning table by the manipulator, the wafer can be smoothly placed on the mounting plate and rotates along with the mounting plate, the water spray gun sprays water towards the center of the wafer, and the wafer autorotation along with the mounting table, so that the cleaning water is thrown out on the surface of the wafer due to the action of centrifugal force to take away abrasive dust attached to the surface of the wafer, and meanwhile, the baffle is adopted to prevent water stain from splashing to influence the workshop environment.

Description

Cleaning mechanism and grinding machine

Technical Field

The utility model relates to a wafer preparation technical field especially relates to a wiper mechanism and have this wiper mechanism's machine of grinding.

Background

The wafer refers to a silicon chip used for manufacturing a silicon semiconductor integrated circuit, the wafer is a carrier used for producing the integrated circuit, and the wafer generally refers to a monocrystalline silicon wafer. Wafers are the most commonly used semiconductor materials, and are classified into 4-inch, 5-inch, 6-inch, 8-inch, and so on, according to their diameters, and recently 12-inch and even larger sizes are developed. The larger the wafer, the more ICs can be produced on the same wafer, which can reduce cost. In a typical application, after the integrated circuit processing technology is completed, different wafers are stacked and bonded together by using a wafer-level packaging technology, and are thinned from the back of the wafer, the thinning removal thickness reaches more than 90% of the thickness of the wafer, the rapid thinning needs to be realized by grinding equipment, the outer surface of the wafer needs to be cleaned after the wafer is ground, the phenomenon that grinding dust is attached to the wafer to influence the packaging quality of the wafer is avoided, the conventional cleaning mechanism is usually cleaned by water and then dried, the mode is low in efficiency, and a satisfactory cleaning effect is difficult to achieve.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a cleaning mechanism which can effectively clean the abrasive dust attached to the surface of a wafer and improve the cleaning efficiency.

The utility model also provides a grind machine that has above-mentioned wiper mechanism.

The utility model provides a technical scheme that its technical problem adopted does: the utility model provides a wiper mechanism, includes the subassembly and the clean bench of blowing, be provided with the mounting panel that is used for placing the wafer on the clean bench, the mounting panel is connected with first rotary driving mechanism, the week side of mounting panel is provided with the baffle, the baffle is the cover tube-shape and fixed mounting on the clean bench, be provided with the spray gun on the baffle, the spray gun orientation the center of mounting panel.

Furthermore, a plurality of adsorption holes are formed in the mounting plate.

Furthermore, a plurality of arc-shaped water drainage grooves are formed in the mounting plate.

Further, the water spraying guns are distributed uniformly along the circumferential direction of the baffle.

Further, the baffle plate protrudes from the upper end face of the cleaning table and is folded towards the inner side.

Furthermore, the air blowing assembly comprises a plurality of air blowing guns which are arranged upwards along the vertical direction, and the air blowing guns are arranged in an arc shape and are arranged on the side wall of the base.

A grinding machine comprises the cleaning mechanism as described in the above embodiment, and further comprises a base arranged on one side of the cleaning mechanism, wherein three grinding tables are arranged on the base, a fine grinding assembly and a coarse grinding assembly are further arranged above the base, the three grinding tables can sequentially rotate to the positions below the coarse grinding assembly and the fine grinding assembly, and the air blowing assembly is arranged on one side, close to the cleaning mechanism, of the base.

Further, a second rotary driving mechanism is arranged on the base at the position corresponding to the coarse grinding assembly and the fine grinding assembly, and the second rotary driving mechanism is in clutch connection with the grinding table.

Further, the grinding table is in including being annular fixed plate, setting the rotor plate of fixed plate bottom and with rotor plate fixed connection's grinding plate, a plurality of negative pressure hole has been seted up on the grinding plate, the grinding plate lid is established on the fixed plate and with form the negative pressure chamber between the fixed plate, the negative pressure chamber is external to have the negative pressure pipe.

The beneficial effects of the utility model are that: the utility model discloses a wiper mechanism is including blowing subassembly and clean bench, wherein be provided with the mounting panel of connecting first rotation actuating mechanism on the clean bench, the week side of mounting panel is provided with the baffle, be provided with the spray gun on the baffle, and the spray gun is towards the center of mounting panel, the earlier through blowing subassembly blowdown attached to the abrasive dust of wafer lower surface when the wafer that has ground is transferred to the clean bench through the manipulator, guarantee that the wafer can be placed smoothly on the mounting panel and rotate along with the mounting panel, the spray gun is towards the center water spray of wafer, and the wafer is along with the mount table rotation, make washing water take away attached to the abrasive dust on wafer surface because of centrifugal force effect is thrown away on the surface of wafer, adopt the baffle to avoid water stain to splash and influence workshop environment simultaneously.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic structural view of a cleaning mechanism according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a grinding mechanism according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a polishing table according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

Referring to fig. 1, a cleaning mechanism includes an air blowing assembly 410 and a cleaning platform 420, wherein a mounting plate 470 for placing a wafer is disposed on the cleaning platform 420, the mounting plate 470 is connected to a first rotation driving mechanism 450, the first rotation driving mechanism 450 may be a conventional servo motor, the mounting plate 470 rotates by the first rotation driving mechanism 450, it should be noted that the mounting plate 470 may be in a disc shape, so as to drive the wafer to rotate on the cleaning platform 420, while the grinding dust attached to the wafer falls off from the surface of the wafer due to the centrifugal force of rotation, so as to achieve the effect of cleaning the surface of the wafer, the periphery of the mounting plate 470 may be provided with a plurality of fixing assemblies, the fixing assemblies are used for fixing the wafer on the mounting plate 470, specifically, the fixing assemblies may be conventional clamps, and the wafer may be clamped on the mounting plate 470 by the clamps, so that the wafer does not move relative to the mounting plate 470 when rotating along with the mounting plate 470; the periphery of the mounting plate 470 is provided with a baffle 440, the baffle 440 is in a sleeve shape and surrounds the periphery of the mounting plate 470, it should be noted that the baffle 440 may be fixedly installed on the cleaning platform 420 and does not want to rotate the mounting plate 470, the height of the baffle 440 is greater than the height of the mounting plate 470 so as to ensure that the splashed cleaning water and the abrasive dust can be effectively blocked, the baffle 440 is provided with a water spray gun 430, the water spray gun 430 faces the center of the mounting plate 470, specifically, the water spray gun 430 faces the center of the wafer so as to clean the area of the central portion of the wafer, the cleaning water adheres to the surface of the wafer and generates centrifugal force along with the rotation of the wafer, and then the abrasive dust adhering to the surface of the wafer is taken away when the cleaning water spray gun 430 flows out from the surface of the wafer, the water spray gun 430 is turned off after being turned on for a period of time, the wafer continues to rotate so as to dry, the structural complexity of the mechanism is reduced.

In some embodiments, the mounting plate 470 has a plurality of suction holes, i.e., the wafer is fixed on the mounting plate 470 by the suction effect of the suction holes.

In some embodiments, the mounting plate 470 is provided with a plurality of arc-shaped drainage grooves 460, the drainage grooves 460 are used for reducing the rotation speed of the mounting plate 470 and increasing the size of the water spraying gun 430 for quick washing in the early stage of washing, the washing water can be quickly drained through the drainage grooves 460, and then the rotation speed of the mounting plate 470 is increased, so that the washing water splashes out due to the centrifugal force.

In some embodiments, the water spraying guns 430 are distributed uniformly along the circumference of the baffle 440, and the purpose of the water spraying guns is to improve the cleaning efficiency.

In some embodiments, the baffle 440 protrudes from the upper end surface of the cleaning station 420 and is turned inward, it should be noted that the minimum inner diameter of the baffle 440 is larger than the maximum outer diameter of the wafer, which is intended to ensure that the wafer can be placed on the mounting plate 470, and in this embodiment, the robot for transferring the wafer sucks the upper surface of the wafer and places the wafer on the mounting plate 470 from above.

In some embodiments, the air blowing assembly 410 includes a plurality of air blowing guns disposed vertically upward, and the plurality of air blowing guns are arranged in an arc shape and mounted on the sidewall of the base 310, so as to ensure that the air blowing assembly 410 can effectively blow off the abrasive dust attached to the lower surface of the wafer, thereby ensuring that the wafer is smoothly fixed on the mounting plate 470.

Referring to fig. 2 and 3, the grinding machine includes a base 310 and three grinding tables 330 disposed on the base 310, a rough grinding assembly 340 and a fine grinding assembly 350 are further disposed above the base 310, and the rough grinding assembly 340 and the fine grinding assembly 350 are distributed along the circumferential direction of the base 310, a cleaning table 420 is disposed on one side of the base 310, and an air blowing assembly 410 is disposed on the sidewall of the base 310 close to the cleaning table 420, it should be noted that the three grinding tables 330 are uniformly distributed on the base 310 along the circumferential direction, the base 310 is circular, and the three grinding tables 330 can rotate along the center of the base 310 to be sequentially rotated below the rough grinding assembly 340 and the fine grinding assembly 350; it should be noted that the grinding table 330 can drive the wafer to rotate, the wafer may rotate counterclockwise or clockwise, the fine grinding assembly 350 and the rough grinding assembly 340 may adopt the same structural design, and the difference between the fine grinding assembly 350 and the rough grinding assembly 340 is the different mesh number of the grinding sheets, and the rotation speed of the fine grinding assembly 350 is higher than that of the rough grinding assembly 340 during use, which is designed to reduce the design and manufacturing cost of the apparatus.

A second rotary driving mechanism 338 is arranged on the base 310 at positions corresponding to the rough grinding assembly 340 and the fine grinding assembly 350, the second rotary driving mechanism 338 is detachably connected with the grinding table 330, and the second rotary driving mechanism 338 is used for driving the grinding table 330 to rotate; specifically, the grinding table 330 includes an annular fixing plate 331, a rotating plate 332 disposed at the bottom of the fixing plate 331, and a grinding plate 333 fixedly connected to the rotating plate 332, a connecting shaft 337 is disposed at the bottom of the rotating plate 332, the connecting shaft 337 is in clutch connection with the output end of the second rotation driving mechanism 338, that is, when the connecting shaft 337 is separated from the output end of the second rotation driving mechanism 338, the grinding table 330 can rotate to the next station along the circumferential direction of the base 310 to avoid interference between the grinding table 330 and the second rotation driving mechanism 338, specifically, the connecting shaft 337 and the second rotation driving mechanism 338 can be connected by a coupling, the coupling can move up and down along the connecting shaft 337 or the output end of the second rotation driving mechanism 338 to realize separation and connection between the connecting shaft 337 and the second rotation driving mechanism 338, and further, a conventional clutch can be further provided, thereby realizing clutch connection; in other embodiments, the base 310 is provided with a rotating disc 320 and a rotating motor for driving the rotating disc 320 to rotate, three grinding tables 330 are circumferentially arranged on the rotating disc 320 and rotate with the rotating disc 320 to a position below the rough grinding assembly 340 or the fine grinding assembly 350, specifically, the grinding tables 330 can translate on the rotating disc 320 for a certain distance, that is, the fixing plate 331 is pressed on the rotating disc 320 and a guide wheel is arranged between the fixing plate 331 and the rotating disc 320, and the rotating disc 320 is provided with a limit groove capable of allowing the guide wheel to slide, while the rotating disc 320 is further provided with a linear driving mechanism for driving the grinding tables 330 to move horizontally, the linear driving mechanism can be a conventional electric push rod, the lower end of the connecting shaft 337 is in a semi-circular sleeve shape, and the lower end of the connecting shaft 337 is provided with internal splines or internal teeth, while the output end of the second rotating driving mechanism 338 is provided with external splines or external teeth, the second rotation driving mechanism 338 may drive the connecting shaft 337 to rotate to be horizontally movable along the limiting groove, that is, when the linear driving mechanism drives the polishing table 330 to move along the limiting groove in the direction away from the second rotational driving mechanism 338, the connecting shaft 337 can be horizontally separated from the output end of the rotary drive without interference, thereby enabling the grinding table 330 to rotate with the turntable 320 to the next station, i.e., after the grinding table 330 is separated from the second rotary drive mechanism 338 under the rough grinding assembly 340, to move with the turntable 320 to the finish grinding assembly 350, the linear driving mechanism can drive the grinding table 330 to move along the limiting groove towards the direction close to the second rotation driving mechanism 338 until the connecting shaft 337 is stably meshed with the output end of the second rotation driving mechanism 338, and the guide wheel is positioned at one end of the limiting groove, so that the grinding table 330 and the turntable 320 can be ensured to be relatively fixed during working; it should be noted that the second rotary driving mechanism 338 in all the above embodiments may be a conventional servo motor.

The polishing plate 333 is provided with a plurality of negative pressure holes 334, the polishing plate 333 is covered on the fixing plate 331 and forms a negative pressure cavity 335 with the fixing plate 331, the negative pressure cavity 335 is externally connected with a negative pressure tube 336, in this embodiment, the negative pressure tube 336 is an air suction tube, a wafer to be processed can be placed on the polishing plate 333 through a manipulator, the negative pressure tube 336 forms the negative pressure cavity 335 between the polishing plate 333 and the fixing plate 331 and tightly adsorbs the wafer to be processed on the polishing plate 333 through the negative pressure holes 334, and the problem that the polishing precision is affected due to the fact that the wafer and the polishing plate 333 move relatively in the polishing operation is avoided.

In some embodiments, the rough grinding assembly 340 and/or the fine grinding assembly 350 are fixed above the base 310, in this embodiment, the rough grinding assembly 340 and the fine grinding assembly 350 have substantially the same structure, and the difference between the two is that the mesh number of the grinding plates is different, specifically, the rough grinding assembly 340 or the fine grinding assembly 350 includes a frame and a grinding head arranged on the frame, the frame is connected with a vertical driving mechanism, and the grinding head is connected with a rotating main shaft, and the grinding head is driven by the rotating main shaft to rotate to realize the grinding operation.

The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.

Claims

1. The utility model provides a wiper mechanism, its characterized in that, is including blowing subassembly and clean bench, be provided with the mounting panel that is used for placing the wafer on the clean bench, the mounting panel is connected with first rotation drive mechanism, the week side of mounting panel is provided with the baffle, the baffle is the cover tube form and fixed mounting on the clean bench, be provided with the spray gun on the baffle, the spray gun orientation the center of mounting panel.

2. The cleaning mechanism of claim 1, wherein the mounting plate has a plurality of suction holes formed therein.

3. The cleaning mechanism of claim 1, wherein the mounting plate defines a plurality of arcuate drainage channels.

4. The cleaning mechanism of claim 1, wherein said water jets are distributed in a plurality and are spaced circumferentially about said baffle.

5. The washer mechanism as recited in claim 1 wherein said flapper projects from an upper end surface of said wash station and is folded inwardly.

6. The cleaning mechanism according to claim 1, wherein the blowing assembly comprises a plurality of blowing guns which are arranged vertically upwards, and the plurality of blowing guns are arranged in an arc shape and are arranged on the side wall of the base.

7. A grinding mill comprising the cleaning mechanism according to any one of claims 1 to 6, further comprising a base provided on one side of the cleaning mechanism, wherein three grinding tables are provided on the base, wherein a fine grinding assembly and a rough grinding assembly are further provided above the base, wherein the three grinding tables are sequentially rotatable to below the rough grinding assembly and the fine grinding assembly, and wherein the air blowing assembly is provided on one side of the base adjacent to the cleaning mechanism.

8. A grinding mill according to claim 7, wherein a second rotary drive is provided on the base at a location corresponding to both the rough grinding assembly and the fine grinding assembly, and the second rotary drive is in clutched connection with the grinding table.

9. The grinding machine according to claim 7 or 8, wherein the grinding table comprises a fixing plate in a ring shape, a rotating plate disposed at the bottom of the fixing plate, and a grinding plate fixedly connected to the rotating plate, the grinding plate has a plurality of negative pressure holes, the grinding plate is covered on the fixing plate and forms a negative pressure chamber with the fixing plate, and the negative pressure chamber is externally connected to a negative pressure pipe.