CN212514754U - Open-loop current sensor - Google Patents
Open-loop current sensor Download PDFInfo
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- CN212514754U CN212514754U CN202020707962.1U CN202020707962U CN212514754U CN 212514754 U CN212514754 U CN 212514754U CN 202020707962 U CN202020707962 U CN 202020707962U CN 212514754 U CN212514754 U CN 212514754U
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Abstract
The utility model provides an open-loop current sensor, include: the sensor comprises a printed circuit board module, a sensing circuit module and an insulation packaging module; the printed circuit board module includes: excitation wire, storage space; the sensing circuit module is placed in the storage space; the printed circuit board module further includes: a signal interface; the sensing circuit module at least comprises: a magnetic field induction element; the printed circuit board module and the sensing circuit module are connected by adopting an insulation packaging module; the insulating packaging module wraps the sensing circuit module in the object placing space. The utility model discloses in, excitation wire draws on printed circuit board, and the current capability that can bear exceeds 100 amperes, has improved the current detection scope greatly, can not arouse overheated and cause the adverse effect to sensing circuit module yet.
Description
Technical Field
The utility model relates to a sensor technical field specifically, relates to an open-loop current sensor.
Background
The current sensor, as the name implies, is a device for detecting current, and can convert the detected current into an electric signal meeting certain standards or other required forms of information output according to certain rules, so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like. An open-loop current sensor, which is a kind of current sensor, is popular among manufacturers because of its advantages of simple structure, high reliability and high overload capability. At present, the open-loop current sensor adopts the Hall effect principle, and the structure thereof comprises: the magnetic core, pass excitation wire, hall element and processing circuit constitution of magnetic core. The magnetic core has an open air gap, and the Hall element is disposed at the open air gap. When current flows through the excitation wire, a magnetic field with the magnetic field intensity being in direct proportion to the current is generated around the excitation wire, the magnetic core gathers magnetic lines of force to the air gap, the Hall element outputs a voltage signal in direct proportion to the magnetic induction intensity at the air gap, and the processing circuit amplifies and outputs the signal to obtain a required linear voltage signal. However, the open-loop current sensor also has obvious defects that 1) the magnetic gathering capacity of the magnetic ring is weakened at high temperature, so that the magnitude of the magnetic field induced by the Hall element cannot really restore the magnitude of the current; 2) the manufacturing process of the magnetic ring openings is complex, the tolerance of the air gaps of the openings is large during batch manufacturing, so that the magnetic gathering capacity is deviated, the screening cost is high, and meanwhile, the magnetic rings are easy to break, so that the reliability of the magnetic rings in a severe working environment cannot be ensured; 3) the output delay is high, and the magnetic ring is firstly focused and then converted into a magnetic field induced by the Hall element, so that the output delay of the sensor is high.
Patent document CN105452880 discloses a current sensor including: a conductor having a gap; a support portion having a gap for electrical insulation from the conductor in a plan view, the support portion supporting a signal processing IC; a magneto-electric conversion element configured to be electrically connectable to the signal processing IC and disposed in the gap between the conductors to detect a magnetic field generated by a current flowing through the conductors, wherein the magneto-electric conversion element is disposed on an opposite side of the conductor from the signal processing IC in a plan view; and an insulating member that supports the magnetoelectric conversion element, wherein the conductor has a U-shaped, V-shaped, or C-shaped current path, and the U-shaped, V-shaped, or C-shaped current path has an opening formed in a direction opposite to a direction in which the support portion is located when viewed in plan. Above-mentioned in the ring-opening current sensor will excite that magnetic wire, hall element and processing circuit are whole to be capsulated together, owing to drawn close the distance between wire and the hall element, hall element can direct induction circular telegram wire magnetic field that produces on every side to saved the magnetic ring, made the structure simpler, the cost is also lower, has also guaranteed the uniformity of batch product. But the disadvantages are also evident: 1) the packaged lead is limited by the size of space and cannot pass large current, so that the detection range of the current sensor is limited, and the current sensor can only detect current of 10 amperes generally; 2) the heat dissipation capability is poor, and the temperature in the packaging body is increased due to the current passing through the packaging body, so that the Hall element and the processing circuit are easily damaged.
SUMMERY OF THE UTILITY MODEL
To the defect among the prior art, the utility model aims at providing an open-loop current sensor.
According to the utility model provides a pair of ring-opening current sensor includes: the sensor comprises a printed circuit board module, a sensing circuit module and an insulation packaging module; the printed circuit board module includes: excitation wire, storage space; the sensing circuit module is placed in the storage space; the printed circuit board module further includes: a signal interface; the excitation wire is used for passing current and generating a magnetic field at the periphery; the storage space is used for placing the sensing circuit module; the signal interface is used for the transmission of wires such as power supply, ground and output signals; the sensing circuit module includes: a magnetic field induction element; the printed circuit board module and the sensing circuit module are connected by adopting an insulation packaging module; the insulating packaging module wraps the sensing circuit module in the object placing space.
Preferably, the excitation wire adopts any one of the following structures: -a curved fillet structure; -a rectilinear shaped configuration.
Preferably, the excitation wire is any one of: -an excitation wire made by a printed circuit board copper-clad process; -the metallic piece is embedded in the excitation wire on the printed circuit board.
Preferably, the storage space adopts any one of the following: -a recessed storage space on the printed circuit board by drilling; -forming a placement space directly on the surface of the printed circuit board.
Preferably, the printed circuit board module adopts a single-layer or multi-layer printed edge circuit board structure. The sensing circuit module may be a magnetic field sensing element, a signal processing module element, a magnetic sensor IC, a magnetic field sensing element, a signal processing module element, and a peripheral protection circuit.
Preferably, the sensing circuit module further comprises a signal processing module element. The sensing circuit module may be a magnetic field sensing element, a signal processing module element, a magnetic sensor IC, a magnetic field sensing element, a signal processing module element, and a peripheral protection circuit.
Preferably, the magnetic field sensing element overlaps with the projection of the excitation wire in the vertical direction. The magnetic field induction element induces a parallel component of a magnetic field generated by the excitation wire.
Preferably, there is no overlap between the magnetic field sensing element and the projection of the excitation wire in the vertical direction. The magnetic field sensing element senses a vertical component of a magnetic field generated by the excitation wire.
Preferably, the method further comprises the following steps: non-conductive adhesive, bonding wire; the sensing circuit module is attached to the inside of the storage space by adopting non-conductive adhesive; the sensing circuit module is electrically connected with the printed circuit board module by adopting a bonding lead; the bonding wire is wrapped in the placement space. The non-conductive adhesive is used for attaching the sensing circuit module to the inside of the storage space, and wrapping the sensing circuit module and the bonding lead in the storage space to avoid exposure in the air; a bonding wire for electrical connection between the sensing circuit module and the printed circuit board; the remaining portion of the storage space is filled with epoxy resin.
Preferably, the non-conductive glue wraps the sensing circuit module in the storage space, and the sensing circuit module can be completely wrapped in the storage space on the plane of the printed circuit board.
Preferably, the power supply, the ground, the input and the output of the sensing circuit module are connected with an external controller through signal interfaces on the printed circuit board module.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model saves a magnetic ring, reduces the cost, ensures the reliability of the sensor and reduces the output delay;
2. in the utility model, the sensing circuit module is packaged by COB, which simplifies the manufacturing process compared with the traditional SMD packaging and reduces the cost;
3. the utility model discloses in, excitation wire draws on printed circuit board, and the current capability that can bear exceeds 100 amperes, has improved the current detection scope greatly, can not arouse overheated and cause the adverse effect to sensing circuit module yet.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is an appearance schematic diagram of an example of the open-loop current sensor of the present invention.
Fig. 2 is a schematic diagram of a front structure of an example of the open-loop current sensor of the present invention.
Fig. 3 is a schematic diagram of a reverse structure of an example of the open-loop current sensor of the present invention.
Fig. 4 is a schematic cross-sectional view of an example of the open-loop current sensor of the present invention.
Fig. 5 is a schematic view of an appearance of an example of the open-loop current sensor of the present invention.
Fig. 6 is a schematic diagram of a front structure of an example of the open-loop current sensor of the present invention.
Fig. 7 is a schematic diagram of a structure of an example of the open-loop current sensor according to the present invention.
Fig. 8 is a schematic cross-sectional view of an example of the open-loop current sensor according to the present invention.
In the figure:
first printed circuit board module 1 second printed circuit board module 13
First non-conductive adhesive 2 and second signal conductor assembly 14
First signal conductor assembly 3 second through-hole assembly 15
First through-hole assembly 4 fourth pad assembly 16
Second non-conductive adhesive 11 third non-conductive adhesive 23
The fourth non-conductive adhesive 24 of the first storage space 12
Detailed Description
The present invention will be described in detail with reference to the following embodiments. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that various changes and modifications can be made by one skilled in the art without departing from the spirit of the invention. These all belong to the protection scope of the present invention.
Example one
Fig. 1-4 illustrate a novel open loop current sensor comprising: a first printed circuit board module 1 comprising thereon:
a first excitation wire 9 connected to an external current source through a third pad 10 for passing a current and generating a magnetic field at the periphery thereof;
a first storage space 12 for storing the first sensor circuit module 7;
a first via assembly 4 for electrical connection of signal conductors between layers of the multilayer printed circuit board module;
a first pad assembly 5 for electrical connection between the sensing circuit module and the printed circuit board module 7;
a second pad assembly 8 for electrically connecting wires such as power, ground and output signals to the outside;
the bonding pad assembly 4 and the first bonding pad assembly 5 are electrically connected through the first signal lead assembly 3 and the first through hole assembly 4;
a second non-conductive adhesive 11 for attaching the first sensor circuit module 7 to the inside of the first housing space 12;
the first non-conductive adhesive 2 is used for wrapping the first sensing circuit module 7 and the first bonding lead 6 in the first storage space 12 and avoiding direct exposure to air;
in the first embodiment of the present invention, the first excitation wire 9 has a curved fillet structure;
in the first embodiment of the present invention, the first excitation wire 9 is made by a copper-clad process of a printed circuit board, or a metal member is embedded in the first printed circuit board module 1;
in the first embodiment of the present invention, the first object placing space 12 is a groove formed by drilling the first printed circuit board module 1, and when the printed circuit board module is thick, the distance between the sensing circuit module and the excitation wire is reduced by drilling the printed circuit board module, so that the magnetic field signal received by the magnetic field sensing element is larger and more stable, and the accuracy of the sensor is increased;
in the first embodiment of the present invention, the first sensing circuit module 7 may be a magnetic field sensing element, a magnetic field sensing element and a signal processing module element, a magnetic sensor IC, a magnetic field sensing element, a signal processing module element, and a peripheral protection circuit;
in the first embodiment of the present invention, there is no overlap between the magnetic field sensing element and the projection of the first excitation wire 9 in the vertical direction, and the magnetic field sensing element senses the vertical component of the magnetic field generated by the excitation wire;
in the first embodiment of the present invention, the remaining portion of the first storage space 12 is filled with epoxy resin;
in the first embodiment of the present invention, the first pcb module 1 is of a dual-layer pcb structure, or a single-layer pcb structure as required;
compare and to adopt traditional SMD packaging form to be in the same place excitation wire, hall element and the whole encapsulation of processing circuit among the prior art, novel ring-opening current sensor adopt COB packaging form, chip package on the board promptly is a packaging mode who is different from SMD packaging technique, specifically is with sensing circuit module with electrically conductive or non-conductive gluing attach on printed circuit board, then carry out the lead bonding and realize its electrical connection to seal chip and bonding lead with gluing. The production process of the SMD package needs to be subjected to links such as die bonding, wire bonding, dispensing, baking, stamping, light splitting and color separation, taping and mounting, the production process of the COB package is simplified on the basis, the bare chip is firstly attached to the circuit board, and then die bonding, wire bonding, testing, dispensing and baking are carried out, so that the COB package saves the production time and the manufacturing cost to a certain extent compared with SMD split charging.
Based on the open-loop current sensor architecture, the working mode is as follows:
according to the magnetic effect of the current, when the first excitation wire 9 passes through the current, a magnetic field is generated around the first excitation wire, the magnetic field component of the magnetic field induction element in the first sensing circuit module 7, which is perpendicular to the magnetic field component of the magnetic field induction element, is output to the processing circuit, and the processing circuit amplifies and outputs the magnetic field component signal to obtain the required linear voltage signal.
Example two
Fig. 5-8 illustrate a novel current sensor comprising:
a second printed circuit board module 13 comprising thereon:
a second excitation wire 20 connected to an external current source through a sixth pad assembly 21 for passing a current and generating a magnetic field at the periphery thereof;
a second storage space 22 for placing the second sensing circuit module 18;
a second via assembly 15 for electrical connection of signal conductors between layers of the multilayer printed circuit board module;
a fourth pad assembly 16 for electrical connection between the sensing circuit module and the first printed circuit board module 13;
a fifth pad assembly 19 for electrically connecting wires such as power, ground and output signals to the outside;
the fourth pad assembly 16 and the fifth pad assembly 19 are electrically connected by the second signal wire assembly 14 and the second via assembly 15;
a third non-conductive adhesive 23 for attaching the second sensor circuit module 18 to the inside of the second housing space 22;
the fourth non-conductive adhesive 24 is used for completely wrapping the plane of the printed circuit board where the second sensing circuit module 18 is located in the second storage space 22 so as to avoid direct exposure to the air;
in the second embodiment of the present invention, the second excitation wire 20 has a straight line shape;
in the second embodiment of the present invention, the second excitation wire 20 is made by a copper-clad process of a printed circuit board, or a metal member is embedded in the second printed circuit board module 13;
in the second embodiment of the present invention, the second storage space 22 is directly formed on the surface of the second pcb module 13;
in the second embodiment of the present invention, the second sensing circuit module 18 may be a magnetic field sensing element, a magnetic field sensing element and a signal processing module element, a magnetic sensor IC, a magnetic field sensing element, a signal processing module element, and a peripheral protection circuit;
in the second embodiment of the present invention, the magnetic field sensing element overlaps with the projection of the second excitation wire 20 in the vertical direction, and the magnetic field sensing element senses the parallel component of the magnetic field generated by the excitation wire;
in the second embodiment of the present invention, the remaining part of the second accommodating space 22 is filled with epoxy resin;
in the second embodiment of the present invention, the signal circuit board module 13 adopts a double-layer printed circuit board structure, and can also adopt a single-layer printed circuit board structure as required;
based on the open-loop current sensor architecture, the working mode is as follows:
according to the magnetic effect of the current, when the second excitation wire 20 passes through the current, a magnetic field is generated around the second excitation wire, the magnetic field induced by the magnetic field induction element in the second sensing circuit module 18 is parallel to the magnetic field component of the magnetic field induction element and is output to the processing circuit, and the processing circuit amplifies and outputs the magnetic field component signal to obtain the required linear voltage signal.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of the specific embodiments of the invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by those skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (10)
1. An open loop current sensor, comprising: the sensor comprises a printed circuit board module, a sensing circuit module and an insulation packaging module;
the printed circuit board module includes: excitation wire, storage space;
the sensing circuit module is placed in the storage space;
the printed circuit board module further includes: a signal interface;
the sensing circuit module at least comprises: a magnetic field induction element;
the printed circuit board module and the sensing circuit module are connected by adopting an insulation packaging module;
the insulating packaging module wraps the sensing circuit module in the object placing space.
2. The open loop current sensor of claim 1, wherein said excitation wire is configured in any one of the following configurations:
-a curved fillet structure;
-a rectilinear shaped configuration.
3. The open loop current sensor of claim 1, wherein the excitation wire employs any one of:
-an excitation wire made by a printed circuit board copper-clad process;
-the metallic piece is embedded in the excitation wire on the printed circuit board.
4. The open loop current sensor of claim 1, wherein the storage space employs any one of:
-a recessed storage space on the printed circuit board by drilling;
-forming a placement space directly on the surface of the printed circuit board.
5. The open loop current sensor of claim 1, wherein the printed circuit board module employs a single or multi-layer printed edge circuit board structure.
6. The open loop current sensor of claim 1, wherein the sensing circuit module employs any of:
-a magnetic field inducing element;
-a magnetic field sensing element and a signal processing module element;
-a magnetic sensor IC;
-a magnetic field sensing element, a signal processing module element and a peripheral protection circuit.
7. The open-loop current sensor of claim 6, wherein the magnetic field sensing element overlaps the excitation wire in a vertical direction projection, the magnetic field sensing element sensing a parallel component of a magnetic field generated by the excitation wire; or
The magnetic field induction element and the excitation wire are not overlapped in the projection direction in the vertical direction, and the magnetic field induction element induces the vertical component of the magnetic field generated by the excitation wire.
8. The open loop current sensor of claim 1, further comprising: non-conductive adhesive, bonding wire;
the sensing circuit module is attached to the inside of the storage space by adopting non-conductive adhesive;
the sensing circuit module is electrically connected with the printed circuit board module by adopting a bonding lead;
the bonding wire is wrapped in the placement space.
9. The open loop current sensor of claim 1, wherein the sensing circuit module is encased in the storage space with a non-conductive adhesive, or
And the plane of the printed circuit board where the sensing circuit module is located is completely wrapped in the storage space by adopting non-conductive adhesive.
10. The open loop current sensor of claim 1, further comprising: an external controller, an input and output interface;
and the power supply, the ground, the input and output interfaces of the sensing circuit module are connected with an external controller through signal interfaces on the printed circuit board module.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020707962.1U CN212514754U (en) | 2020-04-30 | 2020-04-30 | Open-loop current sensor |
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| CN202020707962.1U CN212514754U (en) | 2020-04-30 | 2020-04-30 | Open-loop current sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111351976A (en) * | 2020-04-30 | 2020-06-30 | 赛卓电子科技（上海）有限公司 | Open-loop current sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111351976A (en) * | 2020-04-30 | 2020-06-30 | 赛卓电子科技（上海）有限公司 | Open-loop current sensor |
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Address after: 201306 Room 101, No. 9 and 10, Lane 1775, Qiushan Road, Lingang xinpian District, pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: Saizhuo Electronic Technology (Shanghai) Co.,Ltd. Address before: Room a2109, building B, 555 Dongchuan Road, Minhang District, Shanghai 200241 Patentee before: SENTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. |