CN111351975A - Closed loop current sensor - Google Patents
Closed loop current sensor Download PDFInfo
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- CN111351975A CN111351975A CN202010365678.5A CN202010365678A CN111351975A CN 111351975 A CN111351975 A CN 111351975A CN 202010365678 A CN202010365678 A CN 202010365678A CN 111351975 A CN111351975 A CN 111351975A
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- 230000005291 magnetic effect Effects 0.000 claims abstract description 112
- 230000005284 excitation Effects 0.000 claims abstract description 42
- 238000004804 winding Methods 0.000 claims abstract description 39
- 238000004806 packaging method and process Methods 0.000 claims abstract description 18
- 230000006698 induction Effects 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 8
- 238000009413 insulation Methods 0.000 claims abstract description 7
- 238000012545 processing Methods 0.000 claims description 25
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 10
- 239000002356 single layer Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 230000001939 inductive effect Effects 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000001514 detection method Methods 0.000 abstract description 3
- 238000013021 overheating Methods 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 7
- 230000004308 accommodation Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000005355 Hall effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
- G01R15/202—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using Hall-effect devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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Abstract
The invention provides a closed loop current sensor, comprising: the sensor comprises a printed circuit board module, a sensing circuit module, a pad unit and an insulation packaging module; the printed circuit board module includes: the excitation wire, the secondary side compensation winding and the object placing space are arranged in the shell; the pad unit includes: a pad assembly; the sensing circuit module is placed in the storage space; the excitation lead is connected with the pad assembly; the printed circuit board module further includes: a signal interface; the sensing circuit module at least comprises: a magnetic field induction element; the printed circuit board module and the sensing circuit module are connected by adopting an insulation packaging module; the insulating packaging module wraps the sensing circuit module in the object placing space. In the invention, after the process is simplified, the accuracy consistency of the mass production of the sensor is higher, and simultaneously, because the excitation wire is drawn on the printed circuit board, the bearable current capacity exceeds 100 amperes, the current detection range is improved, and overheating can not be caused.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a closed-loop current sensor.
Background
The current sensor, as the name implies, is a device for detecting current, and can convert the detected current into an electric signal meeting certain standards or other required forms of information output according to certain rules, so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like. A closed-loop current sensor, as a detection device of the current sensor, is favored by manufacturers due to its advantages of wide operating bandwidth, fast response and high precision.
At present, closed-loop current sensors all adopt a Hall effect principle, and the structure of the closed-loop current sensors comprises: the magnetic core, pass excitation wire, hall inductive element, processing circuit and secondary side compensation winding of magnetic core. Compared with an open-loop Hall current sensor, the closed-loop Hall current sensor has the advantages that the auxiliary compensation winding is added, and the performance of the closed-loop Hall current sensor is greatly improved by the aid of the auxiliary compensation winding. The processing circuit receives the magnetic field signal output of the Hall sensing element, amplifies the magnetic field signal into a current signal and provides the current signal for the secondary compensation winding, and the magnetic field generated by the secondary compensation winding in the magnetic core and the magnetic field generated by the primary current are equal in size and opposite in direction at the air gap, so that the primary magnetic field is counteracted, and a negative feedback closed-loop control circuit is formed. If the secondary side current is too small, the generated magnetic field is not enough to counteract the primary side magnetic field, the processing circuit outputs larger current, otherwise, the processing circuit outputs reduced current, and therefore the magnetic field balance at the air gap is maintained. If the primary current changes and the magnetic field balance at the air gap is damaged, the negative feedback closed-loop control circuit can also adjust the secondary output circuit to enable the magnetic field to reach balance again.
However, the closed-loop current sensor also has obvious defects that 1) the magnetic gathering capacity of the magnetic ring is weakened at high temperature, so that the magnitude of the magnetic field induced by the Hall element cannot really restore the magnitude of the current; 2) the manufacturing process of the magnetic ring openings is complex, the tolerance of the air gaps of the openings is large during batch manufacturing, so that the magnetic gathering capacity is deviated, the screening cost is high, and meanwhile, the magnetic rings are easy to break, so that the reliability of the magnetic rings in a severe working environment cannot be ensured; 3) the structure is complicated, and the volume is great, compares open loop current sensor and has a set of secondary side compensation winding more, and the cost is higher. Therefore, in order to solve the above problems, a new closed-loop current sensor needs to be redesigned from the prior art to solve the above technical drawbacks.
Patent document CN105452880A discloses a current sensor having excellent insulation resistance. The current sensor (1) is provided with a conductor (10), a support part (30) for supporting a signal processing IC (20), a magnetoelectric conversion element (13) which is configured to be electrically connectable to the signal processing IC (20) and is arranged in a gap (10a) of the conductor (10) to detect a magnetic field generated from a current flowing through the conductor (10), and an insulating member (14) for supporting the magnetoelectric conversion element (13). There is still room for improvement in structure and performance.
Disclosure of Invention
In view of the deficiencies in the prior art, it is an object of the present invention to provide a closed loop current sensor.
According to the present invention there is provided a closed loop current sensor comprising: the sensor comprises a printed circuit board module, a sensing circuit module, a pad unit and an insulation packaging module; the printed circuit board module includes: the excitation wire, the secondary side compensation winding and the object placing space are arranged in the shell; the pad unit includes: a pad assembly; the sensing circuit module is placed in the storage space; the excitation lead is connected with the pad assembly; the excitation wire is connected with an external current source through a bonding pad and is used for passing current and generating a magnetic field at the periphery of the excitation wire; the secondary side compensation winding can be used for offsetting a primary side magnetic field generated by primary side current to form a negative feedback closed-loop control circuit; the printed circuit board module further includes: a signal interface; the signal interface is used for transmission of wires such as power supply, ground and output signals; the sensing circuit module includes: a magnetic field induction element; the printed circuit board module and the sensing circuit module are connected by adopting an insulation packaging module; the insulating packaging module wraps the sensing circuit module in the object placing space.
Preferably, the excitation wire adopts any one of the following structures: -a curved fillet structure; -a rectilinear shaped configuration.
Preferably, the excitation wire is any one of: -an excitation wire made by a printed circuit board copper-clad process; -the metallic piece is embedded in the excitation wire on the printed circuit board; the secondary side compensation winding adopts any one of the following: -a secondary compensation winding made by a printed circuit board copper-clad process; -a secondary side compensation winding with metallic pieces embedded on the printed circuit board.
Preferably, the secondary side compensation winding adopts a single-layer or multi-layer printed circuit board structure metal conducting wire wound along the circumferential direction.
Preferably, there is or is no overlap between the projections of the magnetic field sensing element and the secondary compensation winding in the vertical direction. The magnetic field induction element and the projection of the secondary side compensation winding in the vertical direction are not overlapped; the magnetic field induction element counteracts the primary magnetic field by inducing the vertical component of the magnetic field generated by the secondary compensation winding; or the projection of the magnetic field induction element and the secondary compensation winding in the vertical direction is overlapped, and the magnetic field induction element counteracts the primary magnetic field by inducing the parallel component of the magnetic field generated by the secondary compensation winding;
preferably, the storage space adopts any one of the following: -a recessed storage space on the printed circuit board by drilling; -forming a placement space directly on the surface of the printed circuit board.
Preferably, the printed circuit board module adopts a single-layer or multi-layer printed edge circuit board structure.
Preferably, the sensing circuit module further comprises a signal processing module element. The sensing circuit module may be a magnetic field sensing element, a signal processing module element, a magnetic sensor IC, a magnetic field sensing element, a signal processing module element, and a peripheral protection circuit.
Preferably, there is overlap or no overlap between the magnetic field sensing element and the projection of the excitation wire in the vertical direction. The magnetic field induction element does not overlap with the projection of the excitation wire in the vertical direction, and the magnetic field induction element induces the vertical component of the magnetic field generated by the excitation wire; or the magnetic field induction element and the excitation wire are overlapped in the projection direction in the vertical direction, and the magnetic field induction element induces the parallel component of the magnetic field generated by the excitation wire.
Preferably, the method further comprises the following steps: non-conductive adhesive, bonding wire; the sensing circuit module is attached to the inside of the storage space by adopting non-conductive adhesive; the sensing circuit module is electrically connected with the printed circuit board module by adopting a bonding lead; the bonding lead is wrapped in the storage space. Meanwhile, the bonding wire and the bonding wire are wrapped in the storage space, so that the bonding wire and the bonding wire are prevented from being exposed in the air; a bonding wire for electrical connection between the sensing circuit module and the printed circuit board; the remaining portion of the storage space is filled with epoxy resin.
Preferably, the non-conductive glue wraps the sensing circuit module in the storage space, and the sensing circuit module can be completely wrapped in the storage space on the plane of the printed circuit board.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention saves a magnetic ring, and the secondary side compensation winding is also integrated on the printed circuit board module, thereby simplifying the structure, reducing the cost and simultaneously ensuring the reliability of the sensor;
2. in the invention, the sensing circuit module is packaged by the COB, so that compared with the traditional SMD packaging, the manufacturing process flow is simplified, and the cost is reduced;
3. in the invention, after the process is simplified, the accuracy consistency of the mass production of the sensor is higher, and simultaneously, as the excitation wire is drawn on the printed circuit board, the bearable current capacity exceeds 100 amperes, the current detection range is greatly improved, and the adverse effect on the sensing circuit module caused by overheating can not be caused.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is an external view of a first embodiment of the present invention.
Fig. 2 is a schematic front view of a first embodiment of the present invention.
FIG. 3 is a schematic diagram of a reverse structure of the first embodiment of the present invention.
FIG. 4 is a cross-sectional view of a first embodiment of the present invention.
FIG. 5 is a schematic external view of a second embodiment of the present invention.
Fig. 6 is a schematic front view of a second embodiment of the present invention.
FIG. 7 is a schematic diagram of a reverse structure of the second embodiment of the present invention.
FIG. 8 is a schematic cross-sectional view of a second embodiment of the present invention.
In the figure:
first printed circuit board module 1 first printed circuit board module 14
First non-conductive adhesive 2 and second signal conductor assembly 15
First signal conductor assembly 3 second via assembly 16
First through hole assembly 4 fourth pad assembly 17
First bonding pad assembly 5 and second bonding wire 18
Second secondary compensation winding 20 of first sensing circuit module 7
Second non-conductive adhesive 12 and second storage space 25
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
Example one
A novel closed loop current sensor is illustrated in fig. 1-4, comprising: a first printed circuit board module 1 comprising thereon: a first excitation wire 10 connected to an external current source through a third pad 11 for passing a current and generating a magnetic field at the periphery thereof; the secondary side compensation winding 8 is used for offsetting a primary side magnetic field generated by primary side current to form a negative feedback closed-loop control circuit;
a first storage space 13 for storing the first sensor circuit module 7; a first via assembly 4 for electrical connection of signal conductors between layers of the multilayer printed circuit board module;
a first pad assembly 5 for electrical connection between the sensing circuit module and the first printed circuit board module 1;
a second pad assembly 9 for electrically connecting wires such as power, ground and output signals to the outside;
the first bonding pad assembly 5 and the second bonding pad assembly 9 are electrically connected through the signal lead assembly 3 and the first through hole assembly 4;
a second non-conductive adhesive 12 for attaching the first sensor circuit module 7 to the inside of the housing space 12;
the first non-conductive adhesive 2 is used for wrapping the first sensing circuit module 7 and the bonding lead 6 in the first storage space 13 and avoiding direct exposure to air;
the first excitation wire 10 has a curved fillet structure;
the first excitation wire 10 is manufactured by adopting a printed circuit board copper-clad process, or a metal piece is embedded into the first printed circuit board module 1;
the secondary side compensation winding is a metal wire with a single-layer printed circuit board structure wound along the circumferential direction, and can also adopt a multi-layer printed circuit board structure according to the requirement;
the magnetic field induction element and the projection of the secondary compensation winding 8 in the vertical direction are not overlapped, and the magnetic field induction element counteracts the primary magnetic field by inducing the vertical component of the magnetic field generated by the secondary compensation winding 8;
the first storage space 13 is a groove drilled in the first printed circuit board module 1;
the first sensing circuit module 7 may be a magnetic field sensing element, a signal processing module element, a magnetic sensor IC, a magnetic field sensing element, a signal processing module element, and a peripheral protection circuit;
there is no overlap between the magnetic field sensing element and the projection of the first excitation wire 10 in the vertical direction, the magnetic field sensing element senses the vertical component of the magnetic field generated by the excitation wire;
the remaining part in the first accommodation space 13 is filled with epoxy resin;
the first printed circuit board module 1 adopts a double-layer printed circuit board structure, and can also adopt a single-layer printed circuit board structure according to requirements;
compared with the prior art that the excitation wire, the Hall element and the processing circuit are all packaged together in a traditional SMD packaging form, the novel closed-loop current sensor disclosed by the invention adopts a COB packaging form, namely chip-on-board packaging, which is a packaging mode different from the SMD packaging technology, and specifically comprises the steps of adhering a sensing circuit module on a printed circuit board by using conductive or non-conductive glue, then carrying out lead bonding to realize electrical connection, and packaging the chip and a bonding lead by using glue. The production process of SMD packaging needs to be subjected to links such as die bonding, wire bonding, dispensing, baking, stamping, light splitting and color separation, taping and pasting, and the production process of COB packaging is simplified on the basis, firstly, the sensing circuit module is pasted on a circuit board, and then die bonding, wire bonding, testing, dispensing and baking are carried out, so that the COB packaging saves the production time and the manufacturing cost to a certain extent compared with SMD subpackaging.
Based on the closed-loop current sensor architecture, the working mode is as follows:
according to the magnetic effect of the current, when the first excitation wire 10 passes through the current, a magnetic field is generated around the first excitation wire, the magnetic field sensing element integrated on the first sensing circuit module 7 senses the magnetic field component of the magnetic field perpendicular to the magnetic field sensing element and outputs the magnetic field component to the processing circuit, the processing circuit receives the magnetic field signal output of the magnetic field sensing element and amplifies the magnetic field signal into a current signal to be provided for the secondary side compensation winding, the secondary side magnetic field generated around the first sensing circuit module 7 by the secondary side compensation winding 8 is equal in magnitude and opposite in direction to the primary side magnetic field generated around the first sensing circuit module 7 by the primary side current, and the primary side magnetic field is counteracted to form a negative feedback closed-loop control circuit. If the secondary side current is too small, the generated secondary side magnetic field is not enough to counteract the primary side magnetic field, the processing circuit outputs a larger current, otherwise, the processing circuit outputs a reduced current, and thus, the magnetic field balance at the first sensing circuit module 7 is maintained. If the primary current changes, the magnetic field balance at the first sensing circuit module 7 is damaged, and the negative feedback closed-loop control circuit can also adjust the secondary output circuit to enable the magnetic field to reach balance again.
Example two
Fig. 5-8 illustrate a novel closed loop current sensor comprising: a second printed circuit board module 14 comprising thereon: a second excitation wire 22 connected to an external current source through a third pad 23 for passing a current and generating a magnetic field at the periphery thereof;
a second secondary compensation winding 20 for canceling a primary magnetic field generated by the primary current to form a negative feedback closed-loop control circuit;
a second storage space 25 for placing the second sensor circuit module 19;
a second via assembly 16 for electrical connection of signal conductors between layers of the multilayer printed circuit board module;
a fourth pad assembly 17 for electrical connection between the sensing circuit module and the printed circuit board module 7;
a fifth pad assembly 21 for electrically connecting wires such as power, ground and output signals to the outside;
the fourth pad assembly 17 and the fifth pad assembly 21 are electrically connected by the second signal wire assembly 15 and the second via assembly 16;
a second non-conductive adhesive 12 for attaching the first sensor circuit module 7 to the inside of the housing space 12;
the third non-conductive adhesive 24 is used for completely wrapping the plane of the printed circuit board where the second sensing circuit module 19 is located in the second storage space 25 so as to avoid direct exposure to the air;
the second excitation wire 22 has a curved fillet structure;
the second excitation wire 22 is manufactured by adopting a printed circuit board copper-clad process, or a metal piece is embedded on the second printed circuit board module 14;
the second subsidiary compensation winding 20 is a metal wire of a single-layer printed circuit board structure wound in the circumferential direction, and a multi-layer printed circuit board structure can be adopted according to the requirement;
there is no overlap between the magnetic field sensing element and the projection of the second secondary compensation winding 20 in the vertical direction, and the magnetic field sensing element cancels the primary magnetic field by sensing the vertical component of the magnetic field generated by the second secondary compensation winding 20;
the second accommodation space 25 is a groove drilled in the second printed circuit board module 14;
the second sensing circuit module 19 may be a magnetic field sensing element, a signal processing module element, a magnetic sensor IC, a magnetic field sensing element, a signal processing module element, and a peripheral protection circuit;
there is no overlap between the magnetic field sensing element and the projection of the second excitation wire 22 in the vertical direction, the magnetic field sensing element sensing the vertical component of the magnetic field generated by the excitation wire;
the remaining part in the second accommodation space 25 is filled with epoxy resin;
the second pcb module 14 has a double-layer pcb structure, and may have a single-layer pcb structure as required;
based on the closed-loop current sensor architecture, the working mode is as follows:
according to the magnetic effect of the current, when the second excitation wire 22 passes through the current, a magnetic field is generated around the second excitation wire, the magnetic field sensing element integrated on the second sensing circuit module 19 senses the magnetic field component of the magnetic field parallel to the magnetic field sensing element and outputs the magnetic field component to the processing circuit, the processing circuit receives the magnetic field signal output by the magnetic field sensing element and amplifies the magnetic field signal into a current signal to be provided to the secondary compensation winding, the secondary magnetic field generated around the second sensing circuit module 19 by the second secondary compensation winding 20 is equal in magnitude and opposite in direction to the primary magnetic field generated around the second sensing circuit module 19 by the primary current, and the primary magnetic field is cancelled to form a negative feedback closed-loop control circuit. If the secondary current is too small, the generated secondary magnetic field is not enough to counteract the primary magnetic field, and the processing circuit outputs a larger current, otherwise, the processing circuit outputs a reduced current, thereby maintaining the magnetic field balance at the second sensing circuit module 19. If the primary current changes, the magnetic field balance at the second sensing circuit module 19 is destroyed, and the negative feedback closed-loop control circuit can also adjust the secondary output circuit to make the magnetic field balance again.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (10)
1. A closed loop current sensor, comprising: the sensor comprises a printed circuit board module, a sensing circuit module, a pad unit and an insulation packaging module;
the printed circuit board module includes: the excitation wire, the secondary side compensation winding and the object placing space are arranged in the shell;
the pad unit includes: a pad assembly;
the sensing circuit module is placed in the storage space;
the excitation lead is connected with the pad assembly;
the printed circuit board module further includes: a signal interface;
the sensing circuit module at least comprises: a magnetic field induction element;
the printed circuit board module and the sensing circuit module are connected by adopting an insulation packaging module;
the insulating packaging module wraps the sensing circuit module in the object placing space.
2. The closed loop current sensor of claim 1, wherein said excitation wire is configured in any one of the following configurations:
-a curved fillet structure;
-a rectilinear shaped configuration.
3. The closed loop current sensor of claim 1, wherein said excitation wire employs any one of:
-an excitation wire made by a printed circuit board copper-clad process;
-the metallic piece is embedded in the excitation wire on the printed circuit board;
the secondary side compensation winding adopts any one of the following:
-a secondary compensation winding made by a printed circuit board copper-clad process;
-a secondary side compensation winding with metallic pieces embedded on the printed circuit board;
the secondary side compensation winding adopts a metal lead of a single-layer or multi-layer printed circuit board structure which is wound along the circumferential direction.
4. The closed-loop current sensor of claim 1, wherein there is or is no overlap between the magnetic field sensing element and the projection of the secondary compensation winding in the vertical direction.
5. The closed loop current sensor of claim 1, wherein the storage space employs any one of:
-a recessed storage space on the printed circuit board by drilling;
-forming a placement space directly on the surface of the printed circuit board.
6. The closed-loop current sensor of claim 1, wherein said printed circuit board module employs a single or multi-layer printed side-by-side circuit board structure.
7. The closed-loop current sensor of claim 1, wherein said sensing circuit module employs any of:
-a magnetic field inducing element;
-a magnetic field sensing element and a signal processing module element;
-a magnetic sensor IC;
-a magnetic field sensing element, a signal processing module element and a peripheral protection circuit.
8. The closed-loop current sensor of claim 1, wherein there is overlap or no overlap between the magnetic field sensing element and the projection of the excitation wire in the vertical direction.
9. The closed-loop current sensor of claim 1, further comprising: non-conductive adhesive, bonding wire;
the sensing circuit module is attached to the inside of the storage space by adopting non-conductive adhesive;
the sensing circuit module is electrically connected with the printed circuit board module by adopting a bonding lead;
the bonding wire is wrapped in the placement space.
10. The closed-loop current sensor as claimed in claim 1, wherein the non-conductive adhesive encapsulates the sensing circuit module within the storage space, or
The non-conductive adhesive completely wraps the plane of the printed circuit board where the sensing circuit module is located in the storage space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010365678.5A CN111351975A (en) | 2020-04-30 | 2020-04-30 | Closed loop current sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010365678.5A CN111351975A (en) | 2020-04-30 | 2020-04-30 | Closed loop current sensor |
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| Publication Number | Publication Date |
|---|---|
| CN111351975A true CN111351975A (en) | 2020-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010365678.5A Pending CN111351975A (en) | 2020-04-30 | 2020-04-30 | Closed loop current sensor |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63228072A (en) * | 1987-03-17 | 1988-09-22 | Hioki Denki Kk | Detector with hall element for measuring instrument |
| JP2008020402A (en) * | 2006-07-14 | 2008-01-31 | Asahi Kasei Electronics Co Ltd | Electric current detection mechanism |
| CN102483443A (en) * | 2009-08-28 | 2012-05-30 | 罗伯特·博世有限公司 | Magnetic field sensor |
| CN202305633U (en) * | 2011-09-30 | 2012-07-04 | 上海汽车集团股份有限公司 | Low current Hall sensing device for electrical device of automobile |
| CN104603623A (en) * | 2012-06-27 | 2015-05-06 | 森斯泰克有限责任公司 | Device for current measurement |
| CN105452880A (en) * | 2013-07-30 | 2016-03-30 | 旭化成微电子株式会社 | Current sensor |
| CN105866515A (en) * | 2016-06-15 | 2016-08-17 | 成都芯进电子有限公司 | Current sensor |
| CN212514753U (en) * | 2020-04-30 | 2021-02-09 | 赛卓电子科技（上海）有限公司 | Closed loop current sensor |
-
2020
- 2020-04-30 CN CN202010365678.5A patent/CN111351975A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63228072A (en) * | 1987-03-17 | 1988-09-22 | Hioki Denki Kk | Detector with hall element for measuring instrument |
| JP2008020402A (en) * | 2006-07-14 | 2008-01-31 | Asahi Kasei Electronics Co Ltd | Electric current detection mechanism |
| CN102483443A (en) * | 2009-08-28 | 2012-05-30 | 罗伯特·博世有限公司 | Magnetic field sensor |
| CN202305633U (en) * | 2011-09-30 | 2012-07-04 | 上海汽车集团股份有限公司 | Low current Hall sensing device for electrical device of automobile |
| CN104603623A (en) * | 2012-06-27 | 2015-05-06 | 森斯泰克有限责任公司 | Device for current measurement |
| CN105452880A (en) * | 2013-07-30 | 2016-03-30 | 旭化成微电子株式会社 | Current sensor |
| CN105866515A (en) * | 2016-06-15 | 2016-08-17 | 成都芯进电子有限公司 | Current sensor |
| CN212514753U (en) * | 2020-04-30 | 2021-02-09 | 赛卓电子科技（上海）有限公司 | Closed loop current sensor |
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