CN104364940B - Purposes for the protective device of electronic structure element, circuit, electrochemical energy accumulator, the method for manufacturing circuit and flexible cap layer - Google Patents
Purposes for the protective device of electronic structure element, circuit, electrochemical energy accumulator, the method for manufacturing circuit and flexible cap layer Download PDFInfo
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- CN104364940B CN104364940B CN201380030445.8A CN201380030445A CN104364940B CN 104364940 B CN104364940 B CN 104364940B CN 201380030445 A CN201380030445 A CN 201380030445A CN 104364940 B CN104364940 B CN 104364940B
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- Prior art keywords
- cap layer
- circuit
- electronic structure
- structure element
- protective device
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/572—Means for preventing undesired use or discharge
- H01M50/584—Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries
- H01M50/586—Means for preventing undesired use or discharge for preventing incorrect connections inside or outside the batteries inside the batteries, e.g. incorrect connections of electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The present invention relates to a kind of protective devices for being used for electronic structure element (120).Herein, the electronic structure element (120) setting for being arranged in electrochemical energy accumulator (100), the inside of shell (106) comprising electrolyte (104), and be provided at least one contact (130) for being used to be in electrical contact with the electronic structure element (120).The protective device has a cap layer (140) of at least local compliance, and the cap layer has a kind of material, the material be not much interaction in chemical aspect among the contact of the electrolyte (104) or do not interact.Cap layer (140) described herein surrounds the electronic structure element (120) with being configured to Fluid Sealing.At least one contact (130) described herein can be drawn from the cap layer (140) to Fluid Sealing.
Description
Technical field
The present invention relates to a kind of for the protective device of electronic structure element, a kind of circuit, a kind of electrochemical energy accumulator, one
Method and flexible cap layer of the kind for manufacturing circuit are used as the purposes of the protective device for electronic structure element.
Background technique
With in battery list pond, in particular for the measurement of voltage, temperature on the lithium ion battery of electric vehicle etc.
Operating status is monitored, this is carried out frequently by external sensor is placed in.In the continuous propulsion for battery
Exploitation in the range of, for the measured value of the update in the inside in battery list pond, such as pressure it is accurate measurement or
Person's measurement becomes more and more important.Here, the condition inside battery list pond be not without difficulty be suitable for sensor,
Traditional packaging material, such as traditional moulding material, PCB(printed circuit board), adhesive, gelatin and similar material.Do not conform to
The addition of suitable material can jeopardize electricity due to possible and chemical reaction between the electrolyte in battery list pond
Pond stability.
Summary of the invention
Based on this background, introduced with the present invention obtained by one kind described in independent claims it is improved for electronics
Protective device, one kind of structural detail obtain improved circuit, one kind obtains improved electrochemical energy accumulator, one kind is improved
Method for manufacturing circuit and a kind of obtain protective device improved, that flexible cap layer is used for electronic structure element
Purposes.Advantageous design scheme is obtained from corresponding dependent claims and following specification.
According to the embodiment of the present invention, electronic structure element prevents the phase between the medium of surrounding by encapsulating cover
Interaction, the electronic structure element more particularly to be electrical or electronic route a part.The structural detail or
Described route itself can not covered or had shell.If the structural detail or the route have shell
Body, such as standard pack, such as molded housing or preforming shell, then encapsulating cover is just capable of forming additional shell
Body.The structural detail or the circuit can be the sensor especially used in the inside of electrochemical energy accumulator, the biography
Sensor is for example with standard-sensor packaging.Encapsulating cover according to the embodiment of the present invention is made of a kind of material, the material
Do not allow the apparent interaction between such as electrolyte of such as battery, and the material especially also can be with electrical isolation
Mode make at least one for the electric conductor that is in contact with the electronic structure element from the encapsulating cover in pass through.
It is an advantage of the current invention that can be realized it is a kind of and inexpensive and reliable, use in corrosive environment
In the protective packaging of electronic structure element or circuit.Especially suggest a kind of for electronic structure element or for for example sensing
The packaging of the form of device, electronics route, wherein the packaging can make one easily by the electronic structure element or
The route of electronics is for example added in battery list pond.Therefore, the shell especially with traditional type, packaging or similar encapsulating
The electronic structure element or circuit of cover can suitably be equipped with according to the embodiment of the present invention, for being for example added to storage
Protective device in battery list pond.Thus it not only realizes the stability test of the battery of the electrochemistry, but also is achieved with
The protective device is come the persistence for the route protected.The protective device be distinguished by it is lesser, can ignore that
Or chemical reaction not will do it and for example between the electrolyte inside battery list pond.Thus the protective device
Can represent it is stable in chemistry about special medium, for electronic structure element or for the encapsulating cover of circuit,
The encapsulating is covered with to be added into the medium.Such solution is not only very inexpensive, but also is for example being used for
As also only making when the encapsulating cover of the sensor of inside battery, it is generally believed that the material and the battery being applicable in battery
Battery chemistries medicament be in contact.
A kind of protective device for electronic structure element, wherein the electronic structure element is arranged for being arranged in electrification
Inside that learn accumulator, shell comprising electrolyte and at least one is provided with for connecing with the electronic structure element electricity
The contact of touching, the protective device have the feature that
At least partly flexible cap layer, the cap layer have a kind of material, the material in the contact of the electrolyte
Interaction is not much in chemical aspect or is not interacted, wherein the cap layer is surrounded with being configured to Fluid Sealing
The electronic structure element, wherein at least one described contact can be drawn from the cap layer to Fluid Sealing.
The electrochemical energy accumulator can be the secondary cell that a kind of especially form is electric current or electrochemistry battery,
Perhaps similar to battery, it is configured to individual unit or is configured to for example so-called electricity the battery of battery list pond or electric current
The subelement of pond group or similar assembly.The electrochemical energy accumulator can for example be arranged for electric vehicle, hybrid electric vehicle or
Person's similar vehicles.The shell of the electrochemical energy accumulator can be sealed hermetically.In the inside of the shell, Neng Gourong
It receives or can accommodate or can arrange or can arrange electrode standard component or electrochemical reaction unit and described
Electrolyte.The material of the cap layer of the protective device can be in the range of being more than the protection duration relative to the electrolyte
It is stable in chemistry.Here, the cap layer, be not much phase interaction in chemistry in the contact of the electrolyte
With or the material that does not interact at least be capable of forming the outer surface of the cap layer.Pass through the material for the cap layer
Selection can determine or can determine the protection duration.The cap layer can be flexible completely, such as
It is rigid on one or more fringe region and is flexible elsewhere.The fringe region of rigidity can for example lead to
Cross following manner and generate: two sections of the cap layer are joined together, are for example welded on top of one another.It is described
Cap layer can also have rigid suture.The cap layer can be made of the material of film-form.Thus, it is possible to pass through the cover
Layer forms the shell of film-form.It is constructed due to the cap layer at least local compliance, the cap layer may be due in the electricity
The pressure oscillation of the inside of the shell of electrochemical energy accumulator and deform.
In one embodiment, the cap layer can have a connect segment, which is configured to can
With another section of the cap layer, with the section of the electronic structure element and as additional project or alternative solution and electricity
It connects to the section Fluid Sealing of road-load body, the electronic structure element can be disposed on the circuit carrier.It is described as a result,
The section of cap layer is configured to carry out the structure of the connection of Fluid Sealing each other.As additional project or alternative solution, institute
Stating connect segment also can be configured to the electronic structure element and/or circuit carrier section Fluid Sealing even
The structure connect.Such embodiment is provided the advantage that can be adjusted by applicable cases and design scheme with various aspects
Whole mode protects the electronic structure element by means of the protective device, to prevent the influence of the electrolyte.At this
In the case of kind, at least one electronic structure element, Fluid Sealing encapsulating can be arranged to by means of the cap layer
Or it is changeably carried out in the case where not being arranged on the electronic structure element.
The especially described cap layer can be made of film or have film.The film for example can be plastic foil or gold
Belong to foil.It can be related to the film by coating.Such as the film can be the metal foil with plastic coat.In such case
Under, the metal foil single side or two-sided can use plastic coat.Such embodiment provide the advantage that the cap layer with
Less cost has relative to the chemical stability of electrolyte, good shape matching, good mechanical performance and electricity
The characteristic of insulation.In order to construct the cap layer, the film can be folded once, and the film, be placed on each other
The edge in face can be joined to one another.Also deep-draw can be carried out to the film, for shaping the cap layer.As substitution
Scheme, the cap layer can by two mounted on top and the part film that is bonded together be made.
The circuit for being arranged in electrochemical energy accumulator, shell comprising electrolyte inside, which is arranged, has following spy
Sign:
At least one electronic structure element；
At least one is used for the contact being in electrical contact at least one described electronic structure element；And
Protective device noted earlier, the protective device have cap layer, surround the electricity to the cap layer Fluid Sealing
At least one electronic structure element on road, wherein at least one contact of the circuit draws with being fluid-tight from the cap layer
Out, and relative to the protective device the mechanical lockable mechanism of at least one electronic structure element is formed.
In conjunction with the circuit, protective device noted earlier can be advantageously used.It can especially in combination with the circuit
Protective device noted earlier is advantageously used, for protecting at least one electronic structure element of the circuit, to prevent
The interaction of chemistry between the electrolyte.Therefore, the circuit can be applicable in simultaneously by means of the protective device
And it is suitable for being added in electrochemical energy accumulator.The electronic structure element for example can be sensor, and the sensor is for example
For detecting the voltage, the internal temperature inside the electrochemical energy accumulator or the electrochemistry of the electrochemical energy accumulator
The internal pressure of accumulator.By the lockable mechanism of the machinery, the electronic structure element can be obtained relative to the protective device
To fixation.Such as the electronic structure element can be maintained on predetermined position in the inside of the protective device.
In order to realize that the lockable mechanism of the machinery, the contact can be configured to rigid element.Such as the contact can construct
For the circuit, circuit carrier protrusion.In one embodiment, at least two contacts can be set, and the contact exists
It is drawn from the cap layer with being fluid-tight on side opposite each other.At least two contact can be filled in the protection
The internal rigid set it is connected to each other.Such as at least two contact can represent it is for the electronic structure element,
Circuit carrier, opposed end section or protrusion.
In one embodiment, the cap layer of the protective device can be arranged at least one described electronics knot against ground
On at least one portion region of constitutive element part.The cap layer of protective device described herein can also be arranged in the circuit against ground
On at least one portion region.Such embodiment, which provides the advantage that, is especially being used as pressure sensor for the circuit
When can improve measurement sensitivity, if the cap layer or protective film abut directly against the component or electronic structure element
At least one surface on.
The cap layer of the protective device can also be loaded with fluid.The fluid for example can include protective gas, oil
Or similar fluid.Gap between the cap layer and at least one described electronic structure element can use the stream herein
Body loads.In this case, the fluid being loaded into cap layer is under defined pressure.Such reality
The mode of applying provides the advantage that the cap layer loaded with the fluid such as improvement when the circuit is used as pressure sensor
Transmitting situation pressure change being transmitted to by means of the cap layer on the sensor element surrounded.
In addition, the circuit can have the circuit carrier of the form of circuit board or connection framework.In this case,
At least one described electronic structure element can be arranged on the circuit carrier, wherein at least one described contact can be institute
State structural detail or the circuit carrier a part.Here, can be surrounded by means of the cap layer of the protective device
At least one portion section of the circuit carrier.At least one described electronic structure element or component can be applied to energy
On enough circuit carriers for connecting or engaging with the cap layer Fluid Sealing, circuit board for example flexible.The circuit carrier
It can pass through the cap layer in order to be contacted and guide to outside, wherein at least one contact of the circuit can be arranged in institute
It states on the component of circuit carrier drawn outward.At least one described electronic structure element or component can be applied to circuit
On carrier, such as circuit board.The circuit carrier can be for example by means of stickup, soldering or similar fashion and at least one gold
Electric conductor belonging to, can connecting or engage with the cap layer Fluid Sealing is in contact.Such as connection framework or lead
Frame also can so be configured to circuit carrier, so that at least one electric conductor for arising directly from the electronic structure element is constituted
The electrical contact being arranged for being in electrical contact.Such embodiment provides the advantage that by means of the protective device,
The different embodiments of the circuit can be protected in a simple manner.Here, can combined circuit it is many-sided and
Inexpensively use the protective device.
In one embodiment, the cap layer of the protective device is capable of fixing the fringe region in the circuit carrier
On.Such as the cap layer is at least capable of fixing on two opposed fringe regions of the circuit carrier or is fixed on all
On fringe region, that is, circumferentially it is fixed on the circuit carrier.The cap layer for example can be by means of engagement as a result,
It is connect with the edge of the circuit carrier with being connected and fixed.The cap layer can so surround the circuit carrier, so that described
Circuit carrier is clamped by the cap layer.It is capable of the shape of previously given at least one portion cap layer flexible in this way
Shape.The cap layer is fixed on this method on the circuit carrier also can be in a predetermined manner by the electronic structure
Element is arranged in the inside of the cap layer.
The especially described circuit can be configured to the sensing detected to the state parameter of the electrochemical energy accumulator
Device.The sensor can be configured to detect the state or state inside the electrochemical energy accumulator in this case
Parameter.The sensor or the circuit can have at least one sensor element.Such sensor element being capable of structure
Make the internal pressure of the operating temperature or the electrochemical energy accumulator for for example detecting the electrochemical energy accumulator.The circuit energy
It is enough configured to from receiving sensor data or measurement data from least one described sensor element.Such embodiment
Provide the advantage that for example, by with measurement in electrochemical energy accumulator, for example, especially for the lithium ion battery of electric vehicle
Internal voltage, this mode of temperature are to running state monitoring, thus, it is possible to realize more accurate measurement and/or for updating
Measured value, such as pressure measurement.
Here, the material of the cap layer can be at least flexible in the section of part.Especially for by means of the electricity
Detect the inner pressure of battery of the electrochemical energy accumulator in road, it is advantageous to which the cap layer is at least partly by material structure flexible
At.
Electrochemical energy accumulator has the feature that
Shell arranges electrochemical reaction unit and electrolyte in the inside of the shell；And
Circuit that is noted earlier, being arranged in the enclosure interior.
In conjunction with the electrochemical energy accumulator, can be advantageously used it is noted earlier, there is protection noted earlier
The circuit of device.Circuit noted earlier can be advantageously used especially in combination with the electrochemical energy accumulator, for especially existing
Inside battery is detected about the electrochemical energy accumulator, at least one state parameter sensing data, wherein the circuit
It is protected by the advantageous design scheme of the protective device, to prevent the influence of electrolyte.
It is a kind of for manufacture setting for be arranged in electrochemical energy accumulator, shell comprising electrolyte inside, it is electric
The method on road has follow steps:
At least one electronic structure element is provided and at least one is used to connect at least one described electronic structure element electricity
The contact of touching；And
Described in being surrounded in a fluid tight manner by means of the protective device at least partly flexible cap layer at least
One electronic structure element, the cap layer have a kind of material, the material in the contact of the electrolyte in chemistry side
Face is not much interaction or does not interact, wherein at least one described contact be fluid-tight from the cap layer
Middle extraction.
By the execution of the method, it is capable of providing a kind of circuit advantageous, noted earlier, which has front
The protective device being previously mentioned.For example by means of thermal bonding or similar fashion in the cap layer in the step of this can be in encirclement
A connect segment and the cap layer another section between or the cap layer a connect segment and the circuit
A section between generate Fluid Sealing engagement connection.
Flexible cap layer is also advantageously used for the protective device of electronic structure element, the electronic structure element to be set
For being arranged in electrochemical energy accumulator, shell comprising electrolyte inside is set, wherein the flexible cover layer has a kind of material
Material, the material among the contact of the electrolyte chemical aspect be not much interaction or do not interact.
Arrangement that traditional circuit can in this way be suitable for inside battery case in the case where spending few or
Operation.
Detailed description of the invention
The present invention is explained in detail by means of attached diagram plasticity.In attached drawing:
Fig. 1 shows a kind of schematic diagram of the electrochemical energy accumulator of embodiment according to the invention；
Fig. 2 to 4 shows the schematical sectional view of the circuit of embodiment according to the invention；
Fig. 5 shows a kind of diagram of the electrochemical energy accumulator of embodiment according to the invention；
Fig. 6 shows a kind of flow chart of the method for embodiment according to the invention；And
Fig. 7 and 8 shows the schematical sectional view of the circuit of embodiment according to the invention.
Below in a preferred embodiment of the present invention description, to be shown in different attached drawings and similarly
The element to work uses identical or similar appended drawing reference, saves the repeated explanation to these elements herein.
Specific embodiment
Fig. 1 shows a kind of schematic diagram of the electrochemical energy accumulator 100 of embodiment according to the invention.The electrochemistry stores
The energy embodiment shown in FIG. 1 according to the invention of device 100 has electrochemical reaction unit 102, electrolyte 104 and shell
106, in the inside of the shell 106, arrangement accommodates the electrochemical reaction unit 102, for example described electrochemistry accumulation of energy in other words
Two electrodes and the electrolyte 104 of device 100.The electrochemical energy accumulator 100 for example can be that form is lithium ion battery
Or the electrochemical secondary cell of similar battery.
Circuit 110 is contained in other words in the inside arrangement of the shell 106 of the electrochemical energy accumulator 100.The circuit
110 for example can be the biography detected at least one state parameter in the inside to the electrochemical energy accumulator 100
Sensor.The embodiment shown in FIG. 1 according to the invention of circuit 110 for example with electronic structure element 120 in other words
Component, such as contact 130 and protective device, wherein the contact 130 in order to at least one described electronic structure element 120
It is in electrical contact and is connected electrically, and wherein there is the protective device cap layer 140 to protect cap layer in other words or by the cover
Layer is constituted.The cap layer at least partly section flexibly constructs.Such as the cap layer can be by the material of film-form or by thin
Film is made.
Surround to 140 Fluid Sealing of cap layer at least one electronic structure element 120 of the circuit 110.The electricity
Drawn from the cap layer at least one 130 Fluid Sealing of contact on road 110.It is only shown in Fig. 1, in the contact
Electric conductor can be connected on 130, and the circuit 110 is electrically connected in the electrochemical energy accumulator 100 to realize
On the signal wire of portion or outside.The cap layer 140 have a kind of material, the material with the electrochemical energy accumulator 100
Interaction is not much in chemical aspect among the contact of electrolyte 104 or is not interacted.
Fig. 2 shows a kind of schematical sectional views of the circuit 110 of embodiment according to the invention.Here it is shown that one
Kind of circuit 110, the circuit for example with electronic structure element 120 or component, for example in order to the electronic structure element 120
Be in electrical contact and be connected electrically contact 130, protect with cap layer 140 cap layer in other words protective device and form be substrate
The circuit carrier 225 of circuit board in other words.The circuit 110 can be the circuit of Fig. 1.The circuit 110 can with for pair
The shape for the sensor that state parameter in the inside of the electrochemical energy accumulator of electrochemical energy accumulator, example as shown in figure 1 is detected
Formula exists.In addition, exemplary show two connect segments 245 of the cap layer 140, the cover in the two connect segments
It is connect with the circuit carrier 225 and the contact 130 to 140 Fluid Sealing of layer.
The electronic structure element 120 is exemplarily arranged in the circuit carrier 225 by means of two solder contacts
In other words on the circuit board.One of described solder contacts are electrically connected with the contact 130.The contact 130 is according to the present invention
Embodiment shown in figure 2 be configured to the guide passage of the circuit carrier 225 circuit board in other words.The contact 130 is from institute
The structural detail region for being wherein disposed with the electronic structure element 120 for stating circuit carrier 225 extends to the circuit
The join domain for being connected to electric conductor on the circuit 110 of carrier 225.Here, the contact 130 be arranged in it is described
In the first main surface of circuit carrier 225 shown above in Fig. 2.Even if being not shown in Fig. 2, the contact 130
The connecting element can be electrically connected or is configured to connecting element in the join domain.
The cap layer 140 in the connect segment 245 Fluid Sealing with the circuit carrier 225 and the contact
130 connections.First connecting portion section in the connect segment 245 of the cap layer 140 is in the circuit carrier 225 and contact 130
The electricity is placed between the structural detail region and the join domain of the circuit carrier 225 on first engaging zones
In first main surface of road-load body 225.Second connecting portion section in the connect segment 245 of the cap layer 140 is carried in the circuit
It is placed in second engaging zones of body 225 in second main surface opposed with the first main surface of the circuit carrier 225.
Here, the first engaging zones and the second engaging zones of the circuit carrier 225 are exemplarily opposed to arrange.The cap layer
140 so extend between its connect segment 245 in the cross section depicted in fig. 2, to be surrounded herein by means of the cap layer 140
A part of the electronic structure element 120 and the circuit carrier 225 and contact 130.So arrange the cap layer 140, from
And other than in the connect segment 245, in the cap layer 140 and the circuit carrier 225, the contact 130 and institute
Stating between electronic structure element 120 can there are gaps.The cap layer 140 is so arranged, so that the company of the circuit carrier 225
Region is connect to be arranged in except the enclosing region of the cap layer 140.The connect segment 245 the circuit carrier 225 with it is described
Mechanical lockable mechanism is formed between cap layer 140.
In other words, Fig. 2 shows the principles of protective sensor packaging, wherein in the interconnecting piece of the cap layer 140
For example by stickup, thermal bonding or similar fashion in the cap layer 140 and the circuit carrier 225 and the touching in section 245
The connection of Fluid Sealing is established between first 130.The cap layer 140 can be the encapsulating cover flexible that such as form is film.
The circuit carrier 225 can be the substrate with electrical contact.
Fig. 3 shows a kind of schematical sectional view of the circuit 110 of embodiment according to the invention.Here it is shown that one
Kind of circuit 110, the circuit for example with electronic structure element 120 or component, such as two in order to the electronic structure member
Part 120 is in electrical contact and the contact 130 being connected electrically, the protective device and form of protecting with cap layer 140 cap layer in other words
For connection framework or the circuit carrier 225 of so-called lead frame.The circuit 110 can be the circuit of Fig. 1.The circuit
110 can be for detecting the state parameter in the inside of electrochemical energy accumulator, the electrochemical energy accumulator of such as Fig. 1
Sensor form exist.In addition, exemplary show four connect segments 245 of the cap layer 140, connected at this four
Be bonded together to 140 Fluid Sealing of cap layer in section and Fluid Sealing connect with the contact 130.The contact
130 embodiments according to the invention being shown in FIG. 3 are configured to the connector of the connection framework or lead frame.The contact
130 are electrically connected with the electronic structure element 120.Each contact in described two contacts 130 has one and connecting pin
The opposite free end in portion, corresponding contact 130 is electrically connected with the electronic structure element 120 on the connection end
It connects.Each free end in the free end of described two contacts 130 is arranged for electric conductor to be connected to the electricity
On road 110.
The cap layer 140 is bonded together with being fluid-tight in the connect segment 245, and Fluid Sealing with
The contact 130 connects.The embodiment according to the invention being shown in FIG. 3 of cap layer 140 is configured to two-part structure.
Here, each part of the cap layer 140 for example has, there are two connect segments 245.The company of the first part of the cap layer 140
First connecting portion section in the first junction Fluid Sealing the connection with the second part of the cap layer 140 in socket part section 245
First connecting portion section connection in section 245.The first contact in the contact 130 extends through first junction, makes
The free end for obtaining first contact 130 is arranged in the outside of the cap layer 140.The first part of the cap layer 140
Second connecting portion section in connect segment 245 in the second junction Fluid Sealing the company with the second part of the cap layer 140
Second connecting portion section connection in socket part section 245.The second contact in the contact 130 extends through second junction,
So that the free end of second contact 130 is arranged in the outside of the cap layer 140.The cap layer 140 so arrangement is simultaneously
And be bonded together, to be surrounded the one of the electronic structure element 120 and the contact 130 by means of the cap layer 140
Part.So arrange the cap layer 140, thus in addition in the junction the external cap layer 140 and the contact 130 and
It can there are gaps between the electronic structure element 120.
In other words, Fig. 3 shows the principle of protective sensor packaging, wherein in the interconnecting piece of the cap layer 140
For example by stickup, thermal bonding or similar fashion in the cap layer 140 and the circuit carrier 225 and the touching in section 245
The connection of Fluid Sealing is established between first 130.The cap layer 140 can be the encapsulating cover flexible that such as form is film.
The electronic structure element 120 and the circuit carrier 225 form the so-called first order level packaging (1st- based on lead frame
Level-Package), wherein the contact 130 is the connector specially shaped of the packaging being for example made of copper
(" leads ").
Fig. 4 shows a kind of schematical sectional view of the circuit 110 of embodiment according to the invention.Here it is shown that one
Kind of circuit 110, the circuit for example with electronic structure element 120 or component, for example in order to the electronic structure element 120
Be in electrical contact and be connected electrically contact 130, protect with cap layer 140 cap layer in other words protective device and form be substrate
The circuit carrier 225 of circuit board in other words.The circuit 110 can be the circuit of Fig. 1.The circuit 110 can with for pair
Electrochemical energy accumulator, the electrochemical energy accumulator of such as Fig. 1 inside in the form of sensor that is detected of state parameter
And exist.In addition, exemplary show two connect segments 245 of the cap layer 140, the cover in the two connect segments
It is connect with the circuit carrier 225 and the contact 130 to 140 Fluid Sealing of layer.
Diagram and shown circuit 110 in Fig. 4 correspond to the diagram or electricity of Fig. 2 other than following situations
Road: the circuit 110 described in Fig. 4 has pressure sensor, and the cap layer 140 is resisted against the electronics at least one section
Second connecting portion section on structural detail 120 and in the connect segment 245 is expanded, so that 140 quilt of the cap layer
It is placed on the widened region of the circuit carrier 225, the region is exemplarily from the second main table of the circuit carrier 225
Face extends to its first main surface.
In other words, Fig. 4 shows the principle of protective sensor packaging, wherein in the interconnecting piece of the cap layer 140
For example by stickup, thermal bonding or similar fashion in the cap layer 140 and the circuit carrier 225 and the touching in section 245
First 130 establish the connection of Fluid Sealing.The cap layer 140 or encapsulating cover on this and are tightened against the electronic structure member
It is straight for passing through in the gapless situation between cap layer 140 and electronic structure element 120 on part 120 or sensor element
The pressure connect transmits the pressure transducer functionality to improve or promote the circuit 110.The cap layer 140 can be such as shape
Formula is encapsulating cover film flexible, flexible.The circuit carrier 225 can be the substrate with electrical contact.
Fig. 5 shows a kind of diagram of the electrochemical energy accumulator 100 of embodiment according to the invention.The electrochemistry accumulation of energy
Device 100 can be the electrochemical energy accumulator of Fig. 1.Here it is shown that shell 106 and the electrification of the electrochemical energy accumulator 100
Two battery contacts 508 of accumulator 100 are learned, described two battery contacts 508 extend out from the shell 106.Especially
Fig. 5 shows the electrochemical energy accumulator 100 or battery that form is so-called bag-type battery, the institute for the bag-type battery
The electrode and the electrolyte for stating electrochemical reaction unit usually pass through simple thermal binding process and are solded into plastic coat
Metal foil form shell 106 in.Circuit, such as Fig. 1 to one of 4 circuit can equally be arranged in the electrochemistry storage
In the shell 106 of energy device 100, even if this point is not shown in Figure 5.Thus for being protected by means of the protective device
For the circuit of shield, advantageously about cost and material be able to use it is a kind of with manufacture for example for the lithium in mobile phone from
Used technology similar technology when the shell or encapsulating cover of sub- battery, so-called bag-type battery.
Fig. 6 shows a kind of a kind of flow chart of the method 600 for manufacturing circuit of embodiment according to the invention, should
Circuit setting for being arranged in electrochemical energy accumulator, the inside of shell comprising electrolyte.The method 600, which has, to be provided to
The step of a few electronic structure element and at least one contact for being used to be in electrical contact at least one described electronic structure element
Rapid 610.The method 600 also with surrounded in a fluid tight manner by means of the protective device with cap layer it is described at least
The step 620 of one electronic structure element, the cap layer have a kind of material, the material among the contact of the electrolyte
Interaction is not much in chemical aspect or is not interacted.At least one contact described herein be fluid-tight from
It is drawn in the cap layer.The circuit of circuit, such as Fig. 1 to one of 4 can be advantageously manufactured by means of the method 600.By
The electrification of one of electrochemical energy accumulator, such as Fig. 1 and 5 can be advantageously arranged in the circuit that manufactures in the method 600
Learn the inside of the shell of accumulator.
Fig. 7 shows a kind of schematical sectional view of the circuit 110 of embodiment according to the invention.Here it is shown that one
Kind of circuit 110, the biography which has electronic structure element 120 or component, is for example arranged on the circuit carrier 225 of plate
Sensor.One of the electronic structure element 120 and the circuit carrier 225 arranges the electronic structure element 120 thereon
Section be arranged in the protective device having been described cap layer 140 inside.The cap layer 140 is configured to encapsulating flexible
Cover is for example configured to film.The electronic structure element 120 is arranged in a section of the circuit carrier 225, the section
There are two opposed protrusion, the two protrusions to draw from the cap layer 140 with being fluid-tight as contact 130 for tool.It is described
Thus contact 130 is a part of the circuit carrier 225.The contact 130 is used for the circuit carrier 225 or described
Electronic structure element 120 is mechanically locked at the inside of the cap layer 140.In addition, at least one contact in the contact 130
As the electrical contact for being in electrical contact with the electronic structure element 120.According to shown embodiment, the two contacts 130
Be configured to electrical contact, and be respectively provided with the guide passage of at least one electricity, the guide passage on the surface of the circuit carrier 225 or
Person is directed to the connector of the electricity of the electronic structure element 120 inside it as an alternative.The circuit carrier 225
It can be in the substrate that it is referred to generally as having electrical contact.
Fig. 8 shows the circuit 110 of a kind of embodiment according to the invention being shown in FIG. 7, schematical overlook
Figure.The cap layer 140 is pellucidly shown, so as to could see the electronic structure element 120 and the circuit carrier 225
, by cap layer surround section.According to this embodiment, a section of the circuit carrier 225 is configured to rectangle, wherein
The electronic structure element 120 is arranged in the section.As an alternative, this section can have other shapes, example
It such as can be round or ellipse.The section is surrounded by the cap layer 140.According to this embodiment, the cap layer 140
It is fixed on the edge of the circuit carrier 225.The edge of the cap layer 140 is fixed on a portion of the circuit carrier 225
On the edge of the circular outside of section, electronic structure element 120 is arranged in the section.The cap layer 140 crosses institute
Contact 130 is stated, and is fixed on the contact 130.Thus the one of the circuit carrier 225 or the circuit carrier 225
A section is clamped in the inside of the cap layer 140, wherein arranging the electronic structure element 120 in the section.By
This is related to a kind of " clamped " circuit carrier 225, and the film of the cap layer 140 is not only close for the circuit carrier
Ground abuts on the circuit carrier 225, and additionally connect again with the circuit carrier 225.In this way, institute
It states circuit carrier 225 and has obtained fixation relative to the cap layer 140, or vice versa.
Embodiment described and being shown in the accompanying drawings only exemplarily is selected.Different embodiments can be complete
It is combined with each other entirely or about each feature.A kind of embodiment can also be mended by the feature of another embodiment
It fills.In addition, step can be repeatedly carried out in the present inventive method, or to hold with described order in a different order
Row.
Claims (11)
1. the protective device of electronic structure element (120) is used for, wherein the electronic structure element (120) is arranged for being arranged in
Electrochemical energy accumulator (100), comprising electrolyte (104) shell (106) inside, and be provided at least one be used for
The contact (130) of electronic structure element (120) electrical contact, wherein the protective device has the feature that
At least cap layer (140) of local compliance, the cap layer have a kind of material, the material with the electrolyte (104)
Contact among chemical aspect be not much interaction or do not interact, wherein the cap layer (140) construction use
The electronic structure element (120) in Fluid Sealing is surrounded, wherein described at least one contact (130) being capable of Fluid Sealing
It is drawn from the cap layer (140), wherein loading the cap layer (140) of the protective device with fluid.
2. protective device according to claim 1, wherein the cap layer (140) has connect segment (245), the interconnecting piece
Section is configured to can be with another section (245) of the cap layer (140), with the section of the electronic structure element (120) simultaneously
And/or person connect with the section Fluid Sealing of circuit carrier (225), and the electronics knot can be disposed on the circuit carrier
Constitutive element part (120).
3. protective device as any one of preceding claims, wherein the cap layer (140) is made of film.
4. circuit (110), the circuit setting for be arranged in electrochemical energy accumulator (100), include the shell of electrolyte (104)
The inside of body (106), wherein the circuit (110) has the feature that
At least one electronic structure element (120)；
At least one is used for the contact (130) being in electrical contact at least one described electronic structure element (120)；And
Protective device as any one of preceding claims, the protective device have cap layer (140), the cap layer
At least one electronic structure element (120) for surrounding to Fluid Sealing the circuit (110), wherein the institute of the circuit (110)
It draws from the cap layer (140) with stating at least one contact (130) Fluid Sealing and is formed relative to the protective device
The mechanical lockable mechanism of at least one electronic structure element, wherein loading the cap layer of the protective device with fluid
(140).
5. circuit (110) according to claim 4, wherein the cap layer (140) of the protective device be arranged in against ground it is described
On at least one portion region of at least one electronic structure element (120).
It is the circuit carrier of circuit board or connection framework with form 6. pressing circuit described in claim 4 or 5 (110)
(225), wherein at least one described electronic structure element (120) is arranged on the circuit carrier (225), wherein it is described at least
One contact (130) is a part of the structural detail (120) the or described circuit carrier (225).
7. circuit (110) according to claim 6 carries wherein the cap layer (140) of the protective device is fixed on the circuit
On the fringe region of body (225).
8. pressing circuit described in claim 4 or 5 (110), wherein the circuit (110) is configured to store the electrochemistry
The sensor that the state parameter of energy device (100) is detected.
9. electrochemical energy accumulator (100), has the feature that
Shell (106) arranges electrochemical reaction unit (102) and electrolyte (104) in the inside of the shell；And
By described in any one of claim 4 to 8, be arranged in the shell (106) inside circuit (110).
10. the method (600) for manufacturing circuit (110), the circuit is arranged for being arranged in electrochemical energy accumulator (100)
, comprising electrolyte (104) shell (106) inside, the method (600) the following steps are included:
(610) at least one electronic structure element (120) is provided and at least one is used for and at least one electronic structure member
The contact (130) of part (120) electrical contact；And
(620) institute is surrounded by means of the protective device at least partly flexible cap layer (140) in a fluid tight manner
State at least one electronic structure element (120), the cap layer has a kind of material, the material with the electrolyte (104)
Contact in be not much interaction in chemical aspect or do not interact, wherein at least one described contact (130)
Drawn from the cap layer (140) to Fluid Sealing,
The cap layer (140) of the protective device is wherein loaded with fluid.
11. the purposes of flexible cap layer (140) is used as the protective device for electronic structure element (120), the electronic structure member
Part (120) setting for be arranged in electrochemical energy accumulator (100), comprising electrolyte (104) shell (106) inside,
Described in flexibility cap layer (140) have a kind of material, the material among the contact of the electrolyte (104) in chemistry side
Face is not much interaction or does not interact, wherein loading the cap layer (140) of the protective device with fluid.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102012209709.0A DE102012209709B4 (en) | 2012-06-11 | 2012-06-11 | Protection device for an electronic component, electrical circuit, electrochemical energy store, method for producing an electrical circuit and use of a flexible sheath |
| DE102012209709.0 | 2012-06-11 | ||
| PCT/EP2013/058691 WO2013185971A1 (en) | 2012-06-11 | 2013-04-26 | Protective device for an electronic component, electric circuit, electrochemical energy store, method for producing an electric circuit and use of a flexible sheath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104364940A CN104364940A (en) | 2015-02-18 |
| CN104364940B true CN104364940B (en) | 2019-02-12 |
Family
ID=48193247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380030445.8A Active CN104364940B (en) | 2012-06-11 | 2013-04-26 | Purposes for the protective device of electronic structure element, circuit, electrochemical energy accumulator, the method for manufacturing circuit and flexible cap layer |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN104364940B (en) |
| DE (1) | DE102012209709B4 (en) |
| WO (1) | WO2013185971A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014222853A1 (en) | 2014-11-10 | 2016-05-12 | Robert Bosch Gmbh | Protective device for an electronic component, sensor component and method for its production |
| DE102015201532A1 (en) | 2015-01-29 | 2016-08-04 | Robert Bosch Gmbh | Separating membrane for creating a fluid-tight interior for an electrical component, electrical circuit, electrochemical energy storage and method for producing an electrical circuit |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6593669B1 (en) * | 1996-05-07 | 2003-07-15 | Technopuce International | Rechargeable or non rechargeable smart battery cell and process for the production of such a cell |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001071826A2 (en) | 2000-03-22 | 2001-09-27 | Sarnoff Corporation | Battery and circuitry assembly |
| KR100745354B1 (en) * | 2004-08-24 | 2007-08-02 | 주식회사 엘지화학 | A safty device for preventing overcharge of secondary batteries and a secondary device therewith |
| US7960047B2 (en) | 2006-10-17 | 2011-06-14 | Valence Technology, Inc. | Method and apparatus for monitoring and controlling an electrochemical cell |
| DE102010046307B4 (en) | 2010-09-15 | 2018-04-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Electrochemical cell of a rechargeable battery |
-
2012
- 2012-06-11 DE DE102012209709.0A patent/DE102012209709B4/en active Active
-
2013
- 2013-04-26 CN CN201380030445.8A patent/CN104364940B/en active Active
- 2013-04-26 WO PCT/EP2013/058691 patent/WO2013185971A1/en active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6593669B1 (en) * | 1996-05-07 | 2003-07-15 | Technopuce International | Rechargeable or non rechargeable smart battery cell and process for the production of such a cell |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104364940A (en) | 2015-02-18 |
| WO2013185971A1 (en) | 2013-12-19 |
| DE102012209709B4 (en) | 2021-10-07 |
| DE102012209709A1 (en) | 2013-12-12 |
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