CN212436190U - Heat radiation structure and mobile terminal - Google Patents
Heat radiation structure and mobile terminal Download PDFInfo
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- CN212436190U CN212436190U CN202021426202.XU CN202021426202U CN212436190U CN 212436190 U CN212436190 U CN 212436190U CN 202021426202 U CN202021426202 U CN 202021426202U CN 212436190 U CN212436190 U CN 212436190U
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Abstract
The utility model provides a heat dissipation structure and a mobile terminal, wherein the heat dissipation structure comprises a shell, a heat dissipation assembly and a first heat conduction component, and a heating area and a low-temperature area are arranged in the shell; at least part of the heat dissipation assembly is positioned in the heating area, so that heat in the heating area is transferred to the shell through the heat dissipation assembly and is dissipated out through the shell; first heat-conducting component is located the low temperature region, first heat-conducting component and radiator unit contact, so that partial heat on the radiator unit transmits to the low temperature region through first heat-conducting component, in order to enlarge the inside thermal distribution area of casing, and improve the diffusion effect of heat on radiator unit and casing, and then accelerate giving off of heat in the district that generates heat, so that the radiating efficiency of the mobile terminal who has this heat radiation structure is higher, thereby solve the problem that the radiating efficiency ratio of the mobile terminal among the prior art is poor.
Description
Technical Field
The utility model relates to a heat dissipation technical field particularly, relates to a heat radiation structure and mobile terminal.
Background
At present, a mobile terminal generally adopts a heat radiation mode of heat conduction heating radiation to transfer part of heat energy to a mobile phone shell, and the temperature is reduced by utilizing a large area of the mobile phone shell to achieve a heat radiation effect.
However, in the prior art, the heat conduction efficiency of the heat dissipation scheme of the mobile terminal is low, and most of heat energy cannot be effectively and quickly transferred out, so that the surface temperature of the mobile terminal is high in the process of using the mobile terminal, and the experience of a user is further reduced; while also affecting the overall performance of the mobile terminal.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a heat dissipation structure and a mobile terminal, which solve the problem of poor heat dissipation efficiency of the mobile terminal in the prior art.
In order to achieve the above object, according to an aspect of the present invention, there is provided a heat dissipation structure, including: the heating device comprises a shell, a heating device and a cooling device, wherein a heating area and a low-temperature area are arranged in the shell; the heat dissipation assembly is at least partially positioned in the heating area, so that heat in the heating area is transferred to the shell through the heat dissipation assembly and is dissipated out through the shell; the first heat conduction component is positioned in the low-temperature area and is in contact with the heat dissipation assembly, so that part of heat on the heat dissipation assembly is transferred to the low-temperature area through the first heat conduction component.
Furthermore, the heat dissipation structure further comprises a second heat conduction component, the second heat conduction component is located in the heating area, and the heat dissipation assembly is in contact with the second heat conduction component, so that heat in the heating area is transferred to the heat dissipation assembly through the second heat conduction component.
Further, the heat dissipation assembly includes a heat transfer member and a first heat dissipation member in contact with each other, the first heat transfer member and the second heat transfer member both being in contact with the heat transfer member; the first heat dissipation part is in contact with the shell; or, the first heat-conducting member and the second heat-conducting member are both in contact with the first heat-dissipating member; the heat transfer member is in contact with the housing.
Further, the first heat-conducting member is made of heat-conducting silicone grease or heat-conducting fibers; and/or the first heat-conducting component is of a columnar structure or a strip structure; and/or the second heat conducting component is made of heat conducting silicone grease or heat conducting fibers; and/or the second heat conduction component is of a columnar structure or a strip structure; and/or, the heat transfer component is made of nano carbon copper foil material; and/or, the heat transfer component is of a sheet structure; and/or the first heat dissipation part is a temperature equalization plate; and/or the shell is made of metal.
Furthermore, the first heat dissipation part is provided with an accommodating cavity, the accommodating cavity comprises an evaporation cavity section, a heat insulation cavity section and a condensation cavity section which are sequentially communicated, the evaporation cavity section is used for accommodating liquid working media, and a capillary structure is arranged in the heat insulation cavity section; the outer wall of the evaporation cavity section is used for being contacted with the heat transfer part, and the outer wall of the condensation cavity section is used for being contacted with the shell; or the outer wall of the evaporation cavity section is used for being in contact with the first heat-conducting part and the second heat-conducting part, and the outer wall of the condensation cavity section is used for being in contact with the heat-conducting part.
Furthermore, the heat dissipation structure further comprises a second heat dissipation part, wherein the second heat dissipation part is arranged on the outer side of the shell and is in contact with the shell, so that heat on the shell is dissipated through the second heat dissipation part.
Furthermore, the second heat dissipation part comprises one heat dissipation fin which is arranged on the shell; alternatively, the heat dissipation plate is provided in plurality, and the plurality of heat dissipation plates are stacked in sequence on the housing.
Further, the first heat-conducting member is plural, and the plural first heat-conducting members are arranged at intervals in the low-temperature region.
Further, the second heat conduction component is multiple, and multiple second heat conduction components are arranged in the heat generation area at intervals.
According to another aspect of the present invention, a mobile terminal is provided, which includes the above heat dissipation structure.
Use the technical scheme of the utility model, this heat radiation structure includes casing and radiator unit, has the region and the low temperature region of generating heat in the casing, and at least part through making radiator unit is located the region of generating heat to make the heat transfer in the region of generating heat to radiator unit, the heat that transmits to radiator unit transmits to the casing again and distributes away through the casing. And through set up first heat conduction part in the low temperature region, first heat conduction part and radiator unit contact, can transmit to the low temperature region through first heat conduction part temporarily from the regional heat that generates heat in the heat that transmits radiator unit like this to enlarge the inside thermal distribution area of casing, and then reduce the temperature in the regional heat that generates heat fast, so that make the surface temperature of casing especially with the regional surface temperature of casing relative that generates heat reduce fast. Meanwhile, partial heat is transmitted to a low-temperature area through the first heat-conducting part, the diffusion effect of the heat on the heat dissipation assembly and the shell can be improved, so that the heat on the heat dissipation assembly is rapidly transmitted to the shell, the heat transmitted to the shell is rapidly dissipated, and the heat is dissipated to the outside the shell, so that the heat dissipation efficiency is improved. Therefore, the heat dissipation structure has high heat dissipation efficiency, and when the heat dissipation structure is applied to the mobile terminal, the heat dissipation efficiency of the mobile terminal with the heat dissipation structure is high, so that the problem that the heat dissipation efficiency of the mobile terminal in the prior art is poor is solved.
Drawings
The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 shows a schematic structural view of an embodiment of a heat dissipation structure according to the present invention;
fig. 2 shows a schematic view of the first heat sink member of the heat sink structure of fig. 1.
Wherein the figures include the following reference numerals:
10. a housing; 11. a low temperature region; 12. a heat generating region;
20. a heat dissipating component; 21. a first heat dissipating member; 22. a heat transfer member;
23. an accommodating chamber; 231. an evaporation chamber section; 232. a thermally insulating cavity section; 233. a condensing chamber section; 234. a capillary structure;
31. a first heat-conductive member; 32. a second heat-conductive member;
40. a second heat sink member; 41. a heat sink;
210. a low temperature component; 220. a heat generating component.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The utility model provides a heat dissipation structure, please refer to fig. 1 and fig. 2, the heat dissipation structure comprises a housing 10, a heat dissipation assembly 20 and a first heat conduction component 31, wherein the housing 10 has a heating area 12 and a low temperature area 11; at least part of the heat dissipation assembly 20 is located in the heat generating region 12, so that heat in the heat generating region 12 is transferred to the casing 10 through the heat dissipation assembly 20 and dissipated through the casing 10; the first heat conduction member 31 is located in the low temperature region 11, and the first heat conduction member 31 contacts the heat dissipation assembly 20, so that part of the heat on the heat dissipation assembly 20 is transferred to the low temperature region 11 through the first heat conduction member 31.
The utility model discloses an among the heat radiation structure, this heat radiation structure includes casing 10 and radiator unit 20, has the regional 12 and the low temperature region 11 of generating heat in the casing 10, is located the regional 12 of generating heat through the at least part that makes radiator unit 20 to make the heat transfer to radiator unit 20 in the regional 12 of generating heat, the heat of transmitting to radiator unit 20 is retransmitted to casing 10 and is distributed away through casing 10 again. And by arranging the first heat conduction member 31 in the low temperature region 11, the first heat conduction member 31 is in contact with the heat dissipation assembly 20, so that part of the heat transferred from the heat generation region 12 to the heat dissipation assembly 20 can be temporarily transferred to the low temperature region 11 through the first heat conduction member 31 to enlarge the distribution area of the heat inside the housing 10, thereby rapidly reducing the temperature of the heat generation region 12, so as to rapidly reduce the surface temperature of the housing 10, particularly the surface temperature of the housing portion opposite to the heat generation region 12. Meanwhile, a part of heat is transferred to the low temperature region 11 through the first heat conduction member 31, so that the heat diffusion effect of the heat on the heat dissipation assembly 20 and the housing 10 can be improved, the heat on the heat dissipation assembly 20 is rapidly transferred to the housing 10, and the heat transferred to the housing 10 is rapidly dissipated, that is, dissipated to the outside of the housing 10, so as to improve the heat dissipation efficiency. Therefore, the heat dissipation structure has high heat dissipation efficiency, and when the heat dissipation structure is applied to the mobile terminal, the heat dissipation efficiency of the mobile terminal with the heat dissipation structure is high, so that the problem that the heat dissipation efficiency of the mobile terminal in the prior art is poor is solved.
It should be noted that after the heat in the heat generating region 12 is dissipated for a certain period of time, and when the average temperature in the low temperature region 11 is higher than the temperature of the heat dissipating assembly 20, the heat in the low temperature region 11 is transferred to the heat dissipating assembly 20 through the first heat conducting member 31, and the heat transferred to the heat dissipating assembly 20 is dissipated through the housing 10.
In the present application, the low temperature region 11 means that the average temperature of the region is lower than the average temperature of the heat generation region 12.
Optionally, the heat sink assembly 20 is in contact with the inner wall of the housing 10 to ensure rapid heat transfer from the heat sink assembly 20 to the housing 10.
Specifically, the heat dissipation structure further includes a second heat conduction member 32, the second heat conduction member 32 is located in the heat generation region 12, and the heat dissipation assembly 20 is in contact with the second heat conduction member 32, so that heat in the heat generation region 12 is transferred to the heat dissipation assembly 20 through the second heat conduction member 32.
Regarding a specific structure of the heat dissipation assembly 20, the heat dissipation assembly 20 includes a heat transfer member 22 and a first heat dissipation member 21 that are in contact with each other.
In this embodiment, the first structural arrangement of the heat dissipation assembly 20 is as follows: as shown in fig. 1, the first heat-conducting member 31 and the second heat-conducting member 32 are both in contact with the heat transfer member 22, and the first heat-dissipating member 21 is in contact with the case 10; that is, the heat transferred through the second heat conduction member 32 is first transferred to the heat transfer member 22, and the heat transferred to the heat transfer member 22 is transferred to the first heat sink member 21, so that the heat is dissipated to the case 10 through the first heat sink member 21 and to the outside of the case 10. Part of the heat on the heat transfer member 22 is transferred to the low temperature region 11 through the first heat transfer member 31.
In this embodiment, the second structural arrangement of the heat dissipation assembly 20 is as follows: the first heat-conducting member 31 and the second heat-conducting member 32 are both in contact with the first heat-radiating member 21, and the heat-transferring member 22 is in contact with the case 10; that is, the heat transferred through the second heat-conducting member 32 is first transferred to the first heat-dissipating member 21, and the heat transferred to the first heat-dissipating member 21 is then dissipated to the heat-transferring member 22, so that the heat is transferred to the case 10 through the heat-transferring member 22 and then dissipated to the outside of the case 10. Part of the heat of the first heat sink member 21 is transferred to the low temperature region 11 through the first heat-conductive member 31.
Specifically, the heat dissipation assembly 20 includes a first heat dissipation section and a second heat dissipation section that are connected to each other, the first heat dissipation section of the heat dissipation assembly 20 is located in the low temperature region 11, and the second heat dissipation section of the heat dissipation assembly 20 is located in the heat generation region 12. The first heat-conducting member 31 is in contact with the first heat dissipation section of the heat dissipation assembly 20, and the second heat-conducting member 32 is in contact with the second heat dissipation section of the heat dissipation assembly 20.
Further, the heat transfer member 22 includes a first heat transfer section and a second heat transfer section connected to each other, and the first heat dissipation member 21 includes a first emission section and a second emission section connected to each other, the first heat transfer section and the first emission section being in contact such that the first heat transfer section and the first emission section together form a first heat dissipation section; the second heat transfer section is in contact with the second emission section such that the second heat transfer section and the second emission section together form a second heat dissipation section.
When the heat dissipation assembly 20 is in the first structural arrangement, the first heat conduction member 31 is in contact with the first heat transfer section, and the second heat conduction member 32 is in contact with the second heat transfer section. Both the first emission section and the second emission section are in contact with the housing 10.
When the heat dissipation assembly 20 is in the second structural arrangement, the first heat conduction member 31 is in contact with the first emission section, and the second heat conduction member 32 is in contact with the second emission section. Both the first heat transfer section and the second heat transfer section are in contact with the casing 10.
Alternatively, the first heat-conductive member 31 is made using heat-conductive silicone grease or heat-conductive fibers; the second heat-conductive member 32 is made of heat-conductive silicone grease or heat-conductive fibers.
Alternatively, the first heat-conducting member 31 has a columnar structure or a strip-like structure; the second heat-conducting member 32 has a columnar structure or a strip-like structure.
Optionally, the casing 10 is made of metal material to ensure the heat conduction effect of the casing 10, and further ensure that the heat in the casing 10 can be dissipated rapidly through the casing 10. Preferably, the housing 10 is made of aluminum material because aluminum has a high thermal conductivity.
Alternatively, the heat transfer member 22 is made of a nano carbon copper foil material having a high thermal conductivity to ensure a heat transfer effect of the heat transfer member 22, thereby ensuring that the heat transfer member 22 can rapidly transfer heat to the first heat sink member 21 or the housing 10.
Alternatively, the heat transfer member 22 is a sheet-like structure; the first heat sink 21 is a temperature uniforming plate, i.e., a VC temperature uniforming plate. Specifically, the heat transfer member 22 and the first heat sink member 21 are attached.
Specifically, when the heat dissipation assembly 20 is in the first structural arrangement, the first heat dissipation component 21 is attached to the inner wall of the housing 10; when the heat dissipation assembly 20 is in the second structural arrangement, the heat transfer member 22 is attached to the inner wall of the casing 10.
Specifically, the heat transfer member 22 is a nano carbon copper sheet.
Specifically, as shown in fig. 2, the first heat sink 21 has an accommodating cavity 23, the accommodating cavity 23 includes an evaporation cavity section 231, a heat insulation cavity section 232 and a condensation cavity section 233, which are sequentially communicated, the evaporation cavity section 231 is used for accommodating a liquid working medium, and the heat insulation cavity section 232 is provided with a capillary structure 234 therein.
When the heat dissipation assembly 20 is in the first structural arrangement, the outer wall of the evaporation cavity section 231 is used to contact the heat transfer part 22, and the outer wall of the condensation cavity section 233 is used to contact the casing 10.
When the heat-radiating type solar heat-radiating device is used specifically, when the heat in the heating area 12 is transmitted to the evaporation cavity section 231 of the first heat-radiating part 21 through the second heat-conducting part 32 and the heat-conducting part 22, the liquid working medium in the evaporation cavity section 231 is heated, evaporated and vaporized, and then changed into steam; the steam flows to the adiabatic chamber section 232 by the pressure difference, and the steam flowing to the adiabatic chamber section 232 contacts the capillary structure 234 with a lower temperature to be condensed into liquid in the condensation chamber section 233, and heat released during the condensation of the steam is dissipated through the housing 10. The condensed liquid working medium flows back to the evaporation cavity section 231 through the heat insulation cavity section 232. The above process is continuously cycled to achieve heat dissipation.
When the heat dissipation assembly 20 is in the second structural arrangement, the outer wall of the evaporation cavity section 231 is used to contact the first heat conduction member 31 and the second heat conduction member 32, and the outer wall of the condensation cavity section 233 is used to contact the heat transfer member 22.
When the heat-radiating type solar heat-radiating device is used specifically, when the heat in the heating area 12 is transmitted to the evaporation cavity section 231 of the first heat-radiating part 21 through the second heat-conducting part 32, the liquid working medium in the evaporation cavity section 231 is heated, evaporated and vaporized to become steam; the steam flows to the heat insulating cavity section 232 under the action of the pressure difference, the steam flowing to the heat insulating cavity section 232 contacts the capillary structure 234 with lower temperature to be condensed into liquid in the condensation cavity section 233, and the heat released in the steam condensation process is transferred to the casing 10 through the heat transfer part 22 and then dissipated through the casing 10. The condensed liquid working medium flows back to the evaporation cavity section 231 through the heat insulation cavity section 232. The above process is continuously cycled to achieve heat dissipation.
In addition, when the heat dissipation assembly 20 is in the second structural arrangement, since the outer wall of the evaporation cavity section 231 is in contact with the first heat conduction member 31, in the initial stage of heat dissipation, that is, the temperature of the outer wall of the evaporation cavity section 231 is higher than the average temperature of the low temperature region 11, part of the heat on the first heat dissipation member 21 is transferred to the low temperature region 11 through the first heat conduction member 31; after the heat dissipation is performed for a certain period of time, when the temperature of the outer wall of the evaporation cavity section 231 is lower than the average temperature of the low temperature region 11, the heat in the low temperature region 11 is transferred to the evaporation cavity section 231 of the first heat dissipation member 21 through the first heat conduction member 31, so as to be dissipated through the first heat dissipation member 21.
Optionally, the capillary structure 234 is a capillary wick.
In this embodiment, the heat dissipation structure further includes a second heat dissipation member 40, and the second heat dissipation member 40 is disposed outside the housing 10 and is in contact with the housing 10, so as to dissipate heat on the housing 10 through the second heat dissipation member 40.
Specifically, the second heat sink member 40 includes heat sinks 41.
Alternatively, the number of the heat radiating fins 41 is one, and the heat radiating fins 41 are provided on the housing 10.
Alternatively, a plurality of heat dissipation fins 41 are stacked in sequence on the housing 10, so that the distribution area of heat in the second heat dissipation part 40 can be enlarged to improve the heat dissipation efficiency of the second heat dissipation part 40, thereby rapidly cooling the temperature.
Optionally, the fins 41 are graphite sheets.
Optionally, the number of the first heat conduction members 31 is multiple, and the multiple first heat conduction members 31 are arranged in the low temperature region 11 at intervals, so that part of heat on the heat dissipation assembly 20 is quickly transferred into the low temperature region 11 through the multiple first heat conduction members 31, and thus the diffusion of heat in the heat generation region 12 is accelerated.
Optionally, the number of the second heat conduction members 32 is multiple, and the multiple second heat conduction members 32 are arranged in the heat generation area 12 at intervals, so that heat in the heat generation area 12 is quickly transferred to the heat dissipation assembly 20 through the multiple second heat conduction members 32, and thus the dissipation of heat in the heat generation area 12 is accelerated.
Specifically, the low temperature region 11 is provided with a low temperature component 210 therein, and the heat generating region 12 is provided with a heat generating component 220 therein. Wherein, the low-temperature component 210 and the heat generating component 220 are both components of the device with the heat dissipation structure; the low temperature part 210 means that the temperature of the low temperature part 210 is lower than that of the heat generating part 220.
The first heat-conductive member 31 is provided on the low temperature member 210, and the plurality of first heat-conductive members 31 are arranged at intervals on the low temperature member 210.
The second heat conductive member 32 is provided on the heat generating component 220, and a plurality of second heat conductive members 32 are arranged at intervals on the heat generating component 220.
The utility model also provides a mobile terminal, it includes foretell heat radiation structure. Through being applied to mobile terminal with this heat radiation structure, can reduce this mobile terminal's surface temperature fast to improve user experience and feel.
Optionally, the mobile terminal is a mobile phone.
The heat generating component 220 of the mobile terminal generates heat during its operation, so that the area where it is located forms the heat generating area 12.
Optionally, the low-temperature component 210 of the mobile terminal is a motherboard.
From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects:
the utility model discloses an among the heat radiation structure, this heat radiation structure includes casing 10 and radiator unit 20, has the regional 12 and the low temperature region 11 of generating heat in the casing 10, is located the regional 12 of generating heat through the at least part that makes radiator unit 20 to make the heat transfer to radiator unit 20 in the regional 12 of generating heat, the heat of transmitting to radiator unit 20 is retransmitted to casing 10 and is distributed away through casing 10 again. And by arranging the first heat conduction member 31 in the low temperature region 11, the first heat conduction member 31 is in contact with the heat dissipation assembly 20, so that part of the heat transferred from the heat generation region 12 to the heat dissipation assembly 20 can be temporarily transferred to the low temperature region 11 through the first heat conduction member 31 to enlarge the distribution area of the heat inside the housing 10, thereby rapidly reducing the temperature of the heat generation region 12, so as to rapidly reduce the surface temperature of the housing 10, particularly the surface temperature of the housing portion opposite to the heat generation region 12. Meanwhile, a part of heat is transferred to the low temperature region 11 through the first heat conduction member 31, so that the heat diffusion effect of the heat on the heat dissipation assembly 20 and the housing 10 can be improved, the heat on the heat dissipation assembly 20 is rapidly transferred to the housing 10, and the heat transferred to the housing 10 is rapidly dissipated, that is, dissipated to the outside of the housing 10, so as to improve the heat dissipation efficiency. Therefore, the heat dissipation structure has high heat dissipation efficiency, and when the heat dissipation structure is applied to the mobile terminal, the heat dissipation efficiency of the mobile terminal with the heat dissipation structure is high, so that the problem that the heat dissipation efficiency of the mobile terminal in the prior art is poor is solved.
The utility model discloses a mobile terminal includes foretell heat radiation structure, therefore this mobile terminal has the same technological effect with above-mentioned heat radiation structure at least.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A heat dissipation structure, comprising:
a housing (10), wherein the housing (10) is provided with a heat generating region (12) and a low temperature region (11);
the heat dissipation assembly (20), at least part of the heat dissipation assembly (20) is located in the heat generating area (12), so that the heat in the heat generating area (12) is transferred to the shell (10) through the heat dissipation assembly (20) and dissipated out through the shell (10);
a first heat conduction member (31), the first heat conduction member (31) being located in the low temperature region (11), the first heat conduction member (31) being in contact with the heat dissipation assembly (20) such that a portion of the heat on the heat dissipation assembly (20) is transferred to the low temperature region (11) through the first heat conduction member (31).
2. The heat dissipation structure according to claim 1, further comprising:
a second heat conduction member (32), the second heat conduction member (32) being located in the heat generation region (12), the heat dissipation assembly (20) being in contact with the second heat conduction member (32) so that heat in the heat generation region (12) is transferred to the heat dissipation assembly (20) through the second heat conduction member (32).
3. The heat dissipation structure according to claim 2, wherein the heat dissipation assembly (20) comprises a heat transfer member (22) and a first heat dissipation member (21) in contact with each other;
the first heat-conduction member (31) and the second heat-conduction member (32) are both in contact with the heat transfer member (22); the first heat sink (21) is in contact with the housing (10); or
The first heat-conductive member (31) and the second heat-conductive member (32) are each in contact with the first heat-dissipating member (21); the heat transfer member (22) is in contact with the casing (10).
4. The heat dissipation structure according to claim 3,
the first heat-conducting component (31) is made of heat-conducting silicone grease or heat-conducting fibers; and/or
The first heat conduction component (31) is of a columnar structure or a strip structure; and/or
The second heat conducting component (32) is made of heat conducting silicone grease or heat conducting fiber; and/or
The second heat conduction component (32) is of a columnar structure or a strip structure; and/or
The heat transfer component (22) is made of a nano carbon copper foil material; and/or
The heat transfer component (22) is of a sheet structure; and/or
The first heat dissipation component (21) is a temperature equalization plate; and/or
The shell (10) is made of metal.
5. The heat dissipation structure of claim 3, wherein the first heat dissipation part (21) is provided with a containing cavity (23), the containing cavity (23) comprises an evaporation cavity section (231), a heat insulation cavity section (232) and a condensation cavity section (233) which are communicated in sequence, the evaporation cavity section (231) is used for containing liquid working medium, and the heat insulation cavity section (232) is internally provided with a capillary structure (234);
the outer wall of the evaporation cavity section (231) is used for contacting with the heat transfer part (22), and the outer wall of the condensation cavity section (233) is used for contacting with the shell (10); or
The outer wall of the evaporation cavity section (231) is used for being in contact with the first heat conduction part (31) and the second heat conduction part (32), and the outer wall of the condensation cavity section (233) is used for being in contact with the heat transfer part (22).
6. The heat dissipation structure according to any one of claims 1 to 5, further comprising:
and the second heat dissipation part (40), wherein the second heat dissipation part (40) is arranged on the outer side of the shell (10) and is in contact with the shell (10) so as to dissipate heat on the shell (10) through the second heat dissipation part (40).
7. The heat dissipation structure according to claim 6, wherein the second heat dissipation member (40) includes a heat dissipation fin (41),
the number of the radiating fins (41) is one, and the radiating fins (41) are arranged on the shell (10); or
The number of the radiating fins (41) is multiple, and the multiple radiating fins (41) are sequentially stacked on the shell (10).
8. The heat dissipation structure according to claim 1, wherein the first heat conduction member (31) is plural, and the plural first heat conduction members (31) are arranged at intervals in the low temperature region (11).
9. The heat dissipation structure according to claim 2, wherein the second heat conduction member (32) is plural, and plural second heat conduction members (32) are arranged at intervals in the heat generation region (12).
10. A mobile terminal comprising a heat dissipation structure, wherein the heat dissipation structure is according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021426202.XU CN212436190U (en) | 2020-07-17 | 2020-07-17 | Heat radiation structure and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021426202.XU CN212436190U (en) | 2020-07-17 | 2020-07-17 | Heat radiation structure and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212436190U true CN212436190U (en) | 2021-01-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021426202.XU Active CN212436190U (en) | 2020-07-17 | 2020-07-17 | Heat radiation structure and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212436190U (en) |
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2020
- 2020-07-17 CN CN202021426202.XU patent/CN212436190U/en active Active
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