CN210835950U - Heat dissipation device and electronic equipment - Google Patents
Heat dissipation device and electronic equipment Download PDFInfo
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- CN210835950U CN210835950U CN201922044646.0U CN201922044646U CN210835950U CN 210835950 U CN210835950 U CN 210835950U CN 201922044646 U CN201922044646 U CN 201922044646U CN 210835950 U CN210835950 U CN 210835950U
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Abstract
The embodiment of the application discloses heat abstractor, the device includes: the soaking body is provided with a first plate, a second plate, a capillary group and an accommodating cavity; the first plate and the second plate are oppositely arranged; the accommodating cavity is positioned between the first plate and the second plate, the capillary group is arranged in the accommodating cavity, and an accommodating space is formed between the capillary group and the first side of the soaking body; the accommodating cavity is filled with a heat dissipation working medium, the first side of the second plate is in contact with an object to be cooled, and at least part of the second side of the second plate is in contact with the heat dissipation working medium; the first end of the pipe body penetrates through the first side of the soaking body and is communicated with the accommodating space; the second end of the pipe body penetrates through the second side of the soaking body and is abutted against one end of the capillary group. The embodiment of the application also discloses the electronic equipment.
Description
Technical Field
The utility model relates to a heat dissipation technology especially relates to a heat abstractor and electronic equipment.
Background
With the continuous development of the times, electronic equipment is generally applied in our lives, and when the electronic equipment such as a computer is used for a long time, a large amount of heat is generated, and at the moment, a heat dissipation device is needed to dissipate the heat of the electronic equipment. With the upgrading and upgrading of electronic devices such as notebook computers and tablet computers, the improvement of the calculation or storage function of functional components such as CPUs puts higher demands on heat dissipation.
Therefore, how to improve the heat dissipation performance is a technical problem to be solved in the art.
SUMMERY OF THE UTILITY MODEL
An embodiment of the present application provides a heat dissipation device, the device includes:
the soaking body is provided with a first plate, a second plate, a capillary group and an accommodating cavity; the first plate and the second plate are oppositely arranged; the accommodating cavity is positioned between the first plate and the second plate, the capillary group is arranged in the accommodating cavity, and an accommodating space is formed between the capillary group and the first side of the soaking body; the accommodating cavity is filled with a heat dissipation working medium, the first side of the second plate is in contact with an object to be cooled, and at least part of the second side of the second plate is in contact with the heat dissipation working medium;
the first end of the pipe body penetrates through the first side of the soaking body and is communicated with the accommodating space; the second end of the pipe body penetrates through the second side of the soaking body and is abutted against one end of the capillary group.
In some embodiments, the heat dissipation working medium in the accommodating cavity can conduct heat with the object to be dissipated based on the second plate, the heat dissipation working medium can change phase into a gaseous working medium after absorbing heat, the gaseous working medium can flow into the tube body through the accommodating space and the first end of the tube body, the gaseous working medium can exchange heat with an external environment through the tube body, and the gaseous working medium can change phase into the heat dissipation working medium after releasing heat; the capillary group can generate capillary force, and the heat dissipation working medium is driven to flow from the second side of the soaking body to the first side of the soaking body through the capillary group by the capillary force.
In some embodiments, at least a portion of the set of capillaries abuts a second side of the second plate, the second plate being capable of conducting heat between the at least a portion of the set of capillaries and the heat sink working substance.
In some embodiments, insulation is disposed between the second end of the pipe body and the second side of the soaking body.
In some embodiments, the apparatus further comprises:
a heat sink that abuts against at least a part of the pipe body; after the heat dissipation working medium flows into the pipe body, the heat dissipation working medium in the pipe body can conduct heat with the radiator based on at least one part of the pipe body.
In some embodiments, the apparatus further comprises:
a fan disposed proximate to the heat sink;
when the fan works, the air around the radiator can be driven away.
In some embodiments, the apparatus further comprises:
a reservoir having a first opening and a second opening;
the second end of the pipe body is communicated with the first opening, the second opening penetrates through the second side of the soaking body and is abutted to the capillary group, and a heat insulation piece is arranged between the second opening and the second side of the soaking body.
In some embodiments, a heat conductive silicone layer having a heat conductive capability is provided between the second plate and the object to be heat-dissipated, and the second plate is abutted against the object to be heat-dissipated through the heat conductive silicone layer.
An embodiment of the present application provides an electronic device, the electronic device includes functional component and does functional component provides radiating heat abstractor, the device includes:
the soaking body is provided with a first plate, a second plate, a capillary group and an accommodating cavity; the first plate and the second plate are oppositely arranged; the accommodating cavity is positioned between the first plate and the second plate, the capillary group is arranged in the accommodating cavity, and an accommodating space is formed between the capillary group and the first side of the soaking body; the accommodating cavity is filled with a heat dissipation working medium, the first side of the second plate is in contact with an object to be cooled, and at least part of the second side of the second plate is in contact with the heat dissipation working medium;
the first end of the pipe body penetrates through the first side of the soaking body and is communicated with the accommodating space; the second end of the pipe body penetrates through the second side of the soaking body and is abutted against one end of the capillary group.
The heat abstractor that this application embodiment provided, the device includes: the soaking body is provided with a first plate, a second plate, a capillary group and an accommodating cavity; the first plate and the second plate are oppositely arranged; the accommodating cavity is positioned between the first plate and the second plate, the capillary group is arranged in the accommodating cavity, and an accommodating space is formed between the capillary group and the first side of the soaking body; the accommodating cavity is filled with a heat dissipation working medium, the first side of the second plate is in contact with an object to be cooled, and at least part of the second side of the second plate is in contact with the heat dissipation working medium; the first end of the pipe body penetrates through the first side of the soaking body and is communicated with the accommodating space; the second end of the pipe body penetrates through the second side of the soaking body and is abutted against one end of the capillary group; the first side of the second plate of the soaking body is in contact with the object to be cooled, and the second side of the second plate is at least partially in contact with the cooling working medium, so that the heat transfer distance from the object to be cooled to the cooling working medium is reduced, the heat conductivity is improved, the heat conduction efficiency of the cooling device on the object to be cooled is improved, and the heat dissipation performance is improved.
Drawings
The drawings illustrate generally, by way of example, but not by way of limitation, various embodiments discussed herein.
FIG. 1 is a schematic diagram of a partial structure of a prior art loop heat pipe;
fig. 2 is a schematic partial structure diagram of a heat dissipation device according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application;
FIG. 4 is a schematic view of a partial structure of a heat dissipation device according to yet another embodiment of the present application;
FIG. 5 is a schematic structural diagram of yet another embodiment of the present application;
FIG. 6 is a schematic structural diagram of yet another embodiment of the present application;
FIG. 7 is a schematic structural diagram of yet another embodiment of the present application;
fig. 8 is a partial structural schematic diagram of another embodiment of the present application.
Detailed Description
So that the manner in which the features and elements of the present embodiments can be understood in detail, a more particular description of the embodiments, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings.
In the description of the embodiments of the present application, it should be noted that, unless otherwise specified and limited, the term "connected" should be interpreted broadly, for example, as an electrical connection, a communication between two elements, a direct connection, or an indirect connection via an intermediate, and the specific meaning of the terms may be understood by those skilled in the art according to specific situations.
It should be noted that the terms "first \ second \ third" referred to in the embodiments of the present application are only used for distinguishing similar objects, and do not represent a specific ordering for the objects, and it should be understood that "first \ second \ third" may exchange a specific order or sequence order if allowed. It should be understood that "first \ second \ third" distinct objects may be interchanged under appropriate circumstances such that the embodiments of the application described herein may be implemented in an order other than those illustrated or described herein.
Before the technical scheme of the invention is elaborated in detail, the design process of the inventor is briefly introduced:
in order to achieve better heat dissipation performance, a certain number of heat dissipation devices, such as heat dissipation fins, or the size of the heat dissipation device, etc., may need to be increased.
Although the heat dissipation effect is improved, the light and thin display device is not facilitated. In order to solve the problem of lightness and thinness and reduce the problem of overlarge traditional air-cooling heat dissipation size, a fanless heat dissipation system is adopted. The fanless heat dissipation system mainly dissipates heat of a CPU through a loop heat pipe, and has a local structure as shown in fig. 1, wherein a copper block 102 is attached to an object to be dissipated 103, the surface of the heat pipe 101 is welded to the copper block 102, and heat generated by the object to be dissipated 103 is transferred to the heat pipe 101 through the copper block 102 for heat dissipation.
The heat dissipation system has low heat conduction efficiency to the object 103 to be dissipated, and the local height is large, which affects the thickness of the device.
In order to solve the technical problems, the inventor designs the following technical scheme:
fig. 2 is a schematic partial structure diagram of a heat dissipation device according to an embodiment of the present application, and fig. 3 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application, as shown in fig. 2 and fig. 3, the heat dissipation device according to an embodiment of the present application includes:
the soaking body 201 has a first plate 202, a second plate 203, a capillary group 204, and a holding chamber 205.
In some embodiments, the soaking body 201 includes a soaking plate; the vapor chamber is a vacuum chamber with a fine structure on the inner wall. When heat is conducted to the evaporation zone from the heat source, the cooling liquid in the cavity starts to generate the gasification phenomenon of the cooling liquid after being heated in the environment with low vacuum degree, at the moment, heat energy is absorbed, the volume rapidly expands, the whole cavity is rapidly filled with gaseous cooling medium, and the condensation phenomenon can be generated when the gaseous working medium contacts a relatively cold zone. The heat accumulated during evaporation is released by the condensation phenomenon, and the condensed cooling liquid returns to the evaporation heat source through the capillary tube of the microstructure, so that the operation is repeated in the cavity. Correspondingly, the first plate 202 is the upper surface of the soaking plate, the second plate 202 is the lower surface of the soaking plate, and the capillary group 204 is the microstructure of the inner wall of the soaking plate; the lower surface of the vapor chamber can be used to contact a heat source.
Wherein, the material of the soaking body 201 may include a metal material, such as copper, gold, aluminum alloy, etc.; non-metallic, thermally conductive materials such as graphite and the like may also be included. Here, the material of the soaking body 201 includes the materials of the first plate 202, the second plate 203, and the capillary group 204; in some embodiments, the first plate 202, the second plate 203, and the capillary group 204 may be the same and/or different materials, such as: the first plate 202 and the second plate 203 are made of metal plates, and the capillary group 204 is made of metal capillaries; alternatively, the first plate 202 and the second plate 203 are metal plates, and the capillary group 204 is made of graphite fibers having a capillary structure. This is by way of example only and is not intended to limit the scope of the present application.
The first plate 202 and the second plate 203 are oppositely arranged; the accommodating cavity 205 is positioned between the first plate 202 and the second plate 203, and the capillary group 204 is arranged in the accommodating cavity 205 and has an accommodating space 206 with the first side of the soaking body 201.
The accommodating cavity 205 is filled with a heat dissipation working medium, a first side of the second plate 203 is in contact with the object to be heat dissipated 103, and a second side of the second plate 203 is at least partially in contact with the heat dissipation working medium.
In the embodiment of the present application, the structure of the object to be heat-dissipated 103 is not limited. For example, the object 103 to be cooled may be a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a memory, a hard disk, or other electronic components that need to be cooled.
In this embodiment, the heat dissipation working medium may include: pure water, freon, methanol, ethanol, acetone, etc. The heat dissipation working medium is only illustrated here, and is not a specific limitation of the present application.
A pipe body 207, wherein a first end of the pipe body 207 penetrates through a first side of the soaking body 201 and is communicated with the accommodating space 206; the second end of the tube 207 is inserted into the second side of the soaking body 206 and is abutted against one end of the capillary group 204.
In some embodiments, tube 207 comprises: heat pipes (heat pipe).
The heat dissipation working medium in the accommodating cavity 205 can conduct heat with the object to be dissipated 103 based on the second plate 203, the heat dissipation working medium can be changed into a gaseous working medium after absorbing heat, the gaseous working medium can flow into the tube 207 through the accommodating space 206 and the first end of the tube 207, the gaseous working medium can exchange heat with the external environment through the tube 207, and the gaseous working medium can be changed into a heat dissipation working medium after releasing heat; the capillary group 204 can generate capillary force, and the heat dissipation working medium is driven by the capillary force to flow from the second side of the soaking body 201 to the first side of the soaking body 201 through the capillary group 204; the heat dissipation function is realized through the circulation of the heat dissipation working medium, in the embodiment, the circulation process of the heat dissipation working medium is driven through capillary force, the driving of devices such as a motor is not needed, and devices such as a fan are not used, so that the noise can be avoided, and the ultra-silent effect of the heat dissipation device can be realized.
In some embodiments, the soaking body 201 is used as an evaporator of the loop heat pipe by communicating the soaking body 201 and the pipe 207 into a whole, so that heat is better transferred; the embodiment of the application can be used for fanless system design, improves the system heat-removing capacity and expands the product range.
In some embodiments, at least a portion of the set of capillaries 204 abuts a second side of the second plate 203, the second plate 203 being capable of conducting heat between the at least a portion of the set of capillaries 204 and the heat dissipating medium.
In the embodiment of the present application, since the capillary group 204 has thermal conductivity, at least a part of the capillary group 204 abuts against the second side of the second plate 203, so that heat can be directly transferred between the second plate 203 and the capillary group 204, and heat of the object 103 to be heat-dissipated is conducted with the heat-dissipating working medium through the second surface of the second plate 203 and the capillary structure of the capillary group 204; the heat conduction area between the heat-radiating working medium and the heat-radiating working medium is increased, and the heat transfer rate is improved.
In the above embodiment, the heat dissipation system may use R1 as the heat conductivity of the object 103 to be dissipated by the formula R1 ═ RCu+RHP pipe wallCalculating; wherein R isCuIs the thermal conductivity, R, of the copper block 102HP pipe wallIs the thermal conductivity of the wall of the heat pipe 101.
In the technical solution of the present application, the heat dissipation device may treat the heat conductivity R2 of the heat dissipation object 103 through a formula R2 ═ RVC pipe wallCalculating; wherein R isVC pipe wallThe thermal conductivity of the second plate 203 which is the soaking body 201.
In some embodiments, vapor chamber and heat pipeThe heat conduction principle of the soaking plate is basically similar, so that the heat conductivity of the plate surface of the soaking plate and the pipe wall of the heat pipe can also be regarded as similar, and R is approximateHP pipe wall≈RVC pipe wall. Therefore, R1 is known to have a thermal conductivity close to that of the heat pipe 101 wall>And R2. Therefore, the heat dissipation device of the present application has a large thermal conductivity.
Fig. 4 is a partial structural view of a heat dissipating device according to another embodiment of the present invention, as shown in fig. 4, in some embodiments, a thermal insulation member 208 is disposed between the second end of the tube 207 and the second side of the soaking body 201.
The heat insulator 208 has heat insulation properties; in this embodiment, the thermal insulation 208 can be used to prevent thermal conduction between the second end of the tube 207 and the second side of the soaking body 201. In some application scenarios, because the temperatures of the portions of the soaking body 201 are very close, the direct connection between the second end of the pipe 207 and the second side of the soaking body 201 enables heat transfer to occur between the second end of the pipe 207 and the second side of the soaking body 201, so that the second end of the pipe 207 has a temperature capable of heating the heat dissipation working medium in the pipe 207 to a gasification temperature, a large amount of gaseous working medium is generated, and the circulation of the heat dissipation working medium is hindered; by arranging the heat insulation piece 208 between the second end of the pipe body 207 and the second side of the soaking body 201, heat transfer between the second end of the pipe body 207 and the second side of the soaking body 201 can be prevented, so that the second end of the pipe body 207 is prevented from heating the heat dissipation working medium in the pipe, the stability of heat dissipation working medium circulation is improved, and the heat dissipation performance of the heat dissipation device is more stable.
In the embodiment of the present application, the specific structure of the heat insulating member 208 is not limited as long as the heat insulating effect can be achieved. For example: the thermal insulation member 208 may be a thermal insulation layer that is sleeved outside the second end of the pipe 207; or may be a length of insulated tubing attached to the second end of the tube 207.
Fig. 5 is a schematic structural diagram of another embodiment of the present application, and as shown in fig. 5, in some embodiments, the heat dissipation device further includes:
a heat sink 209 that abuts at least a part of the pipe 207; after the heat dissipation working medium flows into the tube 207, the heat dissipation working medium in the tube 207 can conduct heat with the heat sink 209 based on at least a portion of the tube 207.
By abutting the heat sink 209 against at least a part of the pipe 207, the heat dissipation area of the heat dissipation device can be increased, and the heat dissipation efficiency of the heat dissipation device can be improved.
In the embodiment of the present application, the structure of the heat sink 209 is not limited, and the heat sink 209 can dissipate heat; for example, the heat sink 209 may be a heat dissipating fin (fin).
Fig. 6 is a schematic structural diagram of another embodiment of the present application, and as shown in fig. 6, in some embodiments, the heat dissipation device further includes:
a fan 210 disposed proximate the heat sink 209;
the fan 210, when operating, can drive off air around the heat sink 209. At this time, the fan 210 can increase the heat dissipation speed of the heat sink 209, thereby increasing the heat dissipation efficiency of the heat dissipation device.
Fig. 7 is a schematic partial structure view of another embodiment of the present application, and as shown in fig. 7, in some embodiments, the heat dissipation device further includes:
a reservoir 211 having a first opening 212 and a second opening 213;
the second end of the tube 207 is connected to the first opening 212, the second opening 213 is disposed through the second side of the soaking body 201 and is abutted against the capillary group 204, and the heat insulating member 208 is disposed between the second opening 213 and the second side of the soaking body 201.
In the embodiment of the application, the liquid reservoir 211 may be used for storing a heat dissipation working medium, and by the matching design of the weight of the heat dissipation working medium and the liquid reservoir 211, the capillary group 204 is ensured to be always soaked by the heat dissipation working medium, so that the heat dissipation device can perform circulating heat dissipation through the heat dissipation working medium; the heat dissipation working medium storage and supply to the capillary group 204 in the working process of the heat dissipation device are ensured; the change and adjustment of gas-liquid distribution in the loop of the heat dissipation device in the starting or variable working condition operation process are adapted, and the free transfer of a heat dissipation working medium among the pipe body 207, the soaking body 201 and the liquid storage device 211 is realized; the liquid storage device 211 can also store non-condensable gas carried in the tube body 207 in the circulation process of the heat dissipation working medium of the heat dissipation system, so that the phenomenon of air lock in a heat dissipation working medium main channel to hinder the supply of the heat dissipation working medium to the capillary group 204 is prevented.
Fig. 8 is a partial structural view of another embodiment of the present application, as shown in fig. 8, in some embodiments, a thermal grease layer 214 with thermal conductivity is disposed between the second plate 203 and the object 103 to be radiated, and the second plate 203 abuts against the object 103 to be radiated through the thermal grease layer 214.
The thermally conductive silicone grease layer 214 may be thermally conductive silicone grease. The heat-conducting silicone grease is a high-heat-conducting and insulating silicone material, and has excellent electrical insulating property and excellent heat conductivity. In some embodiments of the present application, the heat conductive silicone grease is used as a heat transfer medium between the second plate 203 and the object 103 to be radiated, so that the heat transfer efficiency between the second plate 203 and the object 103 to be radiated can be improved, and the heat radiation capability of the heat radiation device can be fully exerted.
The embodiment of the application further provides electronic equipment, the electronic equipment comprises a functional component and a heat dissipation device for providing heat dissipation for the functional component, and the heat dissipation device comprises the heat dissipation device related to the embodiment.
Here, the structure of the electronic device is not limited. For example, the electronic device may be a computer, a server, a notebook, a tablet, a cell phone, a game console, and the like.
The structure of the functional components is not limited. For example, the functional element may be a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a memory, a hard disk, or other electronic components requiring heat dissipation.
The electronic equipment that this application embodiment provided changes heat abstractor because including heat abstractor, and heat abstractor includes: the soaking body is provided with a first plate, a second plate, a capillary group and an accommodating cavity; the first plate and the second plate are oppositely arranged; the accommodating cavity is positioned between the first plate and the second plate, the capillary group is arranged in the accommodating cavity, and an accommodating space is formed between the capillary group and the first side of the soaking body; the accommodating cavity is filled with a heat dissipation working medium, the first side of the second plate is in contact with an object to be cooled, and at least part of the second side of the second plate is in contact with the heat dissipation working medium; the first end of the pipe body penetrates through the first side of the soaking body and is communicated with the accommodating space; the second end of the pipe body penetrates through the second side of the soaking body and is abutted against one end of the capillary group; the first side of the second plate of the soaking body is in contact with the object to be cooled, and the second side of the second plate is at least partially in contact with the cooling working medium, so that the heat transfer distance from the object to be cooled to the cooling working medium is reduced, the heat conductivity is further improved, and the heat conduction efficiency of the cooling device on the object to be cooled is improved; the object to be radiated is in direct contact with the soaking body, so that the height occupied by the copper block in the prior art is saved, the local height of the equipment is reduced, and the thickness of the equipment is reduced.
The technical solutions described in the embodiments of the present application can be arbitrarily combined without conflict.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (9)
1. A heat dissipation device, the device comprising:
the soaking body is provided with a first plate, a second plate, a capillary group and an accommodating cavity; the first plate and the second plate are oppositely arranged; the accommodating cavity is positioned between the first plate and the second plate, the capillary group is arranged in the accommodating cavity, and an accommodating space is formed between the capillary group and the first side of the soaking body; the accommodating cavity is filled with a heat dissipation working medium, the first side of the second plate is in contact with an object to be cooled, and at least part of the second side of the second plate is in contact with the heat dissipation working medium;
the first end of the pipe body penetrates through the first side of the soaking body and is communicated with the accommodating space; the second end of the pipe body penetrates through the second side of the soaking body and is abutted against one end of the capillary group.
2. The device of claim 1, wherein the heat dissipation working medium in the accommodating cavity can conduct heat with the object to be dissipated based on the second plate, the heat dissipation working medium can change phase into a gaseous working medium after absorbing heat, the gaseous working medium can flow into the tube body through the accommodating space and the first end of the tube body, the gaseous working medium can exchange heat with the external environment through the tube body, and the gaseous working medium can change phase into the heat dissipation working medium after releasing heat; the capillary group can generate capillary force, and the heat dissipation working medium is driven to flow from the second side of the soaking body to the first side of the soaking body through the capillary group by the capillary force.
3. The device of claim 1, at least a portion of the set of capillaries abutting a second side of the second plate, the second plate being capable of conducting heat between the at least a portion of the set of capillaries and the heat sink working substance.
4. The apparatus of claim 1 wherein insulation is disposed between the second end of the pipe body and the second side of the soaking body.
5. The apparatus of claim 2, the apparatus further comprising:
a heat sink that abuts against at least a part of the pipe body; after the heat dissipation working medium flows into the pipe body, the heat dissipation working medium in the pipe body can conduct heat with the radiator based on at least one part of the pipe body.
6. The apparatus of claim 5, the apparatus further comprising:
a fan disposed proximate to the heat sink;
when the fan works, the air around the radiator can be driven away.
7. The apparatus of claim 1, the apparatus further comprising:
a reservoir having a first opening and a second opening;
the second end of the pipe body is communicated with the first opening, the second opening penetrates through the second side of the soaking body and is abutted to the capillary group, and a heat insulation piece is arranged between the second opening and the second side of the soaking body.
8. The apparatus according to claim 1, wherein a heat conductive silicone layer having a heat conductive ability is provided between the second plate and the object to be heat-radiated, and the second plate abuts against the object to be heat-radiated through the heat conductive silicone layer.
9. An electronic device comprising a functional component and a heat dissipation apparatus that provides heat dissipation for the functional component, the apparatus comprising:
the soaking body is provided with a first plate, a second plate, a capillary group and an accommodating cavity; the first plate and the second plate are oppositely arranged; the accommodating cavity is positioned between the first plate and the second plate, the capillary group is arranged in the accommodating cavity, and an accommodating space is formed between the capillary group and the first side of the soaking body; the accommodating cavity is filled with a heat dissipation working medium, the first side of the second plate is in contact with an object to be cooled, and at least part of the second side of the second plate is in contact with the heat dissipation working medium;
the first end of the pipe body penetrates through the first side of the soaking body and is communicated with the accommodating space; the second end of the pipe body penetrates through the second side of the soaking body and is abutted against one end of the capillary group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922044646.0U CN210835950U (en) | 2019-11-22 | 2019-11-22 | Heat dissipation device and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922044646.0U CN210835950U (en) | 2019-11-22 | 2019-11-22 | Heat dissipation device and electronic equipment |
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| CN210835950U true CN210835950U (en) | 2020-06-23 |
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