CN217503850U - Radiator and semiconductor air conditioner - Google Patents

Abstract

The present disclosure relates to a radiator and a semiconductor air conditioner. The radiator includes: a plurality of heat dissipation fins; A plurality of heat-dissipating fins are bent, and the second end of the heat-conducting pipe is connected to the plurality of heat-dissipating fins; a heat-conducting block is connected to the first end of the heat-conducting pipe; The notch space at least partially accommodates the bent portion.

Description

Radiators and Semiconductor Air Conditioners

technical field

The present disclosure relates to the field of household electrical appliances, in particular to a radiator and a semiconductor air conditioner.

Background technique

With the continuous improvement of people's living standards, air conditioners have become a commonly used electrical equipment in people's lives; a new type of air conditioner—semiconductor air conditioner, because it takes into account the needs of users for the cooling, heating effect and convenience of air conditioners, gradually favored by consumers.

Due to the positional layout of the radiator in the semiconductor air conditioner, the heat pipe in the radiator may be bent at a large angle, which needs to occupy a large space, resulting in an increase in the volume of the semiconductor air conditioner.

SUMMARY OF THE INVENTION

In order to overcome the problems existing in the related art, the present disclosure provides a radiator and a semiconductor air conditioner.

According to a first aspect of the embodiments of the present disclosure, there is provided a heat sink, comprising:

Multiple cooling fins;

a heat transfer pipe, the first end of the heat transfer pipe is formed with a bending part, the bending part is bent toward the plurality of heat dissipation fins, and the second end of the heat transfer pipe is connected to the plurality of heat dissipation fins ;

A heat-conducting block is connected to the first end of the heat-conducting pipe, the heat-conducting block is formed with a gap space, and the gap space at least partially accommodates the bending portion.

Optionally, the thermally conductive block includes:

The first side is in contact with the semiconductor heat exchange fin;

A second side surface, the second side surface is adjacent to the first side surface, and a portion of the second side surface is recessed to form the notch space facing the plurality of heat dissipation fins.

Optionally, the first side surface of the heat conducting block covers the first temperature changing surface or the second temperature changing surface of the semiconductor heat exchange sheet.

Optionally, the thermally conductive block includes:

a third side surface, the third side surface and the second side surface are two opposite side surfaces on the thermally conductive block;

The first end of the heat-conducting pipe penetrates from the second side of the heat-conducting block, and penetrates from the third side of the heat-conducting block.

Optionally, the third side surface forms the gap space facing the plurality of heat dissipation fins;

The first end of the heat-conducting pipe protrudes from the notch space of the third side surface, is bent toward the plurality of heat dissipation fins, and is connected to the plurality of heat dissipation fins.

Optionally, the plurality of heat dissipation fins are arranged in layers, and the stacked direction of the plurality of heat dissipation fins is parallel to the extending direction of the second end of the heat pipe in the plurality of heat dissipation fins.

Optionally, an included angle is formed between the plane where the heat conducting block is located and the plane where the heat dissipation fins are located, and the included angle is in the range of 90 degrees to 180 degrees.

According to a second aspect of the embodiments of the present disclosure, there is provided a semiconductor air conditioner, comprising:

A first radiator and a second radiator; wherein the first radiator and the second radiator are the radiators shown in the first aspect of the embodiment of the disclosure;

A semiconductor heat exchange fin is arranged between the first radiator and the second radiator, and the first temperature changing surface of the semiconductor heat exchange fin is in contact with the heat conducting block of the first radiator, and the semiconductor The second temperature changing surface of the heat exchange fin is in contact with the heat conducting block of the second heat sink.

Optionally, the air conditioner includes: a semiconductor mounting board;

The semiconductor mounting board includes:

a mounting hole, the mounting hole penetrates the first surface and the second surface of the semiconductor mounting board and is used for mounting the semiconductor heat exchange fin, and the first temperature changing surface of the semiconductor heat exchange fin faces the first surface , the second temperature-changing surface faces the second surface;

a first mounting portion, disposed on the first surface, for mounting the heat conducting block of the first heat sink;

The second mounting part is arranged on the second surface and is used for mounting the heat conducting block of the second heat sink.

Optionally, the air conditioner includes:

an air outlet duct, the first radiator is disposed in the air outlet air duct, and the stacked arrangement direction of the plurality of radiating fins in the first radiator is perpendicular to the airflow direction of the air outlet air duct;

a cooling air duct, the second radiator is arranged in the cooling air duct, and the stacked arrangement direction of the plurality of cooling fins in the second radiator is perpendicular to the airflow direction of the cooling air duct;

The stacking direction of the plurality of heat dissipation fins in the first heat sink is perpendicular to the stacking direction of the plurality of heat dissipation fins in the second heat sink.

The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects:

In the embodiment of the present disclosure, a bent portion is formed at the first end of the heat-conducting pipe, and the bent portion is connected with the heat-conducting block; the second end of the heat-conducting pipe is connected with a plurality of heat dissipation fins, so that the The positional layout of the heat-conducting blocks and the heat-dissipating fins in the heat sink is more flexible; and by forming a notch space on the heat-conducting block, without affecting the contact area between the heat-conducting block and the heating device, the notch space at least partially accommodates The bent portion of the heat pipe reduces the volume occupied by the heat sink.

It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description serve to explain the principles of the invention.

FIG. 1 is a schematic structural diagram 1 of a heat sink according to an exemplary embodiment.

FIG. 2 is a second structural schematic diagram of a heat sink according to an exemplary embodiment.

FIG. 3 is a partial enlarged schematic view of FIG. 2 .

Fig. 4 is a third structural schematic diagram of a heat sink according to an exemplary embodiment.

FIG. 5 is a fourth schematic structural diagram of a heat sink according to an exemplary embodiment.

FIG. 6 is a partial enlarged schematic view of FIG. 5 .

FIG. 7 is a schematic structural diagram of a semiconductor air conditioner according to an exemplary embodiment.

FIG. 8 is a schematic cross-sectional structure diagram of a semiconductor air conditioner according to an exemplary embodiment.

FIG. 9 is a partial enlarged schematic view of FIG. 8 .

FIG. 10 is a schematic structural diagram 1 of a semiconductor mounting board according to an exemplary embodiment.

FIG. 11 is a second structural schematic diagram of a semiconductor mounting board according to an exemplary embodiment.

FIG. 12 is a schematic structural diagram of a semiconductor mounting board and a heat sink assembly according to an exemplary embodiment.

In the above figures: 10, radiator; 11, cooling fin; 12, heat pipe; 13, heat conduction block; 20, semiconductor air conditioner; 21, first radiator; 22, second radiator; 23, semiconductor heat exchange sheet; 24, semiconductor mounting board; 25, air outlet; 26, cooling air duct; 12a, bent part; 13a, gap space; 13b, first side; 13c, second side; 13d, third side; 24a, the mounting hole; 24b, the first mounting portion; 24c, the second mounting portion.

Detailed ways

Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. Where the following description refers to the drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the illustrative examples below are not intended to represent all implementations consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with some aspects of the invention as recited in the appended claims.

An embodiment of the present disclosure provides a heat sink, as shown in FIGS. 1-2 . FIG. 1 is a schematic structural diagram 1 of a radiator according to an exemplary embodiment; FIG. 2 is a schematic diagram according to an exemplary embodiment. A schematic diagram of the structure of a radiator II. The radiator 10 includes:

a plurality of cooling fins 11;

The heat pipe 12, the first end of the heat pipe 12 is formed with a bending part 12a, the bending part 12a is bent toward the plurality of heat dissipation fins 11, the second end of the heat pipe 12 and the A plurality of cooling fins 11 are connected;

The heat-conducting block 13 is connected to the first end of the heat-conducting pipe 12, and the heat-conducting block 13 is formed with a gap space 13a, and the gap space 13a at least partially accommodates the bending portion 12a.

In the embodiment of the present disclosure, the heat sink includes: a heat dissipation fin, a heat conduction pipe and a heat conduction block.

Wherein, the first end of the heat-conducting pipe is connected with the heat-conducting block, and the second end is connected with the heat-dissipating fin.

Here, the heat-conducting blocks and the heat-conducting pipes can be made of materials with good heat conductivity, such as aluminum, copper or their alloys.

The heat-conducting block is in contact with the heating surface of the heating device, absorbs the heat emitted by the heat-generating body, and transfers the absorbed heat to the outside through the heat-conducting pipe connected to the heat-conducting block, thereby realizing heat dissipation. Here, the heating device may include electronic components such as a CPU, a graphics card and the like that generate a large amount of heat.

The plurality of heat-dissipating fins are arranged at intervals at the second end of the heat-conducting pipe, and the heat-conducting pipe transfers the heat absorbed by the heat-conducting block from the first end to the second end, and uses the plurality of heat-dissipating fins at the second end of the heat-conducting pipe to improve the heat dissipation. The speed at which the heat at the second end of the heat pipe is dissipated, thereby improving the heat dissipation efficiency.

It should be noted that the heat dissipation fins are used to dissipate the heat transferred by the heat pipe to the air or other media. Typically, the cooling fins can directly exchange heat with the air.

In the embodiment of the present disclosure, a bending portion is formed at the first end of the heat conduction pipe, one end of the bending portion is connected to the heat conduction block, and the other end is bent toward the direction of the plurality of heat dissipation fins.

It can be understood that, since the first end of the heat transfer pipe is connected to the heat transfer block, and the second end is connected to the heat dissipation fin, the first end of the heat transfer pipe is formed with a bent portion, so that the The positional layout between the heat-conducting blocks and the heat-dissipating fins is more flexible, and does not need to be limited to the stacked arrangement along the extending direction of the heat-conducting pipes.

Here, the bending angle of the bending portion can be set according to actual requirements.

A notch space is formed on the connecting surface of the heat conducting block and the heat conducting pipe, and the notch space at least partially accommodates the bent portion of the heat conducting pipe.

It can be understood that, through the gap space, the cross-sectional area of the connecting body between the bent portion and the thermally conductive block is reduced, thereby reducing the volume occupied by the heat sink.

In the embodiment of the present disclosure, a bent portion is formed at the first end of the heat-conducting pipe, and the bent portion is connected with the heat-conducting block; the second end of the heat-conducting pipe is connected with a plurality of heat dissipation fins, so that the The positional layout of the heat-conducting blocks and the heat-dissipating fins in the heat sink is more flexible; and by forming a notch space on the heat-conducting block, without affecting the contact area between the heat-conducting block and the heating device, the notch space at least partially accommodates The bent portion of the heat pipe reduces the volume occupied by the heat sink.

Optionally, as shown in FIG. 3 , FIG. 3 is a partial enlarged schematic diagram of FIG. 2 . The thermally conductive block 13 includes:

The first side surface 13b is in contact with the semiconductor heat exchange fins;

The second side surface 13c, the second side surface 13c is adjacent to the first side surface 13b, and the second side surface 13c is partially recessed to form the notch space 13a facing the plurality of heat dissipation fins.

In an embodiment of the present disclosure, the thermally conductive block includes: a first side surface and a second side surface, and the first side surface and the second side surface are adjacent to each other.

Wherein, the first side surface of the heat conducting block is in contact with the first temperature changing surface or the second temperature changing surface of the semiconductor heat exchange sheet, and conducts heat exchange with the first temperature changing surface or the second temperature changing surface of the semiconductor heat exchange sheet, and absorbs all the heat. The heat or cold generated by the semiconductor heat exchange fins.

It should be noted that the semiconductor heat exchange fin is an electronic component that uses the thermoelectric effect (Peltier effect) to generate cold and heat; after direct current is applied to the semiconductor heat exchange fin, the The cooling surface can absorb the heat of the surrounding environment to achieve the cooling effect, and the heating surface of the semiconductor heat exchange sheet can release heat to the surrounding environment to achieve the heating effect.

Here, the first temperature-changing surface of the semiconductor heat exchange sheet may be a cooling surface, and the second temperature-changing surface may be a heating surface; or, the first temperature-changing surface may be a heating surface, and the second temperature-changing surface may be Cooling surface.

It should be noted that, when the current direction of the direct current supplied to the semiconductor heat exchange fins changes, the cooling surface and the heating surface of the semiconductor also change accordingly. For example, if the electrical signal flowing through the semiconductor heat exchange sheet is in the first current direction, the first temperature-changing surface of the semiconductor heat-exchanging sheet is the cooling surface, and the second temperature-changing surface is the heating surface; The electrical signal of the heat exchange fin is the second current direction, the first temperature changing surface of the semiconductor heat exchange fin is the heating surface, and the second temperature changing surface is the cooling surface; here, the first current direction and the second current In the opposite direction.

The second side surface is the connection surface between the heat-conducting block and the heat-conducting pipe, and a partial area of the second side surface is recessed inward to form the gap space, and the gap of the gap space faces the plurality of heat dissipation fins piece.

Here, the size of the gap space can be set according to actual requirements, and the gap space at least partially accommodates the bent portion of the heat transfer pipe.

It can be understood that by forming the gap space on the second side surface of the thermally conductive block, and making the gaps in the gapped space face the plurality of heat dissipation fins, it is possible to ensure that the thermally conductive block is exchanged with the semiconductor. On the basis that the contact area of the heat fin remains unchanged, the notch space is used to at least partially accommodate the bent portion of the heat transfer pipe, and the bent portion is connected with the heat transfer block, so as to reduce the volume of the heat sink .

Optionally, the first side surface of the heat conducting block covers the first temperature changing surface or the second temperature changing surface of the semiconductor heat exchange sheet.

In the embodiment of the present disclosure, the area of the first side surface of the heat-conducting block is greater than or equal to the area of the first temperature-changing surface or the second temperature-changing surface of the semiconductor heat exchange fin, so that the first side surface of the heat-conducting block covers the first temperature changing surface or the second temperature changing surface of the semiconductor heat exchange fin.

It should be noted that the heat dissipation efficiency of the heat sink is related to the contact area between the heat conduction block and the semiconductor heat exchange fins; The larger the contact area is, the higher the heat dissipation efficiency of the heat sink is; if the contact area between the heat conducting block and the semiconductor heat exchange fin is smaller, the heat dissipation efficiency of the heat sink is lower.

In the embodiment of the present disclosure, the first side surface of the thermally conductive block covers the first temperature-changing surface or the second temperature-changing surface of the semiconductor heat exchange fins, so as to maximize the contact area between the thermally conductive block and the semiconductor heat exchange fins , thereby improving the heat dissipation efficiency of the radiator.

In some embodiments, a thermally conductive glue may be coated on the contact surface of the first side surface of the thermally conductive block and the first or second temperature-changing surface of the semiconductor heat exchange sheet.

Here, the thermally conductive colloid may be a material with good thermal conductivity such as silicone grease and silicone oil.

The thermally conductive colloid can fill the gap between the first side of the thermally conductive block and the first or second temperature-varying surface of the semiconductor heat exchange sheet, so that the first side of the thermally conductive block and the semiconductor exchange The first temperature-changing surface or the second temperature-changing surface of the heat fin is in full contact, thereby increasing the contact area between the heat conduction block and the semiconductor heat exchange fin, and improving the heat dissipation efficiency.

Optionally, as shown in FIG. 4 , FIG. 4 is a third schematic structural diagram of a heat sink according to an exemplary embodiment. The thermally conductive block includes:

The third side surface 13d, the third side surface 13d and the second side surface 13c are two opposite side surfaces on the thermally conductive block 13;

The first end of the heat conducting pipe 12 penetrates through the second side surface 13 c of the heat conducting block 13 and passes through the third side surface 13 d of the heat conducting block 13 .

In an embodiment of the present disclosure, the thermally conductive block further includes: a third side surface; the third side surface is adjacent to the first side surface, and the third side surface is opposite to the second side surface.

The first end of the heat-conducting pipe penetrates from the second side of the heat-conducting block, and goes out from the third side of the heat-conducting block, that is, the first end of the heat-conducting pipe is disposed through the heat-conducting block. , so that the contact area between the heat-conducting pipe and the heat-conducting block can be increased, and the heat transfer efficiency of the heat-conducting pipe can be improved.

Here, the heat-conducting pipe includes an evaporation end and a condensation end; if the heat-conducting block is in contact with the heating surface of the semiconductor heat exchange sheet, the area inside the heat-conducting block in the heat-conducting pipe is the heat-conducting block. The evaporating end of the tube, and the area where the heat-conducting tube is connected to the plurality of heat dissipation fins is the condensation end of the heat-conducting tube. If the heat-conducting block is in contact with the cooling surface of the semiconductor heat-exchange fins, the area of the heat-conducting pipe inside the heat-conducting block is the condensation end of the heat-conducting pipe; the heat-conducting pipe and the plurality of heat-dissipating fins The area where the sheets are connected is the evaporation end of the heat pipe.

It should be noted that the heat transfer tube is usually composed of a tube shell, a liquid absorbing core and an end cap. The inside of the heat transfer tube is pumped into a negative pressure state and injected into an appropriate liquid. This liquid has a low boiling point and is easy to volatilize; the heat transfer tube The wall of the tube has a wick, which is composed of capillary porous material.

When the evaporating end is heated, the liquid in the wick evaporates rapidly, the vapor flows to the condensing end under a small pressure difference, releases heat, and condenses into liquid again; ) back to the evaporation end. This cycle does not stop, so that the heat absorbed by the evaporation end is transferred to the condensation end.

It can be understood that, when there is a temperature difference in the heat transfer pipe, the liquid in the heat transfer pipe can be evaporated and condensed to transfer heat.

In the embodiment of the present disclosure, the first end of the heat transfer pipe is inserted from the second side of the heat transfer block and passed out from the third side of the heat transfer block, so that the length of the evaporation end or the condensation end in the heat transfer pipe is The length of the heat-conducting block is the same, so that the heat transfer efficiency of the heat-conducting pipe can be improved.

Optionally, as shown in FIGS. 5-6 , FIG. 5 is a fourth schematic structural diagram of a heat sink according to an exemplary embodiment; FIG. 6 is a partial enlarged schematic diagram of FIG. 5 .

The third side surface 13d forms the notch space 13a facing the plurality of heat dissipation fins 11;

The first end of the heat transfer pipe 12 protrudes from the notch space 13 a of the third side surface 13 d , is bent toward the plurality of heat dissipation fins 11 , and is connected to the plurality of heat dissipation fins 11 .

In the embodiment of the present disclosure, the third side surface of the thermally conductive block is also formed with a notch space facing the plurality of heat dissipation fins;

The first end of the heat-conducting pipe is formed with two bending parts, wherein, for the convenience of description, the bending part close to the second side of the heat-conducting block can be determined as the first bending part, and the bending part close to the heat-conducting block can be determined as the first bending part. The bent portion of the third side surface of the fin is determined as a second bent portion; here, the first bent portion and the second bent portion are both bent toward the direction of the plurality of heat dissipation fins.

The first end of the heat-conducting pipe penetrates into the heat-conducting block from the notch space of the second side surface of the heat-conducting block, and the notch space of the second side side at least partially accommodates the first bending part; the heat-conducting pipe The first end of the end protrudes from the notch space of the third side surface of the heat conducting block, and is connected with the plurality of heat dissipation fins. The notch space of the third side surface at least partially accommodates the second bent portion.

Here, both the first end and the second end of the heat transfer pipe are connected to the plurality of heat dissipation fins; it can be understood that if the heat transfer block is in contact with the heating surface of the semiconductor heat exchange fin, all In the heat transfer pipe, the area inside the heat transfer block is the evaporation end of the heat transfer pipe, and the area where the heat transfer pipe is connected with the plurality of heat dissipation fins is the condensation end of the heat transfer pipe; then the heat transfer pipe Contains two condenser ends.

If the heat-conducting block is in contact with the cooling surface of the semiconductor heat-exchange fins, the area of the heat-conducting pipe inside the heat-conducting block is the condensation end of the heat-conducting pipe; the heat-conducting pipe and the plurality of heat-dissipating fins The area where the fins are connected is the evaporation end of the heat-conducting pipe; then the heat-conducting pipe includes two evaporation ends; that is, the heat exchange volume between the heat-conducting pipe and the plurality of heat dissipation fins increases.

In the embodiment of the present disclosure, the gap space is formed on both the second side surface and the third side surface of the heat conduction block, and the gap in the gap space faces the plurality of heat dissipation fins. On the one hand, the first end of the heat conduction pipe and The second ends are all connected with a plurality of heat dissipation fins, so as to increase the heat exchange volume between the heat pipe and the plurality of heat dissipation fins; improve the heat transfer rate of the heat pipe and improve the heat dissipation efficiency of the radiator; On the basis of ensuring that the contact area between the heat-conducting block and the semiconductor heat-exchange fin remains unchanged, the gap space is used to at least partially accommodate the bent portion of the heat-conducting pipe, and the bent portion and the heat-conducting block can be used for connection to reduce the size of the heat sink.

Optionally, as shown in FIG. 1-2 , the plurality of heat dissipation fins 11 are arranged in layers, and the direction of the stacked arrangement of the plurality of heat dissipation fins 11 and the second end of the heat pipe 12 are in the plurality of layers. The extending directions of the heat dissipation fins 11 are parallel.

In the embodiment of the present disclosure, the plurality of heat dissipation fins are arranged in layers, and the direction of the stacked arrangement of the plurality of heat dissipation fins is the same as the extension direction of the second end of the heat pipe in the plurality of heat dissipation fins Parallel arrangement, that is, a plurality of heat dissipation fins are arranged in parallel in a grid structure, which can greatly increase the contact area between the heat dissipation fins and the air, improve the heat exchange efficiency between the heat dissipation fins and the air, and thus improve the heat dissipation efficiency of the radiator.

In some embodiments, a plurality of heat dissipation holes may be opened on the heat dissipation fins, and the heat dissipation holes can increase the flow speed of the air between the heat dissipation fins, accelerate the heat transfer efficiency, and improve the heat dissipation efficiency of the heat sink.

Optionally, an included angle is formed between the plane where the heat conducting block is located and the plane where the heat dissipation fins are located, and the included angle is in the range of 90 degrees to 180 degrees.

In the embodiment of the present disclosure, an included angle is formed between the plane where the heat conducting block is located in the heat sink and the plane where the heat dissipation fin is located, and the included angle ranges from 90 degrees to 180 degrees.

It should be noted that, in the embodiment of the present disclosure, by setting a gap space on the heat conduction block, the gap does not affect the contact area between the heat conduction block and the semiconductor heat exchange fin, and does not affect the volume of the heat sink. The space at least partially accommodates the bent portion of the heat transfer pipe, so that the heat transfer pipe can be bent at 90 degrees to 180 degrees, so that the plane where the heat conducting block in the heat sink is located and the plane where the heat dissipation fins are located are between The included angle of 90 degrees to 180 degrees can be formed between them, and the arrangement position of the heat conduction block and the heat dissipation fin in the heat sink is more flexible.

An embodiment of the present disclosure provides a semiconductor air conditioner, as shown in FIGS. 7-9 . FIG. 7 is a schematic structural diagram of a semiconductor air conditioner according to an exemplary embodiment; FIG. 8 is a schematic diagram of a semiconductor air conditioner according to an exemplary embodiment. Schematic diagram of the cross-sectional structure of the semiconductor air conditioner. FIG. 9 is a partial enlarged schematic view of FIG. 8 . The semiconductor air conditioner 20 includes:

The first radiator 21 and the second radiator 22; wherein, the first radiator 21 and the second radiator 22 are the radiator 10 shown in one or more of the above solutions;

The semiconductor heat exchange fins 23 are arranged between the first heat sink 21 and the second heat sink 22 , and the first temperature changing surface of the semiconductor heat exchange fins 23 is connected to the heat conduction block of the first heat sink 21 . contact, the second temperature changing surface of the semiconductor heat exchange fin 23 is in contact with the heat conducting block of the second heat sink 22 .

In an embodiment of the present disclosure, the semiconductor air conditioner includes: a first radiator, a second radiator, and a semiconductor heat exchange fin;

The first heat sink, the semiconductor heat exchange fin and the second heat sink are arranged in layers; and the first temperature changing surface of the semiconductor heat exchange fin is in contact with the heat conducting block of the first heat sink, The first heat sink dissipates heat on the first temperature changing surface of the semiconductor heat exchange fin. The second temperature-changing surface of the semiconductor heat exchange fin is in contact with the heat-conducting block of the second radiator, and the second temperature-changing surface of the semiconductor heat exchange fin is dissipated through the second heat sink.

Here, the first radiator and the second radiator each include: a heat-conducting block, a heat-conducting pipe, and a plurality of heat-dissipating fins; a bending part; the bending part is at least partially accommodated in the gap space of the heat conduction block; the first end of the heat conduction pipe is connected with the heat conduction block, and the second end is connected with the plurality of heat dissipation fins.

The airflow flowing in the semiconductor air conditioner indirectly exchanges heat with the first temperature changing surface of the semiconductor heat exchange fin via the first radiator; Indirect heat exchange is carried out between the surfaces, thereby changing the temperature of the airflow to achieve the effect of cooling or heating.

In the embodiment of the present disclosure, the notch spaces in the heat conducting blocks of the first radiator and the second radiator are used to at least partially accommodate the bent portions of the heat conducting pipes of the first radiator and the second radiator, Under the condition that the contact area between the heat conducting block of the first heat sink and the first temperature changing surface and the contact area between the heat conducting block of the second heat sink and the second temperature changing surface are not reduced, the first heat sink and the second heat sink are reduced The volume of the device is reduced, thereby reducing the volume of the semiconductor air conditioner, thereby improving the portability of the semiconductor air conditioner and improving the user experience.

Optionally, as shown in FIGS. 10-12 , FIG. 10 is a schematic structural diagram 1 of a semiconductor mounting board according to an exemplary embodiment; FIG. 11 is a schematic diagram of a semiconductor mounting board according to an exemplary embodiment Schematic diagram two. FIG. 12 is a schematic structural diagram of a semiconductor mounting board and a heat sink assembly according to an exemplary embodiment. The air conditioner 20 includes: a semiconductor mounting board 24;

The semiconductor mounting board 24 includes:

Mounting holes 24a, the mounting holes 24a pass through the first surface and the second surface of the semiconductor mounting board 24 for mounting the semiconductor heat exchange fins 23, and the first temperature changing surface of the semiconductor heat exchange fins 23 faces the first surface, the second temperature-changing surface faces the second surface;

The first mounting portion 24b is disposed on the first surface and is used for mounting the heat conducting block of the first heat sink 21;

The second mounting portion 24c is disposed on the second surface and is used for mounting the heat conducting block of the second heat sink 22 .

In an embodiment of the present disclosure, the air conditioner includes: a semiconductor mounting board;

The semiconductor mounting board is provided with mounting holes, and the size of the mounting holes is adapted to the size of the semiconductor heat exchange fins; the mounting holes pass through the first surface and the second surface of the semiconductor mounting board; here , the first surface and the second surface are two opposite surfaces of the semiconductor mounting board.

By installing the semiconductor heat exchange fins in the mounting holes, the first temperature change surface of the semiconductor heat exchange fins faces the first surface of the semiconductor mounting board; the second temperature change surface of the semiconductor heat exchange fins toward the second surface of the semiconductor mounting board.

Since the heat-conducting blocks of the first heat sink and the second heat sink are in contact with the first and second temperature-changing surfaces of the semiconductor heat exchange fins, respectively, the embodiment of the present disclosure is provided on the first surface of the semiconductor mounting board. The first mounting part is used to install the heat conduction block of the first heat sink; it can be understood that after the heat conduction block of the first heat sink is installed on the first mounting part, the heat conduction of the first heat sink The block is attached to the first temperature-changing surface of the semiconductor heat exchange fin, and a first heat sink is used to perform heat exchange with the first temperature-changing surface of the semiconductor heat exchange fin.

By arranging a second mounting portion on the second surface of the semiconductor mounting board for mounting the heat conducting block of the second heat sink; it can be understood that the heat conducting block of the second heat sink is mounted on the second mounting portion Afterwards, the heat conducting block of the second radiator and the second temperature changing surface of the semiconductor heat exchange fin are attached, and the second radiator is used to perform heat exchange with the second temperature changing surface of the semiconductor heat exchange fin.

It should be noted that, because the heat-conducting blocks of the first radiator and the second radiator need to be in contact with the temperature-changing surfaces of the semiconductor heat exchange fins, the heat exchange between the first radiator and the second radiator and the temperature-changing surfaces can be passed. Change the temperature of the output air flow of the semiconductor air conditioner to achieve cooling or heating effect; but in the assembly process of the semiconductor air conditioner, the fixing between the first radiator, the second radiator and the semiconductor heat exchange fin is more complicated, and the difficulty of mold release is also difficult. higher.

Therefore, the embodiments of the present disclosure use the semiconductor mounting board to mount the semiconductor heat exchange fin, the first heat sink and the second heat sink on the semiconductor mounting board. By mounting the semiconductor mounting board on the semiconductor air conditioner, the semiconductor heat exchange The fixation between the radiator and the second radiator reduces the assembly difficulty of the semiconductor air conditioner and the mold release difficulty of the semiconductor air conditioner.

Optionally, as shown in FIG. 8 , the air conditioner 20 includes:

The air outlet duct 25, the first radiator 21 is arranged in the air outlet air duct 25, and the stacked arrangement direction of the plurality of radiating fins in the first radiator 21 is the same as the direction of the air outlet air duct 25. Air flow is vertical;

A cooling air duct 26 , the second radiator 22 is arranged in the cooling air duct 26 , and the stacked arrangement direction of the plurality of cooling fins in the second radiator 22 is perpendicular to the airflow direction of the cooling air duct 26 ;

The stacking direction of the plurality of heat dissipation fins in the first heat sink 21 is perpendicular to the stacking direction of the plurality of heat dissipation fins in the second heat sink 22 .

In the embodiment of the present disclosure, the air conditioner includes: an air outlet duct and a heat dissipation air duct; the air outlet air duct and the heat dissipation air duct are isolated from each other. Here, the air outlet air duct is used to output cold air or hot air; the heat dissipation air duct is used to dissipate heat to the outside.

It can be understood that the semiconductor mounting board can be installed at the connection between the housing of the air outlet duct and the housing of the cooling air duct; the semiconductor heat exchange fins mounted on the semiconductor mounting board are The first temperature-changing surface faces the air outlet air duct; the airflow circulating in the air outlet air duct exchanges heat with the first temperature-changing surface through the first radiator, thereby changing the temperature of the air flow and dissipating the heat. The exchanged airflow is output from the air outlet of the air outlet duct to achieve the effect of cooling or heating.

The second temperature-changing surface of the semiconductor heat exchange fin faces the cooling air duct, and the airflow circulating in the cooling air duct dissipates heat from the second temperature-changing surface through the second radiator.

It can be understood that, since the first heat sink includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged in layers; the direction of the stacked arrangement of the plurality of heat dissipation fins in the first heat sink The airflow direction of the air outlet air duct is vertical; an airflow channel is formed between the plurality of heat dissipation fins of the first radiator, and the extension direction of the airflow channel is parallel to the airflow direction in the air outlet air duct.

The second heat sink includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged in layers, and the stacked arrangement direction of the plurality of heat dissipation fins in the second heat sink is related to the airflow direction of the heat dissipation air duct Vertical; a heat dissipation channel is formed between the plurality of heat dissipation fins of the second radiator, and the extension direction of the heat dissipation channel is parallel to the airflow direction in the heat dissipation air channel.

It should be noted that by making the stacking direction of the plurality of heat dissipation fins in the first heat sink perpendicular to the airflow direction of the air outlet duct, the stacking of the plurality of heat dissipation fins in the second heat sink is made. The setting direction is perpendicular to the airflow direction of the cooling air duct, which can ensure that the air in the air outlet duct can circulate more smoothly in the airflow duct, and the air in the cooling air duct can circulate more smoothly in the cooling duct, reducing the Air resistance in the outlet air duct and cooling air duct.

In the embodiment of the present disclosure, the stacking direction of the plurality of heat dissipation fins in the first heat sink is perpendicular to the stacking direction of the plurality of heat dissipation fins in the second heat sink, that is, the direction of the air outlet duct is vertical. The airflow direction is perpendicular to the airflow direction in the cooling air duct, so that the airflow of different temperatures output by the air outlet air duct and the cooling air duct will not interfere with each other.

Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or techniques in the art not disclosed by this disclosure . The specification and examples are to be regarded as exemplary only, with the true scope and spirit of the invention being indicated by the following claims.

It should be understood that the present invention is not limited to the precise structures described above and illustrated in the accompanying drawings, and that various modifications and changes may be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

Claims (10)

1. A heat sink, comprising:

a plurality of heat dissipating fins;

a first end of the heat pipe is provided with a bent part, the bent part is bent towards the plurality of radiating fins, and a second end of the heat pipe is connected with the plurality of radiating fins;

the heat conduction block is connected with the first end of the heat conduction pipe, a gap space is formed in the heat conduction block, and at least part of the gap space accommodates the bending part.

2. The heat sink of claim 1, wherein the heat conducting block comprises:

the first side surface is contacted with the semiconductor heat exchange sheet;

a second side adjacent to the first side, the second side partially recessed to form the notch spaces facing the plurality of fins.

3. The heat sink of claim 2, wherein the first side of the thermal conduction block covers the first temperature-varying surface or the second temperature-varying surface of the semiconductor heat exchanger fin.

4. The heat sink of claim 2, wherein the heat conducting block comprises:

a third side surface, wherein the third side surface and the second side surface are two opposite side surfaces on the heat conduction block;

the first end of the heat conduction pipe penetrates through the second side face of the heat conduction block and penetrates out of the third side face of the heat conduction block.

5. The heat sink as recited in claim 4 wherein the third side forms the gap space toward the plurality of fins;

the first end of the heat conduction pipe is penetrated out from the gap space of the third side face, and is bent towards the plurality of radiating fins and connected with the plurality of radiating fins.

6. The heat sink according to claim 1, wherein the plurality of fins are arranged in a stacked manner in a direction parallel to a direction in which the second end of the heat conductive pipe extends inside the plurality of fins.

7. The heat sink of claim 1, wherein an angle is formed between a plane of the heat conducting block and a plane of the heat dissipating fin, and the angle is in a range of 90 degrees to 180 degrees.

8. A semiconductor air conditioner, comprising:

a first heat sink and a second heat sink; wherein the first and second heat sinks are the heat sink of any one of claims 1-7;

the semiconductor heat exchange fin is arranged between the first radiator and the second radiator, a first variable temperature surface of the semiconductor heat exchange fin is in contact with the heat conduction block of the first radiator, and a second variable temperature surface of the semiconductor heat exchange fin is in contact with the heat conduction block of the second radiator.

9. The air conditioner according to claim 8, wherein the air conditioner comprises: a semiconductor mounting board;

the semiconductor mounting board includes:

the mounting hole penetrates through the first surface and the second surface of the semiconductor mounting plate and is used for mounting the semiconductor heat exchange plate, the first temperature change surface of the semiconductor heat exchange plate faces the first surface, and the second temperature change surface of the semiconductor heat exchange plate faces the second surface;

the first mounting part is arranged on the first surface and used for mounting the heat conducting block of the first radiator;

and the second mounting part is arranged on the second surface and used for mounting the heat conduction block of the second radiator.

10. The air conditioner according to claim 8, wherein the air conditioner comprises:

the first radiator is arranged in the air outlet duct, and the stacking direction of the plurality of radiating fins in the first radiator is vertical to the airflow direction of the air outlet duct;

the second radiator is arranged in the radiating air duct, and the stacking direction of a plurality of radiating fins in the second radiator is vertical to the airflow direction of the radiating air duct;

the stacking direction of the plurality of radiating fins in the first radiator is perpendicular to the stacking direction of the plurality of radiating fins in the second radiator.

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