CN212434467U - Capacitor element heat radiation structure of controller - Google Patents
Capacitor element heat radiation structure of controller Download PDFInfo
- Publication number
- CN212434467U CN212434467U CN202020959061.1U CN202020959061U CN212434467U CN 212434467 U CN212434467 U CN 212434467U CN 202020959061 U CN202020959061 U CN 202020959061U CN 212434467 U CN212434467 U CN 212434467U
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- China
- Prior art keywords
- heat
- circuit board
- bottom plate
- controller
- capacitor
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- Withdrawn - After Issue
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Abstract
A capacitor element heat radiation structure of a controller comprises a heat radiation bottom plate, a control circuit board is arranged on the heat radiation bottom plate, a power circuit board is also arranged on the heat radiation bottom plate, the power circuit board is positioned between the heat radiation bottom plate and the control circuit board, and the power circuit board is attached to the heat radiation bottom plate; the capacitor element heat radiation structure of the controller comprises: the capacitor elements are arranged on the control circuit board, heat conduction materials are filled among the capacitor elements, and a heat conduction element is arranged among the capacitor elements.
Description
Technical Field
The present invention relates to a capacitor element heat dissipation structure of a controller, and more particularly to a capacitor element heat dissipation structure of a controller, which can increase heat conduction elements between capacitor elements, guide the heat generated by the capacitor elements to a heat dissipation bottom plate for rapid heat dissipation, and increase the service life of the capacitor elements.
Background
The controller comprises a heat dissipation bottom plate, a control circuit board, a power circuit board and other components, wherein the control circuit board and the power circuit board are arranged on the heat dissipation bottom plate, the power circuit board is attached to the heat dissipation bottom plate, and the controller further comprises a capacitor element arranged on the control circuit board.
Furthermore, the power circuit board usually generates heat energy, the heat energy generated by the power circuit board can be quickly dissipated through the heat dissipation bottom plate, the capacitor element also generates heat energy due to large current output, but the heat energy generated by the capacitor element can only be naturally dissipated, the heat dissipation speed is slow, the capacitor element can accumulate too much heat energy due to long-time large current output, the temperature is too high, the service life of the capacitor element is reduced, and even the function failure is caused, so how to quickly dissipate the heat energy of the capacitor element to increase the service life of the capacitor element is an important issue at present.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a capacitor element heat dissipation structure of a controller, which can guide the heat generated by the capacitor element to a heat dissipation bottom plate for rapid heat dissipation, thereby increasing the service life of the capacitor element.
In order to achieve the above object, the present invention provides a capacitor element heat dissipation structure of a controller, the controller includes a heat dissipation bottom plate, a control circuit board is disposed on the heat dissipation bottom plate, a power circuit board is further disposed on the heat dissipation bottom plate, the power circuit board is located between the heat dissipation bottom plate and the control circuit board, and the power circuit board is attached to the heat dissipation bottom plate; the capacitor element heat radiation structure of the controller comprises: the capacitor elements are arranged on the control circuit board, heat conduction materials are filled among the capacitor elements, and a heat conduction element is arranged among the capacitor elements.
According to the utility model discloses a first embodiment, this heat conduction component's one end is located this heat conduction material, and this heat conduction component's the other end is located the recess on this heat dissipation bottom plate, has still poured this heat conduction material between this heat conduction component and the recess.
According to the utility model discloses a second embodiment, this heat conduction component is integrated into one piece with this radiating bottom plate, and this heat conduction component's one end is located this heat conduction material.
According to the utility model discloses a third embodiment, this heat-conducting element's one end is passed through the locking part and is connected with this control circuit board locking, and this power circuit board extends to this electric capacity component below, and this heat-conducting element is located this power circuit board.
The following description of the preferred embodiment is provided to enable one of ordinary skill in the art to make the present invention more readily understood, and is provided in conjunction with the accompanying drawings.
Drawings
Fig. 1 is a perspective view of a capacitor element heat dissipation structure of a controller according to a first embodiment and a second embodiment of the present invention.
Fig. 2 is a perspective cross-sectional view taken along line 2-2 of fig. 1.
Fig. 3 is a plan sectional view of fig. 2.
Fig. 4 is a perspective cross-sectional view taken along line 2-2 of fig. 1.
Fig. 5 is a plan sectional view of fig. 4.
Fig. 6 is a perspective view of a third embodiment of a capacitor heat dissipation structure of a controller according to the present invention.
Fig. 7 is a perspective cross-sectional view taken along line 7-7 of fig. 6.
Fig. 8 is a plan sectional view of fig. 7.
Description of reference numerals: 10-a heat dissipation bottom plate; 11-a control circuit board; 12-a power circuit board; 13-a capacitive element; 14-a thermally conductive material; 15-heat conducting element.
Detailed Description
Referring to fig. 1 to 8, the present invention relates to a capacitor element heat dissipation structure of a controller, the controller includes a heat dissipation bottom plate 10, a control circuit board 11 is disposed on the heat dissipation bottom plate 10, a power circuit board 12 is further disposed on the heat dissipation bottom plate 10, the power circuit board 12 is located between the heat dissipation bottom plate 10 and the control circuit board 11, and the power circuit board 12 is attached to the heat dissipation bottom plate 10; the capacitor element heat radiation structure of the controller comprises: a plurality of capacitor elements 13 disposed on the control circuit board 11, wherein a heat conductive material 14 is filled between the plurality of capacitor elements 13, and a heat conductive element 15 is disposed between the plurality of capacitor elements 13.
Fig. 1 to 3 are a perspective view, a perspective sectional view and a plane sectional view of a first embodiment of the present invention. According to the utility model discloses a first embodiment, this heat conduction component 15's one end is located this heat conduction material 14, and this heat conduction component 15's the other end is located the recess on this radiating bottom plate 10, has still poured this heat conduction material 14 between this heat conduction component 15 and the recess.
Fig. 1, fig. 4 and fig. 5 are a perspective view, a perspective sectional view and a plane sectional view of a second embodiment of the present invention. According to the utility model discloses a second embodiment, this heat conduction element 15 is integrated into one piece with this radiating bottom plate 10, and this heat conduction element 15's one end is located this heat conduction material 14, and this heat conduction element 15's the other end is integrated into one piece with this radiating bottom plate 10.
Fig. 6 to 8 show a perspective view, a perspective sectional view and a plan sectional view of a third embodiment of the present invention. According to the third embodiment of the present invention, one end of the heat conducting element 15 is locked and connected to the control circuit board 11 through the locking member, and the power circuit board 12 extends to the lower side of the capacitor element 13, and the heat conducting element 15 is located on the power circuit board 12.
Continuing with the above embodiment, the heat conducting element 15 is a heat pipe, which has a fast temperature equalization characteristic.
Continuing with the above embodiment, the heat conducting element 15 is made of a metal material with a fast temperature equalization characteristic.
Through the utility model discloses the capacitor element heat radiation structure of controller can lead the produced heat energy of capacitor element to the radiating bottom plate with quick heat dissipation, increases capacitor element's life.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A capacitor element heat radiation structure of a controller comprises a heat radiation bottom plate, a control circuit board is arranged on the heat radiation bottom plate, a power circuit board is also arranged on the heat radiation bottom plate, the power circuit board is positioned between the heat radiation bottom plate and the control circuit board, and the power circuit board is attached to the heat radiation bottom plate; the controller is characterized in that the capacitor element heat dissipation structure of the controller comprises:
the capacitor elements are arranged on the control circuit board, heat conduction materials are filled among the capacitor elements, and a heat conduction element is arranged among the capacitor elements.
2. The heat dissipating structure of a capacitive element of a controller as claimed in claim 1, wherein one end of the heat conducting element is located in the heat conducting material, the other end of the heat conducting element is located in the groove of the heat dissipating bottom plate, and the heat conducting material is further filled between the heat conducting element and the groove.
3. The heat dissipating structure of a capacitive element of a controller as claimed in claim 1, wherein the heat conducting element is integrally formed with the heat dissipating base plate, and one end of the heat conducting element is located in the heat conducting material.
4. The heat dissipating structure of a capacitor device in a controller of claim 1, wherein one end of the heat conducting element is connected to the control circuit board by a locking member, and the power circuit board extends to a position below the capacitor device, and the heat conducting element is disposed on the power circuit board.
5. The capacitive element heat dissipating structure of claim 1, wherein the heat conducting element is a heat pipe.
6. The heat dissipating structure of a capacitor element in a controller of claim 1, wherein the heat conducting element is made of a metal material with a fast temperature equalization characteristic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020959061.1U CN212434467U (en) | 2020-05-29 | 2020-05-29 | Capacitor element heat radiation structure of controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020959061.1U CN212434467U (en) | 2020-05-29 | 2020-05-29 | Capacitor element heat radiation structure of controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212434467U true CN212434467U (en) | 2021-01-29 |
Family
ID=74270991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020959061.1U Withdrawn - After Issue CN212434467U (en) | 2020-05-29 | 2020-05-29 | Capacitor element heat radiation structure of controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212434467U (en) |
-
2020
- 2020-05-29 CN CN202020959061.1U patent/CN212434467U/en not_active Withdrawn - After Issue
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20210129 Effective date of abandoning: 20230804 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20210129 Effective date of abandoning: 20230804 |