CN212421829U - Immersion groove - Google Patents
Immersion groove Download PDFInfo
- Publication number
- CN212421829U CN212421829U CN202020844343.7U CN202020844343U CN212421829U CN 212421829 U CN212421829 U CN 212421829U CN 202020844343 U CN202020844343 U CN 202020844343U CN 212421829 U CN212421829 U CN 212421829U
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- CN
- China
- Prior art keywords
- tank
- lateral wall
- groove
- immersion
- cutting
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to an immerse groove belongs to crystal silicon processing technology field, immerse the groove setting between the cutting roller of two parallels, and its below that is located the cutting roller and lays the buddha's warrior attendant gauze, immerse the upper portion opening in groove, it includes the lateral wall and the tank bottom that is connected with the lateral wall, lateral wall and tank bottom enclose into the space that holds the cutting fluid, and the upper portion of a set of lateral wall is provided with the wire casing, supplies buddha's warrior attendant line to run through, has simple structure, low cost, the cooling and the lubricated effect of buddha's warrior attendant line to be showing characteristics.
Description
Technical Field
The utility model belongs to the technical field of crystal silicon processing, specifically speaking relates to an immerse groove.
Background
The crystalline silicon is an important component for realizing photoelectric conversion of the solar cell panel, and can be processed into a crystalline silicon wafer meeting the standard through a plurality of procedures. In the processing process of crystalline silicon, the processing efficiency and the cutting quality are the main concerns in the field of single/multi-wire diamond wire cutting. Spraying is adopted as a main cooling mode in the traditional processing process, the temperature of a cutting area can be reduced to a certain extent by adopting the traditional nozzle spraying and pouring modes, and chips are washed away, but the wire diameter of the diamond wire is extremely small, so that the wire diameter can be as low as 50 mu m in the aspect of multi-wire cutting, and the single wire cutting can also be below 120 mu m. Therefore, the cutting seam is extremely small, the capability of cutting fluid brought into a cutting area in a thin line is limited, sufficient cooling and lubricating effects cannot be guaranteed, and particularly the lubricating capability of the cutting fluid is not fully exerted, so that the cutting quality and the machining efficiency are limited to a certain extent. Therefore, in the case of extremely small slits, how to effectively cool the diamond wire is a problem to be solved.
SUMMERY OF THE UTILITY MODEL
To prior art's all sorts of insufficiencies, now provide the groove of immersing that holds the coolant liquid, can effectually cool off for the buddha's warrior attendant line.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides an immerse groove, sets up between two parallel cutting rollers, and its below that is located the diamond wire net of laying on the cutting roller, immerse the upper portion opening in groove, it includes lateral wall and the tank bottom that is connected with the lateral wall, lateral wall and tank bottom enclose into the space that holds the cutting fluid, and the upper portion of a set of lateral wall is provided with the wire casing, supplies the diamond wire to run through.
Further, the bottom of the tank is provided with a protrusion, and the protrusion faces the opening of the immersion tank, facilitating the collection of chips toward the bottom edge of the tank.
Further, the longitudinal section of the wire groove is rectangular.
Furthermore, a plurality of drainage ports are arranged at the joint of the side wall and the bottom of the groove and used for discharging cutting fluid.
Furthermore, the longitudinal section of the drainage port is rectangular, and the drainage ports are arranged at intervals.
Further, the immersion groove has a rectangular longitudinal section, and the drain opening is provided along the longitudinal direction of the immersion groove.
The utility model has the advantages that:
1. the wire casing is seted up on immersing groove upper portion for hold the buddha's warrior attendant line, effectively avoid the lateral wall to interfere buddha's warrior attendant line, simple structure.
2. The bottom of the immersion groove is provided with a drainage port for discharging the chips and cutting fluid precipitated on the bottom of the immersion groove.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
In the drawings: 1-side wall, 2-groove bottom, 3-wire groove and 4-drainage port.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following description, together with the drawings of the present invention, clearly and completely describes the technical solution of the present invention, and based on the embodiments in the present application, other similar embodiments obtained by those skilled in the art without creative efforts shall all belong to the protection scope of the present application. In addition, directional terms such as "upper", "lower", "left", "right", etc. in the following embodiments are directions with reference to the drawings only, and thus, the directional terms are used for illustrating the present invention and not for limiting the present invention.
The present invention will be further described with reference to the accompanying drawings and preferred embodiments.
The first embodiment is as follows:
as shown in fig. 1, an immersion bath is provided between two parallel cutting rolls and is located below a diamond wire mesh laid on the cutting rolls. The immersion groove comprises a side wall 1 and a groove bottom 2 connected with the side wall 1, the side wall 1 is connected with the edge of the groove bottom 2 in a sealing mode and encloses a space for containing cutting fluid, and an opening is formed in the upper portion of the immersion groove and used for immersing the diamond wire in the cutting fluid. For the erection of diamond wire, the upper portion of lateral wall 1 that corresponds below the diamond wire is provided with the wire casing 3 that supplies the diamond wire to run through, simultaneously, because crystal silicon can produce the smear metal at the in-process of cutting, consequently, be provided with a plurality of discharge ports 4 in the edge of lateral wall 1, supply the smear metal to discharge, discharge port 4 sets up along the bottom edge interval of lateral wall 1. In order to facilitate the collection of the chips at the bottom and the outflow of the chips with the cutting fluid, the bottom of the groove bottom 2 is provided with a projection, and the projection faces the opening.
In this embodiment, immerse the groove and the vertical section of outlet all becomes the rectangle, and immerse groove and cutting roller parallel arrangement, outlet 4 sets up along the length direction interval of immersing the groove, simultaneously, the vertical section of tank bottom 2 becomes triangle-shaped, and the smear metal piece of being convenient for slides to the edge of tank bottom 2, and then flows from outlet 4. And a nozzle is arranged above the diamond wire mesh and used for supplementing the cutting fluid lost in the immersion groove. In other embodiments, the longitudinal cross-section of the immersion tank and the longitudinal cross-section of the tank bottom 2 can also be of other shapes.
When the immersion groove is used, the immersion groove is filled with cutting fluid, the diamond wire penetrates through the wire groove 3 and is immersed in the cutting fluid, the crystalline silicon is in contact with the diamond wire from the upper part of the diamond wire, in the cutting process, the cutting fluid in the immersion groove is brought into a cutting area, the lubricating effect can be effectively achieved for the cutting of the crystalline silicon, heat generated by friction between the diamond wire and the crystalline silicon is taken away, meanwhile, generated cutting chips slide to the edge of the groove bottom 2, and finally the immersion groove is discharged along with the cutting fluid through the drainage port 4. In this embodiment, the nozzles are arranged in two sets, and the two sets of nozzles are respectively arranged on two sides of the crystalline silicon.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, i.e. the present invention is intended to cover all equivalent variations and modifications within the scope of the present invention.
Claims (6)
1. The utility model provides an immerse groove, sets up between two parallel cutting rollers, and its below that is located the diamond wire net of laying on the cutting roller, its characterized in that, immerse the upper portion opening in groove, it includes lateral wall and the tank bottom that is connected with the lateral wall, the space of holding cutting fluid is enclosed into to lateral wall and tank bottom, and the upper portion of a set of lateral wall is provided with the wire casing, supplies the diamond wire to run through.
2. An immersion tank as claimed in claim 1 wherein the tank floor is provided with a projection and the projection is directed towards the opening of the immersion tank to facilitate the collection of swarf towards the edge of the tank floor.
3. An immersion bath as claimed in claim 2, wherein the longitudinal section of the wire chase is rectangular.
4. The immersion tank as claimed in claim 3, wherein a plurality of discharge ports are provided at the junctions of the side walls and the bottom of the tank for discharging the cutting fluid.
5. The immersion tank as claimed in claim 4, wherein the vent is rectangular in longitudinal section and the plurality of vents are spaced apart.
6. The immersion tank as claimed in claim 5, wherein the immersion tank has a rectangular longitudinal section and the drain opening is provided along a length of the immersion tank.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010115991.3A CN111186041A (en) | 2020-02-25 | 2020-02-25 | Immersion type diamond wire cutting crystalline silicon and cooling and lubricating method |
CN2020101159913 | 2020-02-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN212421829U true CN212421829U (en) | 2021-01-29 |
Family
ID=70704410
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010115991.3A Pending CN111186041A (en) | 2020-02-25 | 2020-02-25 | Immersion type diamond wire cutting crystalline silicon and cooling and lubricating method |
CN202010426640.4A Pending CN111421689A (en) | 2020-02-25 | 2020-05-19 | Immersion type diamond wire cutting crystalline silicon and cooling and lubricating method |
CN202020844343.7U Active CN212421829U (en) | 2020-02-25 | 2020-05-19 | Immersion groove |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010115991.3A Pending CN111186041A (en) | 2020-02-25 | 2020-02-25 | Immersion type diamond wire cutting crystalline silicon and cooling and lubricating method |
CN202010426640.4A Pending CN111421689A (en) | 2020-02-25 | 2020-05-19 | Immersion type diamond wire cutting crystalline silicon and cooling and lubricating method |
Country Status (1)
Country | Link |
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CN (3) | CN111186041A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116587451A (en) * | 2023-06-21 | 2023-08-15 | 苏州博宏源机械制造有限公司 | Semiconductor wafer material processing device and method |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111976043B (en) * | 2020-08-26 | 2022-05-31 | 西安奕斯伟材料科技有限公司 | Crystal bar cutting device and crystal bar cutting method |
CN114434664B (en) * | 2022-03-07 | 2024-10-15 | 高景太阳能股份有限公司 | Device for reducing cutting jumper rate of silicon rod and cutting method |
CN114851413A (en) * | 2022-03-25 | 2022-08-05 | 河南科技大学 | Connecting piece groove, diamond wire slicing machine and cutting method of large-size silicon rod |
CN114953229A (en) * | 2022-06-30 | 2022-08-30 | 青岛高测科技股份有限公司 | Composite processing method of wire cutting machine |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0985737A (en) * | 1995-09-22 | 1997-03-31 | Toray Eng Co Ltd | Wire type cutting device |
JPH09193142A (en) * | 1996-01-19 | 1997-07-29 | Mitsubishi Materials Corp | Wire type cutting processing apparatus |
JPH11198020A (en) * | 1997-11-04 | 1999-07-27 | Tokyo Seimitsu Co Ltd | Fixed abrasive grain wire saw |
DE19841492A1 (en) * | 1998-09-10 | 2000-03-23 | Wacker Siltronic Halbleitermat | Method and device for separating a large number of disks from a brittle hard workpiece |
CH696389A5 (en) * | 2002-02-19 | 2007-05-31 | Meyer & Burger Ag Maschf | Wire saw. |
TW201226087A (en) * | 2010-12-31 | 2012-07-01 | Micron Diamond Wire & Equipment Co Ltd | Cutting and cooling device of diamond wire |
JP5427822B2 (en) * | 2011-04-05 | 2014-02-26 | ジルトロニック アクチエンゲゼルシャフト | How to cut a workpiece with a wire saw |
CN103128866A (en) * | 2011-11-21 | 2013-06-05 | 赵钧永 | Improved multi-line cutting device |
CN104385470B (en) * | 2014-11-18 | 2016-07-06 | 泉州市永茂电子科技有限公司 | A kind of crystal bar slice systems |
CN109421185B (en) * | 2017-09-05 | 2021-05-28 | 上海新昇半导体科技有限公司 | Cutting method and cutting device for crystal bar |
CN110202707B (en) * | 2019-06-19 | 2021-04-20 | 广东先导先进材料股份有限公司 | Multi-wire cutting device and cutting fluid supply assembly thereof |
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2020
- 2020-02-25 CN CN202010115991.3A patent/CN111186041A/en active Pending
- 2020-05-19 CN CN202010426640.4A patent/CN111421689A/en active Pending
- 2020-05-19 CN CN202020844343.7U patent/CN212421829U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116587451A (en) * | 2023-06-21 | 2023-08-15 | 苏州博宏源机械制造有限公司 | Semiconductor wafer material processing device and method |
CN116587451B (en) * | 2023-06-21 | 2024-01-26 | 苏州博宏源机械制造有限公司 | Semiconductor wafer material processing device and method |
Also Published As
Publication number | Publication date |
---|---|
CN111421689A (en) | 2020-07-17 |
CN111186041A (en) | 2020-05-22 |
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