JPH09193142A - Wire type cutting processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent falling matter from falling on the mechanical part such as the grooved roller or the wire arranged under a cutting region by providing a receiving tray member receiving the processing liquid or cut powder falling from the wire and the cut broken pieces of a member to be cut. SOLUTION: A receiving tray member 20 receiving the processing liquid L and a cut powder falling from wire 8 passing through the cutting processing region A of a member 9 to be cut and the cut broken pieces of the member to be cut is provided under the wire 8 and those falling matters are prevented from falling on the machine part such as the grooved roller 7a or the wire arranged under the cutting processing region A.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire-type cutting apparatus for cutting a high-hardness brittle material such as a semiconductor material, a magnetic material, or a ceramic with a wire.

[0002]

2. Description of the Related Art A wire-type cutting device presses a member to be cut against the wire by a pressing device while running a wire stretched between a plurality of groove rollers in one direction by a wire traveling device at a predetermined speed. At the same time, there are known ones in which a cutting liquid containing abrasive grains is supplied to the cutting portion of the member to be cut to cut the member to be cut, and ones in which wires are alternately run in opposite directions to perform cutting.

In a conventional wire-type cutting apparatus, a processing liquid containing abrasive grains is directed toward a wire immediately before cutting a member to be cut, as shown in Japanese Patent Application Laid-Open No. 7-1442, for example. , From above, some of which adhere to the wire and most of the others fall through the wire. That is, a part of the working fluid attached to the wire is used for cutting the member to be cut, and the other working fluid is collected in a slurry receiving tank arranged at the lowest position of the apparatus and is recycled and used. It was like.

[0004]

However, in the wire type cutting apparatus having the above-mentioned structure, the working fluid falling from the wire is applied to another groove roller or the like which applies tension to the wire below the cutting working area. Since it will fall on the machine part, the inconvenience that the soundness of the machine part or the like may be impaired may be considered for long-term use. In particular, the machining fluid that falls from the wire contains foreign matter such as cutting chips and cut debris from the member that has been cut by the wire, and these foreign matter may damage the groove rollers and the wire. Inconvenience may occur.

The wire used in the wire-type cutting and processing apparatus is extremely thin, 0.16 to 0.18 mm. Therefore, the amount of the working fluid that adheres to the wire is extremely small with respect to the total amount of the working fluid that is sprayed, and even if the working fluid is in contact with the wire, it does not adhere to the wire. In many cases, it is dropped due to inertial force, and it is difficult to surely attach the wire to the wire.

The present invention has been made in view of the above-mentioned circumstances, and prevents mechanical parts from being damaged by falling objects such as machining fluid, cutting chips or cutting fragments falling from a wire. It is an object of the present invention to provide a wire-type cutting and processing apparatus that can be used.

[0007]

In order to achieve the above-mentioned object, the invention according to claim 1 is a method in which a wire stretched between a plurality of groove rollers is run at a predetermined speed by a wire running device, A wire-type cutting process for pressing the cutting member against the wire from above by a pressing device, and cutting the member to be cut while supplying a working liquid containing abrasive grains to the cutting part of the member to be cut from the working liquid supply device. An apparatus for wire cutting, comprising a saucer member for receiving a working fluid, cutting chips, and cutting debris of a member to be cut, which is immediately below the wire passing through a cutting region of the member to be cut. Is proposed.

The invention according to claim 2 proposes, in the wire-type cutting and processing apparatus, a wire-type cutting and processing apparatus provided with a processing liquid circulating means for supplying the processing liquid received by the tray member to the processing liquid supply device. doing. Further, the invention according to claim 3 is such that the saucer member stores the working liquid such that the liquid surface is brought close to the wire, and the cut lower part of the member to be cut is immersed in the working liquid storage tank. We propose a wire-type cutting and processing device.

Further, in the invention according to claim 4, the working fluid layer formed on the upper surface of the wire which is connected to the working fluid storage tank and is disposed adjacently below the wire stretched between the cutting working area and the groove roller. There is proposed a wire-type cutting and processing apparatus having a working liquid receiving plate member for immersing a wire therein, and the working liquid supply device having a supply port for supplying the working liquid to the upper surface of the working liquid receiving plate member. .

Further, in the invention according to claim 5, the machining fluid receiving plate member is provided with an inclined portion which is gradually lowered from the groove roller toward the cutting machining area, and the invention according to claim 6 is the machining fluid supply device. Proposes a wire-type cutting and processing apparatus having a nozzle for ejecting the processing liquid so that the processing liquid received on the processing liquid receiving plate member flows toward the cutting processing area.

[0011]

According to the wire type cutting and processing apparatus according to the present invention,
By the operation of the wire running device, the wire stretched between the plurality of groove rollers is run in one direction or both directions at a predetermined speed. Then, by operating the pressing device, the member to be cut is pressed against the running wire. Since the working fluid containing the abrasive grains supplied from the machining fluid supply device is attached to the wire, the wire causes the abrasive grains to rub against the member to be cut, so that the wire moves along with the movement of the member to be cut by the pressing device. Then, the member to be cut is cut.

In this case, since the wire type cutting apparatus according to the present invention is provided with the saucer member immediately below the wire passing through the cutting processing area, the working fluid, the cutting chips and the cutting fragments dropped from the wire. Are received by the saucer member. Therefore, it is possible to prevent the falling objects from falling onto the mechanical parts such as the groove rollers arranged below the falling objects.

Further, if the receiving member is provided with the working liquid circulating means, the working liquid received by the receiving member can be circulated and reused so as to be supplied to the working liquid supply device. . Further, since the working fluid is extracted from the tray member by the operation of the working fluid circulation means, it is possible to adjust the liquid level so that the working fluid does not overflow from the tray member.

Further, when the saucer member is a working liquid storage tank, the lower part of the member to be cut, which protrudes downward of the wire when cut, is immersed in the working liquid storage tank. In the lower part of the member to be cut, which is immersed in the working fluid in this way, a plurality of grooves having a width dimension almost equal to the thickness of the wire are formed by the wire, so that the working fluid is separated by the capillary phenomenon. Is raised in the groove to reach the contact position between the wire and the member to be cut. As a result, the cutting liquid is constantly supplied to the cutting processing unit during cutting and descending, so that the cutting processing of the member to be cut is efficiently performed.

A working liquid receiving plate member is provided between the cutting working area and the groove roller, and the working liquid containing abrasive grains is supplied to the upper surface of the working liquid receiving plate member from the supply port of the working liquid supplying device. In that case, the wire before cutting the member to be cut is immersed in the working liquid received by the working liquid receiving plate member. Since the working fluid is received on the working fluid receiving plate member, the inertial force is weakened, so that the working fluid is easily maintained in the adhered state to the wire to be contacted, and a sufficient amount of the working fluid for cutting is carried to the member to be cut. As a result, a more efficient cutting process will be performed.

Further, when the working fluid receiving plate member is provided with an inclined portion which is gradually lowered from the groove roller toward the cutting working area, the working fluid received on the upper surface of the working fluid receiving plate member is inclined. The portion causes the fluid to flow from the groove roller toward the cutting area, that is, in the same direction as the running direction of the wire. As a result, the relative speed between the working fluid and the wire that is immersed in the working fluid is reduced, the adhesion of the working fluid to the wire is improved, and the working fluid is made to flow toward the cutting working area. The machining liquid is poured onto the surface of the member to be cut, and is effectively supplied to the contact start position between the wire and the member to be cut. The same applies to the machining fluid supply device provided with a nozzle for ejecting the machining fluid so that the machining fluid received on the machining fluid receiving plate member flows toward the cutting machining area.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a wire type cutting and processing apparatus according to the present invention will be described below with reference to FIG. The wire type cutting and processing apparatus 1 according to the present embodiment is shown in FIG.
As shown in FIG. 3, the wire traveling device 3, the pressing device 4, the working liquid supply device 5, the saucer member 20, and the working liquid circulating means 21 are mounted on the device frame 2.

The wire traveling device 3 includes, for example, a pair of reels individually rotated by a drive motor such as a servo motor (not shown), a tension holding mechanism, a tension detecting mechanism, a cutting mechanism 7 and a traveling amount detecting mechanism. Therefore, when the wire 8 is fed from one reel to the other reel through the various mechanisms described above, the traveling direction and the traveling amount of the wire 8 by both reels are alternately changed to travel.

Among the mechanisms constituting the wire traveling device 3, the cutting mechanism 7 includes three groove rollers 7a, 7b, 7c arranged in parallel and horizontally in an inverted triangle shape, and a lower groove roller. A drive motor 7d for cutting traveling that rotates 7a is provided. The wire 8 is used for each groove roller 7a, 7b, 7c.
It is wound in parallel with a plurality of grooves formed at predetermined intervals. Wire 8 between the upper two groove rollers 7b, 7c
Is stretched horizontally, and a cutting area A for pressing and cutting the member 9 to be cut by the pressing device 4 described later is formed near the center thereof.

The pressing device 4 includes a support mechanism 10 for supporting the member 9 to be cut, a moving mechanism 11 including a ball screw for moving the support mechanism 10 up and down, and a servo motor for operating the moving mechanism 11. A pressing force detector 13 such as a load cell for detecting the pressing force (reaction force) of the member 9 to be cut against the drive motor 12 and the wire 8, and the moving drive motor 1
A movement amount detector 14 such as a rotary encoder for detecting the movement amount of the support mechanism 10 from the number of rotations of 2.

The pressing device 4 supports the member 9 to be cut by the support mechanism 10 and supports it by the groove rollers 7b, 7 of the cutting mechanism 7.
The force is applied vertically to the wire 8 during c, and the detection signal from the pressing force detector 13 keeps the pressing force of the member 9 to be cut against the wire 8 constant so that the movement drive motor 12 applies a force. The pressing movement speed of the cutting member 9 is adjusted.

The machining liquid supply device 5 is provided with, for example, a pair of nozzles 15 and 16 as supply ports for spraying the machining liquid L onto the wire 8. Each nozzle 15, 16
Is, for example, a slit nozzle, and pipes 15a and 16a arranged so as to be orthogonal to the wire 8,
Slit-shaped opening 1 provided in the pipes 15a and 16a
5b and 16b, and adjusting blocks 15d and 16d fixed by adjusting screws 15c and 16c so that the opening areas of the openings 15b and 16b can be adjusted.

The nozzles 15 and 16 are arranged between the cutting processing area A and the groove rollers 7b and 7c, and the processing liquid L is obliquely incident on the wire 8. The openings 15b and 16b are arranged so as to be inclined downward toward the cutting processing area A side.

The tray member 20 is, for example, a box-shaped container having a volume capable of accommodating the member 9 to be cut, and is arranged below the wire 8 in the cutting processing area A. Further, the upper end opening 20a of the tray member 20 is provided with a collar portion 20b arranged between the cutting processing area A and the groove roller, and the processing liquid sprayed from the nozzles 15 and 16 and falling from the wire. The L is received and guided into the tray member 20.

The machining liquid circulating means 21 has a drain pipe 21 having one end connected to the side wall of the tray member 20 near the bottom surface thereof.
a and a valve 21b provided in the middle of the drainage pipe 21a
A filter 21c for removing dust such as cutting fragments from the working liquid L flowing through the drainage pipe 21a; and a drainage pipe 21a.
And a pump 21d for flowing the working liquid L therein in one direction.

The other end of the drainage pipe 21a is connected to the nozzles 15 and 16 as the working fluid supply device. The filter 21c is, for example, a woven wire mesh,
The size of the cut pieces generated by the cutting process is about 1 mm at the maximum, whereas the size of the abrasive grains is about 10 μm, so that the size of 22 to 40 mesh is used. Processing liquid L
The abrasive grains can be passed through and only the cut pieces can be captured and removed.

Further, the flow rate of the working liquid L extracted from the pan member 20 through the drainage pipe 21a is controlled by the valve 21b.
By automatically adjusting the opening degree of the processing liquid L, the flow rate of the processing liquid L is approximately the same as that of the processing liquid L supplied from the nozzles 15 and 16, so that the processing liquid L does not overflow from the upper end opening 20a of the tray member 20. .

The operation of the wire-type cutting and processing apparatus 1 of the present embodiment thus configured will be described below. In order to cut and process a member to be cut by the wire type cutting and processing apparatus 1 of the present embodiment, first, the wire traveling device 3 is operated to cause the wire 8 to travel in the mutual directions, and the machining liquid circulating means 21 is also operated. The processing liquid L in the tray member 20 is sprayed from the nozzles 15 and 16.

In this state, the pressing device 4 is actuated to lower the member 9 to be cut, and the wire 8 being reciprocated in the horizontal direction is pressed from above. As a result, the wire 8 to which the working liquid L sprayed from the nozzles 15 and 16 is attached is slid on the surface of the member 9 to be cut, and the member 9 to be cut begins to be cut from its lower end. Become.

In this case, the working liquid L dropped from the wire is received by the collar portion 20b of the tray member 20 and guided into the tray member 20. Further, when the wire passes through the cutting processing area A and the member to be cut begins to be cut, the cutting fluid and the cutting debris of the member to be cut become mixed in the working liquid L falling from the wire.

However, according to the wire-type cutting and processing apparatus 1 of this embodiment, since the tray member 20 is provided, these processing liquid L, cutting chips, and cutting debris are located below the cutting processing area A. It is possible to prevent the mechanical parts such as the grooved rollers 7a and the wires 8 arranged from falling down.

The machining liquid L received by the pan member 20 is discharged by the machining liquid circulating means 21.
It is circulated so as to be jetted from the nozzles 15 and 16 toward the wire via the 1a, the valve 21b, the filter 21c, and the pump 21d. Then, during this circulation, foreign matter such as cutting fragments contained in the working fluid L is removed by the filter 21c, so that the working fluid L is effectively reused.

Further, the operation of the machining liquid circulating means 21 adjusts the liquid level L ₁ so that the machining liquid L in the tray member 20 does not overflow from the upper end opening 20a of the tray member 20, so that the mechanical component Soundness will be reliably maintained.

Next, a second embodiment of the wire type cutting and processing apparatus according to the present invention will be described with reference to FIGS. Note that the portions having the same configuration as the above-described first embodiment will be denoted by the same reference numerals, and the description will be simplified. Wire type cutting apparatus 31 according to the present embodiment
The wire-type cutting process according to the first embodiment in that the working liquid storage tank 32 is adopted in place of the saucer member 20, and the working liquid receiving plate member 6 is adopted in place of the collar portion 20b of the saucer member 20. It differs from the device 1.

The working liquid storage layer 32 is a box-shaped container having a volume such that the entire member 9 to be cut can be immersed.
It is arranged below the wire 8 in the cutting processing area A, and its upper end opening 32a is arranged in the vicinity of the wire 8. Further, the flow rate of the working liquid L extracted from the working liquid storage tank 32 through the drainage pipe 21a is adjusted by automatically adjusting the opening degree of the valve 21b so that the working liquid L is discharged from the upper end opening 32a of the working liquid storage tank 32. The liquid level L ₁ does not overflow and the upper end opening 32
It is adapted to be maintained at a constant position near a.

As a result, when the member to be cut 9 cut by the wire 8 passes through the wire 8 and advances downward, the lower part of the member to be cut 9 immediately contacts the liquid surface L ₁ of the machining liquid storage tank 32. It comes in contact with. Then, the working liquid L in the working liquid storage tank 32 is extracted from the working liquid storage tank 32 by the operation of the working liquid circulating means 21, and the shavings are removed by the filter 21c.
It is recycled so as to be supplied to No. 6 and reused. At this time, the flow rate in the drainage pipe 21a is adjusted so that the working liquid L does not overflow from the working liquid storage tank 32, so that the working liquid L is disposed further below the groove roller 7a.
Therefore, it is possible to prevent a large amount of landing on mechanical parts such as.

The working liquid receiving plate member 6 is a flat plate provided between the working liquid storage tank 32 and the groove rollers 7b and 7c so as to extend horizontally from the upper end of the working liquid storage tank 32. It is a member and is arranged in the vicinity of the wire 8 from below the wire 8 with a minute gap therebetween, and receives the machining liquid L jetted from the nozzles 15 and 16 below the wire 8. . The size of the gap between the working liquid receiving plate member 6 and the wire 8 is, for example, the nozzle 1
It is assumed that the working fluid L supplied from 5, 16 is set to be smaller than the depth dimension of the working fluid L when flowing on the working fluid receiving plate member 6.

The operation of the wire-type cutting and processing apparatus 31 of the present embodiment thus configured will be described below.
In order to cut and process the member 9 to be cut by the wire type cutting and processing device 31 of the present embodiment, the wire traveling device 3 is operated to cause the wire 8 to travel in the mutual directions, and the machining liquid circulating means 21 is operated. The working liquid L in the working liquid storage tank 32 is sprayed from the nozzles 15 and 16.

In this state, the pressing device 4 is actuated to lower the member 9 to be cut, and the wire 8 being horizontally reciprocated is pressed from above. In this case,
The machining liquid L supplied from the nozzles 15 and 16 is received by the machining liquid receiving plate member 6 and thereby the wire 8
While being held in the vicinity of, the working liquid receiving plate member 6 is made to flow in a layer having an appropriate thickness dimension.

As a result, the wire 8 running horizontally in the vicinity of above the working liquid receiving plate member 6 is immersed in the working liquid L flowing on the working liquid receiving plate member 6. Will be placed in the state. Therefore, the processing liquid L
Will be in contact with the wire 8 for a relatively long time.

Moreover, in this embodiment, the nozzle 1
Since the openings 15b, 16b of the nozzles 5, 16 are arranged obliquely downward toward the cutting processing area A side, the nozzle 15,
The machining fluid L jetted from 16 is made to flow on the machining fluid receiving plate member 6 in the direction of the cutting machining area A.
That is, the working liquid L is directed to the wire 8 toward the cutting working area A.
As a result of being guided in the same direction as, while being guided while reducing its relative speed, the adhesion of the working liquid L to the wire 8 is improved.

Then, by sliding the wire 8 to which the sufficient working liquid L is attached on the surface of the member 9 to be cut, the member 9 to be cut can be efficiently cut.

Further, when the member to be cut passes through the wire and is lowered below the wire as the cutting process progresses, the member to be cut 9 is arranged below the wire 8 in the cutting area A in the vicinity thereof. The working liquid L in the working liquid storage tank 32 is brought into contact with the liquid surface L ₁ . At this point, a groove 9a is formed by the plurality of wires 8 in the lower portion of the member 9 to be cut. These grooves 9a are extremely thin and have a width dimension almost equal to the thickness dimension of the wire 8.

Therefore, when the lower portion of the member 9 to be cut having such a shape comes into contact with the liquid surface L ₁ of the working liquid L in the working liquid storage tank 32, the working liquid L rises in the groove 9a by the capillary phenomenon. . Since the wire 8 being cut is disposed immediately above the liquid level L _{1 in} the groove 9a, the working liquid L is supplied to the periphery of the wire 8 being cut. That is, the cutting liquid L can be efficiently supplied by constantly supplying the working liquid L.

Further, in the wire type cutting apparatus 31 according to this embodiment, the opening of the valve 21b is prevented by the operation of the working fluid circulating means 21 so that the working fluid L circulated does not overflow from the working fluid storage tank 32. Therefore, it is possible to effectively prevent the machining liquid L from falling on a large amount of various mechanical parts arranged below the machining liquid storage tank 32.

Further, since the machining fluid storage tank 32 is arranged below the cutting machining area A, not only the machining fluid L falling from the wire 8 but also the cutting fluid generated by the cutting machining as in the first embodiment. The powder, the cut pieces of the member 9 to be cut, and the like are received in the working liquid storage tank 32. Therefore, it is possible to prevent these falling objects from falling onto the mechanical parts such as the groove roller 7a and the wire 8 and prevent the occurrence of inconvenience such as damage to the mechanical parts.

In the above two embodiments, the wire-type cutting and processing apparatus 1 of the type in which the wires 8 are alternately run bidirectionally has been described, but the wire-type cutting and processing apparatus of the type in which the wire 8 is run in one direction is described. The same can be applied to the device 1. That is, the nozzles 15 and 16 and the working liquid receiving plate member 6 provided on both sides of the cutting working area A.
Need only be arranged on the upstream side in the traveling direction of the wire 8 with respect to the cutting area A.

Further, in the first embodiment, the tray member 20 is a box-shaped container having a volume capable of accommodating the member 9 to be cut, but instead of this, in the first embodiment. A box-shaped container having a shallower depth may be arranged below the wire 8 with a gap so that the member 9 to be cut can completely pass through the wire 8.

Further, in the wire type cutting and processing apparatus 31 according to the second embodiment, the working liquid L is supplied onto the working liquid receiving plate member 6 by setting the jetting direction of the working liquid L from the nozzles 15 and 16. The machining liquid L was made to flow in the direction of the cutting working area A, but instead of this, as shown in FIG. 5, the working liquid receiving plate member 6 is moved from the groove rollers 7b, 7c to the cutting working area A. Inclined part 1 which becomes gradually lower as it goes
7 may be provided.

In particular, when the wire 8 is run in one direction, as shown in FIG. 6, the wire 8 between the groove rollers 7b and 7c is slightly inclined, and the working liquid is made to follow the wire 8. The receiving plate member 6 may also be inclined so as to gradually lower in the direction of the cutting processing area A.

In these cases, regardless of the spraying direction of the working liquid L from the nozzles 15 and 16, the slanting portion 17 causes the working liquid L to flow toward the cutting working area A. Similar to the embodiment, it is possible to improve the adhesion of the working liquid L to the wire 8 and improve the cutting efficiency.

Further, instead of the working liquid receiving plate member 6 made of a flat plate having a flat upper surface in the second embodiment,
As shown in FIG. 7, it is also possible to adopt one having a plurality of grooves 18 formed on the upper surface along the traveling direction of the wire 8. According to this, when the working liquid L supplied from the nozzles 15 and 16 is received by the working liquid receiving plate member 6, the working liquid L is supplied to the plurality of grooves 1 formed on the upper surface of the working liquid receiving plate member 6.
8 is filled, and it is made to flow in the groove 18. Therefore, it is possible to easily form a layer of the working fluid L on the upper surface of the working fluid receiving plate member 6 with a sufficient depth for immersing the wire 8 and surely attach the working fluid L to the wire 8. be able to.

In the second embodiment, the machining liquid is ejected from the nozzles 15 and 16 by the operation of the pump 21d of the machining liquid circulating means 21, but instead of this, or in combination with this. Separately, machining fluid supply device 5
However, by having a collecting device such as a saucer, a filter and a pump connected to the collecting device below the working fluid storage tank 32, and supplying the working fluid L pumped up by the pump to the nozzles 15 and 16, The overflow from the processing liquid storage tank 32 may be allowed.

[0054]

As described in detail above, the wire-type cutting and processing apparatus according to the invention of claim 1 is a processing liquid and a cutting powder falling from the wire below the wire passing through the cutting processing area of the member to be cut. Also, since it is provided with a tray member for receiving the cutting debris of the member to be cut, it is possible to prevent those fallen objects from falling onto mechanical parts such as groove rollers and wires arranged below the cutting processing area. The effect is that the soundness of the mechanical parts can be maintained.

According to the wire type cutting and processing apparatus of the second aspect of the present invention, the working fluid received by the tray member can be circulated and reused so as to be supplied to the working fluid supply apparatus. Also, by the operation of the machining fluid circulation means,
Since the working liquid is extracted from the tray member, the liquid level can be adjusted so that the working liquid does not overflow from the tray member. Therefore, it is possible to reliably prevent the machining fluid and the cutting chips received by the tray member from dropping from the tray member, and it is possible to more effectively maintain the soundness of the wire and the like.

Further, in the wire type cutting and processing apparatus according to the third aspect of the present invention, the saucer member stores the processing liquid so that the liquid surface is brought close to the wire, and processes the cut lower part of the member to be cut. Since it consists of a processing liquid storage tank that is immersed in the liquid,
As the cutting process progresses, the lower part of the member to be cut protrudes below the wire and is immersed in the working liquid in the working liquid storage tank at the same time, and the capillary is attached to the cutting part arranged in the groove formed by the cutting process. The working fluid can be supplied depending on the phenomenon. Therefore, the working liquid can be constantly supplied to the wire being cut, and the cutting work can be efficiently performed.

Further, in the wire type cutting and processing apparatus according to the invention of claim 4, a processing liquid receiving plate member connected to the processing liquid storage tank is provided below the wire stretched between the cutting processing region and the groove roller. Since the machining liquid is supplied to the upper surface of the machining liquid receiving plate member from the supply port of the machining liquid supplying device, the wires are immersed in the machining liquid layer formed on the upper surface of the machining liquid receiving plate member. There is an effect that the efficiency of the cutting process can be improved by adhering a sufficient working liquid to the wire heading for the cutting process area.

Further, in the wire type cutting and processing apparatus according to the fifth aspect of the present invention, the processing liquid receiving plate member is provided with the inclined portion which is gradually lowered from the groove roller toward the cutting processing area. The working liquid supplied from the supply port can be made to flow toward the cutting processing area by the inclined portion.
Therefore, the relative speed between the wire and the working liquid, which are also run toward the cutting working area, is reduced, and the working liquid is moved along with the wire until just before the wire cuts the member to be cut in the cutting working area. , Can be sufficiently attached to the wire.

Further, in the wire type cutting and processing apparatus according to the invention of claim 6, the processing liquid supply device causes the processing liquid received on the processing liquid receiving plate member to flow toward the cutting processing region. Since it is equipped with a nozzle for ejecting, it is possible to improve the adhesion of the working liquid to the wire in the same manner as described above, and it is possible to perform more efficient cutting.

[Brief description of the drawings]

FIG. 1 is a front view of a cutting mechanism and a pressing device showing a first embodiment of a wire type cutting and processing apparatus according to the present invention.

FIG. 2 is a front view of a cutting mechanism and a pressing device showing a second embodiment of a wire type cutting and processing apparatus according to the present invention.

3 is a perspective view showing a nozzle and a working liquid receiving plate member arranged on both sides of a cutting area of the wire type cutting apparatus of FIG.

FIG. 4 is a front view in which a part of a nozzle and a working liquid receiving plate member in a cutting area of the wire type cutting apparatus of FIG. 2 is cut.

FIG. 5 is a partially cut front view showing a modified example of the working fluid receiving plate member of the wire-type cutting and processing apparatus according to the present invention.

FIG. 6 is a partially cut front view showing another modification of the working fluid receiving plate member of the wire-type cutting and processing apparatus according to the present invention.

FIG. 7 is a perspective view showing another modification of the working liquid receiving plate member of the wire type cutting and processing apparatus according to the present invention.

[Explanation of symbols]

 1,31 Wire type cutting / processing device 3 Wire traveling device 4 Pressing device 5 Processing liquid supply device 6 Processing liquid receiving plate member 7a, 7b, 7c Groove roller 8 Wire 9 Cutting target member 15, 16 Nozzle (supply port) 17 Inclination 18 Groove (Wire Insertion Groove) 20 Saucepan Member 21 Machining Fluid Circulation Means 32 Machining Fluid Storage Tank (Saucepan Member) A Cutting Processing Area L Machining Fluid

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Atsushi Sakamoto 1-7-5 Sakuragicho, Omiya City, Saitama Prefecture Sony City Building 21F, Mitsubishi Materials Corporation Ikuno Works Omiya Office (72) Inventor Takahiro Uchida Omiya City, Saitama Prefecture Sakuragicho 1-7-5 Sonic City Building 21F Mitsubishi Materials Co., Ltd. Ikuno Manufacturing Omiya Office

Claims (6)

[Claims] 1. While traveling a wire stretched between a plurality of groove rollers at a predetermined speed by a wire traveling device,
A wire type cutting for pressing the member to be cut against the wire from above by a pressing device and cutting the member to be cut while supplying a working liquid containing abrasive grains to the cutting processing part of the member to be cut from the working liquid supply device. A processing apparatus, comprising a saucer member which is located below a wire passing through a cutting processing area of the member to be cut and which receives a working liquid, cutting chips, and cutting fragments of the member to be cut falling from the wire. Wire cutting equipment. 2. The wire type cutting and processing apparatus according to claim 1, further comprising a working liquid circulating means for supplying the working liquid received by the tray member to the working liquid supply device. 3. The processing liquid storage tank, wherein the saucer member stores the processing liquid so that the liquid surface comes close to the wire, and dips the cut lower part of the member to be cut into the processing liquid. The wire-type cutting and processing apparatus according to claim 1 or 2, which is characterized. 4. A working fluid which is connected to a working fluid storage tank and is disposed in the vicinity of a wire extending between a cutting processing area and a groove roller so as to be adjacent thereto, and which dips the wire in a working fluid layer formed on the upper surface thereof. The working fluid supply device comprises a receiving plate member, and the working fluid supply device has a supply port for feeding the working fluid to the upper surface of the working fluid receiving plate member. Wire cutting machine. 5. The wire-type cutting device according to claim 1, wherein the working liquid receiving plate member is provided with an inclined portion which is gradually lowered from the groove roller toward the cutting working area. Processing equipment. 6. The machining fluid supply device is provided with a nozzle for ejecting the machining fluid so that the machining fluid received on the machining fluid receiving plate member flows toward the cutting machining area. The wire type cutting and processing apparatus according to any one of claims 1 to 5.