CN114953229A - Composite processing method of wire cutting machine - Google Patents
Composite processing method of wire cutting machine Download PDFInfo
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- CN114953229A CN114953229A CN202210764247.5A CN202210764247A CN114953229A CN 114953229 A CN114953229 A CN 114953229A CN 202210764247 A CN202210764247 A CN 202210764247A CN 114953229 A CN114953229 A CN 114953229A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 218
- 239000002131 composite material Substances 0.000 title claims abstract description 44
- 238000003672 processing method Methods 0.000 title claims abstract description 17
- 239000002173 cutting fluid Substances 0.000 claims abstract description 46
- 238000003754 machining Methods 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims description 43
- 238000003860 storage Methods 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 28
- 238000005507 spraying Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 24
- 238000001816 cooling Methods 0.000 abstract description 18
- 238000007599 discharging Methods 0.000 abstract description 16
- 230000008901 benefit Effects 0.000 abstract description 9
- 238000007654 immersion Methods 0.000 abstract description 6
- 238000005461 lubrication Methods 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 230000008642 heat stress Effects 0.000 abstract 1
- 229910003460 diamond Inorganic materials 0.000 description 28
- 239000010432 diamond Substances 0.000 description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 230000001050 lubricating effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000010892 electric spark Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
The embodiment of the application provides a composite processing method of a linear cutting machine, which comprises the steps of controlling a cutting line to move at a preset linear speed, controlling the cutting line and a bar to be cut to move oppositely at a preset feeding speed, immersing a part of the cutting line, which is in contact with the bar to be cut, in a cutting process into cutting fluid, respectively connecting and conducting the bar to be cut and the cutting line with a power supply, carrying out grinding and discharging composite cutting, and driving the cutting fluid to enter a cutting joint for internal cooling and lubrication by the movement of the cutting line in a manner of immersing the cutting line; the cutting line is used for carrying out discharge composite processing to obtain more sufficient cooling conditions, the heat damage is improved, the service life of the cutting line is prolonged, the wafer forming quality is improved, and the wafer heat stress is eliminated. The immersion cutting improves the discharging effect of the cutting line, the cutting fluid as a medium helps the discharging effect to realize, the bridge is easier to form, the discharging effect ratio is increased, and the advantages of the cutting line discharge combined machining are fully exerted.
Description
Technical Field
The application relates to the technical field of wire cutting, in particular to a combined machining method of a wire cutting machine.
Background
Processing efficiency and cutting quality are of major concern in the field of single/multiple wire diamond wire cutting. In order to improve the cutting efficiency, a material removing mode of superposing a diamond wire and discharge cutting is generally adopted at present, on the basis of diamond wire cutting, a high-frequency pulse power supply is connected to a workpiece and a tool to form a discharge loop, so that the diamond wire is discharged and removed as a cutting tool, based on the composite cutting mode, casting cutting is adopted for cooling and lubricating, for example, the temperature of a cutting area can be reduced to a certain extent through a nozzle and the cutting chips are washed away by adopting a traditional nozzle spraying and casting mode, but the wire diameter of the diamond wire is extremely fine, the wire diameter can be as low as 50 mu m in the aspect of multi-wire cutting, and the single wire can be cut to be less than 120 mu m. Therefore, the cutting slits are extremely small, the capability of the cutting fluid brought into the cutting area in the thin wire is limited, sufficient cooling and lubricating effects cannot be ensured, and particularly the lubricating capability of the cutting fluid is not fully exerted, so that the cutting quality and the machining efficiency are limited to a certain extent.
Disclosure of Invention
The embodiment of the application provides a combined machining method of a wire cutting machine, and aims to solve the problems that in an existing cutting device, the cutting fluid capacity of a diamond wire brought into a cutting area is insufficient, and the cooling and lubricating effects cannot be guaranteed.
In order to achieve the above purpose, the present application provides the following technical solutions:
the wire cutting machine comprises a liquid storage box, wherein cutting liquid with a discharge medium function is arranged in the liquid storage box; the method comprises the following steps: fixing a bar to be cut; controlling the cutting line to move at a preset linear speed; controlling the cutting line and the bar to be cut to move oppositely at a preset feeding speed, and immersing a part of the cutting line, which is in contact with the bar to be cut, into the cutting fluid in the cutting process; and respectively connecting and conducting the bar to be cut and the cutting line with a power supply, and performing grinding discharge composite cutting.
Compared with the prior art, the combined machining method of the wire cutting machine, which is provided by the embodiment of the application, has the following technical effects:
the linear cutting machine is provided with a liquid storage box, cutting fluid with a discharge medium function is arranged in the liquid storage box, the method controls a cutting line to move at a preset linear speed, and controls the cutting line and a bar to be cut to move oppositely at a preset feeding speed, the part of the cutting line, which is contacted with the bar to be cut, is immersed into the cutting fluid in the cutting process, the bar to be cut and the cutting line are respectively connected and conducted with a power supply to carry out grinding and discharging composite cutting, and the cutting fluid is driven to enter a cutting joint for internal cooling and lubrication by the movement of the cutting line in a mode of immersing the cutting line; meanwhile, when the cutting line is used for carrying out discharge composite processing, more sufficient cooling conditions can be obtained, the heat damage is improved, the service life of the cutting line is prolonged, the slicing quality of the wafer is improved, and the thermal stress of the wafer is eliminated. More importantly, the immersion cutting can improve the discharging effect of the cutting line, and as the actual injection amount of the cutting fluid in the seam is increased, the cutting fluid serving as a medium can help the discharging effect to be realized, so that an electric bridge is easier to form to increase the ratio of the discharging effect, and the advantage of the discharge composite machining of the cutting line is fully exerted; compared with a mode of directly pouring the steel wire into a working area by using a nozzle, the method has the advantages that the machining precision, the surface quality, the actual tension fluctuation of the diamond wire and the like are optimized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic flow chart of a composite processing method of a wire cutting machine according to an embodiment of the present disclosure;
fig. 2 is a schematic structural view of a wire cutting machine to which the composite processing method of the present application is applied according to the first embodiment;
fig. 3 is a schematic structural view of a wire cutting machine to which the composite working method of the present application is applied in a second embodiment;
fig. 4 is a schematic structural view of a wire cutting machine to which the composite working method of the present application is applied in a third embodiment;
fig. 5 is a schematic structural view of a wire cutting machine according to a fourth embodiment to which the composite processing method of the present application is applied;
fig. 6 is a schematic structural view of a wire cutting machine according to a fifth embodiment to which the composite processing method of the present application is applied.
The drawings are numbered as follows:
cutting roller 1, liquid storage box 2, earial drainage mouth 3, spray assembly 4, treat that cut bar 5, discharge device 6, cutting wheel 7, cutting line 8.
Detailed Description
The embodiment of the invention discloses a composite processing method of a wire cutting machine, which aims to solve the problems that in the existing cutting device, the cutting fluid capacity of a diamond wire brought into a cutting area is insufficient, and the cooling and lubricating effects cannot be guaranteed.
In order to make the technical solutions and advantages of the embodiments of the present application more apparent, the following further detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings makes it clear that the described embodiments are only a part of the embodiments of the present application, and are not exhaustive of all embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
Referring to fig. 1-6, fig. 1 is a schematic flow chart illustrating a composite processing method of a wire cutting machine according to an embodiment of the present disclosure; fig. 2 is a schematic structural view of a wire cutting machine to which the composite processing method of the present application is applied according to the first embodiment; fig. 3 is a schematic structural view of a wire cutting machine to which the composite working method of the present application is applied in a second embodiment; fig. 4 is a schematic structural view of a wire cutting machine to which the composite working method of the present application is applied in a third embodiment; fig. 5 is a schematic structural view of a wire cutting machine according to a fourth embodiment to which the composite processing method of the present application is applied; fig. 6 is a schematic structural view of a wire cutting machine according to a fifth embodiment to which the composite processing method of the present application is applied.
In a specific embodiment, the present application provides a combined machining method for a wire cutting machine, which may be applied to a wire cutting machine, such as a multi-wire cutting machine or a guillotine, where the wire cutting machine includes a liquid storage box, and a cutting fluid with a discharge medium function, such as a metal cutting fluid or other cutting fluids with a discharge medium function, in the liquid storage box, may be set according to the state of the art. The liquid storage box is generally a rectangular cavity, and the structure is simple and convenient to arrange; its length can be set up according to the length of waiting to cut the bar, and the stock solution box top has the opening in order to be used for waiting to cut the submergence of bar. Generally, the liquid storage box is filled with cutting liquid, so that the contact area between the liquid storage box and a bar to be cut is further increased, and the cooling effect is improved; the bottom of the liquid storage box is provided with a drainage port and a chip removal hole, the drainage port ensures that the cutting fluid in the liquid storage box flows in real time and can take away heat in time, and as can be understood, in order to enable the liquid storage box to be filled with a certain amount of cutting fluid, the situation that the part of a cutting line in a cutting area, which is in contact with a bar to be cut, is immersed into the cutting fluid in the cutting process is met, and the liquid inlet speed of the liquid storage box is higher than the liquid outlet speed; the liquid storage box is also used for collecting chips generated in the cutting process, and the chip removal holes are used for discharging the cutting chips generated in the cutting process. Specifically, the composite processing method comprises the following steps:
s10: fixing a bar to be cut;
the feeding assembly can be arranged to clamp and feed the bar to be cut, the bar to be cut can be a round bar or a square bar, and the bar to be cut can be arranged as required;
s20: controlling the cutting line to move at a preset linear speed;
s30: controlling the cutting line and the bar to be cut to move oppositely at a preset feeding speed, and immersing a part of the cutting line, which is in contact with the bar to be cut, into the cutting fluid in the cutting process;
the cutting line is preferably a diamond wire, the preset linear velocity can be set in cooperation with electrical parameters, and preferably, the preset linear velocity is 11-100m/s, preferably 11m/s, 50m/s or 100 m/s; the predetermined feed rate is 20-100mm/min, preferably 20mm/min, 50mm/min or 100 mm/min. The cutting line and the bar to be cut move towards each other at a preset feeding speed, for example, the cutting line can be controlled to move towards the direction of the bar to be cut, or the bar to be cut is controlled to move towards the direction of the cutting line, or the cutting line and the bar to be cut are respectively controlled to move towards each other, and the cutting line and the bar to be cut can be arranged according to the structure of the cutting machine; in the cutting process, the part, in contact with the bar to be cut, of the cutting line is immersed into the cutting fluid, it can be understood that the actual contact area of the diamond wire cutting workpiece is located below the liquid level of the cutting fluid in the liquid storage box, preferably, the whole part, in contact with the bar to be cut, of the cutting line is immersed into the cutting fluid, and the cutting fluid is driven to enter the cutting area through the movement of the diamond wire by means of the mode of immersing the cutting area, so that cooling and lubrication in the cutting area are achieved.
S40: and respectively connecting and conducting the bar to be cut and the cutting line with a power supply, and performing grinding discharge composite cutting.
Compared with the prior art, the combined machining method of the wire cutting machine, which is provided by the embodiment of the application, has the following technical effects:
the linear cutting machine is provided with a liquid storage box, cutting fluid with a discharge medium function is arranged in the liquid storage box, the method controls a cutting line to move at a preset linear speed, and controls the cutting line and a bar to be cut to move oppositely at a preset feeding speed, the part of the cutting line, which is contacted with the bar to be cut, is immersed into the cutting fluid in the cutting process, the bar to be cut and the cutting line are respectively connected and conducted with a power supply to carry out grinding and discharging composite cutting, and the cutting fluid is driven to enter a cutting joint for internal cooling and lubrication by the movement of the cutting line in a mode of immersing the cutting line; meanwhile, when the cutting line is used for carrying out discharge composite processing, more sufficient cooling conditions can be obtained, the heat damage is improved, the service life of the cutting line is prolonged, the slicing quality of the wafer is improved, and the thermal stress of the wafer is eliminated. More importantly, the immersion cutting can improve the discharging effect of the cutting line, and as the actual injection amount of the cutting fluid in the seam is increased, the cutting fluid serving as a medium can help the discharging effect to be realized, so that the action ratio of increasing the discharging effect due to easy formation of an electric bridge is compared with that of increasing the discharging effect, and the advantage of the discharge composite machining of the cutting line is fully exerted; compared with a mode of directly pouring the steel wire into a working area by using a nozzle, the method has the advantages that the machining precision, the surface quality, the actual tension fluctuation of the diamond wire and the like are optimized.
Specifically, the power supply is a high-frequency pulse power supply; the power supply has frequency of 3k-500kHz, such as 3kHz, 3.9kHz, 7.8kHz, 15.6kHz, … … and 500 kHz; the pulse width of the power supply is 2-256 μ s, such as 2 μ s, 4 μ s, 8 μ s, 16 μ s, 32 μ s, 64 μ s, 128 μ s, or 256 μ s; the pulse interval of the power supply is preferably 2-8 times the pulse width, the unit is the same as mu s, and the pulse interval can be 2 times, 3 times, 5 times or 8 times the pulse width. The current of the power supply is preferably 5-60A, the voltage of the power supply is 70-120V, and other current voltage values commonly used by high-frequency pulse power supplies can also be adopted. Compared with the prior single diamond wire grinding machining, the composite machining of the diamond wire combined with electric spark has the advantages that the efficiency is greatly improved, and the machining precision is also obviously improved; meanwhile, the machining allowance can be kept smaller; the tension stability of the diamond wire is better; the discharging function has self-sharpening function on the abrasive grains of the electroplated gold steel wire, and the cutting capability of the wire can be fully exerted. In the diamond wire combines electric spark combined machining process, the selection difference of discharge parameter has different degree influences to the processing effect, and is specific, and electric current, voltage increase can provide bigger energy, help the clearance, simultaneously, can be through improving the pulse width in order to improve the processing surface quality, then need match between the pulse setting between the pulse. The embodiment of the application obtains the efficient and high-quality composite cutting effect by reasonably setting parameters among current, voltage, pulse width and pulse.
S40 specifically includes:
and one of the bar to be cut and the cutting line is conducted with the anode of the power supply, and the other is conducted with the cathode of the power supply.
Preferably, conducting one of the bar to be cut and the cutting line with the positive electrode of the power supply, and conducting the other with the negative electrode of the power supply specifically includes:
and conducting the cut bar with the positive electrode of a power supply through an auxiliary electrode, and conducting the cut line with the negative electrode of the power supply through a conductive sliding block, a conductive wheel or the auxiliary electrode.
Preferably, the anode of the discharge device is connected with the bar to be cut, the cathode of the discharge device is connected with the cutting roller, the discharge device is taken as a high-frequency pulse power supply for illustration, the silicon rod (bar to be cut) is connected with the anode of the high-frequency pulse power supply through the connecting electrode, and the connecting electrode can be in an auxiliary electrode mode, or a direct connection electrode mode or a conductive adhesive mode, a silver paste mode or the like; the negative electrode of the high-frequency pulse power supply is connected with the diamond wire in a mode of utilizing a conductive sliding block, a conductive wheel or an auxiliary electrode and the like. Thereby forming a conductive loop of a tool pole and a workpiece pole between the diamond wire and the silicon rod, and realizing the discharge action between the tool and the workpiece by using high-frequency pulses provided by a power supply; after the electrode connection is finished, the high-frequency pulse power supply is started, the silicon rod moves to the diamond wire net from top to bottom, and after the silicon rod contacts the wire net, pulse discharge is formed between the diamond wire and the silicon rod, so that the material is etched by using energy generated by the discharge, and meanwhile, the abrasive particle cutting effect of the diamond wire provides more main material removal. Immersion cooling can provide a medium for the discharge and provide more adequate cooling and lubrication.
In the specific embodiment, the cutting fluid is water-based cutting fluid which has good cooling performance, is cheap and easy to obtain, and a machined workpiece is easy to clean, so that the cutting fluid is a common cutting fluid type in a high-speed cutting machining procedure, and can be set according to the development level of the prior art. And meanwhile, the water-based cutting fluid with better electrolysis effect under the condition of electrification is preferably selected, the discharge effect of electric spark cutting is further optimized, an electric bridge is easier to form, the action ratio of discharge is increased, and the advantage of discharge composite machining of the cutting line is fully exerted.
In one embodiment, the tension of the cutting line is 4.8N-200N, and particularly, 4.8N, 5N, 50N, 100N or 200N, and the tension of the cutting line can be set according to the electrical parameters so as to realize the grinding discharge composite cutting of the bar to be cut under the combined action of the electrical parameters and the electrical parameters.
In this embodiment, the composite processing method further includes:
s50: spraying cutting fluid to the intersection position of the bar to be cut and the cutting line by using a spraying assembly; when the cutting fluid of the fluid storage box can not be replenished, the cutting fluid is sprayed to the intersection position of the bar to be cut and the cutting line through the spraying assembly, and the intersection position of the bar to be cut and the cutting line is lubricated and cooled.
In another embodiment, the composite processing method further includes:
s60: and in the cutting process, the cutting fluid is supplemented into the liquid storage box at a preset liquid inlet speed. It can be understood that the liquid storage box is provided with a liquid outlet and a chip removal hole, and the preset liquid inlet speed in the liquid storage box is higher than the liquid outlet speed, so that a certain amount of cutting liquid is stored in the liquid storage box, and the cutting liquid can immerse the part of the cutting line, which is in contact with the bar to be cut, in the cutting process. Specifically, the preset liquid inlet speed can be set according to the requirement, and is not described herein again.
The composite machining method provided by the application can be applied to a wire cutting machine, and as an optional embodiment, the wire cutting machine applying the machining method comprises at least two cutting rollers/cutting wheels, a liquid storage box and a discharging device which are oppositely arranged.
As shown in fig. 2, it can be understood that, in the first embodiment, the wire cutting machine may be a multi-wire cutting machine, which includes two oppositely disposed cutting rollers, a liquid storage box is disposed between the two cutting rollers and below the cutting line of the cutting area, and meanwhile, each cutting roller is connected to a guide wheel, a tension mechanism, a wire arranging mechanism and a wire roller to realize multi-wire cutting, and the specific structure and the disposition position thereof may be set as required.
As shown in fig. 3, in the second embodiment, the wire cutting machine is a circular diamond wire cutting machine, which includes two cutting wheels and two guide wheels arranged oppositely, the two cutting wheels and the two guide wheels form four supporting points, and diamond wires are respectively wound around the peripheries of the two guide wheels and the two guide wheels; in the vertical direction, the two cutting wheels are positioned below, and the two guide wheels are correspondingly positioned above the cutting wheels; the liquid storage box is positioned below a cutting area formed by the two cutting wheels, and the silicon rod can be cut by feeding the cutting wheels.
As shown in fig. 4, in the third embodiment, the wire cutting machine is a single wire cutting machine, which comprises two cutting wheels arranged oppositely, three guide wheels and a wire storage roller, wherein the wire storage roller and the cutting wheel set are arranged at two ends in the horizontal direction, the two cutting wheels arranged oppositely are arranged along the vertical direction, two guide wheels are arranged between the wire storage roller and the cutting wheel arranged above the wire storage roller, and a weight is arranged between the two guide wheels to ensure the tension of the cutting wire; another guide wheel is arranged between the wire storage roller and the cutting wheel positioned below the wire storage roller, and the specific structure of the guide wheel can be arranged according to the requirement.
As shown in fig. 5, in the fourth embodiment, the wire cutting machine is a reciprocating single-wire cutting machine, which comprises two cutting wheels arranged oppositely, and one side of each cutting wheel is respectively connected with a guide wheel, a tension mechanism, a wire arranging wheel and a wire roller; as shown in fig. 6, in a fifth embodiment, the wire cutting machine is a circular wire cutting machine, which includes two cutting wheels and two guide wheels, wherein the two cutting wheels are located at two ends in the vertical direction, the two guide wheels are respectively located at the other ends of the cutting wheels along the horizontal direction to form a four-point annular structure, the cutting wires are respectively located at the peripheries of the two guide wheels and the two cutting wheels, and a liquid storage box is arranged between the two cutting wheels.
The diamond wire discharge composite processing under the immersion type cooling condition can obtain more sufficient cooling condition, improve the heat damage, prolong the service life of the diamond wire, improve the slicing quality of the wafer and eliminate the thermal stress of the wafer. Meanwhile, more importantly, the immersion cutting can improve the discharge effect of the diamond wire, the cutting fluid serving as a medium can help the discharge effect to be realized due to the fact that the actual injection amount of the cutting fluid in the wire gap is increased, the proportion of the cutting fluid to the effect of increasing discharge due to the fact that a bridge is easily formed is increased, and the advantage of the diamond wire discharge composite machining is fully played.
The wire cutting machine is used for cutting a circular silicon rod; meanwhile, the cutting tool is also suitable for cutting other hard and brittle materials such as semiconductors and conductors; and other non-hard and brittle materials. The wire cutting machine can obtain similar effects when cutting by using the processing method, such as 1) the surface roughness quality is better; 2) the processing precision is higher; 3) the discharge effect is enhanced, and the cutting efficiency is higher; 4) the lubricating and cooling effects are better, the wire consumption of the diamond wire is lower, and the damage of the finished product is reduced.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (11)
1. The composite processing method of the wire cutting machine is characterized in that the wire cutting machine comprises a liquid storage box, wherein cutting liquid with a discharge medium function is arranged in the liquid storage box; the method comprises the following steps:
fixing a bar to be cut;
controlling the cutting line to move at a preset linear speed;
controlling the cutting line and the bar to be cut to move oppositely at a preset feeding speed, and immersing a part of the cutting line, which is in contact with the bar to be cut, into the cutting fluid in the cutting process;
and respectively connecting and conducting the bar to be cut and the cutting line with a power supply, and performing grinding discharge composite cutting.
2. The composite working method of a wire electric discharge machine according to claim 1, wherein the power source is a high-frequency pulse power source.
3. The composite working method of a wire electric discharge machine according to claim 2, wherein the frequency of the power source is 3k to 500 kHz.
4. The combined machining method of a wire electric discharge machine according to claim 2, wherein the pulse width of the power source is 2 to 256 μ s and the pulse interval of the power source is 2 to 8 times the pulse width.
5. The combined machining method of a wire cutting machine according to claim 1, wherein the current of the power supply is 5 to 60A, and the voltage of the power supply is 70 to 120V.
6. The combined machining method for a wire cutting machine according to claim 1, characterized in that the cutting fluid is a water-based cutting fluid.
7. The combined machining method of the wire cutting machine according to claim 1, wherein the bar to be cut and the cutting wire are respectively connected and conducted with a power supply, and the performing of the grinding discharge combined cutting specifically comprises:
and conducting one of the bar to be cut and the cutting line with the positive pole of the power supply, and conducting the other one with the negative pole of the power supply.
8. The combined machining method of the wire cutting machine according to claim 7, wherein the conducting of one of the bar to be cut and the cutting wire with the positive electrode of the power supply and the other conducting with the negative electrode of the power supply specifically comprises:
and conducting the cut bar with the positive electrode of the power supply through the auxiliary electrode, and conducting the cutting line with the negative electrode of the power supply through the conductive sliding block, the conductive wheel or the auxiliary electrode.
9. The composite working method of a wire cutting machine according to claim 1, wherein the tension of the cutting wire is 4.8 to 200N.
10. The composite working method of a wire cutting machine according to claim 1, characterized by further comprising:
and spraying cutting fluid to the intersection position of the bar to be cut and the cutting line by using a spraying assembly.
11. The composite working method of a wire cutting machine according to claim 1, characterized by further comprising:
and in the cutting process, the cutting fluid is supplemented into the liquid storage box at a preset liquid inlet speed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210764247.5A CN114953229A (en) | 2022-06-30 | 2022-06-30 | Composite processing method of wire cutting machine |
Applications Claiming Priority (1)
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