CN211074274U - Diamond multi-wire electric spark discharge cutting wire cutting device - Google Patents
Diamond multi-wire electric spark discharge cutting wire cutting device Download PDFInfo
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- CN211074274U CN211074274U CN201921707156.8U CN201921707156U CN211074274U CN 211074274 U CN211074274 U CN 211074274U CN 201921707156 U CN201921707156 U CN 201921707156U CN 211074274 U CN211074274 U CN 211074274U
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Abstract
The utility model relates to a diamond multi-wire electric spark discharge cutting wire cutting device, which comprises a cutting device main body, one side of the middle part of the cutting device main body is provided with a first cutting roller, one side of the first cutting roller is provided with a second cutting roller, the front end of the first cutting roller is provided with a first driving main shaft, the front end of the second cutting roller is provided with a second driving main shaft, the outer surface of the rear end of the first cutting roller is provided with a first driven main shaft, the utility model combines the fixed abrasive diamond wire saw with the electrospark wire cutting, and then the diamond wire saw electric spark composite processing is generated, the processing efficiency of the diamond multi-wire cutting photovoltaic silicon wafer is further improved, the processing cost is reduced, and aiming at the processing quality problems of micro cracks and the like on the processing surface of the semiconductor silicon wafer processed by the diamond multi-wire cutting, the quality improvement of the processing surface is realized by adding the electric spark discharge processing on the basis of the diamond multi-wire cutting.
Description
Technical Field
The utility model belongs to the technical field of the diamond-cutting, specifically speaking relates to multi-line electric spark of diamond wire-electrode cutting device that cuts that discharges.
Background
Diamond is commonly called "diamond" and is the original body of diamond, which is a mineral composed of carbon elements and is an allotrope of carbon elements. Diamond is the hardest naturally occurring substance in nature and is used in a wide variety of applications, for example: artware, cutting tools in industry. Graphite can be formed into synthetic diamond and precious stone at high temperature and high pressure, and because of the highest hardness, diamond cutting and machining must be performed using diamond powder or laser (such as 532nm or 1064nm wavelength laser), the density of diamond is 3.52g/cm, the refractive index is 2.417 (at 500 nm light wave), and the dispersion is 0.044.
In the actual use process, the diamond multi-wire electric spark discharge cutting wire cutting device can realize the following operations: the processing efficiency of the photovoltaic silicon wafer by diamond multi-wire cutting can be further improved, the processing cost is reduced, and the photovoltaic silicon wafer is compositely processed by the electric spark diamond wire by combining the traditional electric spark discharge processing and the diamond multi-wire cutting technology; aiming at the processing quality problems of microcracks and the like on the processing surface of a semiconductor silicon wafer processed by diamond wire multi-wire cutting, the quality of the processing surface is improved by adding electric spark discharge processing on the basis of diamond wire multi-wire cutting, so that the method provides help for the popularization and the application of the method in the semiconductor industry, and finally the whole operation is more efficient and convenient.
Although the existing diamond multi-wire electric spark discharge cutting wire cutting device is simple in structure and convenient to operate, the device is single in function, the single machining mode causes low actual use efficiency, microcracks are prone to occurring on the machined surface of a semiconductor silicon wafer, and further the overall machining process level is difficult to improve.
SUMMERY OF THE UTILITY MODEL
Aiming at various defects in the prior art, the diamond multi-wire electric spark discharge cutting wire cutting device is provided, and the problems in the background technology can be effectively solved.
In order to achieve the above object, the utility model provides a following technical scheme:
the multi-wire electric spark discharge cutting line cutting device of diamond, including the cutting device main part, middle part one side of cutting device main part is provided with a cutting roller No. one, one side of a cutting roller is provided with No. two cutting rollers, the front end of a cutting roller is provided with the initiative main shaft No. one, the front end of No. two cutting rollers is provided with the initiative main shaft No. two, the rear end surface of a cutting roller is provided with driven main shaft No. one, the rear end surface of No. two cutting rollers is provided with driven main shaft No. two, the upper end middle part surface of cutting device main part is provided with P type silicon rod.
Preferably, a power feeding roller is arranged between the first cutting roller and the diamond wire net, and one side of the P-type silicon rod is fixedly connected with one side of the positive electrode of the pulse power supply through power feeding metal.
Preferably, the P-type silicon rod and the silicon rod sticking plate are connected in a sticking manner through a resin plate, and a connecting hole is formed in the outer surface of the upper end of the silicon rod sticking plate.
Preferably, the front end and the rear end of the first driving main shaft and the second driving main shaft are both provided with a connecting flange.
Preferably, the first driving main shaft is located on one side of the second driving main shaft, and the first driven main shaft is located on one side of the second driven main shaft.
Preferably, a negative electrode wire feeding line is arranged on one side of the lower end of the cutting device main body, a positive electrode wire feeding line is arranged between the P-type silicon rod and the pulse power supply, a diamond wire net is arranged at the upper end of the negative electrode wire feeding line, the number of the negative electrode wire feeding lines is two, and the two sets of negative electrode wire feeding lines are respectively located on two sides of the lower end of the cutting device main body and are of symmetrical structures.
Preferably, a silicon rod sticking plate is arranged at the upper end of the P-type silicon rod, and the pulse power supply supplies power to the electric brush through a negative pole power inlet wire.
The utility model has the advantages that:
1. compared with a diamond wire multi-wire cutting machine tool, the utility model has the advantages that the fixed abrasive diamond wire saw and the electric spark wire cutting are combined machining of the diamond wire saw and the electric spark wire, the electric discharge machining can reduce scratches on the surface of the silicon wafer, surface microcracks generated on the surface of the silicon wafer by the diamond wire cutting are avoided, the surface quality is improved, the cutting force of the diamond wire cutting is reduced, the abrasion of the diamond wire is reduced, the residual of carbon elements is inhibited, and the machining efficiency is higher; the silicon material can be subjected to discharge machining on the basis of a mechanical grinding removal mode; the added auxiliary electricity feeding roller realizes the electricity feeding of the diamond wire mesh, and simultaneously, silicon materials with larger diameters can be cut in space; etching action of the electric discharge machining forms more uniform pits on scratches of the diamond wire, and the machining quality is better than that obtained by a diamond wire cutting machine; in the application field, the conventional diamond wire cutting machine tool is generally applied to the application field of photovoltaic silicon wafers with low requirements on surface quality, but the diamond wire cutting machine tool is difficult to meet the requirements in the fields with obvious requirements on processing quality, such as semiconductor slices, cannot be popularized and applied, has higher processing quality, and is more suitable for the field of semiconductor slices.
2. Compared with an electric spark multi-wire cutting machine tool, the utility model can improve the material removal rate, and simultaneously, the mechanical grinding removes the heat affected zone remained by electric spark discharge, thereby improving the processing quality and the material surface performance; compared with electric spark multi-wire cutting equipment, the material removal rate and the machining efficiency are greatly increased; the concentrated section of a thousand kerfs of big load capacity can't be realized to spark-erosion wire cutting, can solve the unable multi-thread cutting efficiency that realizes of electrical discharge machining and promote, compares in traditional spark-erosion wire cutting, no matter is at single line cutting efficiency or increase multi-thread function and can improve cutting efficiency by a wide margin, compares in the multi-thread cutting of diamond, assists spark-erosion discharge machining on this basis, improves machining efficiency to a certain extent.
3. Compared with the electrostatic adsorption free abrasive machining equipment, the diamond wire cutting machine has higher machining efficiency than the free abrasive, less abrasive loss and longer service life of the cutting wire; different from the situation that the discharge adsorption abrasive enters the cutting area, the diamond wire directly enters the cutting area to be mechanically removed and electrically etched under the discharge action, the efficiency of cutting the silicon wafer can be obviously improved, the width of a cut can be reduced, and the cutting cost is reduced.
4. Compared with the wire cut electric discharge machining equipment for replacing the diamond wire, the wire cut electric discharge machining equipment has the advantages that the mechanical cutting action of the diamond wire is the main removing mode, and the machining efficiency is higher; the cutting machine tool is additionally provided with the discharge machining device on the basis of the diamond wire cutting machine tool, and compared with an electric spark machine tool, the machining equipment has more outstanding performance of replacing diamond wires, and has higher rigidity and higher precision; for the diamond multi-wire cutting machine tool, the number of wire meshes can be obviously increased, and the cutting efficiency is further improved.
Drawings
Fig. 1 is a schematic view of the overall structure of the multi-thread mechanism of the present invention;
fig. 2 is a schematic view of multi-line composite processing of the spark diamond wire according to the present invention;
FIG. 3 is a schematic diagram of diamond wire cutting;
FIG. 4 is a schematic view of wire electric discharge machining;
FIG. 5 is an enlarged view of the driving spindle of the present invention;
FIG. 6 is an enlarged view of the silicon rod sticking plate of the present invention;
in the figure: 1. a first cutting roller; 2. a P-type silicon rod; 3. sticking the silicon rod on a plate; 4. a first driven main shaft; 5. a pulse power supply; 6. a second driven main shaft; 7. a first driving main shaft; 8. a second driving main shaft; 9. a power feeding roller; 10. a second cutting roller; 11. a diamond wire mesh; 12. a positive electrode wire feeding; 13. a negative electrode wire inlet; 14. a cutting device body.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following description, together with the drawings of the present invention, clearly and completely describes the technical solution of the present invention, and based on the embodiments in the present application, other similar embodiments obtained by those skilled in the art without creative efforts shall all belong to the protection scope of the present application. In addition, directional terms such as "upper", "lower", "left", "right", etc. in the following embodiments are directions with reference to the drawings only, and thus, the directional terms are used for illustrating the present invention and not for limiting the present invention.
The present invention will be further described with reference to the accompanying drawings and preferred embodiments.
As shown in fig. 1, the principle of diamond wire electric spark multi-wire cutting is shown in fig. 1, a first cutting roller 1 is arranged on one side of the middle of a cutting device main body 14, a second cutting roller 10 is arranged on one side of the first cutting roller 1, a first driving main shaft 7 is arranged at the front end of the first cutting roller 1, a second driving main shaft 8 is arranged at the front end of the second cutting roller 10, a first driven main shaft 4 is arranged on the outer surface of the rear end of the first cutting roller 1, a second driven main shaft 6 is arranged on the outer surface of the rear end of the second cutting roller 10, a P-type silicon rod 2 is arranged on the outer surface of the middle of the upper end of the cutting device main body 14, a pulse power supply is connected to a silicon material and a diamond wire on the basis of a diamond wire cutting machine, a mode of removing materials by electric spark discharge machining is added on the basis of a diamond wire grinding mode, a diamond wire is initially wound, the silicon material is wound on the two processing rollers and then wound on the take-up and pay-off roller through the guide wheel, the tension wheel and the wire arrangement wheel, a workpiece is connected to the positive electrode of a negative electrode wire inlet 13 of a pulse power supply through a positive electrode wire inlet 12, a diamond wire is connected to the negative electrode of the pulse power supply through the negative electrode wire inlet 13 and reciprocates, and a wire mesh formed between the processing rollers cuts the silicon material into silicon chips in a grinding mode and an electric discharge processing mode.
As shown in fig. 3, the diamond wire is firstly wound on the take-up and pay-off wheel, is wound on the two processing rollers through the wire arrangement wheel, the tension wheel and the guide wheel, is finally wound on the take-up and pay-off wheel through the guide wheel, the tension wheel and the wire arrangement wheel, reciprocates, and a cutting wire net formed between the processing rollers and the processing rollers cuts the silicon material into silicon chips in a grinding mode.
As shown in figure 4, the aim of processing is achieved by utilizing instantaneous high temperature generated by pulse spark discharge between a reciprocating molybdenum wire or a single-wire moving copper wire and a workpiece to achieve the purpose of removing silicon material local air flow, melting or brittle collapse caused by thermal stress.
The utility model discloses a combination of diamond multi-wire cutting and electrical discharge machining, increase the electrical discharge machining device on original diamond multi-wire cutting basis, compare with diamond wire multi-wire cutting machine, increased the spark discharge erosion removal mode on the basis of diamond wire multi-wire cutting grinding removal mode, promote machining efficiency, combined machining tool has increased the spark discharge device on the basis of diamond wire multi-wire cutting equipment, including pulse power supply, advance electric installation etc. structurally, the supplementary roller that advances electric, adopt three-roller structure, the machined surface comprises diamond cutting mar and discharge etching pit, the precision and the quality that obtain after using are higher; in the application field, the diamond wire cutting technology and the machine tool are more suitable for semiconductor slicing. Compared with the traditional electric spark multi-wire cutting machine tool, the mechanical grinding removal mode is added on the basis of the mode of removing silicon materials by electric spark discharge erosion, the material removal modes are different, and the cutting efficiency of the diamond wire cutting technology integrating electric discharge machining is higher; the machine tool is also different from an electric spark machine tool, compared with the electric spark wire cutting, a multi-wire cutting mechanism is added, the form of the machine tool is also greatly changed, and the number of wire meshes of cutting equipment is obviously increased; compared with the electrostatic adsorption free abrasive processing equipment, the device is different from the operation of bringing the free abrasive into a processing area by utilizing the electrostatic adsorption; the utility model realizes the wire cut electrical discharge machining by utilizing the electrical discharge machining, and removes materials by utilizing two machining modes of diamond wire grinding and electrical discharge pulse etching, thereby improving the cutting effect; compare with the spark-erosion wire cutting equipment who changes the diamond wire, be different from spark-erosion wire cutting machine to change the spark-erosion wire cutting machine of diamond wire, with diamond wire cutting removal mode as the owner, supplementary application discharge machining, realize the dual removal of material, and simultaneously, increase pulse discharge machining device on the basis of diamond multi-wire saw lathe, form brand-new diamond multi-wire saw spark-erosion machining equipment, and on its basis and simplify the lathe structure after improving the function, make compact structure, can obtain better processingquality when realizing high-efficient cutting, provide help for its popularization and application in the semiconductor industry, finally make holistic operation more high-efficient, convenient.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, i.e. the present invention is intended to cover all equivalent variations and modifications within the scope of the present invention.
Claims (7)
1. Multi-wire electric spark of diamond spark cutting wire cutting device, including cutting device main part (14), its characterized in that: middle part one side of cutting device main part (14) is provided with cutting roller (1) No. one, one side of cutting roller (1) is provided with No. two cutting rollers (10), the front end of cutting roller (1) is provided with initiative main shaft (7) No. one, the front end of No. two cutting rollers (10) is provided with initiative main shaft (8) No. two, the rear end surface of cutting roller (1) is provided with driven main shaft (4) No. one, the rear end surface of No. two cutting rollers (10) is provided with driven main shaft (6) No. two, the upper end middle part surface of cutting device main part (14) is provided with P type silicon rod (2).
2. The diamond multi-wire electric spark discharge cutting wire cutting device according to claim 1, wherein: an electricity feeding roller (9) is arranged between the first cutting roller (1) and the diamond wire net (11), and one side of the P-shaped silicon rod (2) is fixedly connected with one side of the positive electrode of the pulse power supply (5) through electricity feeding metal.
3. The diamond multi-wire electric spark discharge cutting wire cutting device according to claim 1, wherein: the P-type silicon rod (2) is connected with the silicon rod sticking plate (3) in a sticking mode through the resin plate, and the outer surface of the upper end of the silicon rod sticking plate (3) is provided with a connecting hole.
4. The diamond multi-wire electric spark discharge cutting wire cutting device according to claim 1, wherein: and the front end and the rear end of the first driving main shaft (7) and the second driving main shaft (8) are both provided with a connecting flange.
5. The diamond multi-wire electric spark discharge cutting wire cutting device according to claim 1, wherein: the first driving main shaft (7) is located on one side of the second driving main shaft, and the first driven main shaft (4) is located on one side of the second driven main shaft (6).
6. The diamond multi-wire electric spark discharge cutting wire cutting device according to claim 2, wherein: the utility model discloses a cutting device, including cutting device main part (14), the lower extreme one side of cutting device main part (14) is provided with negative pole and advances electric wire (13), be provided with between P type silicon rod (2) and pulse power supply (5) anodal electric wire (12) of advancing, the upper end that the electric wire (13) was advanced to the negative pole is provided with buddha's warrior attendant gauze (11), the quantity that electric wire (13) were advanced to the negative pole is two sets of, and two sets of negative poles advance electric wire (13) and are located cutting device main part (.
7. The diamond multi-wire electric spark discharge cutting wire cutting device according to claim 6, wherein: the upper end of the P-type silicon rod (2) is provided with a silicon rod sticking plate (3), and the pulse power supply (5) supplies power to the electric brush through a negative pole power inlet wire (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921707156.8U CN211074274U (en) | 2019-10-12 | 2019-10-12 | Diamond multi-wire electric spark discharge cutting wire cutting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921707156.8U CN211074274U (en) | 2019-10-12 | 2019-10-12 | Diamond multi-wire electric spark discharge cutting wire cutting device |
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| CN211074274U true CN211074274U (en) | 2020-07-24 |
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| CN201921707156.8U Active CN211074274U (en) | 2019-10-12 | 2019-10-12 | Diamond multi-wire electric spark discharge cutting wire cutting device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110587840A (en) * | 2019-10-12 | 2019-12-20 | 青岛高测科技股份有限公司 | Diamond multi-wire electric spark discharge cutting method and wire cutting device |
| WO2023232020A1 (en) * | 2022-05-31 | 2023-12-07 | 青岛高测科技股份有限公司 | Cutting device |
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2019
- 2019-10-12 CN CN201921707156.8U patent/CN211074274U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110587840A (en) * | 2019-10-12 | 2019-12-20 | 青岛高测科技股份有限公司 | Diamond multi-wire electric spark discharge cutting method and wire cutting device |
| WO2023232020A1 (en) * | 2022-05-31 | 2023-12-07 | 青岛高测科技股份有限公司 | Cutting device |
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