CN212342576U - 一种晶圆分片分离机构 - Google Patents
一种晶圆分片分离机构 Download PDFInfo
- Publication number
- CN212342576U CN212342576U CN202021051720.8U CN202021051720U CN212342576U CN 212342576 U CN212342576 U CN 212342576U CN 202021051720 U CN202021051720 U CN 202021051720U CN 212342576 U CN212342576 U CN 212342576U
- Authority
- CN
- China
- Prior art keywords
- wafer
- separating
- slicing
- separation
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 104
- 235000012431 wafers Nutrition 0.000 claims abstract description 367
- 238000000926 separation method Methods 0.000 claims abstract description 50
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 73
- 230000005540 biological transmission Effects 0.000 claims description 32
- 238000009434 installation Methods 0.000 claims description 31
- 238000002955 isolation Methods 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 22
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 12
- 239000007921 spray Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000013467 fragmentation Methods 0.000 description 4
- 238000006062 fragmentation reaction Methods 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000013016 damping Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021051720.8U CN212342576U (zh) | 2020-06-10 | 2020-06-10 | 一种晶圆分片分离机构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021051720.8U CN212342576U (zh) | 2020-06-10 | 2020-06-10 | 一种晶圆分片分离机构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN212342576U true CN212342576U (zh) | 2021-01-12 |
Family
ID=74077030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202021051720.8U Active CN212342576U (zh) | 2020-06-10 | 2020-06-10 | 一种晶圆分片分离机构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN212342576U (zh) |
-
2020
- 2020-06-10 CN CN202021051720.8U patent/CN212342576U/zh active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100622412B1 (ko) | 트레이 이송장치 | |
CN212342576U (zh) | 一种晶圆分片分离机构 | |
CN212342577U (zh) | 一种湿法分片装置 | |
CN209615885U (zh) | 机械手一体化搬运、施釉系统 | |
CN212322972U (zh) | 一种晶圆湿法分片用料框 | |
CN211455663U (zh) | 一种wafer自动切换机构 | |
JP2011219356A (ja) | 板ガラス搬送装置 | |
CN108782655A (zh) | 一种三明治蛋糕的制备方法 | |
CN219602509U (zh) | 翻转机构及输送装置 | |
CN219286433U (zh) | 一种电池片分片设备 | |
CN210364603U (zh) | 一种纸托吸附装置 | |
CN111282781A (zh) | 物料输送装置和具有该物料输送装置的并线点胶机器人 | |
CN108651569A (zh) | 一种蛋糕自动涂奶油的加工机构 | |
CN216686469U (zh) | 一种半自动扩晶机用具辅助上料机构 | |
CN214493501U (zh) | 一种电池自动装配装置 | |
CN211077668U (zh) | 一种用于板材转向输送的气浮台装置 | |
CN210854139U (zh) | 一种鼠标组装流水线 | |
CN107968063A (zh) | 硅片水下自动上料装置 | |
CN221304592U (zh) | 一款晶圆自动分片机构 | |
CN108684776A (zh) | 一种蛋糕自动分切的加工机构 | |
CN218571366U (zh) | 一种豆腐乳加工的腌制设备 | |
CN220884907U (zh) | 一种包装盖抓取装置 | |
CN218592985U (zh) | 一种全自动切片取料机器人 | |
CN211743112U (zh) | 一种硅片抽放定位装置及转送系统 | |
CN219603457U (zh) | 一种玻璃切割装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: No.12 Haitai East Road, Huayuan Industrial Zone, Binhai New Area, Tianjin Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. |