CN212324074U - Packaging device for controlling internal water vapor content - Google Patents
Packaging device for controlling internal water vapor content Download PDFInfo
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- CN212324074U CN212324074U CN202021444823.0U CN202021444823U CN212324074U CN 212324074 U CN212324074 U CN 212324074U CN 202021444823 U CN202021444823 U CN 202021444823U CN 212324074 U CN212324074 U CN 212324074U
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Abstract
The utility model belongs to the technical field of a preparation device of a surface-mounted crystal oscillator for communication, and discloses a packaging device for controlling the internal water vapor content, which is provided with a packaging base, wherein a wafer, an IC integrated circuit and a metal leading-out terminal are bonded on the packaging base; and an upper cover is arranged on the outer sides of the wafer, the IC integrated circuit and the metal leading-out end. A packaging hardware for controlling inside steam content adopts parallel seal welding, welds through the resistance welding that adopts becket and metal cover, and hardly there is the heat to produce the influence to crystal oscillator during seal welding. By controlling the gas adsorption and the mass adsorption and determining the parameters of the nitrogen dew point and the vacuumizing and nitrogen filling circulation, the reliability and the long-term working stability of the oscillator can be ensured. The adjustment parameters of the pressure relay and the electrical setting data are solidified, and the sealing performance of sealing welding can be effectively guaranteed.
Description
Technical Field
The utility model belongs to the technical field of surface mounted crystal oscillator preparation facilities is used in the communication, especially, relate to an packaging hardware for controlling inside steam content.
Background
At present, the existing packaging mode is laser sealing, the laser sealing can generate redundant gas, and the frequency stability and the long-term working reliability of the oscillator are influenced to a greater or lesser extent although the vacuum pump exhausts the gas.
Through the above analysis, the problems and defects of the prior art are as follows:
the laser sealing welding can generate redundant gas, if the phenomena of gas adsorption and release exist, the surface-mounted crystal oscillator can repeat and go erratically along with the change of the environmental temperature, the humidity and the like, and the phenomena of irregular frequency change, poor high-low temperature performance, frequency jump at a certain temperature point and the like can be caused; the evaporation metal film can generate oxidation phenomenon in the sealing and welding process, the oxidation causes the evaporation metal film to be corroded and damaged to become loose in structure, the repeated change of surface tension is aggravated, the aging characteristic of the crystal oscillator is finally poor, and the reliability is reduced.
The difficulty and significance for solving the problems and defects are as follows:
the sealing welding process is a key technology of long-term working reliability of the surface-mounted crystal oscillator, and a parallel sealing welding method is adopted, so that frequency aging can be effectively solved, and the sealing performance and the long-term working stability of the crystal oscillator are improved.
The parallel sealing and welding process can basically eliminate adsorption and release of gas containing impurities and water vapor, ensure the sealing property of a product, improve the precision of the surface-mounted crystal oscillator, almost no heat influences the crystal oscillator during sealing and welding, and the crystal oscillator is positioned in a cavity sealed by dry and clean gas in the sealing and welding process, so that the aging rate of the crystal oscillator can be greatly reduced.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems existing in the prior art, the utility model provides a packaging hardware for controlling inside steam content.
The utility model is realized in such a way that a packaging device for controlling the internal water vapor content is provided with a packaging base, and a wafer, an IC integrated circuit and a metal leading-out terminal are bonded on the packaging base; and an upper cover is arranged on the outer sides of the wafer, the IC integrated circuit and the metal leading-out end.
Further, the packaging base is a ceramic packaging base.
Further, the encapsulation base is provided with silver solder layer, the bottom of silver solder layer is provided with kovar ring, metallic coating, ceramic ring, ceramic substrate have set gradually on the upper strata of silver solder layer.
Furthermore, the IC integrated circuit is composed of a crystal oscillation circuit, a pulse synthesis and control circuit and an output buffer.
Further, the upper cover adopts a metal kovar cover.
Further, the packaging method adopts parallel seal welding, and the crystal oscillator is hardly affected by heat during seal welding through resistance welding of the metal ring and the metal cover.
Combine foretell all technical scheme, the utility model discloses the advantage that possesses and positive effect are:
first, a packaging device for controlling the content of water vapor inside employs parallel seal welding, and by employing resistance welding of a metal ring and a metal cap, almost no heat affects the crystal oscillator during seal welding.
Secondly, the reliability and the stability of long-term operation of the crystal oscillator can be ensured by controlling gas adsorption and mass adsorption and determining the parameters of a nitrogen dew point and a vacuumizing and nitrogen filling cycle.
Thirdly, the adjustment parameters of the pressure relay and the electrical setting data are solidified, and the sealing performance of the sealing welding is effectively guaranteed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained from the drawings without creative efforts.
Fig. 1 is a diagram of a package base of a surface mount crystal oscillator according to an embodiment of the present invention.
Fig. 2 is a structural diagram of a surface mount crystal oscillator according to an embodiment of the present invention.
In the figure: 1. an upper cover; 2. a kovar ring; 3. a wafer; 4. a silver solder layer; 5. a metal coating; 6. an IC integrated circuit; 7. a ceramic ring; 8. a ceramic substrate; 9. and a metal leading-out terminal.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
To the problem that prior art exists, the utility model provides a packaging hardware for controlling inside steam content, it is right to combine the figure below the utility model discloses do detailed description.
And bonding the wafer 3, the IC 6 and the metal leading-out end 9 to a ceramic packaging base to form a product to be sealed and welded, wherein the wafer generates corresponding electric signals by utilizing the inverse piezoelectric effect, the electric signals are acquired and processed by the IC to form stable required frequency signals, and finally, the product to be sealed and welded and the upper cover 1 are sealed and welded together by adopting a parallel sealing and welding process to form the surface-mounted crystal oscillator with a certain size.
The packaging base is a ceramic packaging base and consists of a kovar ring 2, a silver soldering layer 4, a metal coating 5, a ceramic ring 7 and a ceramic substrate 8.
The IC integrated circuit 6 is composed of a crystal oscillation circuit, a pulse synthesis and control circuit and an output buffer, and can reduce power loss and crystal drive current.
The main factors influencing the water vapor content in the surface mount crystal oscillator have two aspects: 1. the high temperature and high humidity of the environment in the operation box can cause the water vapor content in the packaged oscillator to be high; 2. the crystal oscillator has poor sealing performance, so that the packaged product has water vapor again.
The packaging device makes the following measures in the sealing and welding process: 1. the index for ensuring fine leak detection is controlled to be 1 x 10- 9Pam3/s, optimizing the technological parameters of sealing, familiarizing with the sealing conditions of the shell and the base, and regularly polishing and finishing the sealing clamp and the electrode; 2. placing the product to be sealed and welded into a dehumidification cabinet for dehumidification, controlling the humidity to be 0-3%, and standing for 24 hours; 3. taking out the product from the dehumidification cabinet, putting the product into a cabin to be sealed and welded, and filling 99.999% of high-purity nitrogen for dehumidification, and circulating for 3 times; 4. the positive pressure is maintained in the operation box by using 99.999 percent of liquid nitrogen pressure, and the dew point of the nitrogen gas during sealing welding is controlled below minus 40 ℃.
The packaging structure consists of a packaging base, a wafer, an IC integrated circuit and an upper cover, wherein the packaging base consists of a kovar ring, a silver welding layer, a metal coating, a ceramic ring and a ceramic substrate; the wafer is a resonance piece which reaches a design frequency value after being subjected to cleaning corrosion, vacuum coating, loading, dispensing, curing, frequency fine tuning and vacuum annealing; the IC integrated circuit consists of a crystal oscillation circuit, a pulse synthesis and control circuit and an output buffer; the upper cover is a metal kovar cover.
The packaging base adopts a ceramic packaging base and consists of a kovar ring 2, a silver soldering layer 4, a metal coating 5, a ceramic ring 7 and a ceramic substrate 8, and the packaging base has the advantages of small size, excellent sealing performance and good reflow soldering resistance, and has the defects of complex metal ring structure, high cost and weaker batch production capacity.
The IC integrated circuit is composed of a crystal oscillation circuit, a pulse synthesis and control circuit and an output buffer, power loss and crystal driving current can be reduced, the crystal oscillation circuit is controlled by a crystal or an external clock, when the oscillator circuit starts to work and reaches a stable state, the circuit is in a default output state, the pulse synthesis and control circuit is realized through external high and low levels, and finally the output buffer is used for outputting a specified frequency signal.
The packaging method comprises the following steps: bonding the wafer 3, the IC integrated circuit 6 and the metal leading-out terminal 9 to the ceramic packaging base to form a product to be sealed and welded; using a special parallel sealing and welding machine, checking sealing, then turning on a power supply, entering a self-checking and positioning state, entering an automatic working state after self-checking is finished, checking a sealing and welding fixture used by the surface-mounted crystal oscillator, starting working when the dew point reaches below-40 ℃, opening a feeding cabin door of a vacuum box, putting a product to be sealed and welded and an upper cover 1 into the vacuum box together, and locking an outer door of the vacuum box clockwise; entering a cycle of vacuumizing and nitrogen filling, pressing an operation switch after baking is finished, after a batch of sealing and welding feeding is finished, performing a leakage detection process on a product, and turning off a power supply of a sealing and welding controller and a main power switch at the rear part of the machine table after sealing and welding are finished; and (5) after the seal welding product is qualified in leak detection, sending the seal welding product to the next working procedure.
And finally, after the seal welding leakage detection is qualified, utilizing an IVA110-S internal gas analyzer to carry out water vapor content detection on the surface-mounted crystal oscillator, wherein the test environment temperature is 23 ℃, the environment humidity is 24% RH, and the test data is shown in the following table:
note: ND means not detected.
Through sampling inspection of a batch of surface mount crystal oscillators, analysis of the water vapor content test data on the table above shows that the packaging device and the packaging method can finally control the water vapor content inside to be less than 5000ppm, have good sealing performance and have the fine leakage rate of less than 1 multiplied by 10-9Pam3The surface mounting oscillator of/s ensures the long-term working stability.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be covered within the protection scope of the present invention by those skilled in the art within the technical scope of the present invention.
Claims (6)
1. The packaging device for controlling the internal water vapor content is characterized in that the packaging device for controlling the internal water vapor content is provided with a packaging base, and a wafer, an IC integrated circuit and a metal leading-out terminal are bonded on the packaging base; and an upper cover is arranged on the outer sides of the wafer, the IC integrated circuit and the metal leading-out end.
2. The packaging device for controlling internal moisture content of claim 1, wherein said packaging base is a ceramic packaging base.
3. The packaging device for controlling internal moisture content according to claim 2, wherein the packaging base is provided with a silver solder layer, the bottom of the silver solder layer is provided with the kovar ring, and the upper layer of the silver solder layer is sequentially provided with the metal coating, the ceramic ring and the ceramic substrate.
4. The packaged device for controlling internal moisture content of claim 1, wherein the IC integrated circuit is comprised of a crystal oscillator circuit, a pulse synthesis and control circuit, an output buffer.
5. The packaging device for controlling moisture content inside according to claim 1, wherein said upper cover is a metal kovar cover.
6. The package for controlling internal moisture content of claim 1 wherein said package is parallel seal welded by resistance welding using a metal ring and a metal lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021444823.0U CN212324074U (en) | 2020-07-21 | 2020-07-21 | Packaging device for controlling internal water vapor content |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021444823.0U CN212324074U (en) | 2020-07-21 | 2020-07-21 | Packaging device for controlling internal water vapor content |
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| CN212324074U true CN212324074U (en) | 2021-01-08 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114850001A (en) * | 2022-03-17 | 2022-08-05 | 惠州市联建光电有限公司 | Coating method of LED display module in LED display screen |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114850001A (en) * | 2022-03-17 | 2022-08-05 | 惠州市联建光电有限公司 | Coating method of LED display module in LED display screen |
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| TR01 | Transfer of patent right |
Effective date of registration: 20220613 Address after: No.16, Wenhui East Road, Weicheng District, Xianyang City, Shaanxi Province Patentee after: Shaanxi Huihua Electronic Technology Co.,Ltd. Address before: No.16, Wenhui East Road, Weicheng District, Xianyang City, Shaanxi Province Patentee before: Shaanxi Huajing Beichuan Electronic Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |