CN112802643A - Sealed precision chip type fixed resistor and manufacturing method thereof - Google Patents
Sealed precision chip type fixed resistor and manufacturing method thereof Download PDFInfo
- Publication number
- CN112802643A CN112802643A CN202010765343.2A CN202010765343A CN112802643A CN 112802643 A CN112802643 A CN 112802643A CN 202010765343 A CN202010765343 A CN 202010765343A CN 112802643 A CN112802643 A CN 112802643A
- Authority
- CN
- China
- Prior art keywords
- chip
- resistor
- tube
- fixed resistor
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/024—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Resistors (AREA)
Abstract
The invention discloses a sealed precision chip type fixed resistor and a manufacturing method thereof, belonging to the field of precision chip resistors. This sealed accurate piece formula fixed resistor contains tube, resistor chip and apron, and the tube has cavity structures and upper surface and is equipped with metal seal ring, and the resistor chip is installed in the tube cavity, and the circuit intercommunication of chip electrode and tube, apron welding are in order to realize the gas tightness encapsulation on the metal seal ring of tube. The resistor chip is protected in the closed cavity of the tube shell and isolated from the external environment, so that the resistor chip can be prevented from being damaged by oxidation, corrosion, mechanical damage and the like, and better moisture resistance and long-term stability are obtained.
Description
Technical Field
The invention relates to the field of electronic components, in particular to a sealed precision chip type fixed resistor.
Background
In practical applications, the fixed resistor is affected by external environment, such as oxidation of oxygen, corrosion of moisture and corrosive gases, mechanical damage due to external stress, and the like. The precision, stability and life of the fixed resistor are seriously damaged due to the influence of severe external environment, and the fixed resistor is a great reason for the failure of the fixed resistor. A stable and reliable working environment is formed in a sealed shell of the sealed precision chip type fixed resistor, the resistor chip can be free from the influence of the external environment when working in the sealed precision chip type fixed resistor, and compared with the traditional chip type fixed resistor, the product has the advantages of high precision, small temperature coefficient, good moisture resistance, good long-term stability and the like.
Disclosure of Invention
The invention aims to provide a sealed precise chip type fixed resistor and a manufacturing method thereof, which realize the isolation of a resistor chip from the external environment and improve the moisture resistance and long-term stability of the fixed resistor.
The invention provides a sealed precise chip type fixed resistor which comprises a tube shell, a resistor chip (a chip type alloy foil fixed resistor chip, a chip type thin film fixed resistor chip, a chip type wire-wound fixed resistor chip or a chip type fixed resistor network chip) and a cover plate. Wherein, the tube has cavity structures and the upper surface is equipped with metal seal ring, and the resistor chip is installed in the tube cavity, and the apron welds on the metal seal ring of tube.
The invention is realized by the following technical scheme:
firstly, installing a resistor chip in a cavity of a tube shell;
then, the electrodes of the resistor chip are brought into communication with the in-package circuit.
And finally, the cover plate is welded on the metal sealing ring of the tube shell to realize air-tight packaging.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
fig. 2 is a schematic cross-sectional structure diagram of an embodiment of the present invention.
In fig. 2, 1 denotes a package, 2 denotes a metal seal ring on the upper surface of the package, 3 denotes a resistor chip, 4 denotes an insulating paste, and 5 denotes a cover plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, and not all embodiments. Other embodiments, which can be derived by one of ordinary skill in the art from the embodiments of the present invention without creative efforts, are also within the scope of the present invention.
Fig. 1 is a schematic structural diagram of an external shape according to an embodiment of the present invention, and fig. 2 is a schematic structural diagram of a cross-section according to an embodiment of the present invention. Referring to fig. 1 and 2, the sealed precision chip-type fixed resistor includes a case 1, a resistor chip 3, and a cover plate 5. Wherein, the tube shell 1 is made of ceramic material and has a cavity structure, and the upper surface thereof is provided with a metal sealing ring 2; the resistor chip 3 is arranged in the cavity of the tube shell 1 through the insulating glue 4, and the electrode of the resistor chip is connected with the bonding pad in the cavity of the tube shell 1; the cover plate 6 is welded on the metal sealing ring 2, so that the resistor chip 3 is packaged to form the sealed precision chip type fixed resistor.
The specific manufacturing steps of the sealed precision chip type fixed resistor are as follows:
1. dripping a proper amount of insulating glue 4 into a chip mounting area in a cavity of the tube shell 1 which is subjected to vacuum baking degassing treatment, and sticking the resistor chip 3 in the tube shell 1 through the insulating glue 4;
2. connecting the electrode of the resistor chip 3 with a bonding pad inside the tube shell 1 to realize the communication between the electrode of the resistor chip 3 and the circuit inside the tube shell 1;
3. the cover plate 5 covers the metal sealing ring 2 on the upper surface of the pipe shell, and the cover plate and the metal sealing ring form a closed cavity in a welding mode.
Finally, it should be noted that: the above-described embodiments are intended to be illustrative of the present invention, rather than restrictive, and various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. Sealed accurate piece formula fixed resistor, its characterized in that includes tube, resistor chip and apron, the tube has cavity structures and is provided with the circuit, the resistor chip is installed in the cavity of tube, the resistor chip communicates with the interior circuit of tube, the apron lid closes the upper surface of tube to be used for encapsulating the resistor chip in the tube to form sealed accurate piece formula fixed resistor.
2. The sealed precision chip fixed resistor of claim 1, wherein the package is made of ceramic, a metal sealing ring is disposed on the top surface of the package, and the cover plate is welded to the metal sealing ring.
3. The sealed precision chip fixed resistor of claim 1, wherein the resistor chip is a chip alloy foil fixed resistor chip, a chip thin film fixed resistor chip, a chip wire-wound fixed resistor chip or a chip fixed resistor network chip.
4. The sealed precision chip fixed resistor of claim 1, wherein the resistor chip is attached to the cavity of the package by an insulating adhesive.
5. The sealed precision chip fixed resistor of claim 1, wherein the electrodes of the resistor chip are connected to bonding pads inside the package to communicate the resistor chip with the circuitry inside the package.
6. The sealed precision chip fixed resistor of claim 1, wherein the packaging of the resistor chip is in a sealed form.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010765343.2A CN112802643A (en) | 2020-07-31 | 2020-07-31 | Sealed precision chip type fixed resistor and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010765343.2A CN112802643A (en) | 2020-07-31 | 2020-07-31 | Sealed precision chip type fixed resistor and manufacturing method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112802643A true CN112802643A (en) | 2021-05-14 |
Family
ID=75806498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010765343.2A Pending CN112802643A (en) | 2020-07-31 | 2020-07-31 | Sealed precision chip type fixed resistor and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112802643A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116598272A (en) * | 2023-07-18 | 2023-08-15 | 深圳基本半导体有限公司 | Double-sided heat dissipation airtight packaging device, assembly and packaging method thereof |
-
2020
- 2020-07-31 CN CN202010765343.2A patent/CN112802643A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116598272A (en) * | 2023-07-18 | 2023-08-15 | 深圳基本半导体有限公司 | Double-sided heat dissipation airtight packaging device, assembly and packaging method thereof |
CN116598272B (en) * | 2023-07-18 | 2024-03-12 | 深圳基本半导体有限公司 | Double-sided heat dissipation airtight packaging device, assembly and packaging method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101650963B1 (en) | Ptc device and electrical apparatus | |
CN202442825U (en) | Dielectric isolation encapsulating structure of pressure sensor | |
CN102928150B (en) | Leadless packaged metal film pressure sensor and preparation method thereof | |
CN111141430A (en) | Film core body sealing assembly in sputtering film pressure sensor and preparation thereof | |
CN110207885A (en) | Pressure sensor core, core manufacture and packaging method and pressure sensor based on upside-down mounting welding core | |
CN112802643A (en) | Sealed precision chip type fixed resistor and manufacturing method thereof | |
CN112216655A (en) | LTCC-based SiP packaging shell and preparation method thereof | |
CN110132462B (en) | Pressure sensor packaging structure and packaging method thereof | |
CN107833838B (en) | A kind of the high reliability packaging structure and its manufacturing method of air-tightness device | |
CN213400732U (en) | Sealed precision piece formula fixed resistor | |
JPWO2003036251A1 (en) | Sensor device | |
CN210689903U (en) | High-reliability pressure sensor | |
CN206161203U (en) | Capacitive pressure sensor with graded seal ring | |
JPH08334426A (en) | Pressure sensor | |
CN210426857U (en) | Oil-containing packaging pressure sensor with simple structure | |
CN103926029B (en) | The hard method for packing of piezoresistive pressure sensor sensitive chip impermeability | |
CN203014756U (en) | Percussion welding ceramic sealed housing and crystal oscillator employing same | |
CN202956242U (en) | Metallic film pressure sensor packed without lead wire | |
CN110749394A (en) | High-reliability pressure sensor | |
JPS5793225A (en) | Vacuum sealing method of vacuum container for pressure transducer | |
CN218539304U (en) | MEMS infrared sensor packaging structure based on silicon-silicon bonding | |
CN105784251B (en) | A kind of corrosion resistance differential pressure core and its manufacturing method | |
CN218101229U (en) | Semiconductor packaging structure | |
CN218781941U (en) | Core body protection cover, pressure sensitive assembly and pressure sensor | |
JPH08201201A (en) | Manufacture of pressure converter |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |