CN212231801U

CN212231801U - Radiating substrate mechanism for base plate

Info

Publication number: CN212231801U
Application number: CN202021498271.1U
Authority: CN
Inventors: 刘盛华
Original assignee: Shanghai Beixin Integrated Circuit Technology Co ltd
Current assignee: Shanghai Beixin Integrated Circuit Technology Co ltd
Priority date: 2020-07-27
Filing date: 2020-07-27
Publication date: 2020-12-25
Anticipated expiration: 2030-07-27

Abstract

The utility model relates to an electronic substrate technical field just discloses a based on base plate is with heat dissipation substrate mechanism, comprising a main body, the bottom fixed mounting of main part has the bottom plate, a plurality of louvres have been seted up to the upper surface of bottom plate, the upper surface middle part of bottom plate is provided with the heat dissipation fan, the positive left side fixed mounting of bottom plate has the fixed plate, the spout has been seted up to one side of fixed plate, upper surface one side fixedly connected with fixing device of bottom plate, the bottom fixedly connected with heat dissipation mechanism of bottom plate, fixing device includes the slider. This based on base plate is with substrate mechanism that dispels heat, through the heat dissipation mechanism that sets up below the bottom plate, the water-cooling tank in the heat dissipation mechanism, fixed connection's first coil pipe and second coil pipe around the water-cooling tank, the water-cooling tank carries away the water-cooling liquid with inside water-cooling liquid through first coil pipe and second coil pipe, carries out the circulatory motion bottom the bottom plate to can reach the heat that derives the base plate and carry out radiating effect.

Description

Radiating substrate mechanism for base plate

Technical Field

The utility model relates to an electron base plate technical field specifically is a base plate is with heat dissipation substrate mechanism.

Background

The base plate is the basic material for manufacturing PCB, generally, the base plate is the copper clad laminate, the single-sided and double-sided printed boards are manufactured on the base plate material-copper clad laminate, hole processing, chemical copper plating, copper electroplating, etching and the like are selectively carried out, the required circuit pattern is obtained, and under the condition that the execution or operation speed of the base plate is too fast, the base plate can generate extremely high heat, the existing base plate continuously emits the self heat outwards, under the condition that other mechanisms and elements do not help, the heat is hardly effectively emitted by the base plate, and the whole body is influenced by poor heat radiation effect.

Disclosure of Invention

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a based on base plate is with heat dissipation substrate mechanism possesses advantages such as the radiating effect is good, has solved the problem that the base plate self mentioned among the above-mentioned background distributes away the heat very hardly.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a heat dissipation substrate mechanism for base plate, includes the main part, the bottom fixed mounting of main part has the bottom plate, a plurality of louvres have been seted up to the upper surface of bottom plate, the upper surface middle part of bottom plate is provided with the heat dissipation fan, the positive left side fixed mounting of bottom plate has the fixed plate, the spout has been seted up to one side of fixed plate, upper surface one side fixedly connected with fixing device of bottom plate, the bottom fixedly connected with heat dissipation mechanism of bottom plate.

Preferably, fixing device includes the slider, slider swing joint is in the inside of spout, the first splint of one end fixedly connected with of slider, the below swing joint of first splint has the second splint, the quantity of fixed plate is four, four fixed plate evenly distributed is in the four corners of bottom plate.

The quantity of slider is two, and two sliders are located the left and right sides of first splint and second splint respectively, through mutual extrusion between first splint and the second splint, reach the fixed tight effect of clamp to the base plate, two are a set of among four fixed plates, correspond each other, and the upper surface of bottom plate is sufficient to have both sides respectively to have a set ofly.

Preferably, the middle part of the upper surface of the first clamping plate is fixedly connected with a fixing block, and one side of the fixing block is fixedly connected with a connecting rod.

Connecting rod fixed connection is between the fixed block, and the connecting rod is convenient to be operated first splint.

Preferably, the heat dissipation mechanism includes a water cooling tank, the water cooling tank is fixedly connected in the middle of the bottom plate, a first coil pipe is arranged above one side of the water cooling tank, and a second coil pipe is fixedly connected below the first coil pipe.

Preferably, the quantity of heat dissipation fan is two, two the left and right sides of heat dissipation fan evenly distributed at the bottom plate middle part, fixing device's quantity is two, two fixing device swing joint is in the left and right sides of bottom plate respectively.

Two heat dissipation fans can carry out the heat dissipation of big degree to the heat on the base plate, and two fixing device can be with base plate fixed clamp tight in the centre, protect the base plate not damaged.

Preferably, first splint and the equal swing joint of second splint are between the fixed plate, the equal fixedly connected with rubber pad of the lower surface of first splint and the upper surface of second splint.

The rubber pads arranged on the surfaces of the first clamping plate and the second clamping plate can play a good role in protecting the substrate fixed in the clamping plates.

Compared with the prior art, the utility model provides a based on base plate is with heat dissipation substrate mechanism possesses following beneficial effect:

1. this based on base plate is with substrate mechanism that dispels heat, through the heat dissipation mechanism that sets up below the bottom plate, the water-cooling tank in the heat dissipation mechanism, fixed connection's first coil pipe and second coil pipe around the water-cooling tank, the water-cooling tank carries away the water-cooling liquid with inside water-cooling liquid through first coil pipe and second coil pipe, carries out the circulatory motion bottom the bottom plate to can reach the heat that derives the base plate and carry out radiating effect.

2. This based on heat dissipation substrate mechanism for base plate through first splint and the second splint on the fixing device to and the joint work effect of dead lever, place the base plate between first splint and second splint, the dead lever is convenient to take first splint up, thereby can reach the effective fixed to the base plate.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic top view of the present invention;

fig. 3 is a schematic side view of the present invention;

fig. 4 is a schematic view of the bottom view structure of the present invention.

Wherein: 1. a main body; 101. a base plate; 102. heat dissipation holes; 103. a heat dissipation fan; 104. a fixing plate; 105. a chute; 2. a fixing device; 201. a slider; 202. a first splint; 203. a second splint; 204. a fixed block; 205. a connecting rod; 3. a heat dissipation mechanism; 301. a water cooling tank; 302. a first coil pipe; 303. a second coil.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, a heat-dissipating substrate mechanism for a substrate includes a main body 1, a bottom plate 101 is fixedly mounted at the bottom of the main body 1, the bottom plate 101 is made of an aluminum alloy plate, the heat-dissipating effect is good, a plurality of heat-dissipating holes 102 are formed in the upper surface of the bottom plate 101, the plurality of heat-dissipating holes 102 can dissipate a portion of heat on the bottom plate 101, a heat-dissipating fan 103 is disposed in the middle of the upper surface of the bottom plate 101, the heat-dissipating fan 103 can blow out the heat on the bottom plate 101, a fixing plate 104 is fixedly mounted on the left side of the front surface of the bottom plate 101, the fixing plate 104 mainly fixes a fixing device 2 and fixes the fixing device between the fixing plates 104, a chute 105 is formed in one side of the fixing plate 104, a first clamping plate 202 and a second clamping plate 203 move up and down inside the chute 105 through a slider 201, the bottom of the bottom plate 101 is fixedly connected with a heat dissipation mechanism 3.

Specifically, as shown in fig. 2 and 3, the fixing device 2 includes a sliding block 201, the sliding block 201 is movably connected to the inside of the sliding groove 105, one end of the sliding block 201 is fixedly connected with a first clamping plate 202, a second clamping plate 203 is movably connected to the lower side of the first clamping plate 202, the number of the fixing plates 104 is four, and the four fixing plates 104 are uniformly distributed at four corners of the bottom plate 101.

Through the technical scheme, the number of the sliding blocks 201 is two, the two sliding blocks 201 are respectively located on the left side and the right side of the first clamping plate 202 and the second clamping plate 203, the first clamping plate 202 and the second clamping plate 203 are mutually extruded to achieve the effect of fixing and clamping the base plate, two of the four fixing plates 104 are in one group and correspond to each other, and two sides of the upper surface of the base plate 101 are provided with one group.

Specifically, as shown in fig. 2 and 3, a fixing block 204 is fixedly connected to the middle of the upper surface of the first clamping plate 202, and a connecting rod 205 is fixedly connected to one side of the fixing block 204.

Through the technical scheme, the number of the fixing blocks 204 is two, the connecting rod 205 is fixedly connected between the fixing blocks 204, and the connecting rod 205 is convenient for operating the first clamping plate 202.

Specifically, as shown in fig. 3 and 4, the heat dissipation mechanism 3 includes a water cooling tank 301, the water cooling tank 301 is fixedly connected to the middle of the bottom plate 101, a first coil 302 is disposed above one side of the water cooling tank 301, and a second coil 303 is fixedly connected below the first coil 302.

Through the technical scheme, the water-cooling solution is stored in the water-cooling tank 301, the first coil pipe 302 and the second coil pipe 303 cover the lower surface of the whole bottom plate 101, and the water-cooling tank 301 conveys the water-cooling solution to the bottom of the whole bottom plate 101 through the first coil pipe 302 and the second coil pipe 303, so that the device is effectively cooled.

Specifically, as shown in fig. 2, the number of the heat dissipation fans 103 is two, the two heat dissipation fans 103 are uniformly distributed on the left and right sides of the middle portion of the bottom plate 101, the number of the fixing devices 2 is two, and the two fixing devices 2 are respectively movably connected on the left and right sides of the bottom plate 101.

Through above-mentioned technical scheme, two heat dissipation fans 103 can carry out the heat dissipation of big degree to the heat on the base plate, and two fixing device 2 can be with base plate fixed clamp tight in the centre, protection base plate not damaged.

Specifically, as shown in fig. 3, the first clamping plate 202 and the second clamping plate 203 are movably connected between the fixing plates 104, and rubber pads are fixedly connected to the lower surface of the first clamping plate 202 and the upper surface of the second clamping plate 203.

Through the technical scheme, the rubber pads arranged on the surfaces of the first clamping plate 202 and the second clamping plate 203 can well protect the substrate fixed in the clamping plates.

When using, pulling connecting rod 205, make the first splint 202 of both sides rise through spout 105, put into the base plate between first splint 202 and the second splint 203, when carrying out work, the produced heat of base plate can outwards give off, bottom plate 101 can absorb heat to it, adsorb self with the heat, heat dissipation fan 103 blows out some heat, after bottom plate 101 adsorbs self with the heat, water-cooling tank 301 in the heat dissipation mechanism 3 in the bottom can circulate bottom plate 101 bottom through first coil pipe 302 and second coil pipe 303 with inside water-cooling solution, thereby cool down the heat dissipation to it.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A substrate-based heat dissipation substrate mechanism comprises a main body (1), and is characterized in that: the bottom fixed mounting of main part (1) has bottom plate (101), a plurality of louvres (102) have been seted up to the upper surface of bottom plate (101), the upper surface middle part of bottom plate (101) is provided with heat dissipation fan (103), the positive left side fixed mounting of bottom plate (101) has fixed plate (104), spout (105) have been seted up to one side of fixed plate (104), upper surface one side fixedly connected with fixing device (2) of bottom plate (101), the bottom fixedly connected with heat dissipation mechanism (3) of bottom plate (101).

2. The substrate-based heat sink mechanism according to claim 1, wherein: fixing device (2) include slider (201), slider (201) swing joint is in the inside of spout (105), the first splint (202) of one end fixedly connected with of slider (201), the below swing joint of first splint (202) has second splint (203), the quantity of fixed plate (104) is four, four fixed plate (104) evenly distributed is in the four corners of bottom plate (101).

3. The substrate-based heat sink mechanism according to claim 2, wherein: the middle part of the upper surface of the first clamping plate (202) is fixedly connected with a fixing block (204), and one side of the fixing block (204) is fixedly connected with a connecting rod (205).

4. The substrate-based heat sink mechanism according to claim 1, wherein: heat dissipation mechanism (3) are including water-cooling tank (301), water-cooling tank (301) fixed connection is in the bottom middle part of bottom plate (101), one side top of water-cooling tank (301) is provided with first coil pipe (302), below fixedly connected with second coil pipe (303) of first coil pipe (302).

5. The substrate-based heat sink mechanism according to claim 1, wherein: the quantity of heat dissipation fan (103) is two, two heat dissipation fan (103) evenly distributed is in the left and right sides at bottom plate (101) middle part, the quantity of fixing device (2) is two, two fixing device (2) swing joint is in the left and right sides of bottom plate (101) respectively.

6. The substrate-based heat sink mechanism according to claim 2, wherein: first splint (202) and second splint (203) all swing joint between fixed plate (104), the equal fixedly connected with rubber pad of the lower surface of first splint (202) and the upper surface of second splint (203).