CN212211508U - Multilayer circuit board with good heat dissipation effect - Google Patents
Multilayer circuit board with good heat dissipation effect Download PDFInfo
- Publication number
- CN212211508U CN212211508U CN202021222971.8U CN202021222971U CN212211508U CN 212211508 U CN212211508 U CN 212211508U CN 202021222971 U CN202021222971 U CN 202021222971U CN 212211508 U CN212211508 U CN 212211508U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- fixedly connected
- dissipation effect
- good heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000694 effects Effects 0.000 title claims abstract description 40
- 230000017525 heat dissipation Effects 0.000 title claims description 44
- 239000000428 dust Substances 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 238000013016 damping Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 abstract description 29
- 239000012535 impurity Substances 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 5
- 239000012528 membrane Substances 0.000 description 3
- 239000011435 rock Substances 0.000 description 3
- 230000008093 supporting effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 206010044565 Tremor Diseases 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a multilayer circuit board that radiating effect is good, including the circuit board body, the circuit board body includes circuit board one and circuit board two, fixedly connected with insulating layer between circuit board one and the circuit board two, terminal surface all is equipped with hollow metal heating panel under circuit board one up end and the circuit board two, the heat conduction of fixedly connected with between the heating panel of upper end and the circuit board one is insulating protruding, fixedly connected with insulating heat conduction is protruding two between the heating panel of lower extreme and the circuit board two, the heating panel both ends are equipped with the opening, a plurality of louvres have been seted up to the heating panel, circuit board one and circuit board two can produce the heat under long-time operating condition, the heat transmits on the heating panel through heat conduction is protruding one and heat conduction is protruding two, give off through louvre. Through setting up dust screen one and dust screen two, reduce the dust impurity that falls into on the circuit board body, dustproof effect is better.
Description
Technical Field
The application relates to the field of circuit boards, in particular to a multilayer circuit board with a good heat dissipation effect.
Background
At present, the circuit board is also called as a printed circuit board or a printed circuit board, and the existence of the printed circuit board can be almost kept away in electronic equipment which can be seen by people, namely electronic components such as electronic watches, calculators, general computers, computer communication electronic equipment and the like.
The chinese patent with the prior publication number CN204721704U discloses a circuit board, which comprises: the circuit board body, the waterproof board that bonds on the circuit board body, arrange the water receiving tank that is used for catchmenting in the waterproof board in, paste the drier piece on the water receiving tank. The circuit board can protect the circuit board, water entering the circuit board is gathered and is sucked up in time, the circuit board is prevented from breaking down, and the service life of the circuit board is prolonged.
In view of the above-mentioned related technologies, the inventor believes that the circuit board has improved waterproof performance, but the circuit board can generate certain heat during long-time operation, which easily raises the internal temperature of the equipment, and if the heat cannot be dissipated in time, the circuit element is easy to lose efficacy due to overheating, which affects the normal operation of the circuit board.
SUMMERY OF THE UTILITY MODEL
In order to improve the radiating effect of circuit board, this application provides a multilayer circuit board that radiating effect is good.
The application provides a multilayer circuit board that radiating effect is good adopts following technical scheme:
the utility model provides a multilayer circuit board that radiating effect is good, including the circuit board body, the circuit board body is including circuit board one and circuit board two that are parallel to each other, circuit board one is located directly over circuit board two, fixedly connected with insulating layer between circuit board one and the circuit board two, the insulating layer sets up along circuit board body circumference, terminal surface all is equipped with hollow metal heating panel under circuit board one up end and the circuit board two, the protruding one of insulating heat conduction of fixedly connected with between heating panel of upper end and the circuit board one, the protruding two of insulating heat conduction of fixedly connected with between heating panel of lower extreme and the circuit board two, the heating panel both ends are equipped with the opening.
Through adopting above-mentioned technical scheme, in the use, two protruding one of heat conduction and the protruding two of heat conduction have good insulating properties, two piece metal heating panels can not direct and circuit board body direct contact about making, and circuit board one and circuit board two can produce the heat under long-time operating condition, and the heat gives off through louvre and both ends opening on the heating panel on the heat conduction is transmitted the heating panel through protruding one of heat conduction and protruding two of heat conduction, and the radiating effect is better.
Preferably, the insulating layer is provided with a plurality of air holes along the circumferential direction.
Through adopting above-mentioned technical scheme, the heat can have the part to remain between circuit board one and circuit board two, and the bleeder vent is convenient for this partial thermal giving off, is favorable to improving the radiating effect of circuit board body.
Preferably, a hollow bar-shaped column is fixedly connected between the first circuit board and the second circuit board, a plurality of exhaust holes are formed in the bar-shaped column, the two sides of the bar-shaped column are rotatably connected with a disc body, and the disc body is fixedly connected with a plurality of light helical blades at equal intervals along the circumferential direction.
By adopting the technical scheme, the strip-shaped column has fixing and supporting effects on the first circuit board and the second circuit board, and the exhaust holes are convenient for heat in the strip-shaped column to dissipate; the air flow can drive the light helical blade to rotate, the air flow between the first circuit board and the second circuit board is enhanced, and the ventilation and heat dissipation effects are improved.
Preferably, a first dustproof net is fixedly connected between the upper end of the radiating plate and the first circuit board, and a second dustproof net is fixedly connected between the lower end of the radiating plate and the second circuit board.
Through adopting above-mentioned technical scheme, dust impurity easily falls in circuit board one and two surfaces of circuit board, and the reducible dust impurity that falls into between heating panel and the circuit board body of dust screen one and dust screen two guarantees the normal use and the radiating effect of circuit board one and circuit board two.
Preferably, the outer part of the insulating layer is fixedly connected with a third dust screen.
Through adopting above-mentioned technical scheme, set up dust screen three, reduce the dust impurity that falls into between circuit board one and the circuit board two, guarantee circuit board body normal work and helical blade's radiating effect.
Preferably, a plurality of insulated damping springs are fixedly connected between the first circuit board and the second circuit board, and the damping springs are respectively positioned at four end corners of the first circuit board.
Through adopting above-mentioned technical scheme, the circuit board body is at the removal in-process, and circuit board one and circuit board two are easily taken place relative rocking, and damping spring plays buffering and cushioning effect, and reducible circuit board body is at the tremor that removes the in-process and produce and rock.
Preferably, a waterproof film is fixedly arranged on the end face, close to the circuit board body, of the heat dissipation plate.
Through adopting above-mentioned technical scheme, when rivers were gone up to circuit board one and circuit board two, waterproof membrane can block water, prevents water and circuit board one and circuit board two contacts for the waterproof performance of circuit board body is better.
Preferably, cushion pads are bonded at four end corners of the end face of the heat dissipation plate far away from the circuit board body.
Through adopting above-mentioned technical scheme, the blotter can protect the circuit board body, reduces the atress that heating panel and object collided, and then is convenient for protect the circuit board body.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the first heat conduction bulge and the second heat conduction bulge have good insulating property, so that the upper metal heat dissipation plate and the lower metal heat dissipation plate can not be directly contacted with the circuit board body, the first circuit board and the second circuit board can generate heat under a long-time working state, the heat is transmitted to the heat dissipation plates through the first heat conduction bulge and the second heat conduction bulge, and is dissipated through the heat dissipation holes and the openings at two ends of the heat dissipation plates, and the heat dissipation effect is good;
2. the strip-shaped columns have fixing and supporting effects on the first circuit board and the second circuit board, and the exhaust holes are convenient for heat in the strip-shaped columns to dissipate; the air flow can drive the light helical blade to rotate, the air flow between the first circuit board and the second circuit board is enhanced, and the ventilation and heat dissipation effects are improved.
Drawings
Fig. 1 is intended to highlight the connection diagram of the first circuit board and the second circuit board.
Fig. 2 is a schematic view of the overall structure of the embodiment.
Description of reference numerals: 1. a circuit board body; 2. a first circuit board; 3. a second circuit board; 4. an insulating layer; 5. a heat dissipation plate; 6. the first heat conduction bulge; 7. a second heat conduction bulge; 8. an opening; 9. heat dissipation holes; 10. air holes are formed; 11. a bar-shaped column; 12. an exhaust hole; 13. a tray body; 14. a helical blade; 15. a first dust screen; 16. a second dust screen; 17. a third dust screen; 18. a damping spring; 19. a waterproof film; 20. a cushion pad.
Detailed Description
The present application is described in further detail below with reference to the accompanying drawings.
The embodiment of the application discloses multilayer circuit board that radiating effect is good.
Referring to fig. 1 and 2, a multilayer circuit board that radiating effect is good, including circuit board body 1, circuit board body 1 includes circuit board one 2 and circuit board two 3 that are parallel to each other, circuit board one 2 is located directly over circuit board two 3, fixedly connected with insulating layer 4 between circuit board one 2 and the circuit board two 3, insulating layer 4 sets up along 1 circumference of circuit board body, multilayer circuit board that radiating effect is good is in the use, insulating layer 4 has better insulating properties, can prevent that circuit board one 2 and circuit board two 3 contact from taking place the short circuit phenomenon, guarantee circuit board body 1's normal work.
Referring to fig. 1 and 2, the first circuit board 2 and the second circuit board 3 can generate more heat under the long-time working state, the heat can exist around the first circuit board 2 and the second circuit board 3, the heat generated by the first circuit board 2 and the second circuit board 3 can be partially remained between the first circuit board 2 and the second circuit board 3, the heat can not be dissipated, the insulating layer 4 is provided with a plurality of air holes 10 along the circumferential direction, the heat can be dissipated between the first circuit board 2 and the second circuit board 3 conveniently, and the heat dissipation effect of the circuit board body 1 is improved.
Referring to fig. 1 and 2, the upper end surface of the first circuit board 2 and the lower end surface of the second circuit board 3 are both provided with hollow metal heat dissipation plates 5, the first heat dissipation plate 5 at the upper end and the first circuit board 2 are fixedly connected with insulated first heat conduction protrusions 6, the second heat dissipation plate 5 at the lower end and the second circuit board 3 are fixedly connected with insulated second heat conduction protrusions 7, and the first heat conduction protrusions 6 and the second heat conduction protrusions 7 have good insulating performance, so that the upper metal heat dissipation plate 5 and the lower metal heat dissipation plate 5 cannot be directly contacted with the circuit board body 1, and the short circuit phenomenon caused.
Referring to fig. 1 and 2, openings 8 have been seted up at the both ends of heating panel 5, and a plurality of louvres 9 have been seted up to heating panel 5, and heating panel 5 adopts the copper product, and copper has good heat conductivility, and on heat transmitted heating panel 5 through heat conduction protruding 6 and heat conduction protruding two 7, through louvre 9 and both ends opening 8 on heating panel 5 give off, the radiating effect is better. Meanwhile, the contact area between the opening 8 and the outside air is increased, and the ventilation and heat dissipation effects are good.
Referring to fig. 1 and 2, water has electric conductivity, water easily makes circuit board body 1 take place phenomenons such as contact failure or short circuit with circuit board body 1 contact, the terminal surface fixedly connected with waterproof membrane 19 of heating panel 5 near circuit board body 1, external environment's water flows on circuit board one 2 and circuit board two 3 through louvre 9 on the heating panel 5, waterproof membrane 19 blocks water, prevent water and circuit board one 2 and circuit board two 3 contact, make circuit board body 1's waterproof performance better, be convenient for guarantee circuit board body 1's normal use.
Referring to fig. 1 and 2, a first dustproof mesh 15 is fixedly connected between the upper-end heat dissipation plate 5 and the first circuit board 2, a second dustproof mesh 16 is fixedly connected between the lower-end heat dissipation plate 5 and the second circuit board 3, and the first dustproof mesh 15 and the second dustproof mesh 16 are arranged to reduce dust and impurities falling between the heat dissipation plate 5 and the circuit board body 1, so that normal use of the first circuit board 2 and the second circuit board 3 and a heat dissipation effect of the heat dissipation plate 5 are guaranteed.
Referring to fig. 1, a hollow bar-shaped column 11 is fixedly connected between a first circuit board 2 and a second circuit board 3, the bar-shaped column 11 is provided with a plurality of vent holes 12, the bar-shaped column 11 plays a role in fixing and supporting the first circuit board 2 and the second circuit board 3, and the vent holes 12 facilitate the dissipation of heat in the bar-shaped column 11; the two sides of the strip-shaped column 11 are rotatably connected with the tray body 13, the tray body 13 is fixedly connected with a plurality of light spiral blades 14 at equal intervals along the circumferential direction, air flow can drive the light spiral blades 14 to rotate, air flow between the first circuit board 2 and the second circuit board 3 is enhanced, and the ventilation and heat dissipation effects are improved.
Referring to fig. 1 and 2, a plurality of insulating damping springs 18 are fixedly connected between the first circuit board 2 and the second circuit board 3, and the damping springs 18 are respectively located at four corners of the first circuit board 2. The circuit board body 1 is at the removal in-process, and circuit board 2 and circuit board two 3 are easily taken place to rock relatively, and damping spring 18 plays buffering and shock-absorbing effect, and reducible circuit board 2 and circuit board two 3 tremble and rock that the removal in-process produced guarantee circuit board body 1's performance. The outer portion of the insulating layer 4 is fixedly connected with a dust screen III 17, the dust screen III 17 reduces dust impurities falling between the first circuit board 2 and the second circuit board 3, and normal work of the circuit board body 1 and the heat dissipation effect of the spiral blades 14 are guaranteed.
Referring to fig. 1 and 2, circuit board body 1 is at the removal in-process, circuit board body 1 may collide with external object, four end angle departments of the terminal surface that circuit board body 1 was kept away from to heating panel 5 bond and have blotter 20, blotter 20 can protect circuit board body 1, reduce the atress that heating panel 5 and object collision produced, and then be convenient for protect circuit board body 1, the wearing and tearing that heating panel 5 took place have been reduced simultaneously, be favorable to prolonging heating panel 5's life, guarantee heating panel 5's radiating effect.
The implementation principle of the multilayer circuit board with good heat dissipation effect in the embodiment of the application is as follows: in the use, the heat that circuit board body 1 produced passes through heat conduction arch one 6 and heat conduction arch two 7, transmits to heating panel 5 on, gives off through louvre 9 and both ends opening 8 on the heating panel 5, and the radiating effect is better, and opening 8 increases and the area of contact of outside air, and the air flow can drive light helical blade 14 rotatory, strengthens the air flow between circuit board one 2 and the circuit board two 3, improves the ventilation cooling effect. The first dustproof net 15 and the second dustproof net 16 can reduce dust and impurities falling between the heat dissipation plate 5 and the circuit board body 1, the waterproof film 19 can block water, and the air holes 10 facilitate heat dissipation between the first circuit board 2 and the second circuit board 3.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. The utility model provides a multilayer circuit board that radiating effect is good, includes circuit board body (1), its characterized in that: the circuit board comprises a circuit board body (1) and a circuit board II (3) which are parallel to each other, wherein the circuit board I (2) is located right above the circuit board II (3), an insulating layer (4) is fixedly connected between the circuit board I (2) and the circuit board II (3), the insulating layer (4) is arranged along the circumferential direction of the circuit board body (1), hollow metal heat dissipation plates (5) are arranged on the upper end faces of the circuit board I (2) and the circuit board II (3) and are arranged on the lower end faces of the circuit board I (2), an insulating heat conduction bulge I (6) is fixedly connected between the heat dissipation plates (5) on the upper end and the circuit board I (2), an insulating heat conduction bulge II (7) is fixedly connected between the heat dissipation plates (5) on the lower end and the circuit board II (3), openings (8) are.
2. The multilayer circuit board with good heat dissipation effect according to claim 1, characterized in that: the insulating layer (4) is provided with a plurality of air holes (10) along the circumferential direction.
3. The multilayer circuit board with good heat dissipation effect according to claim 1, characterized in that: fixedly connected with hollow bar post (11) between circuit board (2) and circuit board two (3), a plurality of exhaust holes (12) have been seted up to bar post (11), and the both sides of bar post (11) are rotated and are connected with disk body (13), and disk body (13) are along a plurality of light helical blade (14) of equidistant fixedly connected with of circumference.
4. The multilayer circuit board with good heat dissipation effect according to claim 1, characterized in that: and a first dustproof net (15) is fixedly connected between the upper end radiating plate (5) and the first circuit board (2), and a second dustproof net (16) is fixedly connected between the lower end radiating plate (5) and the second circuit board (3).
5. The multilayer circuit board with good heat dissipation effect according to claim 1, characterized in that: and a third dust screen (17) is fixedly connected to the outside of the insulating layer (4).
6. The multilayer circuit board with good heat dissipation effect according to claim 1, characterized in that: a plurality of insulated damping springs (18) are fixedly connected between the first circuit board (2) and the second circuit board (3), and the damping springs (18) are respectively positioned at four end corners of the first circuit board (2).
7. The multilayer circuit board with good heat dissipation effect according to claim 1, characterized in that: and a waterproof film (19) is fixedly arranged on the end face, close to the circuit board body (1), of the heat dissipation plate (5).
8. The multilayer circuit board with good heat dissipation effect according to claim 1, characterized in that: and cushion pads (20) are bonded at four end corners of the end face of the heat dissipation plate (5) far away from the circuit board body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021222971.8U CN212211508U (en) | 2020-06-28 | 2020-06-28 | Multilayer circuit board with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021222971.8U CN212211508U (en) | 2020-06-28 | 2020-06-28 | Multilayer circuit board with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212211508U true CN212211508U (en) | 2020-12-22 |
Family
ID=73817707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021222971.8U Expired - Fee Related CN212211508U (en) | 2020-06-28 | 2020-06-28 | Multilayer circuit board with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212211508U (en) |
-
2020
- 2020-06-28 CN CN202021222971.8U patent/CN212211508U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212211508U (en) | Multilayer circuit board with good heat dissipation effect | |
| CN210868009U (en) | Natural gas station industry switch equipment | |
| CN210955084U (en) | Embedded single-board computer chip protection structure | |
| CN106789105A (en) | A kind of industrial switch for being provided with graphite heat radiation fin | |
| US20220256741A1 (en) | Control device | |
| CN210328410U (en) | Gain amplifier's heat radiation structure | |
| CN105379097A (en) | Power conversion device | |
| CN211047658U (en) | Acceleration card and DU equipment | |
| CN209861447U (en) | Heat radiation structure of motor controller | |
| CN212163558U (en) | Soft route mainboard that heat dispersion is good | |
| CN208210420U (en) | A kind of radiator structure of pcb board | |
| CN212910592U (en) | Main control single board with heat dissipation function | |
| CN219180192U (en) | Heat radiation protection device of solid state disk | |
| CN201017271Y (en) | Waterproof type display apparatus having computer without fan | |
| JP3113683U (en) | Heat dissipation device for computer motherboard | |
| CN218920844U (en) | Network equipment heat radiation structure | |
| CN215068003U (en) | Reinforced heat radiation machine case | |
| CN219019116U (en) | Multilayer circuit board capable of interconnecting inner layers | |
| CN211019731U (en) | Communication equipment | |
| CN213937963U (en) | Quick radiating router casing | |
| CN219577441U (en) | Waterproof type power supply plate structure of antidetonation | |
| CN216531896U (en) | Heat dissipation type circuit board | |
| CN219738101U (en) | Network card | |
| CN213755501U (en) | Printed circuit board capable of fast radiating | |
| CN209765450U (en) | shockproof heat dissipation keyboard |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201222 |