CN212209463U - Packaging structure and electronic device - Google Patents

Packaging structure and electronic device Download PDF

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Publication number
CN212209463U
CN212209463U CN201921688729.7U CN201921688729U CN212209463U CN 212209463 U CN212209463 U CN 212209463U CN 201921688729 U CN201921688729 U CN 201921688729U CN 212209463 U CN212209463 U CN 212209463U
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China
Prior art keywords
substrate
layer
heat
package
connection
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Active
Application number
CN201921688729.7U
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Chinese (zh)
Inventor
窦志敏
陈丘
叶润清
佘勇
马富强
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Priority to CN201921688729.7U priority Critical patent/CN212209463U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The application discloses packaging structure, because second component is connected with the second base plate for the heat of second component can directly be transmitted to the second base plate. In addition, each second heat dissipation block is connected with at least one second connecting column, and each second heat dissipation block is connected with one second component, namely at least part of the second components are connected with the second connecting columns through the second heat dissipation blocks, so that the heat of at least part of the second components can be transmitted to the second connecting columns through the second heat dissipation blocks and transmitted to the second substrate or other structures connected with the second connecting columns through the second connecting columns, the heat of the second components is transmitted out, and the heat conduction path of the second components is increased. In this application, the heat transmission path of the components in the packaging structure all has a plurality of, when components and parts work generates heat, can go out heat transmission through what multiple path was timely to improve packaging structure's heat transmission efficiency, reinforcing packaging structure's radiating effect.

Description

Packaging structure and electronic device
Technical Field
The present disclosure relates to the field of packaging technologies, and particularly to a package structure and an electronic device including the same.
Background
With the trend of miniaturization and multi-functionalization of end products, the three-dimensional package stacking technology becomes one of the very important effective means for increasing the circuit density. Through the three-dimensional packaging stacking technology, more and more components such as passive devices, active devices and the like are integrated together, so that the heat dissipation of the components in the three-dimensional packaging stacking structure becomes an increasingly prominent and urgent problem to be solved, and the problem that the normal work of the components in the packaging structure is influenced or the damage to the components in the packaging structure is caused due to the concentrated heat of the components in the three-dimensional packaging stacking structure is avoided.
SUMMERY OF THE UTILITY MODEL
The application provides a packaging structure with good radiating effect, and an electronic device comprising the packaging structure.
In a first aspect, the present application provides a package structure, which includes a first package body and a second package body stacked on the first package body.
The first packaging body comprises a first substrate and a first packaging layer packaged on the first substrate; a plurality of external pins are formed on one side of the first substrate, which is far away from the first packaging layer, and the external pins are used for connecting an external structure of the packaging structure; the first packaging layer comprises a first packaging material layer, one or more first components and a plurality of first connecting columns, wherein the one or more first components and the plurality of first connecting columns are embedded in the first packaging material layer; each first component is electrically connected with the first substrate; one end of each first connecting column is connected with the first substrate, and the other end of each first connecting column extends to the surface, away from the first substrate, of the first packaging material layer; the first connecting column is formed by adopting a heat conducting material.
The second packaging body comprises a second substrate and a second packaging layer packaged on the second substrate; the second packaging layer comprises a second packaging material layer, one or more second components, a plurality of second connecting columns and one or more second heat dissipation blocks, wherein the one or more second components, the plurality of second connecting columns and the one or more second heat dissipation blocks are embedded in the second packaging material layer; each second component is connected with the second substrate; one end of each second connecting column is connected with the second substrate, and the other end of each second connecting column extends to the surface, away from the second substrate, of the second packaging material layer; each second heat dissipation block is connected with at least one second connecting column, and each second heat dissipation block is connected with one or more second components; the second connecting column and the second heat dissipation block are made of heat conduction materials; the second substrate or the second connecting column is connected with the first connecting column.
In the present application, since each of the second components is connected to the second substrate, heat of the second components can be directly transferred to the second substrate. In addition, each second heat dissipation block is connected with at least one second connecting column, and each second heat dissipation block is connected with one second component. I.e. at least part of the second component can be connected to the second connection stud via the second heat slug. The second connecting column is connected with the second substrate, and the second substrate or the second connecting column is connected with the first connecting column, so that heat generated by the second component can be transmitted to the second substrate through the second radiating block and the second connecting column in sequence or transmitted to the first substrate through the second radiating block, the second connecting column and the first connecting column in sequence, the heat transfer path of the second component is increased, and the heat of the second component is accelerated to be dissipated. In some embodiments, a plurality of external pins are formed on the first substrate, and the external structure of the package structure is connected through the external pins, so that heat transmitted to the first substrate can be transmitted to the external structure of the package structure through the external pins, and heat dissipation of the package structure is achieved. For the application, due to the increase of the approaches of the second component, the heat of the second component in the packaging structure can be rapidly transmitted to the first substrate, so that the heat dissipation efficiency of the packaging structure is improved. In this application, for the mode that the heat of second component can only loop through second base plate, second spliced pole, first spliced pole with heat transmission to first base plate, the way greatly increased of the heat transmission to first base plate of second component of this application, and then can accelerate thermal effluvium in the packaging structure. And, owing to be in set up in the packaging structure the second radiating block first spliced pole, second spliced pole make heat in the packaging structure can pass through the second radiating block first spliced pole, second spliced pole transmit for the heat can be quick first packaging body with exchange between the second packaging body, avoid the heat to be in the first packaging body perhaps gather in the second packaging body to avoid the heat gathering and the damage of the interior components and parts of packaging structure that cause.
In some embodiments, heat in the package structure can also be transmitted out through the second substrate side. In this embodiment, because the heat of second component transmits to the way of second base plate is more, can directly transmit to promptly the second base plate also can loop through the second radiating block and the second spliced pole transmits to the second base plate to can be faster with heat in the packaging structure transmits to packaging structure's outside for packaging structure's radiating efficiency makes packaging structure can have good radiating effect, thereby can avoid the heat in the three-dimensional encapsulation stacked structure too high and influence the normal work of components and parts in the packaging structure or the damage that causes components and parts in the packaging structure.
In some embodiments, the first package includes one or more first heatslug, each first heatslug connected to at least one of the first connection posts, and each first heatslug connected to one or more of the first components; the first heat dissipation block is formed of a heat conductive material.
Because the first component is connected with the first substrate, the heat of the first component can be directly transmitted to the first substrate and transmitted out through the first substrate. In addition, the first component is connected with the first connecting column through the first radiating block, and the first connecting column is connected with the first substrate, so that the heat of the first component can be transmitted to the first connecting column through the first radiating block and then transmitted to the first substrate through the first connecting column, and the heat is transmitted out through the first substrate. In other words, in this embodiment, the first component in the first encapsulation layer has a plurality of heat conduction paths, so that heat generated by the operation of the first component can be rapidly transmitted, and the heat dissipation efficiency of the encapsulation structure is further improved. In addition, due to the fact that heat conduction paths in the packaging structure are increased, heat between the first packaging body and the second packaging body can be rapidly transmitted, the heat is prevented from being concentrated at a certain position in the packaging structure, and damage to components and parts caused by heat concentration is avoided.
In some embodiments, each first heat dissipation block is located on a side of the first component facing away from the first substrate, and each first connection pillar is located close to an edge of the first package body relative to the first component; or each second heat dissipation block is positioned on one surface of the second component, which is far away from the second substrate, and the second connecting column is close to the edge of the second packaging body relative to the second component. In some embodiments, each first heat dissipation block is located on a side of the first component facing away from the first substrate, and each first connection pillar is located close to an edge of the first package body relative to the first component; and each second heat dissipation block is positioned on one surface of the second component, which is far away from the second substrate, and the second connection column is close to the edge of the second packaging body relative to the second component.
In this application embodiment, first spliced pole is relative first component is close to the edge of first packaging body, first radiating block with first spliced pole links to each other to form the cover and locates first component deviates from the frame construction of first base plate one side, frame construction can strengthen the inside intensity of packaging structure avoids packaging structure receives the effect of external power and the damage that produces. When first spliced pole or second spliced pole ground connection, when frame construction can form faraday electromagnetic shield, isolation that can be fine electromagnetic interference between first component in the packaging structure and other structures in the packaging structure to and the electromagnetic interference of packaging structure external environment to the first component in the packaging structure. The second spliced pole is relative the second binary device is close to the edge of second packaging body, the second radiating block with the second spliced pole links to each other to form the cover and locates the second binary device deviates from the frame construction of second base plate one side, frame construction can strengthen the inside intensity of packaging structure avoids packaging structure receives the effect of external power and the damage that produces. When first spliced pole or second spliced pole are through ground connection, when the frame structure formed faraday electromagnetic shield, isolation that can be fine the electromagnetic interference between second component and other structures in the packaging structure to and the electromagnetic interference of packaging structure external environment to the second component in the packaging structure.
In some embodiments, at least one of the first connection posts or the second connection posts is grounded, all of the first heatslug are integrally connected and electrically connected to the grounded first connection post or the grounded second connection post, and all of the second heatslugs are integrally connected and electrically connected to the grounded first connection post or the grounded second connection post.
In the embodiment of the application, as at least one of the first connecting column or the second connecting column is grounded, the first heat dissipation block connected into a whole can be electrically connected with the grounded first connecting column or the grounded second connecting column, so that the first heat dissipation block connected into a whole is grounded. And, connect as an organic whole second radiating block can be connected with the first spliced pole of ground connection or the second spliced pole of ground connection electricity to make and connect as an organic whole second radiating block ground connection, thereby make the second radiating block with the frame construction that the second spliced pole links to each other to form and first radiating block with the frame construction homoenergetic that first spliced pole links to each other to form can form faraday electromagnetic shield, isolation that can be fine electromagnetic interference between first component in the packaging structure and the second component to and the electromagnetic interference of the component in the packaging structure of packaging structure external environment.
In some embodiments, the first component, the first heat dissipation block and the first connection post are all multiple, the multiple first heat dissipation blocks are arranged at intervals, the first component and the first connection post connected to different first heat dissipation blocks are different, and different first heat dissipation blocks are used for transmitting different signals; or the second component, the second radiating block and the second connecting column are multiple, and the second radiating block is arranged at intervals, different, connected with the second radiating block, and different signals are transmitted by the second radiating block. In some embodiments, the first component, the first heat dissipation block and the first connection post are all multiple, the multiple first heat dissipation blocks are arranged at intervals, the first component and the first connection post connected to different first heat dissipation blocks are different, and different first heat dissipation blocks are used for transmitting different signals; and, the second binary device, the second radiating block and the second spliced pole are a plurality of, and are a plurality of interval sets up between the second radiating block, and different the second binary device that the second radiating block is connected and the second spliced pole is different, and is different the second radiating block is used for transmitting different signals.
In this embodiment of the application, the first component and the first connection post connected to different first heat dissipation blocks are different, and different first heat dissipation blocks are used for transmitting different signals; the second component and the second connecting column which are connected with the different second radiating blocks are different, and the different second radiating blocks are used for transmitting different signals, namely in some embodiments, the first radiating block and the second radiating block not only can play a role in heat transmission, but also can play a role in signal transmission, and a signal transmission path in the packaging structure is increased.
In some embodiments, an external pin is disposed on a side of the second package body away from the first package body, and the external pin is used for electrically connecting with an external structure of the package structure.
In the embodiment of the application, because the surface that first base plate deviates from first encapsulation layer is equipped with external pin, the surface that the second base plate deviates from the second encapsulation layer is equipped with external pin, make the signal both can transmit through first base plate side, also can transmit through the second base plate, for only setting up external pin's mode at the unilateral (like first base plate), external pin's quantity increases, thereby can increase the density of drawing forth the signal among the whole packaging structure, increase the quantity of components and parts in the packaging structure, improve the integrated quantity of components and parts in the packaging structure, be convenient for realize electronic device's miniaturization and the diversified promotion of function. In addition, compared with the mode that the external pins are arranged on one side only, the components in the packaging structure can be connected with the external pins on the first substrate and the external pins on the second substrate, so that the flexibility of the arrangement of the components and the wiring in the packaging structure can be increased, and the design of the packaging structure is simplified.
In some embodiments, the second packaging layer is located on a side of the second substrate facing the first packaging layer, and the first connection posts are connected with the second connection posts; the packaging structure further comprises a connecting layer, wherein the connecting layer is connected between the first packaging layer and the second packaging layer and is connected with the first connecting column and the second connecting column.
In some embodiments, the connection layer may be solder or conductive paste.
The first package body and the second package body are fixedly connected together through the connecting layer, and compared with a mode that the first package body and the second package body are directly packaged into a whole through the packaging layer, the first package body and the second package body are more easily disassembled. In some cases, when a package structure with another structure needs to be obtained, a new package structure can be obtained only by replacing the type of the second package body connected to the first package body (or replacing the first package body connected to the second package body), so that the new package structure can be obtained quickly and conveniently, the first package body or the second package body 0 can be recycled, and waste of resources is avoided.
In some embodiments, the connection layer includes a plurality of sub-connection blocks arranged at intervals, the first connection posts and the second connection posts are both arranged in plurality, at least a portion of the first connection posts are arranged opposite to at least a portion of the second connection posts, the sub-connection blocks are connected between the opposite first connection posts and the opposite second connection posts, and the sub-connection blocks are made of a heat-conducting and electric-conducting material.
In some embodiments, when the connection layer is solder, the plurality of sub-connection blocks may be a plurality of solder points arranged at intervals; when the connection layer is made of conductive adhesive, the plurality of sub-connection blocks may be a plurality of adhesive drops arranged at intervals.
In this embodiment, the first package body and the second package body are fixedly connected and electrically connected through the sub-connection blocks arranged at intervals, so that the package structure can be simpler when the first package body or the second package body needs to be replaced. In addition, the use of materials of the connecting layer can be reduced, and the production cost can be reduced. It can be understood that, in some embodiments, the material of the connection layer may also be filled between the first package body and the second package body, that is, the sub-connection blocks of the connection layer are connected together, so as to achieve a more stable connection effect, avoid a gap between the first package body and the second package body, and enhance the strength of the package structure in the thickness direction.
In some embodiments, the surface of the second heat slug facing away from the second substrate exposes the second package layer, the surface of the first heat slug facing away from the first substrate exposes the first package layer, and the connection layer further includes a heat conduction slug connected between the surface of the first heat slug facing away from the first package layer and the surface of the second heat slug facing away from the second package layer.
In the embodiment of the application, the heat conducting block is connected between the first heat radiating block and the second heat radiating block, so that heat transfer between the second heat radiating block and the second packaging body is realized, the transmission speed of heat between the first packaging body and the second packaging body is increased, and the soaking efficiency in the packaging structure is improved. And a heat conducting block is arranged between the surface of the first heat dissipation block exposed out of the first packaging material layer and the surface of the second heat dissipation block exposed out of the second packaging material layer, namely the heat conducting block is added between the first packaging body and the second packaging body, so that the connecting and fixing strength between the first packaging body and the second packaging body can be further improved.
In some embodiments, the surface of the second heat slug facing away from the second substrate exposes the second package layer, the surface of the first heat slug facing away from the first substrate exposes the first package layer, the surface of the first heat slug facing away from the first package layer contacts the surface of the second heat slug facing away from the second package layer, and the first heat slug and the second heat slug form an integral structure.
In the embodiment of the application, the surface of the first connecting column exposed out of the first packaging material layer is in contact with the surface of the second connecting column exposed out of the second packaging material layer, and the first connecting column and the second connecting column are fixed through intermolecular force, so that the first heat dissipation block and the second heat dissipation block form an integrated structure.
In some embodiments, the second package body further includes a third package layer, the third package layer is packaged on a surface of the second substrate facing away from the second package layer, and the third package layer includes a third package material layer and one or more third devices embedded in the third package material layer, and each of the third devices is connected to the second substrate.
In the embodiment of the application, through the one side encapsulation third encapsulation layer that deviates from the second encapsulation layer at the second base plate, the relative two sides of second base plate all set up the encapsulation layer promptly to increase the quantity of the components and parts that packaging structure's thickness direction piled up, increase the quantity of the components and parts in the packaging structure when reducing the area that packaging structure is applied to in the electronic device, thereby be convenient for realize electronic device's miniaturization and multi-functionalization.
In some embodiments, the third encapsulation layer further comprises a plurality of third connection studs and one or more third heatslug embedded within the third encapsulation material layer; one end of each third connecting column is connected to the second substrate, the other end of each third connecting column extends to the surface, deviated from the second substrate, of the third packaging material layer, each third heat dissipation block is connected with at least one third connecting column, and each third heat dissipation block is connected with one or more third elements.
In this application embodiment, partial heat that the third component produced can directly transmit to the second base plate, and partial heat can be in proper order through third radiating block, third spliced pole transmission to second base plate, increases the heat transmission route of third component to can be quick transmit the heat that the work of third component produced to other positions of packaging structure, avoid the heat to concentrate. And the heat generated by the second substrate can be transmitted to the first substrate through the second connecting column and the first connecting column in sequence and transmitted to the outside of the packaging structure through the external pin of the first substrate, so that the heat dissipation is realized. It can be understood that heat generated by the second component in the second package layer and the first component in the first package layer can also be transmitted to the third package layer, so as to realize uniform heat in the package structure, avoid heat accumulation at a certain position in the package structure, and avoid damage to the package structure due to heat accumulation.
In some embodiments, the second substrate includes a wiring layer and an insulating layer covering a side of the wiring layer away from the second package layer, and the second component is electrically connected to the wiring layer; the insulating layer is partially hollow so as to expose part of the wiring layer; one side of the second substrate, which is far away from the second packaging layer, is covered with a heat-conducting adhesive layer, the heat-conducting adhesive layer is in contact with the exposed part of the wiring layer, and the heat-conducting adhesive layer is used for transmitting heat.
In this application embodiment, because the position that the heat-conducting glue layer passes through the insulating layer fretwork contacts with the line layer of second base plate for the heat that transmits to the second base plate can be quick derives through the heat-conducting glue layer, reinforcing packaging structure's radiating effect. In some embodiments, a release film is disposed on a surface of the thermal adhesive layer facing away from the second encapsulation layer. When being fixed in other structures of electronic equipment with packaging structure, directly tear the type membrane and remove and can paste the heat-conducting adhesive layer in other structures, easy operation is convenient.
In some embodiments, the first component includes a front-mounted chip, a surface of the front-mounted chip facing away from the first substrate is laminated with a metal sheet, and the first heat slug is connected to the metal sheet; or the second component comprises a front chip, a metal sheet is stacked on the surface of the front chip, which is far away from the second substrate, and the second heat dissipation block is connected to the metal sheet. In some embodiments, the first component includes a front-mounted chip, a surface of the front-mounted chip facing away from the first substrate is laminated with a metal sheet, and the first heat slug is connected to the metal sheet; and the second component comprises a front chip, a metal sheet is laminated on the surface of the front chip, which is far away from the second substrate, and the second heat dissipation block is connected to the metal sheet.
The surface of the normally-mounted chip (i.e. the chip connected to the substrate in a normally-mounted manner) in the first packaging body, which deviates from the first substrate, is laminated with a metal sheet, and the first heat dissipation block is connected to the metal sheet, so that damage to the normally-mounted chip when a laser hole is formed in the first packaging material layer and the first heat dissipation block is formed is avoided. Similarly, a metal sheet is stacked on the surface of the normal chip (i.e. the chip connected to the substrate in a normal manner) in the second package body, which is away from the second substrate, and the second heat dissipation block is connected to the metal sheet, so that damage to the normal chip when the hole is formed on the second packaging material layer by laser and the second heat dissipation block is formed is avoided.
In some embodiments, the metal sheet may be formed of the same material as the first and second heat dissipation blocks, so that the metal sheet and the first and second heat dissipation blocks can form an integral structure, thereby avoiding increasing a contact interface and enhancing a heat conduction effect.
In some embodiments, the first component in the first substrate is a plurality of components, and at least two of the plurality of components are stacked in a thickness direction of the first package body; or the second component in the second substrate is multiple, and at least two of the multiple second components are stacked in the thickness direction of the second package body. In some embodiments, the first component in the first substrate is a plurality of components, and at least two of the plurality of components are stacked in a thickness direction of the first package body; and the second component in the second substrate is a plurality of components, and at least two of the plurality of components are stacked in the thickness direction of the second package.
In the embodiment of the application, the first component in the first packaging layer is stacked in the thickness direction of the packaging structure, so that the component is stacked in the thickness direction of the packaging structure, and the density of the component in the packaging structure is improved. When the same number of first components are packaged in the first packaging layer, as part of the first components are stacked in the thickness direction of the packaging structure, compared with the packaging structure in which the first components are directly connected to the first substrate, the size of the first substrate can be reduced, and the occupied area of the packaging structure is reduced.
In a second aspect, the present application further provides an electronic device, which includes a functional module and the package structure, wherein the functional module is electrically connected to the package structure. Because packaging structure has good radiating effect, avoids the damage that the heat concentrates in the packaging structure and causes for packaging structure can have longer life, and then can guarantee electron device's life.
In some embodiments, the electronic device includes a motherboard, and the package structure and the functional module are fixed on the motherboard and electrically connected to the motherboard; the first substrate of the packaging structure is close to the mainboard relative to the first packaging layer and is electrically connected with the mainboard through the external pins.
In the embodiment of the application, the packaging structure is connected with each functional module through the circuit of the mainboard, so that the packaging structure is electrically connected with each functional module arranged on the mainboard. In addition, the packaging structure and part or all of the functional modules are electrically connected through the mainboard, so that at least part of heat generated by the packaging structure can be transmitted to the functional modules connected or contacted with the mainboard or other structures of the electronic equipment through the mainboard, and the phenomenon that the packaging structure is damaged due to overheating caused by heat accumulation in the packaging structure is avoided.
In some embodiments, the electronic device includes a middle frame, the middle frame is disposed opposite to the motherboard, and the package structure is located between the middle frame and the motherboard and connects the middle frame and the motherboard; the second packaging body of the packaging structure is connected with the middle frame on the surface deviating from the first substrate, and the middle frame is used for heat dissipation.
In the embodiment of the application, the packaging structure is arranged between the main board and the middle frame and is in contact with the main board and the middle frame, so that part of heat generated by the packaging structure is transmitted to the main board, and part of heat is transmitted to the middle frame to be dissipated. In some embodiments, the package structure is fixedly connected to both the main board and the middle frame, so as to maintain the stability of the package structure in the electronic device.
In some embodiments, the electronic device is a mobile phone, the functional module includes one or more of an antenna module, a sensor module, an audio module, a camera module, a connector module, and a power module, and the package structure is electrically connected to the functional modules, so that the antenna module, the audio module, the sensor module, and the camera module 500 are controlled to operate by components in the package structure, and the electronic device can implement various functions.
Drawings
In order to more clearly explain the technical solutions in the present application or the background art, the drawings used in the present application or the background art will be described below.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of a portion of the electronic device shown in FIG. 1;
fig. 3 is a schematic cross-sectional view of a package structure according to an embodiment of the present application;
FIG. 4 is a perspective view of a first package body of the package structure of the embodiment shown in FIG. 3;
FIG. 5 is a perspective view of a first package body of a package structure according to further embodiments of the present application;
fig. 6 is a schematic cross-sectional view of a package structure according to another embodiment of the present application;
fig. 7 is a schematic cross-sectional view of a package structure according to another embodiment of the present application;
fig. 8 is a schematic cross-sectional view of a package structure according to another embodiment of the present application;
fig. 9 is a schematic cross-sectional view of a package structure according to another embodiment of the present application;
fig. 10 is a schematic cross-sectional view of a package structure according to another embodiment of the present application;
fig. 11 is a schematic cross-sectional view of a package structure according to another embodiment of the present application;
fig. 12 is a schematic cross-sectional view of a package structure according to another embodiment of the present application;
FIG. 13 is a schematic partial cross-sectional view of the package structure of FIG. 12 in an electronic device;
fig. 14 is a schematic cross-sectional view of a package structure according to another embodiment of the present application;
fig. 15 is a schematic cross-sectional view of a package structure according to another embodiment of the present application;
fig. 16 is a schematic cross-sectional view of a package structure according to another embodiment of the present application;
fig. 17 is a schematic cross-sectional view of a package structure according to another embodiment of the present application;
FIG. 18 is a flowchart of a process for fabricating the package structure of the embodiment shown in FIG. 3;
fig. 19a to 19k are schematic cross-sectional views of the package structure in the steps shown in fig. 18.
Detailed Description
Technical solutions in some embodiments of the present application will be described below with reference to the drawings in some embodiments of the present application.
In this application, the term "A and/or B" includes "A" or "B" or "A and B".
The application relates to a packaging structure, a packaging method and an electronic device comprising the packaging structure. The electronic device can be a mobile phone, a tablet computer, a wearable watch, a router and other electronic products. The packaging structure can integrate components such as active devices and/or passive devices in one package. The active devices may be various chips and other components, and the passive devices may be capacitors, inductors, resistors and other components. In the embodiment of the application, the packaging structure is electrically connected with the functional module of the electronic device, so that the functional module of the electronic device is controlled to work through the matching work of the active element and the passive element in the packaging structure.
For example, referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device 1000 according to an embodiment of the present application. The electronic device includes a package structure 100 and at least one functional module electrically connected to the package structure 100. Components capable of controlling each functional module to work are packaged in the packaging structure 100, so that each functional module is controlled to work by the components packaged in the packaging structure 100, and each function of the electronic device is realized. The components in the package structure 100 include active devices such as a processor and a memory, and passive devices such as a capacitor element, an inductor element, and a resistor element.
In this embodiment, the electronic device 1000 is a mobile phone. The functional modules of the mobile phone include the antenna module 200, the audio module 300, the sensor module 400, the camera module 500, the connector module 600, the power module 700, and the like, so that various functions of the mobile phone are realized through the functional modules in the mobile phone. In some embodiments, the package structure 100 is packaged with an antenna module processing chip, an audio module processing chip, a sensor module processing chip, and a camera module processing chip, so that the package structure 100 is electrically connected to the antenna module 200, the audio module 300, the sensor module 400, and the camera module 500, and thus the antenna module 200, the audio module 300, the sensor module 400, and the camera module 500 are controlled to operate by components in the package structure 100, so that the electronic device 1000 can implement various functions. It is understood that when the electronic device 1000 is other equipment, the electronic device 1000 can include other types of functional modules, and other types of components are correspondingly packaged in the package structure 100 to electrically connect the functional modules with the package structure 100, so as to implement the functions of the electronic device 1000.
In the embodiment of the present application, the number of components packaged in the package structure 100 may be increased or decreased as needed. For example, in some embodiments, a power module processing chip and a connector module processing chip may be added to the package structure 100, and the package structure 100 is electrically connected to the connector module 600 and the power module 700, so as to expand the functions of the package structure 100.
Referring to fig. 2, fig. 2 is a schematic cross-sectional view illustrating a partial structure of an electronic device 1000 according to some embodiments of the present disclosure. In some embodiments, the electronic device 1000 may further include a motherboard 800, and the package structure 100, some or all of the functional modules are disposed on the motherboard 800. In some embodiments, the main board 800 is a Printed Circuit Board (PCB), and the package structure 100 is connected to each functional module through a circuit of the main board 800, so as to electrically connect the package structure 100 and each functional module disposed on the main board 800. Moreover, since the package structure 100 and some or all of the functional modules are electrically connected through the motherboard 800, at least part of the heat generated by the package structure 100 can be transmitted to the functional module connected or in contact with the motherboard 800 or other structures of the electronic device 1000 through the motherboard 800, thereby preventing the heat from being accumulated in the package structure 100 and causing the package structure 100 to be overheated and damaged. For example, in the embodiment shown in fig. 2, the package structure 100 and the connector module 600 are disposed on the motherboard 800, and when the heat generated by the package structure 100 is large and the heat generated by the connector module 600 is low, the heat of the package structure 100 can be transmitted to the position of the connector module 600 through the motherboard 800, so as to avoid the package structure 100 from being damaged due to overheating caused by the heat accumulating at the position of the package structure 100.
In some embodiments, the electronic device 1000 further includes a middle frame 900, the middle frame 900 is disposed opposite to the main board 800, and the package structure 100 is connected to the middle frame 900 and the main board 800. The middle frame 900 can be used for heat dissipation. The package structure 100 is disposed between the main board 800 and the middle frame 900 and contacts the main board 800 and the middle frame 900, so that the heat generated by the package structure 100 is partially transmitted to the main board 800 and partially transmitted to the middle frame 900 for dissipation. In some embodiments, the package structure 100 is fixedly connected to both the main board 800 and the middle frame 900, so as to keep the package structure 100 stable in the electronic device 1000.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a package structure 100 according to an embodiment of the present application. The package structure 100 includes a first package 10 and a second package 20 stacked on the first package 10. A connection layer 30 is disposed between the first package body 10 and the second package body 20. The connection layer 30 is made of an electrically and thermally conductive material, i.e., the connection layer 30 can conduct electricity and heat. The electrical connection of the first package 10 and the second package 20 is achieved through the connection layer 30, so that communication between the first package 10 and the second package 20 is enabled. Moreover, since the connection layer 30 has a heat conduction function, heat between the first package 10 and the second package 20 can be mutually transmitted through the connection layer 30, and heat is prevented from being accumulated on the first package 10 or the second package 20.
In this embodiment, the connection layer 30 may be solder or conductive adhesive, has good thermal and electrical conductivity, and can fixedly connect the first package body 10 and the second package body 20 together.
In the embodiment of the present application, the first package body 10 and the second package body 20 are fixedly connected together by the connection layer 30, and the first package body 10 and the second package body 20 are easier to be disassembled compared with a method of directly packaging the first package body 10 and the second package body 20 into a whole by the package layer. In some cases, when it is necessary to obtain a package structure 100 with another structure, a new package structure 100 can be obtained only by replacing the type of the second package 20 connected to the first package 10 (or replacing the first package 10 connected to the second package 20), so that a new package structure 100 can be obtained quickly and conveniently, and the first package 10 or the second package 20 can be recycled, thereby avoiding waste of resources. For example, the first package 10 of some embodiments has an antenna module processing chip and an audio module processing chip packaged therein, and the second package 20 has a sensor module processing chip and a camera module processing chip packaged therein. When it is required to obtain the package structure 100 in which the antenna module processing chip, the audio module processing chip, the power module processing chip, and the connector module processing chip are packaged, only the second package 20 in which the power module processing chip and the connector module processing chip are packaged needs to be replaced with the second package 20 in which the sensor module processing chip and the camera module processing chip are packaged, so that the required package structure 100 is obtained.
In some embodiments of the present application, a surface of the first package body 10 facing the second package body 20 has a plurality of first connection terminals 10a, a surface of the second package body 20 facing the first package body 10 has a plurality of second connection terminals 20a, and the electrical connection between the first package body 10 and the second package body 20 is achieved through the electrical connection between at least part of the first connection terminals 10a and at least part of the second connection terminals 20 a. In some embodiments, at least a portion of the first connection terminal 10a is disposed opposite to at least a portion of the second connection terminal 20 a. In the present embodiment, the connection layer 30 includes a plurality of sub-connection blocks 31 arranged at intervals, and each sub-connection block 31 is connected between the first connection terminal 10a and the second connection terminal 20a arranged oppositely, so as to electrically connect the first package 10 and the second package 20. Wherein, the orthographic projection of the second connection terminal 20a on the surface of the first package body 10 facing the second package body 20 at least partially overlaps with the first connection terminal 10a arranged opposite thereto.
In the embodiment of the present application, when the connection layer 30 is a solder, the plurality of sub-connection blocks 31 may be a plurality of solder points arranged at intervals; when the connection layer 30 is a conductive paste, the plurality of sub-connection blocks 31 may be a plurality of paste drops arranged at intervals.
In this embodiment, the sub-connection blocks 31 arranged at intervals are used to realize the fixed connection and the electrical connection between the first package 10 and the second package 20, so that the package structure 100 can be simpler when the first package 10 or the second package 20 needs to be replaced. In addition, the use of the material of the connection layer 30 can be reduced, and the production cost can be reduced. It is understood that, in some embodiments, the material of the connection layer 30 may also be filled between the first package body 10 and the second package body 20, that is, the sub-connection blocks of the connection layer 30 are connected together, so as to achieve a more stable connection effect, avoid a gap between the first package body 10 and the second package body 20, and enhance the strength of the package structure 100 in the thickness direction.
The first package 10 includes a first substrate 11 and a first package layer 12 packaged on the first substrate 11. The first substrate 11 is a circuit board, and includes two opposite insulating layers 111 and at least one wiring layer 112 disposed between the two insulating layers 111. When the wiring layers 112 are a plurality of layers, the first substrate 11 further includes a signal interconnection layer 113 disposed between two adjacent wiring layers 112. The signal interconnection layer 113 includes an insulating material layer 1131 and a connection line 1132 penetrating through the insulating material layer 1131. The insulating material layer 1131 spaces and insulates the two adjacent routing layers 112, and the connection lines 1132 embedded in the insulating material layer 1131 connect the adjacent routing layers 112, so that communication can be performed between the multiple routing layers 112. In this embodiment, the routing layer 112 has two layers. It is understood that the number of routing layers 112 may be more layers.
In some embodiments, insulating layer 111 has only one layer. Specifically, the insulating layer 111 near the first packaging layer 12 may be absent, and the first packaging layer 12 is directly packaged on the routing layer 112 of the first substrate 11.
In this embodiment, a bonding pad connected to the routing layer 112 is further disposed on a surface of the insulating layer 111 away from the routing layer 112, and the bonding pad is used to connect a component and the like to the routing layer 112 of the first substrate 11.
One side of the first substrate 11 facing away from the first package layer 12 is provided with an external pin 13, and the external pin 13 is used for electrically connecting with an external structure of the package structure 100. The external structure of the package structure 100 is other structures, modules or components besides the package structure and electrically connected to the package structure. The external leads 13 are connected to the wiring layer 112, so that the first substrate 11 is electrically connected to the external structures (e.g., functional modules of the electronic device 1000) of the package structure 100, and the structure electrically connected to the first substrate 11 in the package structure 100 is electrically connected to the external structures of the package structure 100.
When the package structure 100 is disposed on the motherboard 800, the first substrate 11 is connected to the motherboard 800 through the external pins 13. Signals generated by a certain working module electrically connected with the motherboard 800 are transmitted into the package structure 100 through the motherboard 800 and the external pins 13 in sequence; or, the signals generated by the processing in the package structure 100 sequentially pass through the first substrate 11, the external connection pins 12, and the motherboard 800 to the working module, so as to implement communication between the package structure 100 and the working module. Moreover, the heat generated by the operation of the components in the package structure 100 can be partially transmitted to the motherboard 800 through the first substrate 11, and the heat generated by the operation of the components in the package structure 100 is dissipated or transmitted to other structures or working modules in the electronic device 1000 through the motherboard 800, so that the heat is prevented from being accumulated at the position of the package structure 100, and the damage caused by the overhigh heat of the package structure 100 is avoided.
The first packaging layer 12 includes a first packaging material layer 121, and one or more first components 122, a plurality of first connection pillars 123, and one or more first heat dissipation bumps 124 embedded in the first packaging material layer 121. The first component 122 is a component in the package structure 100, and may be an active component such as a chip, or a passive component such as a capacitor, an inductor, or a resistor. Each of the first components 122 is electrically connected to the first substrate 11. The first component 122 may be directly connected to the first substrate 11, or may be indirectly connected to the first substrate 11 through another structure.
In this embodiment, the first component 122 is disposed on the first substrate 11, and the pins 1211 of the first component 122 are connected to the pads of the first substrate 11, so as to directly connect the first component 122 and the first substrate 11. The first component 122 may be one or more. When the number of the first components 122 is plural, since the plural first components 122 are disposed on the first substrate 11 and electrically connected to the first substrate 11, the communication between the first components 122 can be performed through the wiring layer 112 of the first substrate 11. By designing the routing of the routing layer 112 of the first substrate 11, connection can be made according to the first component 122 to be electrically connected to the first substrate 11.
In the embodiment of the present application, the first component 122 may be electrically connected to the first substrate 11 by a method such as a patch or a bonding method.
In some embodiments, when the first component 122 is a chip, the chip may be connected to the first substrate 11 by a flip-chip or a face-down method. For example, in the embodiment shown in fig. 3, two first components 122 are included in the first packaging layer 12, and both of the two first components 122 are chips. One of the first components 122 is connected to the first substrate 11 in a flip-chip manner, that is, the leads of the first component 122 are located on the side of the first component 121 facing the first substrate 11, and the leads of the first component 122 are directly connected to the pads on the first substrate 11, so as to electrically connect the first component 122 to the first substrate 11. The other first component 122 is connected to the first substrate 11 in a face-up manner, that is, the lead of the first component 122 is located on a side of the first component 122 away from the first substrate 11, and the lead is bonded to the pad on the first substrate 11 through the bonding wire 1221, so that the first component 122 is electrically connected to the first substrate 11.
In some embodiments, the surface of the normal chip (i.e. the chip attached to the substrate by the normal method) facing away from the first substrate 11 is laminated with a metal sheet, and the first heat slug 124 is attached to the metal sheet, so as to avoid damage to the normal chip when laser drilling the first packaging material layer 121 and forming the first heat slug 124. The metal sheet may be formed of the same material as or different from the first heat dissipation block 124. In this embodiment, the metal sheet is formed of the same material as the first heat dissipation block 124 and is integrated with a heat dissipation block 124, so as to avoid increasing a contact interface, thereby enhancing the heat conduction effect.
Each first connection pillar 123 has one end connected to the first substrate 11 and the other end extending to the surface of the first packaging material layer 121 away from the first substrate 11 and connected to the second package body 20. In this embodiment, the end surface of the first packaging material layer 121 extending to the surface of the first connecting pillar 123 away from the first substrate 11 is the first connecting terminal 10a of the first package 10. Specifically, the first connection pillar 123 is fixed on the first substrate 11 by a conductive adhesive or a solder, and is electrically connected to the first substrate 11 by a conductive adhesive or a solder pad. In the embodiment of the present application, the first connecting pillar 123 and the first heat sink 124 are made of an electrically and thermally conductive material, that is, the first connecting pillar 123 and the first heat sink 124 both have a high thermal conductivity (thermal conductivity is greater than 10W/m · K), and can conduct heat, and the first connecting pillar 123 and the first heat sink 124 can also conduct electricity. In some embodiments, the first connecting pillar 123 and the first heat slug 124 are made of metal material such as gold, silver, copper, aluminum, etc. The material of the first connecting post 123 and the second heat dissipating block may be the same or different. In this embodiment, the first connecting pillar 123 and the first heat slug 124 are both made of copper, and the first connecting pillar 123 and the first heat slug 124 are formed as an integral structure. It is understood that in some embodiments, the first connection post 123 and/or the first heat dissipation block 124 may also be made of other non-metallic conductive materials, or in the following embodiments, the first connection post 123 and/or the first heat dissipation block 124 may be a heat pipe, so as to achieve better heat conduction effect.
Each first heat slug 124 is connected to at least one first connection post 123, and each first heat slug 124 is connected to one or more first components 122, such that at least a portion of the heat generated by the operation of the first components 122 can be transferred to the first connection post 123 through the first heat slug 124. In this embodiment, the number of the first components 122 and the number of the first heatsinks 124 are the same, and each first heatsink slug 124 corresponds to one first component 122 and is connected to the corresponding first component 122. It is understood that in some embodiments, the number of first components 122 may be greater than the number of first heatsinks 124, with only a portion of first components 122 being connected to first heatsinks 124. For example, in some embodiments, some active devices and some passive devices in the first plurality of components 122 may be connected to the first heat slug 124 only to enhance the heat dissipation effect of the active devices, since the active devices often generate heat more than the passive devices during operation. The arrows in fig. 3 show the heat transmission paths within the package structure 100. In this embodiment, since the first components 122 are disposed on the first substrate 11 and directly connected to the first substrate 11, a portion of heat of the first components 122 is directly transmitted to the first substrate 11 and transmitted to the outside of the package structure 100 through the first substrate 11. In addition, the first substrate 11 is further connected to the first heat slug 124, and a portion of the heat of the first component 122 can be further transmitted to the first substrate 11 through the first heat slug 124 via the first connection pillar 123, and transmitted to the outside of the package structure 100 through the first substrate 11. In this embodiment, since the first substrate 11 is connected to the motherboard 800 through the external pins 13, the heat transmitted to the first substrate 11 can be transmitted to the motherboard 800. In this embodiment, each first component 122 has a corresponding first heat slug 124 attached thereto such that each first component 122 is capable of dissipating heat through the first heat slug 124. It is understood that in some embodiments, only a portion of the first component 122 may be coupled to the first heat slug 124 such that only a portion of the first component 122 is capable of dissipating heat through the first heat slug 124. For example, when one first component 122 generates a larger amount of heat and the other first component 122 generates a smaller amount of heat, only one first heat dissipation block 124 may be disposed to connect with the first component 122 having a larger amount of heat, so as to reduce the number of first heat dissipation blocks 124 and save cost while ensuring the heat dissipation effect.
In the embodiment of the present invention, since the first connection post 123 is connected to the first substrate 11, and the first heat slug 124 is connected to the first component 122 and the first connection post 123, a part of the heat generated by the first component 122 can be transmitted to the first substrate 11 through the first heat slug 124 and the first connection post 123. Compared to the package structure without the first connection pillar 123 and the first heat slug 124, the package structure 100 of the embodiment of the application can increase the transmission path of the heat generated by the first component 122 by adding the first heat slug 124 and the first connection pillar 123, thereby improving the heat dissipation capability of the package structure 100.
It is understood that, in some embodiments, the first package layer 12 may also be free of the first heat slug 124 because the first component 122 does not generate high heat during operation, or because the first component 122 is directly connected to the first substrate 10, and most of the heat can be directly transmitted to the first substrate 10, so that the heat dissipation efficiency is high.
In this embodiment, since the first connection pillar 123 and the first heat slug 124 are made of metal materials, they have higher strength than the first packaging material layer 121. In order to achieve a better heat conduction effect, the first connection post 123 and the first heat dissipation block 124 occupy a larger volume in the first package 10. For example, in some embodiments of the present application, the diameter of the first connection post 123 is 200 μm or more, so as to achieve better heat conduction effect. Therefore, in the present embodiment, the frame structure formed by embedding the first heat slug 124 and the first connection pillar 123 in the first packaging material layer 121 can also enhance the strength of the first package 10.
Since the first heat slug 124 and the first connection post 123 are both capable of conducting electricity, and the first connection post 123 is connected to the first substrate 11, in some embodiments, a signal can be input to the first connection post 123 through the first substrate 11, and the signal can be transmitted to the first component 122 through the first connection post 123 and the first heat slug 124; alternatively, the signal generated by the first component 122 can be transmitted to the first substrate 11 through the first connection post 123 and the first heat dissipation block 124, and can be communicated with the outside through the first substrate 11. That is, the first connection post 123 and the first heat dissipation block 124 can also perform a signal transmission function, increase a signal transmission path in the package structure 100, and implement redistribution of signals. In this embodiment, the first substrate 11 is electrically connected to the external connection structure of the package structure 100 through the external connection pin 13, so as to implement signal communication between the inside and the outside of the package structure 100.
It is understood that the structure formed by the connection of the first connection post 123 and the first heat dissipation block 124 functions differently according to the signals input to the first connection post 123 and the first heat dissipation block 124. For example, in some embodiments, the external pin 13 is electrically connected to the power module, that is, the first connection pillar 123 inputs a power signal, so that the structure formed by connecting the first connection pillar 123 and the first heat slug 124 can serve as a power network of the package structure 100, and can supply power to components connected to the heat slugs in the first package layer 12 through the power network. Alternatively, in some embodiments, the external pin 13 connected to the first connection post 123 may be grounded, and the ground return in the package structure 100 may be able to sequentially pass through the first heat dissipation block 124, the first connection post 123, the connection line of the first substrate 11, and the external pin 13 from the first component 122 to the ground, thereby forming a low-impedance ground network path, which can form a good faraday electromagnetic shield.
The connection structure of the first connection post 123 and the first heat slug 124 has different functions, and the connection structure of the first connection post 123 and the first heat slug 124 and the position of the connection structure in the package structure 100 may be different. In this embodiment, the first heat slug 124 is located on a side of the first component 122 departing from the first substrate 11, the first connection pillar 123 is close to an edge of the first package body 10 relative to the first component 122, the first heat slug 124 is connected with the first connection pillar 123 to form a frame structure covering the side of the first component 122 departing from the first substrate 11, the frame structure can enhance the strength inside the package structure 100, and the package structure 100 is prevented from being damaged by external force. When the first connecting column 123 is grounded through the external pin 13 and the frame structure forms a faraday electromagnetic shield, it is able to well isolate the electromagnetic interference between the first component 122 in the package structure 100 and other structures in the package structure 100, and the electromagnetic interference of the external environment of the package structure 100 to the first component 122 in the package structure 100.
It is understood that in some other embodiments of the present application, the first connection pillar 123 may be partially disposed near an edge of the first package body 10 with respect to the first component 122, and may also be partially disposed at any other position of the first substrate 11. For example, the first connection pillars 123 may be disposed between adjacent first components 122 on the first substrate 11. By increasing the number of the first connection pillars 123 connected to the first substrate 11 in the package structure 100, the heat transfer path of the first component 122 to the first substrate 11 can be increased, and the heat extraction efficiency of the first component 122 can be improved. In addition, the volume occupied by the first connection pillars 123 in the first encapsulation layer 12 can be increased, and the strength of the package structure 100 can be enhanced.
Referring to fig. 4, fig. 4 is a perspective view of the first package body 10 of the package structure 100 shown in fig. 3 according to the embodiment. In this embodiment, the first heatsinks 124 connected to the respective first components 122 are connected as a whole, and the first connecting columns 123 are connected to the first heatsinks 124. In some cases, the embodiment shown in FIG. 4 may also be considered to have only one first heatslug 124, with all first components 122 connected to the same first heatslug 124. In other words, the first heat slug 124 and the first connecting pillar 123 of the heavy first package 10 of the present embodiment are connected into an integral frame. In this embodiment, the first heat dissipation block 124 and the first connection column 123 are connected to form an integrated frame, and when at least one first connection column 123 is grounded, the integrated frame formed by the first heat dissipation block 124 and the first connection column 123 forms a faraday electromagnetic shield, which can well isolate the electromagnetic interference between the first component 122 in the package structure 100 and other structures in the package structure 100, and the electromagnetic interference of the external environment of the package structure 100 to the first component 122 in the package structure 100. In addition, since no gap is required to be reserved between the first heat dissipation blocks 124, the first heat dissipation blocks 124 and the first connection pillars 123 occupy a larger volume in the first package body 10, and a better heat conduction effect and a better strength enhancement effect are achieved.
Referring to fig. 5, fig. 5 is a perspective view of a first package body 10 of a package structure 100 according to other embodiments of the present application. In this embodiment, the first connection post 123 and the first heat sink 124 can provide signals for the first component, so as to ensure the directionality of signal transmission. The first heatsinks 124 connected to different first components 122 are spaced apart, and the first connection posts 123 connected to different first heatsinks 124 are also spaced apart. In this embodiment, the number of the first components 122 is two, and the first components 122a and 122b are respectively provided. There are two first heatsinks 124, namely a first heatsink 124a and a first heatsink 124 b. The first heat slug 124a is connected to the first component 122a, and the first heat slug 124b is connected to the first component 122 b. The first heat dissipation block 124a is spaced apart from the first heat dissipation block 124 b. In some embodiments, the first connection post 123 connected to the first heat slug 124a and the first connection post 123 connected to the first heat slug 124a are connected to different external connection pins 13 through the wiring layer 112 on the first substrate 11, different external connection pins 13 input different signals, and the first connection post 123 connected to the first heat slug 124a input different signals, respectively, so as to input different signals for the first component 122a and the first component 122b, respectively.
Referring to fig. 3 again, in the present embodiment, the structure of the second package 20 is similar to that of the first package 10, and includes a second substrate 21 and a second package layer 22 packaged on the second substrate 21. The second encapsulation layer 22 is located on a side of the second substrate 21 facing the first encapsulation layer 12.
The second substrate 21 is a circuit board, and includes two opposite insulating layers 211 and at least one wiring layer 212 disposed between the two insulating layers 211. When the wiring layers 212 are multi-layered, the second substrate 21 further includes a signal interconnection layer 213 disposed between two adjacent wiring layers 212. The signal interconnection layer 213 includes an insulating material layer 2131 and connecting wires 2132 penetrating the insulating material layer 2131. The insulating material layer 2131 separates and insulates two adjacent wiring layers 212, and the connecting wires 2132 embedded in the insulating material layer 2131 connect the adjacent wiring layers 212, so that communication can be performed between the wiring layers 212. In this embodiment, the routing layer 212 has two layers. It is understood that the number of routing layers 212 may be more layers.
In some embodiments, the second substrate 21 may also include only one insulating layer. Specifically, the insulating layer on the side of the second substrate 21 facing the second packaging layer 22 is not present, so that the second packaging layer 22 is directly packaged on the routing layer 212 of the second substrate 21.
In this embodiment, the surface of the insulating layer 211 away from the routing layer 212 is further provided with a pad connected to the routing layer 212, and the pad is used to connect a component and the like to the routing layer 212 of the second substrate 21.
The second packaging layer 22 includes a second packaging material layer 221, and one or more second components 222, a plurality of second connection pillars 223, and one or more second heat dissipation bumps 224 embedded in the second packaging material layer 221. The second component 222 may be an active device such as a chip, or may be a passive device such as a capacitor, an inductor, or a resistor. Each of the second components 222 is connected to the second substrate 21. The second component 222 may be directly connected to the second substrate, or may be indirectly connected to the second substrate 21 through another structure.
In some embodiments, the second component 222 may be a chip, and the chip may be connected to the second substrate 21 by a flip-chip or a face-up method. The surface of the normal chip (i.e. the chip attached to the substrate by the normal method) facing away from the second substrate 12 is laminated with a metal sheet, and the second heat slug 224 is attached to the metal sheet, so as to avoid damage to the normal chip when the laser is drilled into the second packaging material layer 221 and the second heat slug 224 is formed. The metal sheet may be formed of the same material as or different from the second heat dissipation block 224. In this embodiment, the metal sheet is made of the same material as the second heat dissipation block 224 and is connected to the second heat dissipation block to form an integral structure, so as to avoid increasing a contact interface, thereby enhancing the heat conduction effect.
In this embodiment, the second component 222 is disposed on the second substrate 21, and the pins of the second component 222 are connected to the pads of the second substrate 21, so as to directly connect the second component 222 and the second substrate 21. When the number of the second components 222 is plural, since the plural second components 222 are all disposed on the second substrate 21 and connected to the pads of the second substrate 21, and the pads are connected to the wiring layer 212 of the second substrate 21, the plural second components 222 can be electrically connected through the wiring layer 212 of the second substrate 21, and the plural second components 222 can communicate with each other through the wiring layer 212 of the second substrate 21. In the embodiment of the present application, the second component 222 may be electrically connected to the second substrate 21 by a patch or a bonding method. In the embodiment of the present application, when the second component 222 is a chip, the chip may be connected to the first substrate 11 in a normal or flip-chip manner.
Each second connection pillar 223 has one end connected to the second substrate 21 and the other end extending to the surface of the second packaging material layer 221 away from the second substrate 21 and connected to the second package body 20. In this embodiment, the end surface of the second connection pillar 223 extending to the surface of the second packaging material layer 221 departing from the second substrate 21 is the second connection terminal 20a of the second package 20.
The second connecting column 223 and the second heat dissipation block 224 are both made of an electrically and thermally conductive material, that is, the second connecting column 223 and the second heat dissipation block 224 both have a high thermal conductivity (thermal conductivity greater than 10W/m · K) and can conduct heat, and the second connecting column 223 and the second heat dissipation block 224 can also conduct electricity. In some embodiments, the second connection post 223 and the second heat slug 224 may be made of a metal material such as gold, silver, copper, aluminum, etc. The material of the second connecting column 223 and the second heat dissipating block 224 may be the same or different. In this embodiment, the second connecting column 223 and the second heat dissipation block 224 are both made of copper, and the second connecting column 223 and the second heat dissipation block 224 are formed as an integral structure. In some embodiments, the second connection post 223 and/or the second heat dissipation block 224 may also be made of other non-metallic conductive materials, or in the following embodiments, the second connection post 223 and/or the second heat dissipation block 224 may be a heat pipe, so as to achieve better heat conduction effect.
In this embodiment, at least a portion of the first connection terminal 10a is disposed opposite to at least a portion of the second connection terminal 20a, that is, at least a portion of the first connection post 123 is disposed opposite to at least a portion of the second connection post 223. The sub-connection block 31 is connected between the first and second connection terminals 10a and 20a, which are oppositely disposed, i.e., the sub-connection block 31 is connected between the first and second connection posts 123 and 223, which are oppositely disposed. Wherein, the relative arrangement of at least part of the first connecting columns 123 and at least part of the second connecting columns 223 means: at least a portion of the first connection posts 123 partially or completely coincide with at least a portion of the second connection posts 223 at an orthographic projection of the first substrate 11 toward the surface of the first encapsulation layer 12. In this embodiment, the orthographic projections of the first connecting column 123 and the second connecting column 223 which are oppositely arranged are completely overlapped in the direction from the first substrate 11 to the surface of the first packaging layer 12, so that when the packaging structure 100 is pressed in the thickness direction, because the height directions of the first connecting column 123 and the second connecting column 223 are the same as the thickness direction of the packaging structure 100, and the first connecting column 123 and the second connecting column 223 correspond to the same position on the first substrate 11, a better supporting effect can be achieved, and the packaging structure 100 is prevented from being damaged due to the pressing in the thickness direction. Also, the heat transfer path of the heat transferred from the first connection post 123 to the second connection post 223 is shortest, thereby achieving efficient heat transfer.
Each second heat slug 224 is connected to at least one second connection post 223 and each second heat slug 224 is connected to one or more second components 222 such that at least a portion of the heat of the second components 222 can be transferred to the second connection posts 223 through the second heat slug 224. In this embodiment, the number of the second components 222 is greater than the number of the second heatsinks 224, and only a portion of the second components 222 are connected to the second heatsinks 224. In this embodiment, the plurality of second components 222 includes two active devices and one passive device, and since the active devices often generate heat higher than the passive devices during operation, the active devices are only connected to the second heat dissipation block 224 to enhance the heat dissipation effect of the active devices. It is understood that in some embodiments, the number of the second heatsinks 224 may be the same as the number of the second components 222, and each of the second components 222 has a corresponding second heatsink 224 connected thereto to conduct at least a portion of the heat of the second component 222 through the second heatsink 224.
In this embodiment, since the second components 222 are disposed on the second substrate 21 and directly connected to the second substrate 21, part of the heat of the second components 222 can be directly transmitted to the second substrate 21 and transmitted to the outside of the package structure 100 through the second substrate 21. In addition, the second substrate 21 is further connected to a second heat slug 224, and a portion of the heat of the second component 222 can be further transmitted to the second substrate 21 through the second heat slug 224 via the second connection post 223 and transmitted to the outside of the package structure 100 through the second substrate 21. Furthermore, a portion of the heat of the second component 222 can be transferred to the first connection pillar 123 through the second connection pillar 223 via the connection layer 30, and then transferred to the first substrate 11. It is understood that in some embodiments, a portion of the heat generated by the first component 122 can also be transmitted to the second substrate 21 through the first heat slug 124, the first connection stud 123, the connection layer 30, and the second connection stud 223 in sequence. In this embodiment, there are three second components 222 in the second packaging layer 22, wherein two second components 222 are connected to the corresponding second heat dissipation bumps 224. In this embodiment, only a portion of the second component 222 is connected to the second heat slug 224, such that only a portion of the heat of the second component 222 can be partially dissipated through the second heat slug 224. For example, when one second component 222 generates a larger amount of heat and the other second component 222 generates a smaller amount of heat, only one second heat dissipation block 224 may be arranged to connect with the second component 222 with the larger amount of heat, so as to reduce the number of the second heat dissipation blocks 224 and save the cost while ensuring the heat dissipation effect. It is understood that in some embodiments, each of the second components 222 is connected to one of the second heat dissipation bumps 224, so that the heat of each of the second components 222 can be partially dissipated through the second heat dissipation bumps 224, thereby improving the heat dissipation efficiency of the package structure 100.
In this embodiment, the first heat slug 124 is connected to the first connection column 123, the first connection column 123 is connected to the first substrate 11, the second heat slug 224 is connected to the second connection column 223, the second connection column 223 is connected to the second substrate 21, and the first connection column 123 is connected to the second connection column 223, so that the first heat slug 124, the first connection column 123, the second heat slug 224, the second connection column 223, the first substrate 11 and the second substrate 21 are connected to form a heat dissipation frame, and heat conduction paths of the first component 122 and the second component 222 can be increased. Compared with the package structure without the first heat dissipation block 124 and the second heat dissipation block 224, the heat dissipation efficiency of the package structure 100 according to the embodiment of the present application is significantly improved, in which the heat of the second component 222 can only be transmitted to the second substrate 21 first and then transmitted to the first substrate 11 through the second substrate 21. Moreover, since the heat dissipation frame is formed in the first package body 10 and the second package body 20, the heat generated in the first package body 10 can be transmitted into the second package body 20 through the heat dissipation frame, and the heat generated in the second package body 20 can be transmitted into the first package body 10 through the heat dissipation frame, that is, the heat in the first package body 10 and the second package body 20 can be transmitted mutually, so that the heat equalization between the first package body 10 and the second package body 20 can be realized, the heat is prevented from being concentrated at a certain position in the package structure 100, and the damage of components in the package structure 100 due to the temperature concentration is prevented.
It should be noted that, in the embodiment of the present application, the first heat dissipation block 124, the first connection column 123, the second heat dissipation block 224, the second connection column 223, the first substrate 11, and the second substrate 21 are connected to form a heat dissipation frame, which can play other roles besides the heat conduction role, and the structures of the heat dissipation frame may also be different according to the roles played.
In this embodiment, the heat dissipation frame plays a role of dissipating heat, so that only the first heat dissipation block 124 needs to be connected to the first component 122 and the first connection post 123, and the second heat dissipation block 224 needs to be connected to the second component 222 and the second connection post 223. Wherein, the first heat dissipation blocks 124 connecting different first components 122 may be separately arranged or connected to each other; the second heatsinks 224 connecting different second components 222 may be separately disposed or may be connected to each other. In this embodiment, the first heat sink 10 is similar to the first package 10 of the package structure shown in fig. 4, and is connected with the first heat slug 124 connected with the different first component 122 as a whole; the second heat radiator 20 is similar to the first package 10 of the package structure shown in fig. 5, and the second heat dissipation blocks 224 connected with different second components 222 are arranged at intervals.
In this embodiment, since the first heat dissipation block 124, the first connection pillar 123, the second heat dissipation block 224, and the second connection pillar 223 are made of metal materials, and have higher strength compared with the first packaging material layer 121 and the second packaging material layer 221, the heat dissipation frame formed by the first heat dissipation block 124, the first connection pillar 123, the second heat dissipation block 224, and the second connection pillar 223 can also be used as a support frame in the package structure 100, so as to improve the strength of the package structure 100 and prevent the package structure 100 from being damaged by external pressure.
In this embodiment, the second heat slug 224 is located on a surface of the second component 222 departing from the second substrate 21, the second connection column 223 is close to the edge of the second package body 20 relative to the second component 222, the second heat slug 224 is connected with the second connection column 223 to form a frame structure covering the surface of the second component 222 departing from the second substrate 21, the frame structure can enhance the strength inside the package structure 100, and the package structure 100 is prevented from being damaged by external force.
It is understood that in some other embodiments of the present application, the second connection stud 223 may be partially disposed near the edge of the first package body 10 relative to the second component 222, and may also be partially disposed at any other position of the second substrate 21. For example, the second connection post 223 may be disposed between adjacent second components 222 on the second substrate 21. By increasing the number of the second connection posts 223 connected to the second substrate 21 in the package structure 100, the heat transmission path of the second component 222 to the second substrate 21 can be increased, and the heat conduction efficiency of the second component 222 is improved. Moreover, the occupied volume of the second connection posts 223 in the second encapsulation layer 22 can be increased, and the strength of the package structure 100 can be enhanced.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a package structure 100 according to another embodiment of the present application. In this embodiment, the first package 10 and the second package 20 have a structure similar to that of the first package 10 shown in fig. 4, that is, the second heatsinks 224 connected to different second components 222 are connected into a whole, that is, all the second heatsinks 224 are connected into a whole. In addition, in the present embodiment, at least a portion of the first connection post 123 connected to the first heat slug 124 is electrically connected to the second connection post 223 connected to the second heat slug 224, so that the first heat slug 124 and the first connection post 123 are connected to the second heat slug 224 and the second connection post 223 as a whole. When at least one first connecting column 123 or at least one second connecting column 223 of the first radiating block 124, the first connecting column 123 and the second radiating block 224, and the second connecting column 223 which are connected into a whole are grounded, the first radiating block 124, the first connecting column 123, the second radiating block 224, and the second connecting column 223 can form a faraday electromagnetic shield. Specifically, at least one first connection column 123 or at least one second connection column 223 is grounded, and the integrally connected first heat sink 124 can be electrically connected with the grounded first connection column 123 or the grounded second connection column 223, so that the integrally connected first heat sink 124 is grounded. In other words, the integrally connected first heat dissipation block 124 can be directly connected with the grounded first connection post 123, so that the integrally connected first heat dissipation block 124 can be grounded; alternatively, the integrally connected first heat dissipation slug 124 can be connected with the grounded first connection post 123 through the connection layer 30, so that the integrally connected first heat dissipation slug 124 can be grounded. And, the integrally connected second heat dissipation block 124 can be electrically connected with the grounded first connection post 123 or the grounded second connection post 223, thereby grounding the integrally connected second heat dissipation block 124. In other words, the integrally connected second heat slug 124 can be directly connected with the grounded first connection post 123, so that the integrally connected second heat slug 224 can be grounded; alternatively, the integrally connected second heat dissipation block 224 can be connected to the grounded first connection post 123 through the connection layer 30, so that the integrally connected second heat dissipation block 224 can be grounded. The arrows in fig. 6 illustrate the direction of the ground return generated by the functional system of the package structure 100 from the components back to the power supply. In this embodiment, at least two external pins 13 of the external pins 13 on the first substrate 11 are grounded, and the ground signal returned by the first component 122 can be transmitted to the grounded external pins 13 through the wiring layer 112 of the first substrate 11 or transmitted to the grounded external pins 13 through the first heat slug 124 and the first ground stud 123. The return ground signal of the second component 222 can be transmitted to the second connection post 223 through the wiring layer 112 of the second substrate 11 or the second heat dissipation block 224, and then sequentially transmitted to the external pin 13 connected to the ground through the second connection post 223, the connection portion 30, the first connection post 123 and the wiring layer 112 of the first substrate 11, so that the heat dissipation frame formed by integrally connecting the first heat dissipation block 124, the first connection post 123, the second heat dissipation block 224 and the second connection post 223 forms a low-impedance ground network path, and the path can form a good faraday electromagnetic shield. In addition, in this embodiment, the first heat slug 124 is located on a side of the first component 122 away from the first substrate 11, the first connection pillar 123 is close to an edge of the first package 10 relative to the first component 122, and the first heat slug 124 is connected to the first connection pillar 123 to form a frame structure covering the side of the first component 122 away from the first substrate 11; the second heat slug 224 is located on a surface of the second component 222 departing from the second substrate 21, the second connection column 223 is close to the edge of the second package body 20 relative to the second component 222, and the second heat slug 224 is connected with the second connection column 223 to form a frame structure covering the surface of the second component 222 departing from the second substrate 21. When the first connection post 123 or the second connection post 223 is grounded through the external pin 13, and the frame structure forms a faraday electromagnetic shield, it can well isolate the first component 122 in the package structure 100 from the second component 222 in the package structure 100, and electromagnetic interference from the environment outside the package structure 100 to the second component 222 in the package structure 100.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a package structure 100 according to another embodiment of the present application. In this embodiment, the structures of the first package 10 and the second package 20 are similar to the structure of the first package 10 shown in fig. 5, that is, the first component 122, the first heat slug 124 and the first connection pillar 123 are all plural, the plural first heat slugs 124 are arranged at intervals, and the first component 122 and the first connection pillar 123 connected to different first heat slugs 124 are different. The number of the second components 222, the second heat dissipation blocks 224 and the second connection columns 223 is multiple, the second heat dissipation blocks 224 are arranged at intervals, and the second components 222 and the second connection columns 223 connected with the different independently arranged second heat dissipation blocks 224 are different. The arrows in fig. 7 illustrate the direction of the ground return generated by the functional system of the package structure 100 from the components back to the power supply. In this embodiment, the external pin 13 connected to the first connection post 123 on the first substrate 11 is electrically connected to the power module, that is, a power signal is input to the first connection post 123, the power signal input to the first connection post 123 is transmitted to the first component 122 through the first heat dissipation block 124 connected to the first connection post 123, so as to supply power to the first component 122, and is transmitted to the second component 222 through the second connection post 223 connected to the first connection post 123 and the second heat dissipation block 224, so as to supply power to the second component 222. In other words, in the present embodiment, the heat dissipation frame not only plays a role of heat dissipation and supporting frame, but also can be used as a power network to supply power to the first component 122 and the second component 222.
It is understood that in some embodiments, the first heat slug 124 and the first connection post 123 connected to different first components 122 may be connected to different external leads 13, and the second heat slug 224 and the second connection post 223 connected to different second components 222 may be connected to different external leads 13. Different external modules connected to the external pins 13 are different, so that different signals are provided for the components connected to the external modules through different first heat dissipation blocks 124 and different second heat dissipation blocks 224. For example, part of the external connection pin 13 is electrically connected to the antenna module 200, so that the first component 122 or the second component 222 connected to the external connection pin 13 communicates with the antenna module 200; part of the external connection pins 13 is electrically connected with the sensor module 400 so that the first component 122 or the second component 222 connected to the external connection pins 13 communicates with the sensor module 400. In this embodiment, by disposing the first connection post 123 and the first heat slug 124, and the second connection post 223 and the second heat slug 224 in the package structure 100, and provides a signal to the first component 122 through the first connection post 123 and the first heat slug 124, the second component 222 is provided with signals through the second connection post 223 and the second heat slug 224, the transmission path of the signals in the package structure 100 is increased, so that in addition to signal distribution to different first components 122 or different second components 222 through the substrate, signals can be distributed to different first components 122 or different second components 222 through the first connection post 123, the first heat slug 124 and the second connection post 223 and the second heat slug 224, i.e., through the first connection post 123, the first heat slug 124, and the second connection post 223, the second heat slug 224, signal redistribution within the package structure 100 can also be achieved.
Referring to fig. 8, fig. 8 is a schematic structural diagram illustrating a package structure according to another embodiment of the present application. The difference between this embodiment and the embodiment shown in fig. 3 is that: one surface of the second substrate 21 facing away from the second package layer 22 is provided with an external pin 23, and the external pin 23 is used for electrically connecting with an external structure of the package structure 100. The external leads 23 are connected to the wiring layer 212, so that the second substrate 21 can be electrically connected to the external structures (e.g., functional modules of the electronic device 1000) of the package structure 100 through the external leads 23, and the structure (e.g., the second component 222) electrically connected to the second substrate 21 in the package structure 100 is electrically connected to the external structures of the package structure 100. Since the second heat slug 224 and the second connection post 223 can conduct electricity, and the second connection post 223 is connected to the second substrate 21, in some embodiments, a signal can be input to the second connection post 223 through the second substrate 21, and the signal can be transmitted to the second component 222 through the second connection post 223 and the second heat slug 224. In this embodiment, the second connection column 223 is connected to the external connection pin 23 of the second substrate 21 through the wiring layer 112 on the second substrate 21, the external connection pin 23 is connected to the external connection structure of the package structure 100, and the external connection structure of the package structure 100 sequentially passes through the external connection pin 23, the second substrate 21, the second connection column 223, and the second heat dissipation block 224 to communicate with the corresponding second component 222. Or, the external connection structure of the package structure 100 is connected to the external connection pin 13 of the first substrate 11, and the external connection structure of the package structure 100 communicates with the corresponding second component 222 sequentially through the external connection pin 13, the first substrate 11, the first connection column 123, the second connection column 223, and the second heat dissipation block 224.
Since the second connection post 223 is electrically connected to the first connection post 123, the signal transmitted through the external pin 23 may also be transmitted to the first component 122 through the second connection post 223, the first connection post 123, and the first heat dissipation block 124 in sequence, so as to implement communication between the first component 122 and the external structure of the package structure 100.
In the embodiment of the present application, because the surface of first substrate 11 that deviates from first encapsulation layer 12 is equipped with external pin 13, the surface of second substrate 21 that deviates from second encapsulation layer 22 is equipped with external pin 23, make the signal both can transmit through first substrate 11 side, also can transmit through second substrate 21, for the mode that only sets up external pin 13 at the unilateral (like first substrate 11), the quantity of external pin 13 increases, thereby can increase the density of leading out the signal in whole packaging structure 100, increase the quantity of the components and parts in packaging structure 100, improve the integrated quantity of the components and parts in packaging structure 100, be convenient for realize the miniaturization and the diversified promotion of function of electronic device 1000. In addition, compared with the method of only disposing the external pins 13 on one side, the components in the package structure 100 can be connected to the external pins 13 on the first substrate 11 and the external pins 23 on the second substrate 21, so that the flexibility of the arrangement of the components and the traces in the package structure 100 can be increased, and the design of the package structure 100 can be simplified.
Referring to fig. 9, fig. 9 is a schematic structural diagram of another embodiment of the present application. The difference between this embodiment and the embodiment shown in fig. 3 is that: in this embodiment, the first components 122 in the first package layer 12 are stacked in the thickness direction of the package structure 100, and the first heat slug 124 is in contact with the first component 122 farthest from the first substrate 11 in the stacked first components 122. Here, the thickness direction of the package structure 100 refers to a direction perpendicular to the first substrate 11 toward the surface of the first package layer 12, i.e., the Y direction shown in fig. 9.
In this embodiment, there are three first components 122 packaged in the first packaging layer 12, and the three first components 122 are the first component 122a, the first component 122b and the first component 122c, respectively. The first component 122a and the first component 122b are disposed on the first substrate 11 and directly connected to the first substrate 11. The first component 122a and the first component 122b are stacked in the thickness direction of the package structure 100, that is, the first component 122c is stacked on a surface of the first component 122a facing away from the first substrate 11. In addition, in the embodiment, the first component 122c is connected to the first substrate 11 through the connection post 125 to electrically connect the first component 122c to the first substrate 11, and a portion of heat generated by the first component 122c can be transmitted to the first substrate 11 through the connection post 125. In this embodiment, the first heat slug 124 contacts the surface of the first component 122c away from the first substrate 11, and a part of the heat generated by the operation of the first component 122c is transmitted to the first substrate 10 through the first heat slug 124 and the first connection post 123, and then transmitted out.
In some embodiments, an end of the connection post 125 facing away from the first component 122c is connected to the first component 122a, so as to enable an electrical connection between the first component 122c and the first component 122a, and enable a portion of heat of the first component 122a to pass through the first component 122c and then be transferred to the first heat slug 124, or enable a portion of heat generated by the first component 122c to pass through the first component 122a and then be transferred to the first substrate 11.
It is understood that the number of the first components 122 stacked in the first package layer 12 is not limited in the present application, and three, four or more first components 122 may be stacked according to actual requirements.
In the embodiment of the present application, a part of the first components 122 in the first encapsulation layer 12 is stacked in the thickness direction of the package structure 100, so that the components are stacked in the thickness direction of the package structure 100, thereby increasing the density of the components in the package structure 100. When the same number of first components 122 are packaged in the first package layer 12, since a portion of the first components 122 are stacked in the thickness direction of the package structure 100, compared to the package structure 100 (such as the package structure 100 shown in fig. 3) in which the first components 122 are all directly connected to the first substrate 11, the size of the first substrate 11 can be reduced, and the occupied area of the package structure 100 can be reduced.
It is understood that in some other embodiments of the present application, the second component 222 may also be stacked in the thickness direction of the package structure 100, so as to further increase the density of components in the package structure 100, and utilize the space in the thickness direction of the package structure 100 to reduce the occupied area of the package structure 100. When the package structure 100 is applied to the electronic device 1000, the size of the electronic device 1000 can be reduced due to the small occupied area, and the electronic device 1000 can be miniaturized. Moreover, because the density of the components in the package structure 100 is increased, compared with the package structure 100 shown in fig. 3, when the size of the package structure 100 is the same, the number of the components that can be packaged in the package structure 100 is greater, which is favorable for improving the function diversity of the electronic device 1000.
Referring to fig. 10, fig. 10 is a schematic view of a package structure 100 according to another embodiment of the present application. The difference between this embodiment and the embodiment shown in fig. 9 is that: the first package layer 12 further has a third substrate 126, and the connection post 124 is supported between the third substrate 126 and the first substrate 11 and electrically connected to the first substrate 11 and the third substrate 126. The surface of the third substrate 126 facing the first substrate 11 and/or the surface facing away from the first substrate 11 may be provided with the first component 122 to fully utilize the space in the thickness direction of the package structure 100. Also, a plurality of (two or more) first components 122 may be provided on the third substrate 126, and electrical connection between at least some of the first components 122 provided on the third substrate 126 may be achieved through the third substrate 126. In this embodiment, the first component 122c is supported on the surface of the first substrate 11 facing the first package layer 12 through the connection post 125, and a space can be formed between the first component 122c and the first substrate 11 to dispose the first component 122a, so that the space in the thickness direction of the package structure 100 is fully utilized, and the density of components in the package structure 100 is improved.
In some embodiments, a third substrate 126 may also be disposed in the second encapsulation layer 22, and the third substrate 126 is supported between the second substrate 21 and the third substrate 126 through the connection posts 125 and electrically connects the second substrate 21 and the third substrate 126. The second component 222 is disposed on a surface of the third substrate 126 facing the second substrate 21 and/or a surface facing away from the second substrate 21. In this embodiment, a plurality of second components 222 may be disposed on the third substrate 126, and the third substrate 126 is used to electrically connect at least some of the second components 222 disposed on the third substrate 126. In this embodiment, the third substrate 126 is provided in the first package layer 12, so that the first component 122 can be provided on both opposite surfaces of the third substrate 126. In addition, the third substrate 126 is disposed in the second encapsulation layer 22, so that the second component 222 can be disposed on both opposite surfaces of the third substrate 126, thereby fully utilizing the space in the thickness direction of the package structure 100 and increasing the density of components in the package structure 100.
It is understood that, in some embodiments, the third substrate 126 may be disposed only in the second encapsulation layer 22, and the third substrate 126 is not disposed in the first encapsulation layer 12, that is, the second component 222 in the second encapsulation layer 22 is stacked in the thickness direction of the encapsulation structure 100, and the first component 122 in the first encapsulation layer 12 is disposed on the first substrate 11.
In some embodiments, one end of the connection post 124 is connected to the third substrate 126, and the other end may be connected to the first component 122 stacked with the third substrate 126 in the thickness direction and closest to the third substrate 126. Alternatively, one end of the connection post 125 may be connected to the third substrate 126, and the other end may be connected to the first component 122 stacked with the third substrate 126 in the thickness direction and closest to the third substrate 126.
Referring to fig. 11, fig. 11 shows another package structure 100 according to the present application. The difference between the present embodiment and the package structure 100 of the embodiment shown in fig. 3 is: the connection layer 30 also includes a thermally conductive mass 32. The thermal conductive bump 32 is located between the surface of the first heat slug 124 exposed from the first packaging material layer 121 and the surface of the second heat slug 224 exposed from the second packaging material layer 221. The thermal conductive block 32 is connected between the first heat slug 124 and the second heat slug 224, and is used for realizing heat transfer between the second heat slug 224 and the second package 20, increasing the transmission speed of heat between the first package 10 and the second package 20, and increasing the heat soaking efficiency in the package structure 100. In addition, the thermal conductive block 32 is disposed between the surface of the first heat dissipation block 124 exposed out of the first package material layer 121 and the surface of the second heat dissipation block 224 exposed out of the second package material layer 221, that is, the thermal conductive block 32 is added between the first package 10 and the second package 20, so that the connection and fixation strength between the first package 10 and the second package 20 can be further improved. The first heat conduction block 32 may be one or more blocks, and the plurality of first heat conduction blocks 32 are arranged at intervals. The first heat conduction block 32 may be a heat conduction structure such as a solder joint or a heat conduction adhesive layer. In this embodiment, the first heat-conducting block 32 is the same as the sub-connecting block 31 and is a welding point, so as to simplify the manufacturing process.
Referring to fig. 12, fig. 12 shows another package structure 100 according to the present application. The difference between this embodiment and the embodiment shown in fig. 3 is that: the side of the second package body 20 facing away from the first package body 10 is covered with a heat conductive adhesive layer 23, and the heat conductive adhesive layer 23 is used for transmitting heat. In this embodiment, the second substrate 21 of the second package body 20 is located on a surface of the second substrate 21 away from the second package layer 22 and away from the first package body 10, and the thermal conductive adhesive layer 23 is located on a surface of the second substrate 21 away from the second package layer 22. In addition, in the present embodiment, the thermal conductive adhesive layer 23 covers a surface of the second substrate 21 away from the second package body 20. The thermal conductive adhesive layer 23 can be used to adhere the package structure 100 to a heat dissipation structure in the electronic device 1000, so as to fix the package structure 100 in the electronic device 1000, and enable heat to be transmitted to the heat dissipation structure through the second substrate 21 and the thermal conductive adhesive layer 23, thereby enhancing the heat dissipation efficiency of the package structure 100.
In this embodiment, a part of the insulating layer 111 on a side of the second substrate 21 away from the second package layer 22 is hollowed out to expose a part of the routing layer 112, and when the thermal adhesive layer 23 covers the second substrate 21 away from the second package layer 22, the thermal adhesive layer 22 can directly contact the exposed part of the routing layer 112. Because the thermal conductivity coefficient of the thermal conductive adhesive layer 23 is higher than that of the insulating layer 111, heat generated by the operation of the components in the package structure 100 of the embodiment can be more quickly transmitted out through the thermal conductive adhesive layer 23. It is understood that, in some embodiments of the present application, the insulating layer 111 on the side of the second substrate 21 away from the second encapsulation layer 22 may be directly removed, and the thermal conductive adhesive layer 23 is covered, so that the heat transmitted by the routing layer 112 is transmitted as soon as possible. It should be noted that the thermal conductive adhesive layer 23 is formed of an insulating thermal conductive material.
In some embodiments, a release film 24 is disposed on a side of the thermal adhesive layer 23 facing away from the second encapsulation layer 22. When the package structure 100 is fixed to the middle frame 900, the release film 24 is directly removed, and the thermal conductive adhesive layer 23 is adhered to the middle frame 900, which is simple to operate.
Referring to fig. 13, fig. 13 is a partial cross-sectional view illustrating the package structure 100 of the embodiment shown in fig. 12 disposed in an electronic device 1000. In this embodiment, the electronic device 1000 includes a middle frame 900 and a main board 800, where the middle frame 900 is used for dissipating heat of the electronic device 1000. The package structure 100 is disposed between the main board 800 and the middle frame 900. The first substrate 11 of the package structure 100 is connected to the motherboard 800 through the external pins 13, so that the package structure 100 and the first substrate 11 are fixed and electrically connected. The thermal conductive adhesive layer 23 of the package structure 100 contacts the middle frame 900 to fix the package structure 100 and the middle frame 900. In this embodiment, the heat generated by the operation of the components in the package structure 100 can be transmitted to the first substrate 11 and transmitted to the motherboard 800 through the external pins 13, and the heat is dispersed to each position of the motherboard 800 and each working module connected to the motherboard 800 through the motherboard 800, thereby preventing the heat from being concentrated at the package structure 100 and causing damage. Moreover, heat generated by the operation of the components in the package structure 100 can be transmitted to the second substrate 21, and then transmitted to the middle frame 900 through the thermal conductive adhesive layer 23, and the heat is dissipated out of the electronic device 1000 through the middle frame 900.
Referring to fig. 14, fig. 14 is a schematic structural diagram of a package structure 100 according to another embodiment of the present application. The difference between this embodiment and the embodiment shown in fig. 3 is that: the second package body 20 further comprises a third package layer 25. The third encapsulant 25 is encapsulated on a surface of the second substrate 21 away from the second encapsulation layer 22. The third encapsulation layer 25 includes a third encapsulation material layer 251 and one or more third components 252 embedded within the third encapsulation material layer 251. Each third component 252 is electrically connected to the second substrate 21. In this embodiment, a plurality of third devices 252 are embedded in the third packaging material layer 251.
In this embodiment, each third component 252 is disposed on the second substrate 21 and directly connected to the second substrate 21, that is, the pins of the third component 252 are directly connected to the second substrate 21. It is understood that in some embodiments of the present application, the third component 252 may also be indirectly connected to the second substrate 21 through the connection posts. Alternatively, in some embodiments, the third component 252 is stacked in the thickness direction of the package structure 100. Some of the stacked third devices 252 are directly electrically connected to the second substrate 21, and other portions of the third devices 252 are indirectly electrically connected to the second substrate 21 through the third devices 252 directly connected to the second substrate 21, or indirectly electrically connected to the second substrate 21 through connection posts.
In this embodiment, the third encapsulating layer 25 is encapsulated on the surface of the second substrate 21 departing from the second encapsulating layer 22, that is, the encapsulating layers are disposed on the two opposite surfaces of the second substrate 21, so as to increase the number of the components stacked in the thickness direction of the encapsulating structure 100, and increase the number of the components in the encapsulating structure 100 while reducing the occupied area of the encapsulating structure 100 applied to the electronic device 1000, thereby facilitating the miniaturization and the multi-functionalization of the electronic device 1000.
Referring to fig. 15, fig. 15 is a schematic structural diagram illustrating a package structure 100 according to another embodiment of the present application. In this embodiment, the third packaging layer 25 further includes a plurality of third connection pillars 253 and one or more third heat dissipation bumps 254, and all of the third connection pillars 253 and all of the third heat dissipation bumps 254 are embedded in the third packaging material layer 251. One end of each third connection pillar 253 is connected to the second substrate 21, the other end of each third connection pillar 253 extends to the surface of the third packaging layer 25, which faces away from the second substrate 21, each third heat dissipation block 254 is connected with at least one third connection pillar 253, each third heat dissipation block 254 is connected with one or more third components 252, so that the third components 252 and the third connection pillars 253 can be connected through the third heat dissipation blocks 254, and the heat of the third components 252 can be transmitted to the third connection pillars 253 through the third heat dissipation blocks 254.
In this embodiment, part of the heat generated by the third component 252 can be directly transmitted to the second substrate 21, and part of the heat can be transmitted to the second substrate 21 through the third heat dissipation block 254 and the third connection pillar 253 in sequence, so that the heat transmission path of the third component 252 is increased, and thus the heat generated by the operation of the third component 252 can be transmitted to other positions of the package structure 100 more quickly, and the heat concentration is avoided. Moreover, the heat generated by the second substrate 21 can be transmitted to the first substrate 11 through the second connection posts 223 and the first connection posts 123 in sequence, and transmitted to the outside of the package structure 100 through the external pins 13 of the first substrate 11, thereby achieving heat dissipation. It is understood that in the present embodiment, the heat generated by the second component 222 in the second packaging layer 22 and the first component 122 in the first packaging layer 12 can also be transmitted to the third packaging layer 25, so as to achieve heat equalization in the packaging structure 100, avoid heat accumulation at a certain position in the packaging structure 100, and avoid damage to the packaging structure due to heat accumulation.
In some embodiments of the present disclosure, the surface of the third heat slug 254 facing away from the second substrate 21 exposes the third packaging material layer 251, so as to simplify the manufacturing process. In some embodiments, the third encapsulating layer 25 covers the thermal adhesive layer 23 on the side facing away from the second substrate 21. Since the surface of the third connection pillar 253 facing away from the third substrate 126 exposes the third packaging material layer 251, the third connection pillar 253 can contact the thermal conductive adhesive layer 23 to transmit a portion of heat in the package structure 100 to the thermal conductive adhesive layer 23 through the third connection pillar 253. When the package structure 100 is disposed in the electronic device 1000, the thermal conductive adhesive layer 23 can fix the package structure 100 on the heat dissipation structure in the electronic device 1000, and the heat generated in the package structure 100 can be transmitted to the heat dissipation structure in the electronic device 1000 through the thermal conductive adhesive layer 23.
In this embodiment, since the third heat dissipation block 254 is exposed from the surface of the second substrate 21 to the third packaging material layer 251, when the thermal conductive adhesive layer 23 covers the side of the third packaging layer 25 away from the second substrate 21, the third heat dissipation block 254 is in direct contact with the thermal conductive adhesive layer 23, so that heat generated by the third component 252 can be more rapidly transmitted to the thermal conductive adhesive layer 23, and transmitted to the heat dissipation structure outside the package structure 100 through the thermal conductive adhesive layer 23, thereby improving the heat dissipation efficiency of the package structure 100.
Referring to fig. 16, fig. 16 is a schematic structural diagram of a package structure 100 according to another embodiment of the present application. The difference between this embodiment and the embodiment shown in fig. 3 is that: the surface of the first heat slug 124 facing away from the first substrate 11 exposes the first packaging material layer 121, the surface of the second heat slug 224 facing away from the second substrate 21 exposes the second packaging layer 22, the surface of the first heat slug 124 facing away from the first packaging layer 12 contacts the surface of the second heat slug 224 facing away from the second packaging layer 22, and the first heat slug 124 and the second heat slug 224 form an integrated structure. In this embodiment, the formation of the first heat dissipation block 124 and the second heat dissipation block 224 as an integral structure means: the first heat slug 124 and the second heat slug 224 can be fixedly connected by intermolecular forces between the first package body 10 and the second package body 20. Specifically, the surface of the first heat dissipation block 124 exposed out of the first package layer 12 is contacted with the surface of the second heat dissipation block 224 exposed out of the second package layer 22, and the contact interface is heated and pressurized, so that an intermolecular force is generated between the surface of the first heat dissipation block 124 exposed out of the first package layer 12 and the surface of the second heat dissipation block 224 exposed out of the second package layer 22, thereby forming the first heat dissipation block 124 and the second heat dissipation block 224 into an integrated structure. In this embodiment, the surface of the first connection pillar 123 exposed by the first packaging material layer 121 contacts the surface of the second connection pillar 223 exposed by the second packaging material layer 221, and the fixation is realized by intermolecular force between the first connection pillar 123 and the second connection pillar 223.
In this embodiment, the first connection post 123, the second connection post 223, the first heat slug 124, and the second heat slug 224 are all formed of copper. In this embodiment, the first package 10 and the second package 20 are stacked, the surface of the first heat slug 124 exposed out of the first package layer 12 contacts the surface of the second heat slug 224 exposed out of the second package layer 22, the surface of the first connection column 123 exposed out of the first package material layer 121 contacts the surface of the second connection column 223 exposed out of the second package material layer 221, and the package structure 100 is heated and pressurized to generate an intermolecular force of copper-copper bonding between the first heat slug 124 and the second heat slug 224, so that the first package 10 and the second package 20 are fixed together by bonding. Furthermore, intermolecular forces of copper-copper bonding are generated between the first connection post 123 and the second connection post 223, so as to fix and electrically connect the first connection post 123 and the second connection post 223.
In some embodiments, the surface of the first heat slug 124 facing away from the first substrate 123 slightly protrudes from the surface of the first packaging material layer 121 facing away from the first substrate 123, and the surface of the second heat slug 224 facing away from the second substrate 223 slightly protrudes from the surface of the second packaging material layer 221 facing away from the second substrate 223, so that when the package structure 100 is heated and pressurized, the first packaging material layer 121 and the second packaging material layer 221 do not affect the close contact between the first heat slug 124 and the second heat slug 224, thereby avoiding the influence caused by intermolecular force between the first heat slug 124 and the second heat slug 224.
In this embodiment, since the first connection post 123, the second connection post 223, the first heat dissipation block 124 and the second heat dissipation block 224 are formed by the same material, and the first heat dissipation block 124 is connected to the first connection post 123, and the second heat dissipation block 224 is connected to the second connection post 223, the first connection post 123 may not be disposed opposite to the second connection post 223, but correspond to the position of the first heat dissipation block 124, that is, when the first package 10 and the second package 20 are stacked, one end of the first connection post 123 exposed out of the first package material layer 121 contacts with the second heat dissipation block 224, so that the signal transmitted in the first connection post 123 can be transmitted to the second connection post 223 through the second heat dissipation block 224. Alternatively, in some embodiments, it is also possible that when the first package 10 and the second package 20 are stacked, one end of the second connection pillar 223 exposed by the second packaging material layer 221 contacts the first heat slug 124, so that the signal transmitted in the first connection pillar 123 can be transmitted to the second connection pillar 223 through the first heat slug 124. When the first connecting pillar 123 contacts the second heat slug 224, the first connecting pillar 123 and the second heat slug 224 can generate intermolecular force under certain conditions, so that the first package 10 and the second package 20 are fixed and electrically connected; or, when the second connection pillar 223 contacts the first heat slug 124, the second connection pillar 223 and the first heat slug 124 can generate intermolecular force under certain conditions, so that the first package body 10 and the second package body 20 are fixed and electrically connected.
Referring to fig. 17, fig. 17 illustrates another package structure 100 according to the present application. The difference between this embodiment and the embodiment shown in fig. 3 is that: the second substrate 21 is located on a side of the second encapsulation layer 22 facing the first substrate 11, and the first connection posts 123 are electrically connected with the second substrate 21. In this embodiment, the second substrate 21 is provided with a pad connected to the routing layer 112 of the second substrate 21, and the surface of the first connection pillar 123 exposed out of the first packaging material layer 121 is connected to the pad on the second substrate 21 through the connection layer 30, so as to electrically connect the first connection pillar 123 to the substrate. In this embodiment, the surface of the first connecting pillar 123 exposed out of the first packaging material layer 121 is the first output terminal 10a of the first package 10, and the pad on the second substrate 21 electrically connected to the first connecting pillar 123 is the second connecting terminal 20 a.
In some embodiments, a side of the second encapsulation layer 22 facing away from the second substrate 21 is covered with a thermal conductive adhesive layer 23. In this embodiment, the surface of the second heat slug 224 facing away from the second substrate 21 exposes the second packaging material layer 221, and the surface of the second connection post 223 facing away from the second substrate 21 exposes the second packaging material layer 221. When covering on the second package layer 22, the thermal conductive adhesive layer 23 can directly contact with the second heat dissipation block 224 and the second connection column 223, so that the heat transmitted from the second heat dissipation block 224 and the heat transmitted to the second connection column 223 can be quickly dissipated through the thermal conductive adhesive layer 23, and the heat dissipation efficiency of the package structure 100 is improved.
The present application further provides a method for manufacturing the package structure 100. Referring to fig. 18, fig. 18 is a flowchart illustrating a process for manufacturing the package structure 100 of the embodiment shown in fig. 3. The method for forming the package structure 100 includes forming the first package 10 and the second package 20, and then connecting the first package 10 and the second package 20 through the connection layer 30 to achieve the fixed connection and the electrical connection between the first package 10 and the second package 20. The method for forming the first package 10 may include:
step 110: referring to fig. 19a, the first connecting pillar 123 and the first component 122 are fixed on the first substrate 11. While in other embodiments of the present application, the first component 122 in the first encapsulation layer 12 is stacked in the thickness direction, step 110 is to fix the first connection pillar 123 and a portion of the first component 122 on the first substrate 11.
In this embodiment, the first connection post 123 may be fixed to the first substrate 11 by means of conductive adhesive or solder, so that the first connection post 123 and the first substrate 11 are fixed and electrically connected. The first component 122 may be fixed on the first substrate 11 by a method such as a die bonding or a bonding method, so as to fix and electrically connect the first component 122 and the first substrate 11.
In some embodiments, when the first component 122 is a chip and the chip is fixed on the first substrate 11 by a face-up method, that is, the leads of the chip are located on the surface of the chip away from the first substrate 11, before the chip is fixed and electrically connected to the first substrate 11 by the bonding wires 1221, the metal sheet 125 needs to be attached to the surface of the chip away from the first substrate 11 by gluing or welding. In this embodiment, the metal sheet 125 is made of the same material as the first connection post 123 and the first heat dissipation block 124. It is understood that in some embodiments, the material of the metal sheet 125 may also be different from the material of the first connection post 123 or the first heat dissipation block 124.
Step 120: referring to fig. 19b, a first packaging material layer 121 is packaged on a surface of the first substrate 11 on which the first connecting pillar 123 and the first component 122 are disposed, such that the first connecting pillar 123 and the first component 122 are embedded in the first packaging material layer 121. The first packaging material layer 121 is a packaging material such as resin.
Step 130: referring to fig. 19c, a groove is formed on the surface of the first packaging material layer 121 facing away from the first substrate 11 to expose a surface of the first connection pillar 123 facing away from the first substrate 11 and a surface of the first component 122 facing away from the first substrate 11. When the surface of the first component 122 facing away from the first substrate 11 is provided with a metal sheet, in step 130, a groove is formed in the first packaging material layer 121 to expose the metal sheet provided on the surface of the first component 122.
In this embodiment, the groove is formed by laser grooving, and the depth of the laser grooving can be controlled according to specific requirements. When the chip is fixed in a normal mounting mode, the active surface of the chip is far away from the first substrate 11. When laser grooving is performed, the grooving position is located above the chip, so that in order to avoid the problem that the chip is damaged due to insufficient control accuracy of the grooving depth, a metal sheet is formed on one surface of the normally-installed chip, which is away from the first substrate 11, and the laser grooving is performed until the metal sheet 125 is exposed, so that the damage of the laser grooving to the chip can be avoided. It will be appreciated that in other embodiments of the present application, the recess may be formed by stamping or the like.
Step 140: referring to fig. 19d, a metal layer 126 is formed on a side of the first packaging material layer 121 away from the first surface, and the metal layer 126 covers a surface of the first packaging material layer 121 away from the first substrate 11 and fills the groove formed in step 130.
Step 150: referring to fig. 19e, the metal layer 126 is thinned to a suitable thickness, and the first heat slug 124 connecting the first component 122 and the first connection pillar 123 is obtained. In this embodiment, the surface of the thinned metal layer 126 away from the first substrate 11 is a plane, so as to facilitate the processing in the subsequent steps. It is understood that in some embodiments, step 150 may not be present.
The method of forming the second package 20 is similar to the method of forming the first package 10, including:
step 210: referring to fig. 19f, a second connecting post 223 and a second component 222 are fixed on the second substrate 21. While in other embodiments of the present application, the second component 222 in the first packaging layer 12 is stacked in the thickness direction, step 110 is to fix the second connection stud 223 and part of the second component 222 on the second substrate 21.
In this embodiment, the second connection post 223 may be fixed on the second substrate 21 by means of a conductive adhesive or solder, so that the second connection post 223 and the second substrate 21 are fixed and electrically connected. The second component 222 may be fixed on the second substrate 21 by a patch or a bonding method, so as to fix and electrically connect the second component 222 and the second substrate 21.
In some embodiments, when the second component 222 is a chip and the chip is fixed on the second substrate 21 by a face-up method, that is, the leads of the chip are located on the surface of the chip away from the second substrate 21, before the chip is fixed and electrically connected to the second substrate 21 by the bonding wires 1221, the metal sheet 225 needs to be attached to the surface of the chip away from the second substrate 21 by gluing or welding. In this embodiment, the metal sheet 225 is made of the same material as the second connection post 223 and the second heat dissipation block 224. It is understood that in some embodiments, the material of the metal sheet 225 may also be different from the material of the second connection column 223 or the second heat dissipation block 224.
Step 220: referring to fig. 19g, a second packaging material layer 221 is packaged on one surface of the second substrate 21 on which the second connection pillar 223 and the second component 222 are disposed, such that the second connection pillar 223 and the second component 222 are embedded in the second packaging material layer 221. The second encapsulant layer 221 is an encapsulant material such as resin.
Step 230: referring to fig. 19h, a groove is formed on the surface of the second packaging material layer 221 facing away from the second substrate 21 to expose the surface of the second connection pillar 223 facing away from the second substrate 21 and the surface of the second component 222 facing away from the second substrate 21. When the surface of the second component 222 facing away from the second substrate 21 is provided with the metal sheet 225, a groove is formed in the second packaging material layer 221 in step 230 to expose the metal sheet 225 provided on the surface of the second component 222.
In this embodiment, the groove is formed by laser grooving, and the depth of the laser grooving can be controlled according to specific requirements. When the chip is fixed in a normal mounting mode, the active surface of the chip is far away from the second substrate 21. When laser grooving is carried out, the grooving position is located above the chip, so that the problem that the chip is damaged due to insufficient control accuracy of the grooving depth is solved, a metal sheet is formed on one surface, away from the second substrate 21, of the chip which is being mounted, and the laser grooving is carried out until the metal sheet 225 is exposed, so that the damage of the laser grooving to the chip can be avoided. It will be appreciated that in other embodiments of the present application, the recess may be formed by stamping or the like.
Step 240: referring to fig. 19i, a metal layer 226 is formed on a side of the second packaging material layer 221 away from the first surface, and the metal layer 226 covers a surface of the second packaging material layer 221 away from the second substrate 21 and fills the groove formed in step 130.
Step 250: referring to fig. 19j, the metal layer 226 is thinned to a suitable thickness to obtain a second heat slug 224 connecting the second component 222 and the second connection stud 223. In this embodiment, the surface of the thinned metal layer 226 away from the second substrate 21 is a plane, so as to facilitate the processing in the subsequent steps. It is understood that in some embodiments, step 150 may not be present.
It is understood that in some embodiments, when the second package body 20 further includes the third package layer 25, the third package layer 25 is formed by repeating steps 210 to 250 on the side of the second substrate 21 facing away from the second component 222.
Finally, the first package 10 is fixedly connected to the second package 20. In some embodiments, fixedly connecting the first package body 10 and the second package body 20 includes:
step 310: referring to fig. 19k, the first package 10 and the second package 20 are fixedly connected by the connection layer 30, and the first package 10 and the second package 20 are electrically connected.
In some embodiments, the connection layer 30 includes a sub-connection block 31, and the sub-connection block 31 may be formed by solder or conductive paste, that is, the first package 10 and the second package 20 are fixedly connected and electrically connected by soldering or dispensing.
In some embodiments, the step 310 may be replaced by attaching the first packaging material layer 211 of the first package 10 and the second packaging material layer 221 of the second package 20, and applying heat and pressure to the first package 10 and the second package 20 to form an intermolecular force between the first heat slug 124 of the first package 10 and the second heat slug 224 of the second package 20, so as to fixedly and electrically connect the first package 10 and the second package 20.
In the present application, the heat generated by the first component 122 can be partially transmitted directly to the first substrate 11, and partially transmitted to the first substrate 11 through the first heat dissipation block 124 and the first connection post 123 connected to the first component 122. Also, the generated heat of the second component 222 can be partially transmitted directly to the second substrate 22 and partially transmitted to the second substrate 21 through the second heat dissipation block 224 and the second connection post 223 connected to the second component 222. The heat transmission path through first components and parts and second binary device can know, the heat transmission path of first components and parts and second binary device in this application all has a plurality ofly, when first components and parts or second binary device work generate heat, can be through the timely heat transmission away of multiple path to improve packaging structure's heat transmission efficiency, reinforcing packaging structure's radiating effect, thereby can avoid the heat in the three-dimensional encapsulation stack structure too high and influence the normal work of components and parts in the packaging structure or to the damage that components and parts caused in the packaging structure. In the embodiment of the present invention, the first connection post 123 and the second connection post 223 are connected to electrically connect the first package 10 and the second package 20. In addition, heat generated by the components in the first package 10 or the second package 20 can be transferred between the first package 10 and the second package 20, so that heat can be prevented from being accumulated in the first package 10 or the second package 20, and damage caused by heat accumulation in the package structure 100 can be prevented.
In the above, it should be noted that the preferred embodiments of the present application are described by way of example only, and it should be understood that various modifications and improvements can be made by those skilled in the art without departing from the principle of the present application, and such modifications and improvements are also considered to be within the scope of the present application.

Claims (20)

1. A packaging structure is characterized by comprising a first packaging body and a second packaging body stacked on the first packaging body;
the first packaging body comprises a first substrate and a first packaging layer packaged on the first substrate; a plurality of external pins are formed on one side of the first substrate, which is far away from the first packaging layer, and the external pins are used for connecting an external structure of the packaging structure; the first packaging layer comprises a first packaging material layer, one or more first components and a plurality of first connecting columns, wherein the one or more first components and the plurality of first connecting columns are embedded in the first packaging material layer; each first component is electrically connected with the first substrate; one end of each first connecting column is connected with the first substrate, and the other end of each first connecting column extends to the surface, away from the first substrate, of the first packaging material layer; the first connecting column is formed by adopting a heat conducting material;
the second packaging body comprises a second substrate and a second packaging layer packaged on the second substrate; the second packaging layer comprises a second packaging material layer, one or more second components, a plurality of second connecting columns and one or more second heat dissipation blocks, wherein the one or more second components, the plurality of second connecting columns and the one or more second heat dissipation blocks are embedded in the second packaging material layer; each second component is connected with the second substrate; one end of each second connecting column is connected with the second substrate, and the other end of each second connecting column extends to the surface, away from the second substrate, of the second packaging material layer; each second heat dissipation block is connected with at least one second connecting column, and each second heat dissipation block is connected with one or more second components; the second connecting column and the second heat dissipation block are made of heat conduction materials; the second substrate or the second connecting column is connected with the first connecting column.
2. The package structure of claim 1, wherein the first package body comprises one or more first heatslug, each first heatslug connected to at least one of the first connection posts, and each first heatslug connected to one or more of the first components; the first heat dissipation block is formed of a heat conductive material.
3. The package structure of claim 2, wherein each of the first heatsinks is located on a side of the first component facing away from the first substrate, and each of the first connection pillars is located near an edge of the first package body opposite the first component; or
Each second heat dissipation block is located on one surface, deviating from the second substrate, of the second component, and the second connection column is close to the edge of the second packaging body relative to the second component.
4. The package structure of claim 3, wherein at least one of the first connection studs or the second connection studs is grounded, all of the first heatsinks are integrally connected and electrically connected to the grounded first connection studs or the grounded second connection studs, and all of the second heatsinks are integrally connected and electrically connected to the grounded first connection studs or the grounded second connection studs.
5. The package structure of claim 2, wherein the first component, the first heat slug, and the first connection post are all plural, the plural first heat slugs are spaced apart from one another, the first component and the first connection post connected to different first heat slugs are different, and different first heat slugs are used for transmitting different signals; or
The second binary device, the second radiating block and the second connecting column are a plurality of, a plurality of intervals are arranged between the second radiating blocks, the second binary device and the second connecting column are different and different, and the second radiating block is used for transmitting different signals.
6. The package structure of claim 1, wherein a side of the second package body facing away from the first package body is provided with an external pin, and the external pin is used for electrically connecting with an external structure of the package structure.
7. The package structure according to any one of claims 2 to 5, wherein the second encapsulation layer is located on a side of the second substrate facing the first encapsulation layer, and the first connection posts are connected with the second connection posts;
the packaging structure further comprises a connecting layer, wherein the connecting layer is connected between the first packaging layer and the second packaging layer and is connected with the first connecting column and the second connecting column.
8. The package structure according to claim 7, wherein the connection layer includes a plurality of sub-connection blocks arranged at intervals, the first connection posts and the second connection posts are both plural, at least a portion of the first connection posts are arranged opposite to at least a portion of the second connection posts, the sub-connection blocks are connected between the opposite first connection posts and the opposite second connection posts, and the sub-connection blocks are made of a heat-conductive and electrically-conductive material.
9. The package structure of claim 8, wherein a surface of the second heatsink slug facing away from the second substrate exposes the second encapsulation layer, a surface of the first heatsink slug facing away from the first substrate exposes the first encapsulation layer, and the connection layer further comprises a thermal slug connected between the surface of the first heatsink slug facing away from the first encapsulation layer and the surface of the second heatsink slug facing away from the second encapsulation layer.
10. The package structure of any one of claims 2-5, wherein a surface of the second heat slug facing away from the second substrate exposes the second encapsulation layer, a surface of the first heat slug facing away from the first substrate exposes the first encapsulation layer, a surface of the first heat slug exposing the first encapsulation layer contacts a surface of the second heat slug exposing the second encapsulation layer, and the first heat slug and the second heat slug form a unitary structure.
11. The package structure of claim 8 or 9, wherein the second package body further comprises a third package layer, the third package layer being packaged on a side of the second substrate facing away from the second package layer, the third package layer comprising a third layer of packaging material and one or more third components embedded in the third layer of packaging material, each of the third components being connected to the second substrate.
12. The package structure of claim 11, wherein the third encapsulation layer further comprises a plurality of third connection studs and one or more third heat slug embedded within the third encapsulation material layer; one end of each third connecting column is connected to the second substrate, the other end of each third connecting column extends to the surface, deviated from the second substrate, of the third packaging material layer, each third heat dissipation block is connected with at least one third connecting column, and each third heat dissipation block is connected with one or more third elements.
13. The package structure of claim 7, wherein the second substrate comprises a routing layer and an insulating layer overlying a side of the routing layer facing away from the second package layer, the second component being electrically connected to the routing layer; the insulating layer is partially hollow so as to expose part of the wiring layer;
one side of the second substrate, which is far away from the second packaging layer, is covered with a heat-conducting adhesive layer, the heat-conducting adhesive layer is in contact with the exposed part of the wiring layer, and the heat-conducting adhesive layer is used for transmitting heat.
14. The package structure of claim 13, wherein a release film is disposed on a side of the thermal adhesive layer facing away from the second package layer.
15. The package structure of claim 2, wherein the first component comprises a front-mounted chip having a metal sheet laminated to a surface of the front-mounted chip facing away from the first substrate, the first heat slug being connected to the metal sheet; or
The second component comprises a front-mounted chip, a metal sheet is stacked on the surface of the front-mounted chip, which is far away from the second substrate, and the second heat dissipation block is connected to the metal sheet.
16. The package structure according to claim 1, wherein the first component in the first substrate is plural, and at least two of the first components in the plural first components are stacked in a thickness direction of the first package body; or
The second component in the second substrate is a plurality of components, and at least two of the plurality of components are stacked in the thickness direction of the second package body.
17. An electronic device, characterized in that the electronic device comprises a functional module and a package structure according to any of claims 1-16, the functional module being electrically connected to the package structure.
18. The electronic device of claim 17, wherein the electronic device comprises a motherboard, and the package structure and the functional module are fixed on the motherboard and electrically connected to the motherboard; the first substrate of the packaging structure is close to the mainboard relative to the first packaging layer and is electrically connected with the mainboard through the external pins.
19. The electronic device of claim 18, wherein the electronic device comprises a middle frame, the middle frame is disposed opposite to the motherboard, and the package structure is located between the middle frame and the motherboard and connects the middle frame and the motherboard; the second packaging body of the packaging structure is connected with the middle frame on the surface deviating from the first substrate, and the middle frame is used for heat dissipation.
20. The electronic device according to any one of claims 17 to 19, wherein the electronic device is a mobile phone, and the functional module includes one or more of an antenna module, a sensor module, an audio module, a camera module, a connector module, and a power module.
CN201921688729.7U 2019-10-10 2019-10-10 Packaging structure and electronic device Active CN212209463U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112888156A (en) * 2021-01-15 2021-06-01 新余市木林森线路板有限公司 High-thermal-conductivity aluminum-based circuit board and preparation process thereof
WO2023142487A1 (en) * 2022-01-27 2023-08-03 华为数字能源技术有限公司 Packaging module and preparation method therefor, and electronic device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112888156A (en) * 2021-01-15 2021-06-01 新余市木林森线路板有限公司 High-thermal-conductivity aluminum-based circuit board and preparation process thereof
WO2023142487A1 (en) * 2022-01-27 2023-08-03 华为数字能源技术有限公司 Packaging module and preparation method therefor, and electronic device

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