CN212161794U - High-efficiency heat dissipation integrated module - Google Patents
High-efficiency heat dissipation integrated module Download PDFInfo
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- CN212161794U CN212161794U CN202021089565.9U CN202021089565U CN212161794U CN 212161794 U CN212161794 U CN 212161794U CN 202021089565 U CN202021089565 U CN 202021089565U CN 212161794 U CN212161794 U CN 212161794U
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- heat
- heat dissipation
- radiator
- integrated module
- metal layer
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Abstract
The utility model discloses a high efficiency heat dissipation collection moulding piece belongs to the electronic component field. Including radiator, the multiunit power module of setting on the radiator, the heat dissipation base face of setting on power module and the welded metal layer of setting between radiator and heat dissipation base face, the utility model discloses also can have fine radiating effect under compact structure's the condition, simple structure and simple to operate, the installation accuracy is higher and the cost is lower.
Description
Technical Field
The utility model relates to an electronic component field, concretely relates to high efficiency heat dissipation collection moulding piece.
Background
In the power electronic technology, various power modules such as IGBT, MOSFET and the like need to timely and efficiently dissipate heat, so that the power modules can work with high performance, along with the improvement of the integration level of the power modules, the size is smaller, the power is higher, the requirement on heat dissipation is gradually improved, along with the improvement of the heat flux density of a radiator, the part with large heat resistance in the radiator can seriously influence the transmission of heat flux, the temperature gradient changes violently, and the heat-dissipation-affecting factor is important. The traditional radiator and heating device are installed through heat-conducting interface materials such as heat-conducting silicone grease, heat-conducting paste, a heat-conducting silicone pad and the like, the manufacturers of the heat-conducting silicone grease are numerous, the components are relatively complex, the heat-conducting performance is difficult to measure, so that the stability of the quality of the heat-conducting silicone grease is difficult to guarantee, the heat-conducting silicone grease is greatly influenced by the temperature, the humidity, the time of exposure in the air, the coating and installation processes and the like, the heat-conducting performance of the same heat-conducting silicone grease is difficult to obtain stable expectation, and the heat-conducting silicone grease with unstable quality is easy to pulverize and form cavities after long-time work, so that the heat-conducting performance is seriously reduced; the performance of the heat-conducting paste is slightly superior to that of the heat-conducting silicone grease, but the heat-conducting paste is still greatly influenced by the quality, the installation process and the like, and the price is high, so that the cost is increased; the heat-conducting silica gel pad is convenient to install, but is often in millimeter level because self is too thick relative to the heat-conducting silicone grease and the heat-conducting paste, and the heat-conducting silica gel pad can be well attached only by large pressure, so that the heat-conducting performance of the heat-conducting silica gel pad is poor compared with the heat-conducting silicone grease and the heat-conducting paste.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to prior art's not enough, provided a high efficiency heat dissipation collection moulding piece, concrete technical scheme is as follows:
a high-efficiency heat dissipation integrated module comprises a heat radiator, a plurality of groups of power modules arranged on the heat radiator, a heat dissipation base surface arranged on the power modules and a welding metal layer arranged between the heat radiator and the heat dissipation base surface.
Preferably, the power module further comprises a positioning frame which is arranged on the radiator and sleeved outside the power module.
Preferably, the positioning frame is detachably connected with the heat sink.
Preferably, the solder metal layer is fixedly connected to the heat sink and the heat dissipation base surface by soldering, respectively.
Preferably, the heat sink is a heat dissipating fin, a water cooling fin or a cold plate.
Preferably, the number of power modules is one or more.
Preferably, the material used for the solder metal layer is a heat conductive metal.
The utility model discloses following beneficial effect has:
the utility model discloses a set up the welding metal level that is used for heat conduction between radiator and heat dissipation base face, replace traditional heat conduction interface material, make between radiator and the power module with the welding metal level welding together to make great thermal resistance reduce to almost zero between power module and the radiator, and the welding metal level is very thin, the installation is firm, the operation is stable, can not pulverize like heat conduction silicone grease and form the hole, thereby guarantee the transmission of thermal current, make the utility model discloses also can have fine radiating effect under compact structure's the circumstances, the utility model discloses simple structure and simple to operate, the installation accuracy is higher and the cost is lower.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a cross-sectional view of the present invention.
Detailed Description
The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.
Examples
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus once an item is defined in one figure, it is not further defined and explained by advocate in subsequent figures.
In the description of the present invention, it should also be noted that, unless explicitly stated or limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1 to 2, the present invention includes a heat sink 1 for performing heat dissipation operation and a power module 2 disposed on the heat sink 1, wherein the heat sink 1 is used for performing heat dissipation processing on the power module 2 in an operating state. The radiator 1 can be made into a shape required by the motor controller according to the structural requirement, and the type adopted by the radiator 1 is a radiating fin, a water cooling fin or a cold plate. The utility model discloses well power module 2's quantity is one or more to satisfy different machine controller's needs.
Referring to fig. 2, a heat dissipation base surface 3 for contacting the heat sink 1 is provided on the power module 2, and a solder metal layer 4 for heat transfer is provided between the heat sink 1 and the heat dissipation base surface 3. The welding metal layer 4 is made of heat conducting metal with excellent heat conducting performance, and the welding metal layer 4 is fixedly connected with the radiator 1 and the heat dissipation base surface 3 respectively in a welding mode. The utility model discloses a set up welding metal layer 4 that is used for heat conduction between radiator 1 and heat dissipation base face 3, replace traditional heat conduction interface material, make between radiator 1 and the power module 2 with welding metal layer 4 welding together to make great thermal resistance reduce to almost zero between power module 2 and the radiator 1, and welding metal layer 4 is very thin, the installation is firm, the operation is stable, can not pulverize like heat conduction silicone grease and form the hole, thereby guarantee the transmission of thermal current, make the utility model discloses also can have fine radiating effect under compact structure's the condition.
Referring to fig. 1, the utility model discloses still including setting up on radiator 1 and the cover establish the locating frame 5 in the power module 2 outside, locating frame 5 is used for carrying out the complete positioning to welding process in-process power module 2, makes radiator 1 can be in welding metal level 4 welding process, and the condition such as offset, slip can not appear in power module 2. The positioning frame 5 is detachably connected with the heat sink 1. The staff utilizes the locating frame 5 to fix power module 2 earlier, then heats the heat conduction metal and makes the heat conduction metal melt, fills up the heat dissipation base plane 3 of power module 2 and the contact surface of radiator 1, takes off locating frame 5 after the cooling, realizes the heat conduction heat dissipation function of weld metal layer 4 from this. The utility model discloses a set up welding metal layer 4 that is used for heat conduction between radiator 1 and heat dissipation base face 3, replace traditional heat conduction interface material, make between radiator 1 and the power module 2 with welding metal layer 4 welding together to make great thermal resistance reduce to almost zero between power module 2 and the radiator 1, and welding metal layer 4 is very thin, the installation is firm, the operation is stable, can not pulverize like heat conduction silicone grease and form the hole, thereby guarantee the transmission of thermal current, make the utility model discloses also can have fine radiating effect under compact structure's the condition.
The utility model discloses simple structure and simple to operate, the installation accuracy is higher and the cost is lower, the utility model discloses a plurality of power module 2 can be installed to well radiator 1, compact structure because the thermal contact resistance between power module 2 and the radiator 1 is very little for also can have fine radiating effect under compact structure's the condition. Meanwhile, the radiator 1 and the module are welded together, and the radiator 1 and the shell are designed into a whole, so that the assembly process flow is simplified, the installation is convenient, the installation precision is higher, and the cost is lower.
It is to be noted that, in this document, the terms "comprises", "comprising" or any other variation thereof are intended to cover a non-exclusive inclusion, so that an article or apparatus including a series of elements includes not only those elements but also other elements not explicitly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of additional like elements in the article or device comprising the element.
The above description is only for the preferred embodiment of the present invention, and should not be construed as limiting the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (7)
1. The high-efficiency heat dissipation integrated module is characterized by comprising a heat radiator (1), a plurality of groups of power modules (2) arranged on the heat radiator (1), a heat dissipation base surface (3) arranged on the power modules (2) and a welding metal layer (4) arranged between the heat radiator (1) and the heat dissipation base surface (3).
2. The high-efficiency heat dissipation integrated module according to claim 1, further comprising a positioning frame (5) disposed on the heat sink (1) and sleeved outside the power module (2).
3. The high efficiency heat dissipating integrated module according to claim 2, wherein the positioning frame (5) is detachably connected to the heat sink (1).
4. The high-efficiency heat dissipation integrated module according to claim 1, wherein the welding metal layer (4) is fixedly connected with the heat sink (1) and the heat dissipation base (3) by welding.
5. The high efficiency integrated heat sink module according to claim 1, wherein the heat sink (1) is a heat sink fin, a water-cooled fin or a cold plate.
6. The high efficiency heat dissipating integrated module according to claim 1, wherein the number of the power modules (2) is one or more.
7. The high efficiency heat dissipation integrated module of claim 1, wherein the material of the solder metal layer (4) is a heat conductive metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021089565.9U CN212161794U (en) | 2020-06-12 | 2020-06-12 | High-efficiency heat dissipation integrated module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021089565.9U CN212161794U (en) | 2020-06-12 | 2020-06-12 | High-efficiency heat dissipation integrated module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212161794U true CN212161794U (en) | 2020-12-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021089565.9U Active CN212161794U (en) | 2020-06-12 | 2020-06-12 | High-efficiency heat dissipation integrated module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212161794U (en) |
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2020
- 2020-06-12 CN CN202021089565.9U patent/CN212161794U/en active Active
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