CN212138000U - Through hole structure of aluminum substrate and demagnetization system based on same - Google Patents
Through hole structure of aluminum substrate and demagnetization system based on same Download PDFInfo
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- CN212138000U CN212138000U CN202020892553.3U CN202020892553U CN212138000U CN 212138000 U CN212138000 U CN 212138000U CN 202020892553 U CN202020892553 U CN 202020892553U CN 212138000 U CN212138000 U CN 212138000U
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- aluminum substrate
- via hole
- aluminium base
- base board
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Abstract
The utility model provides a via hole structure of aluminium base board and demagnetization system based on via hole structure, includes aluminium base board, the via hole has openly been seted up to aluminium base board, the via hole runs through to aluminium base board's bottom, it has the pad to cover around the via hole, the inside packing of via hole has the copper thick liquid, the upper end of copper thick liquid is equipped with soldering tin, through soldering tin will the pad with the welding of copper thick liquid, the bottom of copper thick liquid with the aluminium base fixed connection in bottom of aluminium base board. The utility model relates to an aluminium base board field, overall structure is simple practical, and economic benefits is high, is fit for promoting.
Description
The technical field is as follows:
the utility model relates to an aluminium base board field, concretely relates to via hole structure of aluminium base board and demagnetization system based on via hole structure.
Background art:
dob (driveronboard) or Driverless, which we generally refer to as "de-energizing," does not actually have power, but rather removes the traditional AC/DC conversion, fusing the LED driver circuit and the LED light string circuit together. The LED drive light source is a new drive mode different from a traditional switch power supply, and is a new drive mode derived based on LED characteristics, the integrated application of DOB drive light sources in the market is more and more, but due to the EMC interference problem of an aluminum substrate, a linear scheme is mostly selected for DOB, and compared with the switch power supply scheme, the linear scheme has the defects of camera stroboflash, poor linearity, low efficiency and the like.
The utility model has the following contents:
for solving the problem that provides in the above-mentioned background art, the utility model provides a via hole structure based on aluminium base board has the demagnetization, makes aluminium base bottom of the board aluminium base via hole connection DOB circuit ground wire copper foil, absorbs the interference, improves circuit conduction interference.
The utility model discloses the technical problem that will solve adopts following technical scheme to realize: the via hole structure of the aluminum substrate comprises the aluminum substrate, wherein a via hole is formed in the front face of the aluminum substrate and penetrates through the bottom of the aluminum substrate, a bonding pad covers the periphery of the via hole, copper paste is filled in the via hole, soldering tin is arranged at the upper end of the copper paste and is used for welding the bonding pad and the copper paste, and the bottom end of the copper paste is fixedly connected with the bottom aluminum base of the aluminum substrate.
Preferably, the aluminum substrate is not electrically conductive between the front surface and the bottom.
The utility model also provides an aluminium base board is based on via hole structure's demagnetization system, the front of aluminium base board is equipped with the generating line ground of electronic circuit, cover with the generating line the via hole with the pad.
Preferably, the bus bar is connected with a circuit ground copper foil, and the circuit ground copper foil is connected with a negative electrode of the driving light source circuit.
The utility model discloses a theory of operation and concrete flow: on the basis of the original electromagnetic compatibility driving scheme, the ground wire copper foil of the circuit is connected with the via hole of the aluminum substrate and the aluminum base at the bottom of the aluminum substrate are added, so that interference is absorbed, and circuit conduction interference is improved; the aluminum substrate is provided with a through hole at a bus ground on the front surface of the aluminum substrate, a pad is covered around the through hole, the bus ground on the front surface of the aluminum substrate is indirectly connected with the bottom aluminum base of the aluminum substrate by filling copper paste made of conductive materials in the through hole, so that the aluminum substrate has a better interference conduction effect, and finally the bottom aluminum base of the aluminum substrate is grounded through a circuit ground wire copper foil connected with the bus ground.
Compared with the prior art, the beneficial effects of the utility model are that: a via hole structure based on an aluminum substrate and having a demagnetization effect effectively and skillfully grounds the bottom of the aluminum substrate, so that the aluminum substrate has the effects of absorbing interference and improving line conducted interference, the conducted interference caused by the aluminum substrate in a DOB scheme of a switching power supply can be effectively eliminated, and an EMC test of an LED lamp product meets the national standard; traditional aluminium base board is not through hole treatment, because the EMC of the LED lamps and lanterns of the DOB drive light source integration scheme circuit of aluminium base board is too serious and can not get into market because of the interference problem, this scheme can greatly reduced DOB drive scheme's EMC debugging degree of difficulty, makes things convenient for each DOB scheme to pass through the standard and gets into market. In a word, the utility model has the advantages of simple and practical whole structure, high economic benefit and suitability for popularization.
Description of the drawings:
in order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts;
FIG. 1 is a schematic sectional view of a bottom via hole of an aluminum substrate of the present invention;
FIG. 2 is a schematic top view of the aluminum substrate of the present invention with the bottom thereof not grounded;
wherein: 1. an aluminum substrate; 2. a circuit ground wire copper foil; 3. a pad; 4. a via hole; 5. a driving light source circuit; 6. copper slurry; 7. soldering tin; 8. and (4) generating a bus ground.
The specific implementation mode is as follows:
in order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand and understand, the present invention is further explained by combining with the specific drawings.
Example (b): as shown in fig. 1-2, a via hole structure with a demagnetization effect based on an aluminum substrate comprises an aluminum substrate 1, wherein a via hole 4 is formed in the front surface of the aluminum substrate 1, the via hole 4 penetrates through the bottom of the aluminum substrate 1, a pad 3 covers around the via hole 4, copper paste 6 is filled in the via hole 4, solder 7 is arranged at the upper end of the copper paste 6, the pad 3 is welded with the copper paste 6 through the solder 7, and the bottom end of the copper paste 6 is fixedly connected with the bottom aluminum base of the aluminum substrate 1.
The front surface and the bottom of the aluminum substrate 1 are not conductive.
The aluminum substrate 1 is an aluminum substrate, the front surface of the aluminum substrate 1 is provided with different circuits for connecting different components, in order to improve electromagnetic interference generated when the aluminum substrate 1 works, the bottom aluminum of the aluminum substrate 1 is subjected to electromagnetic conduction and grounding treatment, so that a via hole 4 is formed in the front surface of the aluminum substrate 1, the via hole 4 penetrates through the bottom of the aluminum substrate, the front surface and the bottom of the aluminum substrate 1 are not conductive, so that a conductive copper paste 6 is filled in the via hole 4, the copper paste 6 is fixedly connected with the bottom aluminum of the aluminum substrate 1, the upper end of the copper paste 6 is welded with the front surface of the aluminum substrate 1 through a soldering tin 7, in order to have better conductivity, a circle of welding pads 3 is covered around the via hole 4, and the welding area of the copper paste 6 and.
A degaussing system of an aluminum substrate based on a via hole structure is characterized in that a bus ground 8 of an electronic circuit is arranged on the front surface of the aluminum substrate, and the bus ground 8 covers a via hole 4 and a bonding pad 3.
The bus ground 8 is connected with a circuit ground copper foil 2, and the circuit ground copper foil 2 is connected with the negative electrode of the driving light source circuit 5.
The bus bar ground 8 connects the current-carrying branch circuits in the distribution device together, and has the function of collecting, distributing and transmitting electric energy, so that the magnetic field interference is the largest here, and in order to make the aluminum substrate 1 have the function of better conducting interference, the via hole 4 and the pad 3 are arranged at the bus bar ground 8, and the bus bar ground 8 covers the via hole 4 and the pad 3, so that the bus bar ground 8 is indirectly connected with the bottom aluminum base of the aluminum substrate 1, and the bus bar ground 8 is connected with the negative electrode of the driving light source circuit 5 through the circuit bottom copper foil 2, so that the bottom aluminum base of the aluminum substrate 1 is grounded.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. The utility model provides a via hole structure of aluminium base board, includes aluminium base board (1), its characterized in that: the aluminum substrate is characterized in that a through hole (4) is formed in the front face of the aluminum substrate (1), the through hole (4) penetrates through the bottom of the aluminum substrate (1), a pad (3) covers around the through hole (4), copper paste (6) is filled in the through hole (4), soldering tin (7) is arranged at the upper end of the copper paste (6), the pad (3) is welded with the copper paste (6) through the soldering tin (7), and the bottom end of the copper paste (6) is fixedly connected with the bottom aluminum base of the aluminum substrate (1).
2. The via structure of an aluminum substrate of claim 1, wherein: the front surface and the bottom of the aluminum substrate (1) are not conductive.
3. A degaussing system of an aluminum substrate based on the via structure of any one of claims 1-2, characterized in that: and the front surface of the aluminum substrate is provided with a bus ground (8) of an electronic circuit, and the bus ground (8) covers the via hole (4) and the bonding pad (3).
4. The demagnetizing system of claim 3, wherein: the bus ground (8) is connected with a circuit ground copper foil (2), and the circuit ground copper foil (2) is connected with the negative electrode of the driving light source circuit (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020892553.3U CN212138000U (en) | 2020-05-25 | 2020-05-25 | Through hole structure of aluminum substrate and demagnetization system based on same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020892553.3U CN212138000U (en) | 2020-05-25 | 2020-05-25 | Through hole structure of aluminum substrate and demagnetization system based on same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212138000U true CN212138000U (en) | 2020-12-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020892553.3U Active CN212138000U (en) | 2020-05-25 | 2020-05-25 | Through hole structure of aluminum substrate and demagnetization system based on same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212138000U (en) |
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2020
- 2020-05-25 CN CN202020892553.3U patent/CN212138000U/en active Active
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