CN212116078U

CN212116078U - Mobile phone heat dissipation structure and mobile phone

Info

Publication number: CN212116078U
Application number: CN202021235710.XU
Authority: CN
Inventors: 权剑良
Original assignee: Chongqing Boaote Intelligent Technology Co ltd
Current assignee: Chongqing Boaote Intelligent Technology Co ltd
Priority date: 2020-06-29
Filing date: 2020-06-29
Publication date: 2020-12-08
Anticipated expiration: 2030-06-29

Abstract

The utility model belongs to the technical field of the cell-phone, a cell-phone heat radiation structure is provided, include: the cell-phone casing, the second heat dissipation layer, the third heat dissipation layer, fourth heat dissipation layer, fifth heat dissipation layer and sixth heat dissipation layer, be provided with the cell-phone screen on the cell-phone casing, be provided with battery and mainboard in the cell-phone casing, the cell-phone casing includes the shell, first heat dissipation layer and inner shell, first heat dissipation layer sets up between shell and inner shell, the inner shell is inlayed and is had a great deal of heat-transfer pipe, the second heat dissipation layer sets up the one side towards the cell-phone casing at the cell-phone screen, the periphery at the battery is established to third heat dissipation layer cover, fourth heat dissipation layer sets up the one side towards the cell-phone screen at the mainboard, fifth heat dissipation layer sets up the one side towards the cell-phone casing at the mainboard, sixth heat dissipation layer sets up the one. Still provide a cell-phone, include above-mentioned heat radiation structure. The utility model provides a cell-phone heat radiation structure and cell-phone, the radiating efficiency is higher.

Description

Mobile phone heat dissipation structure and mobile phone

Technical Field

The utility model relates to a cell-phone technical field, concretely relates to mobile phone heat radiation structure and cell-phone.

Background

With the development of the technology level, the processor of the mobile phone is also continuously upgraded, and the increase of the processing speed of the processor chip can lead to the increase of power consumption and the synchronous increase of thermal power. Many mobile phones will be scalded after being used for a period of time, so that not only is the user experience very poor, but also the service lives of relevant parts of the mobile phones can be shortened. At present, the heat that common radiating mode used radiating film or fin to give off mobile phone motherboard and battery in the cell-phone mainly conducts, conduct the heat that gives off mobile phone motherboard and battery on the cell-phone casing, give off the heat through the cell-phone casing, because the restriction of cell-phone casing material leads to the coefficient of thermal conductivity of cell-phone casing to be low, can't be quick dispel the heat to the cell-phone, and it is two-way at cell-phone casing heat conduction, when outside air's temperature was on the high side, the radiating efficiency of cell-phone can be more slow, the service life that receives of cell-phone has seriously been influenced.

SUMMERY OF THE UTILITY MODEL

To the defect among the prior art, the utility model aims at providing a cell-phone heat radiation structure and cell-phone to improve its radiating efficiency.

In order to achieve the above object, an aspect of the present invention provides a heat dissipation structure for mobile phone, including: a mobile phone shell, a second heat dissipation layer, a third heat dissipation layer, a fourth heat dissipation layer, a fifth heat dissipation layer and a sixth heat dissipation layer,

the mobile phone shell is provided with a mobile phone screen, the mobile phone shell is internally provided with a storage battery and a mainboard,

the mobile phone shell comprises an outer shell, a first heat dissipation layer and an inner shell, wherein the first heat dissipation layer is arranged between the outer shell and the inner shell, a plurality of heat transfer pipes are embedded in the inner shell,

the second heat dissipation layer sets up the cell-phone screen towards one side of cell-phone casing, the third heat dissipation layer cover is established the periphery of battery, the fourth heat dissipation layer sets up the mainboard towards one side of cell-phone screen, the fifth heat dissipation layer sets up the mainboard towards one side of cell-phone casing, the sixth heat dissipation layer sets up the cell-phone casing towards one side of cell-phone screen.

Further, the first heat dissipation layer is a graphene film.

Further, the heat transfer pipe is a carbon nanotube.

Further, the second heat dissipation layer is a graphene film.

Further, the third heat dissipation layer is a graphene film.

Further, the fourth heat dissipation layer is an ultrathin VC.

Further, the fifth heat dissipation layer is an ultrathin VC.

Further, the sixth heat dissipation layer is a graphene film.

On the other hand the utility model provides a mobile phone, including above-mentioned heat radiation structure.

The utility model has the advantages that:

the utility model provides a mobile phone heat radiation structure, cell-phone casing, second heat dissipation layer, third heat dissipation layer, fourth heat dissipation layer, fifth heat dissipation layer and sixth heat dissipation layer, the cell-phone casing includes shell, first heat dissipation layer and inner shell.

The heat generated by one side of the mainboard facing the mobile phone screen is transferred to the fourth heat dissipation layer and then to the third heat dissipation layer, the heat is transferred to the second heat dissipation layer by the third heat dissipation layer, and finally the heat is transferred to the sixth heat dissipation layer by the second heat dissipation layer, and the heat generated by the storage battery is directly transferred to the sixth heat dissipation layer through the second heat dissipation layer. The heat that the mainboard produced towards the one side of cell-phone shell just directly transmits the sixth heat dissipation layer through the fifth heat dissipation layer.

And the heat of the sixth heat dissipation layer is transferred to the storage battery and the mainboard, and finally is transferred to the first heat dissipation layer through the heat transfer pipe, and then is transferred to the outside air by the shell, thereby achieving the purpose of heat dissipation and further improving the heat dissipation efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Fig. 1 is a perspective view of a heat dissipation structure of a mobile phone according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;

FIG. 3 is an enlarged view at B shown in FIG. 2;

FIG. 4 is an enlarged view at C shown in FIG. 2;

fig. 5 is an exploded view of the heat dissipating structure of the handset shown in fig. 1;

fig. 6 is a perspective view of the mobile phone housing of the mobile phone heat dissipation structure shown in fig. 1;

FIG. 7 is a cross-sectional view taken in the direction D-D of FIG. 6;

FIG. 8 is an enlarged view at E shown in FIG. 7;

figure 9 is an exploded view of the handset housing shown in figure 6.

Reference numerals:

100-a mobile phone shell, 110-an outer shell, 120-a first heat dissipation layer, 130-an inner shell, 140-a heat transfer pipe, 200-a second heat dissipation layer, 300-a third heat dissipation layer, 400-a fourth heat dissipation layer, 500-a fifth heat dissipation layer, 600-a sixth heat dissipation layer, 700-a mobile phone screen, 800-a storage battery and 900-a mainboard.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience of description and simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting.

Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

As shown in fig. 1-9, the utility model provides a mobile phone heat radiation structure, include: a handset case 100, a second heat dissipation layer 200, a third heat dissipation layer 300, a fourth heat dissipation layer 400, a fifth heat dissipation layer 500, and a sixth heat dissipation layer 600.

The mobile phone case is provided with a mobile phone screen 700, and the mobile phone case 100 is internally provided with a storage battery 800 and a mainboard 900.

The mobile phone case 100 includes an outer case 110, a first heat dissipation layer 120, and an inner case 130, the first heat dissipation layer 120 is disposed between the outer case 110 and the inner case 130, and the inner case 130 is embedded with a plurality of heat transfer pipes 140, and the heat transfer pipes 140 are uniformly distributed on the inner case 130.

Therefore, heat generated by the storage battery 800 and the main board 900 in the mobile phone shell 100 is transmitted to the first heat dissipation layer 120 through the inner shell 130 and the heat transmission pipes 140, then transmitted to the outer shell 110 through the first heat dissipation layer 120, and finally transmitted to the outside air through the outer shell 110, so that the purpose of heat dissipation is achieved, meanwhile, the heat inside the mobile phone shell 100 is uniformly dispersed to the mobile phone shell 100, and the situation that the local temperature of the mobile phone shell 100 is too high and the user experience is influenced is avoided.

According to the law of fourier transform,

wherein q is the heat transfer capacity per unit area; k is the thermal conductivity, t is the temperature, thickness, A is the area, and Q is the heat flow throughout the plane.

From this, Q is proportional to the area a and the thermal conductivity k, and inversely proportional to the thickness. Therefore, the heat generated from the battery 800 and the main board 900 directly passes through the heat transfer pipe 140 with a high thermal conductivity k and the first heat dissipation layer 120 through the mobile phone case 100, and then is transferred to the case 110 by the first heat dissipation layer 120 with a high thermal conductivity k, and finally is transferred to the outside air by the case 110, thereby achieving heat dissipation. In the conventional mobile phone, the heat is directly transferred from the mobile phone housing 100 to the outside air, so as to dissipate the heat. This not only increases the thermal conductivity k, but also reduces the thickness of the heat transfer compared to the conventional handset housing 100. Therefore, the heat transfer efficiency is improved.

The second heat dissipation layer 200 is disposed on the side of the cell phone screen 700 facing the cell phone housing 100. The third heat dissipation layer 300 is sleeved on the periphery of the battery 800. The fourth heat dissipation layer 400 is disposed on the side of the main board 900 facing the mobile phone screen 700. The fifth heat dissipation layer 500 is disposed on a side of the main board 900 facing the mobile phone case. The sixth heat dissipation layer 600 is disposed on a side of the handset housing 100 facing the handset screen 700.

Thus, heat generated at a side of the motherboard 900 facing the mobile phone screen 700 is transferred to the third heat dissipation layer 300 through the fourth heat dissipation layer 400, then transferred to the second heat dissipation layer 200 through the third heat dissipation layer 300, and finally transferred to the sixth heat dissipation layer 600 through the second heat dissipation layer 200. And the heat generated from the battery 800 is directly transferred to the sixth heat dissipation layer 600 through the second heat dissipation layer 200. Heat generated from the side of the main board 900 facing the mobile phone case is directly transferred to the sixth heat dissipation layer 600 through the fifth heat dissipation layer 500.

The heat transferred to the sixth heat dissipation layer 600 by the battery 800 and the main board 900 is finally transferred to the first heat dissipation layer 120 through the heat transfer pipe 140, and then transferred to the external air by the casing 110, thereby achieving the purpose of heat dissipation.

In one embodiment, the first heat dissipation layer 120 is a graphene film, which is an ultra-thin heat dissipation material with a high thermal conductivity, and can effectively reduce the thermal density of the heat source, achieve large-area rapid heat transfer, large-area heat dissipation, and eliminate the phenomenon of single-point high temperature. Meanwhile, the graphene film has diversified thickness selection, can be punched into any specified shape, and is convenient to use in various different products, especially in space-limited electronic products.

In one embodiment, the heat transfer tube 140 is a carbon nanotube having a high thermal conductivity to facilitate heat transfer from the mobile phone housing to the first heat dissipation layer 120.

In one embodiment, the second heat dissipation layer 200 is a graphene film, which is an ultra-thin heat dissipation material with a high thermal conductivity, and can effectively reduce the thermal density of the heat source, achieve large-area rapid heat transfer, large-area heat dissipation, and eliminate the phenomenon of single-point high temperature. Meanwhile, the graphene film has diversified thickness selection, can be punched into any specified shape, and is convenient to use in various different products, especially in space-limited electronic products.

In one embodiment, the third heat dissipation layer 300 is a graphene film, which is an ultra-thin heat dissipation material with a high thermal conductivity, and can effectively reduce the thermal density of the heat source, achieve large-area rapid heat transfer, large-area heat dissipation, and eliminate the phenomenon of single-point high temperature. Meanwhile, the graphene film has diversified thickness selection, can be punched into any specified shape, and is convenient to use in various different products, especially in space-limited electronic products.

In one embodiment, the fourth heat spreader 400 is an ultra-thin VC, i.e., an ultra-thin heat spreader, which has high conduction efficiency and is made of metal, such as copper, and has a relatively stable shape, so as to compensate for a height difference of the mobile phone motherboard 900 caused by mounting electronic components, such as chips. Thereby facilitating the transfer of heat generated on the main board 900 to the second heat dissipation layer 200.

In one embodiment, the fifth heat dissipation layer 500 is an ultra-thin VC, i.e., an ultra-thin soaking plate, which has high conduction efficiency and is made of metal, such as copper, and has a relatively stable shape, so as to compensate for a height difference of the mobile phone motherboard 900 caused by mounting electronic components, such as chips. Thereby facilitating the transfer of heat generated on the main board 900 to the sixth heat dissipation layer 600.

In one embodiment, the sixth heat dissipation layer 600 is a graphene film, which is an ultra-thin heat dissipation material with a high thermal conductivity, and can effectively reduce the thermal density of the heat source, achieve large-area rapid heat transfer, large-area heat dissipation, and eliminate the phenomenon of high temperature of a single point. Meanwhile, the graphene film has diversified thickness selection, can be punched into any specified shape, and is convenient to use in various different products, especially in space-limited electronic products.

The working principle of the utility model is as follows:

when the heat dissipation structure is used, heat generated by one side of the main board 900 facing the mobile phone screen 700 is transferred to the third heat dissipation layer 300 through the fourth heat dissipation layer 400, then transferred to the second heat dissipation layer 200 through the third heat dissipation layer 300, and finally transferred to the sixth heat dissipation layer 600 through the second heat dissipation layer 200. And the heat generated from the battery 800 is directly transferred to the sixth heat dissipation layer 600 through the second heat dissipation layer 200. Heat generated from the side of the main board 900 facing the mobile phone case is directly transferred to the sixth heat dissipation layer 600 through the fifth heat dissipation layer 500.

The utility model provides a heat radiation structure, through the heat that produces battery 800 and mainboard 900 with cell-phone casing 100 inside, transmit the first heat dissipation layer 120 for in cell-phone casing 100 through sixth heat dissipation layer 600, transmit for shell 110 by first heat dissipation layer 120 at last to heat transfer efficiency has been improved.

The utility model also provides a mobile phone, including above-mentioned heat radiation structure.

In the specification of the present invention, a large number of specific details are explained. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims

1. A mobile phone heat radiation structure is characterized in that: the method comprises the following steps: a mobile phone shell, a second heat dissipation layer, a third heat dissipation layer, a fourth heat dissipation layer, a fifth heat dissipation layer and a sixth heat dissipation layer,

2. The heat dissipation structure of mobile phone of claim 1, wherein: the first heat dissipation layer is a graphene film.

3. The heat dissipation structure of mobile phone of claim 1, wherein: the heat transfer pipe is a carbon nanotube.

4. The heat dissipation structure of mobile phone of claim 1, wherein: the second heat dissipation layer is a graphene film.

5. The heat dissipation structure of mobile phone of claim 1, wherein: the third heat dissipation layer is a graphene film.

6. The heat dissipation structure of mobile phone of claim 1, wherein: the fourth heat dissipation layer is ultra-thin VC.

7. The heat dissipation structure of mobile phone of claim 1, wherein: the fifth heat dissipation layer is made of ultrathin VC.

8. The heat dissipation structure of mobile phone of claim 1, wherein: the sixth heat dissipation layer is a graphene film.

9. A mobile phone, characterized in that: comprising the heat dissipating structure of any of claims 1-8.