CN218679726U - Electronic device - Google Patents

Abstract

The application provides an electronic device, and relates to the technical field of electronic devices. The electronic equipment comprises a shell and a control module, wherein the shell is provided with an accommodating space; at least two heating devices arranged in the accommodating space; the heat dissipation pipeline is arranged in the accommodating space and comprises a first end and a second end, the first end is connected with the first port of the pump body, the second end is connected with the second port of the pump body, so that a closed path for storing liquid is formed, and the pump body drives the liquid to circularly flow in the heat dissipation pipeline; wherein the closed path passes through and contacts at least two of the heat generating devices.

Description

Electronic device

Technical Field

The application relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

With the improvement of the performance of electronic products, the heat generated by the integrated circuits and other electro-acoustic-optical devices inside the electronic products is higher and higher, which means that the heat dissipation capability of the electronic products is also improved.

Various traditional passive heat dissipation structures applied to electronic products, such as heat pipes and the like, can approximately uniformly disperse heat by taking each heat source as a center, but because the heat sources in the electronic products are usually positioned in one or more areas, the heat uniformity effect in the electronic products is poor; some electronic products also use a water cooling system and are provided with a fan, a radiating fin and the like to perform internal and external circulation on the electronic products, but the mode requires that heat is concentrated at the position of the fan or the radiating fin to achieve the optimal radiating effect, and the soaking requirement cannot be met.

If the heat energy cannot be uniformly dispersed in real time, the local temperature of the product is increased, and the use experience of a user is influenced.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application aims to provide electronic equipment to solve the technical problem that local temperature of a product is higher due to poor internal heat soaking effect of an electronic product.

In order to solve the above technical problem, an embodiment of the present application provides the following technical solutions:

the application provides an electronic device, this electronic device includes: a housing having an accommodating space; at least two heating devices arranged in the accommodating space; the heat dissipation pipeline is arranged in the accommodating space and comprises a first end and a second end, the first end is connected with the first port of the pump body, the second end is connected with the second port of the pump body, so that a closed path for storing liquid is formed, and the pump body drives the liquid to circularly flow in the heat dissipation pipeline; wherein the closed path passes through and contacts at least two of the heat generating devices.

In some modified embodiments of the present application, the method further includes: the heat conducting plate is arranged in the accommodating space, covers the heat dissipation pipeline and an area formed by the enclosing of the heat dissipation pipeline, and at least partially extends to the outside of the area formed by the enclosing of the heat dissipation pipeline.

In some modified embodiments of the present application, at least one of the at least two heat generating devices includes a first heat generating member and a second heat generating member having a height difference; the heat dissipation pipeline is provided with a first bending part located between the first heating part and the second heating part, and a height difference is formed on two sides of the first bending part so that the heat dissipation pipeline is respectively contacted with the first heating part and the second heating part.

In some variations of the present application, the heat dissipation conduit has a rigid tube segment and a partially flexible tube segment.

In some modified embodiments of the present application, a portion of the heat dissipation pipeline contacting at least one of the heat generating devices has at least one second bent portion.

In some variations of the present application, the flexible tube segment of the heat dissipation conduit forms the first bend; the flexible pipe section of the heat dissipation pipeline forms the second bending part.

In some modified embodiments of the present application, the number of the second bent portions corresponding to one heat generating device is plural, and the plural second bent portions are continuously arranged to form a serpentine tube section.

In some modified embodiments of the present application, a heat conductive layer is disposed between the heat dissipation pipeline and the heat generating device.

In some modified embodiments of the present application, the method further includes: and the connecting piece is used for fixing the heat dissipation pipeline to the shell and enabling the heat dissipation pipeline to be attached to the heating device.

In some modified embodiments of the present application, the heat dissipation pipe has a circular cross-sectional shape; or the surface of the heat dissipation pipeline contacting the heating device is a plane.

Compared with the prior art, the electronic equipment that this application provided, through set up the heat dissipation pipeline in electronic equipment's casing and form the closed route that the storage has liquid with the pump body, the heat dissipation pipeline passes through and contacts two at least devices that generate heat in the casing, liquid is at the heat dissipation pipeline inner loop flow under the effect of the pump body, thereby can conduct the heat that the device that generates heat produced and scatter the local heat source, and further disperse the heat of heat dissipation pipeline through the heat-conducting plate, reach good heat dissipation, the soaking effect, avoid electronic equipment's local high temperature, can improve user's use and experience.

Drawings

The above and other objects, features and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:

fig. 1 schematically illustrates a main structure diagram of an electronic device provided by an embodiment of the present application;

fig. 2 schematically illustrates a front view structure diagram of an electronic device provided by an embodiment of the present application;

fig. 3 schematically illustrates a structural schematic diagram of connection between a heat dissipation pipeline of an electronic device and a pump body according to an embodiment of the present application;

fig. 4 schematically illustrates a partial structural diagram of a heat dissipation pipeline of an electronic device provided by an embodiment of the present application;

fig. 5 schematically illustrates a structural diagram of a second bent portion of a heat dissipation pipeline of an electronic device according to an embodiment of the present application;

the reference numbers illustrate:

the heat pump comprises a shell 1, a heating device 2, a first heating piece 21, a second heating piece 22, a heat dissipation pipeline 3, a first bent part 31, a second bent part 32, a pump body 4 and a heat conduction plate 5.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which this application belongs.

With the improvement of the performance of electronic products, the heat generated by the integrated circuits and other electro-acoustic-optical devices inside the electronic products is higher and higher, which means that the heat dissipation capability of the electronic products is also improved. If the heat energy cannot be uniformly dispersed in real time, the local temperature of the product is increased, and the use experience of a user is influenced; it may even cause the integrated circuit inside the packaged chip to downconvert. Therefore, the heat dissipation capability must be improved to maintain the normal operation of the electronic device and the chip.

Various traditional passive heat dissipation structures applied to electronic products, such as heat pipes and the like, can approximately uniformly disperse heat by taking each heat source as a center, but because the heat sources in the electronic products are usually positioned in one or more areas, the heat uniformity effect in the electronic products is poor; there are also electronic products that use water cooling systems, connect the pump to the pipeline, and equip with fans, heat sinks, etc. to do the internal and external circulation to the electronic products, but this kind of mode requires to concentrate the heat in the position of fan or heat sink in order to reach the optimal radiating effect, contradict with the requirement of soaking, and the volume and the weight of heat sink, fan are generally great, are not suitable for small-size or portable electronic equipment.

Example one

Referring to fig. 1 to 3, an embodiment of the present application proposes an electronic device, including: a housing 1 having an accommodating space; at least two heating devices 2 arranged in the accommodating space; the heat dissipation pipeline 3 and the pump body 4 are arranged in the accommodating space, the heat dissipation pipeline 3 comprises a first end and a second end, the first end is connected with a first port of the pump body 4, the second end is connected with a second port of the pump body 4, a closed path for storing liquid is formed, and the pump body 4 drives the liquid to circularly flow in the heat dissipation pipeline 3; wherein the closed path passes through and contacts at least two of the heat generating devices 2.

Specifically, the electronic device provided in this embodiment may be, but is not limited to, a small or portable electronic device such as a mobile phone, a tablet computer, a notebook computer, and the like, and the electronic device includes: casing 1, at least two generate heat device 2 and for solving inside heat dissipation, the heat dissipation pipeline 3 and the pump body 4 that the soaking problem set up of electronic equipment, wherein, casing 1 is the shell or the shell of a part of electronic equipment, for example: when the electronic equipment is a notebook computer, the casing 1 is a shell of a host part of the notebook computer, an accommodating space is arranged inside the casing 1, at least two heating devices 2 are arranged in the accommodating space, the heating devices 2 refer to devices which generate heat energy or main devices which generate higher heat energy in the casing 1 of the electronic equipment during operation of the electronic equipment, in order to ensure the operation effect of the devices and optimize the use experience of users, a heat dissipation pipeline 3 and a pump body 4 are further arranged in the accommodating space, the heat dissipation pipeline 3 is provided with two open ends which are respectively a first end and a second end, liquid is stored inside the heat dissipation pipeline 3, the first end of heat dissipation management is connected with a first port of the pump body 4, the second end of the heat dissipation pipeline is connected with a second port of the pump body 4, so that the heat dissipation pipeline 3 and the pump body 4 form a closed path, power can be provided by the pump body 4 to enable the liquid to circularly flow in the heat dissipation pipeline 3, the closed path formed by the heat dissipation pipeline 3 passes through and contacts with at least two heating devices 2 in the accommodating space, the heat dissipation pipeline 3 passes through two or more inner spaces 2, the heat dissipation pipeline can achieve the heat dissipation effect of the heat dissipation pipeline, and further increase the heat dissipation effect of the heat dissipation pipeline 3.

Specifically, the at least two heating devices 2 in the accommodating space may refer to the same device, or may refer to different devices, where the same and different may be specific to aspects such as shape, size, function, and the like; in order to improve the heat conduction effect of the heat dissipation pipeline 3, the pipe wall of the heat dissipation pipeline 3 can be made of copper, and the liquid inside the heat dissipation pipeline 3 can be water or more preferably antifreeze liquid so as to prevent the liquid from freezing to influence the cooling and soaking effects in the environment with lower temperature. The first end of the heat dissipation pipeline 3 and the first port of the pump body 4 and the second end of the heat dissipation pipeline 3 and the second port of the pump body 4 can be connected through welding or glue joint respectively; in order to satisfy the lightweight requirements of small electronic devices and portable electronic devices, and in accordance with the space that can be arranged inside the casing 1, the pipe diameter of the heat dissipation pipe 3 and the size of the pump body 4 can be reduced. The closed path formed by the heat dissipation pipeline 3 can be in a circular ring shape, a rectangular ring shape or other regular or irregular ring shapes, and can be specifically set according to the position of the heating device 2 to be dissipated and the internal layout of the accommodating space; the cross-sectional shape of the heat dissipation pipe 3 may be various, for example: referring to fig. 4, the heat dissipation pipe 3 may be circular, and the cross section of the heat dissipation pipe may be circular, so as to reduce the flow resistance of the liquid in the heat dissipation pipe 3, or may be oblate or semicircular, and the like, so as to make the surface of the heat dissipation pipe 3 contacting the heating device 2 be a plane, so as to increase the contact area between the heat dissipation pipe 3 and the heating device 2, thereby improving the heat conduction efficiency and effect; the heat dissipation pipeline 3 can be in direct contact with the heating device 2, or in order to further improve the effect of the heat dissipation pipeline 3 and the liquid heat conduction quantity of the heating device 2, a heat conduction layer can be arranged between the heat dissipation pipeline 3 and the heating device 2, so that the heat conduction area can be increased, and the heat conduction layer can be formed by coating heat conduction paste.

According to the above list, this application embodiment provides an electronic equipment, through set up heat dissipation pipeline 3 in electronic equipment's casing 1 and form the closed route that has liquid with pump body 4 storage, heat dissipation pipeline 3 is through and contact two at least devices 2 that generate heat in the casing 1, liquid circulates in heat dissipation pipeline 3 under the effect of pump body 4, thereby can conduct the heat that generates heat device 2 and scatter the local heat source, reach good heat dissipation, soaking effect, avoid electronic equipment's local high temperature, can improve user's use experience.

Further, referring to fig. 1, in a specific implementation, the electronic device provided in this embodiment further includes: and the heat conducting plate 5 is arranged in the accommodating space, covers the heat dissipation pipeline 3 and the area formed by enclosing the heat dissipation pipeline 3, and at least partially extends to the outside of the area formed by enclosing the heat dissipation pipeline 3.

It is specific, in order to further improve the soaking effect, in the technical scheme that this application was taken, still be provided with heat-conducting plate 5 in the accommodation space, cover on heat dissipation pipeline 3 through heat-conducting plate 5, and cover the region that heat dissipation pipeline 3 encloses and closes the formation, and the part of heat-conducting plate 5 extends to heat dissipation pipeline 3 and encloses outside the region that closes the formation, thereby can further scatter the linear heat source of heat dissipation pipeline 3 for the face-like, can diffuse the heat of heat dissipation pipeline 3 to the outside of heat dissipation pipeline 3's inboard respectively through heat-conducting plate 5, thereby reach more excellent soaking effect. The heat conducting plate 5 can be made of materials with good heat conducting performance such as graphite, graphene or copper foil; the heat conducting plate 5 can be a flat structure, or when the height difference exists between the heating devices 2 in the accommodating space of the shell 1 or a structure needing to be avoided exists, the graphite sheet can also be a non-integrated flat structure and can comprise a plurality of stepped parts with the height difference; it should be noted that, in order to show the relative positions of the heat conducting plate 5, the heat dissipating pipeline 3 and the heating device 2 in the accommodating space, the heat conducting plate 5 shown in fig. 1 is in a perspective view.

Further, referring to fig. 1, in an implementation, at least one of the at least two heat generating devices 2 includes a first heat generating component 21 and a second heat generating component 22 having a height difference; the heat dissipation pipeline 3 has a first bending portion 31 located between the first heat generating component 21 and the second heat generating component 22, and a height difference is formed on two sides of the first bending portion 31 so that the heat dissipation pipeline 3 is in contact with the first heat generating component 21 and the second heat generating component 22 respectively.

Specifically, in the technical solution adopted by the present application, all the heat generating devices 2 in the accommodating space of the housing 1 may include at least a first heat generating component 21 and a second heat generating component 22 having a height difference, where the height difference may be formed by a height difference of the heat generating devices 2 themselves, for example: the first heating element 21 can be a circuit board such as a PCB, that is, a plate, the second heating element 2 can be a mechanical hard disk, and/or the height difference can be formed by the installation height difference of the heating element 2 in the accommodating space; in order to enable the heat dissipation pipeline 3 to simultaneously contact the first heat generating part 21 and the second heat generating part 22 having a height difference, a first bending part 31 may be disposed at a portion of the heat dissipation pipeline 3 between the first heat generating part 21 and the second heat generating part 22, and the height difference formed at both sides of the first bending part 31 is adapted to the height difference between the first heat generating part 21 and the second heat generating part 22, so that both sides of the first bending part 31 of the heat dissipation pipeline 3 can be respectively attached to the first heat generating part 21 and the second heat generating part 22.

Further, in a specific implementation, the heat dissipation pipeline 3 has a rigid pipe section and a partially flexible pipe section.

Specifically, in order to facilitate the processing of the heat dissipation pipeline 3, in the technical scheme adopted by the application, the heat dissipation pipeline 3 can be made of a rigid pipe section as a whole and a flexible pipe section as a local part, wherein the rigid pipe section can be made of metal copper, the flexible pipe section has certain flexibility and is easy to deform, and a corrugated pipe can be specifically adopted; the rigid pipe section can be used for a linear pipe section part of the heat dissipation pipeline 3, and the flexible pipe section can be used for a bending part and a corner part in the heat dissipation pipeline 3, so that the degree of freedom of designing a complex path of the heat dissipation pipeline 3 is improved, and heat diffusion is easier. To facilitate the formation of the first bend 31, the first bend 31 may be formed by a flexible tube segment; when the closed path formed by the heat dissipation pipe 3 is a rectangular loop or another loop having corners, the portions of the corners may also be formed by flexible pipe segments.

Further, referring to fig. 1 to fig. 3 and fig. 5, in an implementation, a portion of the heat dissipation pipeline 3 contacting at least one of the heat generating devices 2 has at least one second bent portion 32.

Specifically, in order to increase the contact area between the heat dissipation pipeline 3 and the heating device 2, in the technical scheme adopted by the application, at least one second bending part 32 may be arranged at the part of the heat dissipation pipeline 3, which is in contact with the heating device 2, and the length of the part of the heat dissipation pipeline 3, which is in contact with the heating device 2, may be increased by the arrangement of the second bending part 32, so as to increase the contact area between the heat dissipation pipeline 3 and the heating device 2, and improve the heat conduction effect and efficiency; the number of the heat dissipation pipeline 3 corresponding to the second bending part 32 of one heat generating device 2 may be one; or the number of the second bending portions 32 of the heat dissipation pipeline 3 corresponding to one heat generating device 2 may also be multiple, and the multiple second bending portions 32 may be continuously arranged, or may also be arranged at intervals, referring to fig. 5, when the multiple bending portions are continuously arranged, they may be arranged to form a serpentine pipe segment, or arranged to form a spiral pipe segment, etc., and are not specifically limited herein; to facilitate the formation of the plurality of second bends 32, the plurality of second bends 32 may be formed by flexible tube segments. The second bent portion 32 may be provided only at a portion of the heat dissipation pipe 3 contacting the heat generating devices 2 generating higher heat energy, or may be provided at a portion of the heat dissipation pipe 3 contacting each heat generating device 2.

Further, in a specific implementation, the electronic device provided in this embodiment further includes: and the connecting piece is used for fixing the heat dissipation pipeline 3 to the shell 1 and enabling the heat dissipation pipeline 3 to be attached to the heating device 2.

Specifically, in order to fix the heat dissipation pipeline 3 inside the casing 1, in the technical scheme adopted in the application, the heat dissipation pipeline 3 can be fixed in the casing 1 through at least one connecting piece, and the heat dissipation pipeline 3 can be attached to the heating device 2 through the fixing of the connecting piece, so that a good heat conduction effect between the heating device 2 and the heat dissipation pipeline 3 is ensured; the connecting piece can be arranged in various ways, such as: the connecting piece can be an adhesive layer so that the heat dissipation pipeline 3 is adhered in the shell 1, or the connecting piece can also be a sleeve piece with a connecting lug part, the sleeve piece is sleeved outside the heat dissipation pipeline 3 needing to be fixed at a position, and is fixed on the shell 1 in a threaded manner by arranging a threaded piece at the connecting lug part, and the connecting piece is not limited to the arrangement form and is not limited in detail here; in order to ensure a good contact effect between the heat dissipation pipeline 3 and the heat generating device 2, a connecting member may be disposed on the heat dissipation pipeline 3 near the heat generating device 2.

It should be noted that in the description of the present specification, the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of describing the present application and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application; the terms "connected," "mounted," "secured," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. An electronic device, comprising:

a housing having an accommodating space;

at least two heating devices arranged in the accommodating space;

the heat dissipation pipeline is arranged in the accommodating space and comprises a first end and a second end, the first end is connected with the first port of the pump body, the second end is connected with the second port of the pump body, so that a closed path for storing liquid is formed, and the pump body drives the liquid to circularly flow in the heat dissipation pipeline;

wherein the closed path passes through and contacts at least two of the heat generating devices.

2. The electronic device of claim 1, further comprising:

the heat conducting plate is arranged in the accommodating space, covers the heat dissipation pipeline and an area formed by the enclosing of the heat dissipation pipeline, and at least partially extends to the outside of the area formed by the enclosing of the heat dissipation pipeline.

3. The electronic device of claim 1,

the at least two heating devices at least comprise a first heating piece and a second heating piece with height difference;

the heat dissipation pipeline is provided with a first bending part located between the first heating part and the second heating part, and a height difference is formed on two sides of the first bending part so that the heat dissipation pipeline is respectively contacted with the first heating part and the second heating part.

4. The electronic device of claim 3,

the heat dissipation pipeline is provided with a rigid pipe section and a part of flexible pipe section.

5. The electronic device of claim 4,

the part of the heat dissipation pipeline, which is in contact with at least one heat generating device, is provided with at least one second bending part.

6. The electronic device of claim 5,

the flexible pipe section of the heat dissipation pipeline forms the first bending part;

the flexible pipe section of the heat dissipation pipeline forms the second bending part.

7. The electronic device of claim 5 or 6,

the number of the second bending parts corresponding to one heating device is multiple, and the second bending parts are continuously arranged to form a snake-shaped pipe section.

8. The electronic device of claim 1,

and a heat conduction layer is arranged between the heat dissipation pipeline and the heating device.

9. The electronic device of claim 1, further comprising:

and the connecting piece is used for fixing the heat dissipation pipeline to the shell and enabling the heat dissipation pipeline to be attached to the heating device.

10. The electronic device of claim 1,

the cross section of the heat dissipation pipeline is circular; or the like, or, alternatively,

the surface of the heat dissipation pipeline contacting the heating device is a plane.

Images