CN212064739U - Compound heat conduction gasket based on graphite alkene - Google Patents

Compound heat conduction gasket based on graphite alkene Download PDF

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Publication number
CN212064739U
CN212064739U CN202021156494.XU CN202021156494U CN212064739U CN 212064739 U CN212064739 U CN 212064739U CN 202021156494 U CN202021156494 U CN 202021156494U CN 212064739 U CN212064739 U CN 212064739U
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layer
graphene
release film
heat
bottom side
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林永胜
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Fujian Meiqing Heat Transfer Technology Co ltd
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Fujian Meiqing Heat Transfer Technology Co ltd
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Abstract

The utility model provides a compound heat conduction gasket based on graphite alkene, include: the mounting part is of a circular ring structure and comprises a plurality of mounting holes and mounting grooves which are uniformly formed; the heat conduction portion sets up the installation department is inboard, includes: a first release film layer; the first graphene layer, the first copper foil layer, the second graphene layer and the second release film layer are sequentially arranged on the substrate. The utility model provides a single heat conduction gasket can't the layering transfer heat, the problem of unable installation.

Description

Compound heat conduction gasket based on graphite alkene
Technical Field
The utility model relates to a heat gasket field especially relates to a compound heat gasket based on graphite alkene.
Background
The electronic instrument is a device for detecting, analyzing and testing the performance, quality and safety of the electronic product; the general concept can be summarized into three major blocks of electronic measuring instruments, electronic analytical instruments and application instruments, and 24 types of fine categories of optical electronic instruments, electronic component measuring instruments, dynamic analytical instruments and the like are available; the heat conducting gaskets fill the air gap between the heat generating device and the heat sink or metal base, and their flexible and elastic characteristics enable them to be used to cover very uneven surfaces. Heat is conducted from the separating device or the entire PCB to the metal housing or the diffuser plate, thereby improving the efficiency and the service life of the heat generating electronic assembly; in the use of the gasket, the pressure and the temperature are mutually restricted, and as the temperature is increased, after the equipment runs for a period of time, the gasket material generates softening, creep and stress relaxation phenomena, the mechanical strength is also reduced, and the sealing pressure is reduced.
With the development of science and technology, the aspects of electronic instruments are continuously developed and advanced, wherein heat conducting gaskets for the electronic instruments are widely used, but the heat conducting gaskets for the electronic instruments in the market still have the defects that only a single heat conducting structure is adopted, heat cannot be transmitted in a layered mode, the heat conducting effect is poor, and secondly, no fixing structure is arranged in the heat conducting gaskets, so that the heat conducting gaskets are easy to displace in the using process and are not convenient for installation and fixation of graphene gaskets.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention is directed to solving the above-described problems. An object of the present invention is to provide a composite heat conducting gasket based on graphene, which solves the above problems, and adopts a layered heat conducting structure, thereby solving the problem that heat cannot be transferred in layers, and the heat conducting effect is poor; through fixed knot structure, solve the heat conduction gasket and take place the displacement problem easily.
A graphene-based composite thermal gasket comprising:
the mounting part is of a circular ring structure and comprises a plurality of mounting holes and mounting grooves which are uniformly formed;
the heat conduction portion sets up in the installation department inboard, includes:
a first release film layer;
the first graphene layer is arranged on the bottom side of the first release film layer and comprises graphene layers and double-sided adhesive layers which are arranged in a staggered mode;
the first copper foil layer is arranged on the bottom side of the first graphene layer;
the second graphene layer is arranged on the bottom side of the first copper foil layer and comprises graphene layers and double-sided adhesive layers which are arranged in a staggered mode;
the second is from the type rete, sets up in second graphite alkene layer bottom side.
Preferably, the mounting portion includes:
a first rubber layer;
the first heat-conducting silica gel layer is arranged at the bottom side of the first rubber layer;
the second copper foil layer is arranged on the bottom side of the first heat-conducting silica gel layer;
the second rubber layer is arranged at the bottom side of the second copper foil layer;
and the second heat-conducting silica gel layer is arranged at the bottom side of the second rubber layer.
Preferably, the number of the mounting holes is four, and the geometric center connecting line of the mounting holes is in a square shape.
Preferably, the mounting grooves include four, and any one of the mounting grooves is disposed between two adjacent mounting holes.
Preferably, the first release film layer and the second release film layer are fluoroplastic release films.
Preferably, the thickness of the single graphene layer is 0.02mm-0.04 mm.
Preferably, the thickness of the first copper foil layer and the second copper foil layer is 0.04mm-0.08 mm.
Preferably, the heat conducting gasket further comprises:
and the fit ring is made of elastic material and is embedded into the first release film layer and/or the second release film layer.
Preferably, the thermal pad further comprises:
the third heat-conducting silica gel layer is arranged between the first release film layer and the first graphene layer;
the fourth heat conduction silica gel layer is arranged between the second release film layer and the second graphene layer.
Preferably, the thermal pad further comprises:
and the shaft hole is arranged at the geometric center of the heat-conducting gasket.
The utility model discloses compound heat conduction gasket of graphite alkene has following technological effect:
1. the utility model discloses a medium-complex thermal gasket adopts a layered structure of a release film layer, multiple graphene sheets and a copper foil layer, and can transmit heat in layers, thereby improving the thermal conductivity of the graphene sheets;
2. the utility model discloses a medium-complex heat conducting gasket, which comprises an installation and fixation structure, and is convenient for the daily installation and use of operators through the installation and fixation treatment of the heat conducting gasket;
3. the composite heat conducting gasket of the utility model contains copper foil, has better electromagnetic shielding performance, and effectively reduces the damage of electromagnetic shielding to external human body;
4. the utility model discloses well compound thermal pad piece, both sides have the elastic material and paste the ring, can adjust thermal pad piece's area of contact, improve the radiating efficiency.
Other characteristic features and advantages of the invention will become apparent from the following description of exemplary embodiments, which is to be read in connection with the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention. In the drawings, like reference numerals are used to indicate like elements. The drawings in the following description are directed to some, but not all embodiments of the invention. For a person skilled in the art, other figures can be derived from these figures without inventive effort.
Fig. 1 schematically illustrates a top view of the heat conductive gasket of the present invention;
fig. 2 is a cross-sectional view of fig. 1A-a of the heat conductive gasket of the present invention.
In the figure: 10. an installation part; 100. mounting holes; 101. mounting grooves; 20. a heat conducting portion; 21. a first release film layer; 22. a first graphene layer; 23. a second graphene layer; 24. a second release film layer; 28. a first copper foil layer; 11. a first rubber layer; 12. a first heat-conducting silica gel layer; 13. a second copper foil layer; 14. a second rubber layer; 15. a second heat-conducting silica gel layer; 25. fitting a ring; 26. a third heat-conducting silica gel layer; 27. a fourth heat-conducting silica gel layer; 30. and the shaft hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
The utility model discloses compound heat conduction gasket basic thought based on graphite alkene is: a layered heat conduction structure is adopted, so that the problem that heat cannot be transferred in a layered mode is solved; through fixed knot structure, solve easy heat conduction gasket and take place the displacement problem easily.
The composite thermal conductive gasket based on graphene is described in detail below with reference to the accompanying drawings.
An object of the present invention is to provide a thermal gasket capable of transferring heat in layers and having a mounting structure, as shown in fig. 1 and 2, the thermal gasket may include:
the mounting portion 10, which is a circular ring structure, includes a plurality of mounting holes 100 and mounting grooves 101.
The heat conduction portion 20 is provided inside the mounting portion 10, and includes:
a first release film layer 21.
First graphite alkene layer 22 sets up in first type rete 21 downside from, including crisscross graphite alkene layer and the two-sided glue film of setting up.
And a first copper foil layer 28 disposed on the bottom side of the first graphene layer 22.
The second graphene layer 23 is disposed on the bottom side of the first copper foil layer 28, and includes graphene layers and double-sided adhesive layers disposed in a staggered manner.
And a second release film layer 24 disposed on the bottom side of the second graphene layer 23.
When the heat conducting gasket is used, the heat conducting gasket can be installed and fixed through the installation hole 100 and the installation groove 101; meanwhile, the heat of the electronic device is transmitted in a layered mode through the graphene layer and the copper foil layer, and the heat transmission efficiency is improved.
In practical use, in order to improve heat dissipation efficiency, the mounting portion 10 may include:
a first rubber layer 11.
And the first heat conducting silica gel layer 12 is arranged at the bottom side of the first rubber layer 11.
And the second copper foil layer 13 is arranged at the bottom side of the first heat-conducting silica gel layer 12.
And a second rubber layer 14 disposed on the bottom side of the second copper foil layer 13.
And the second heat conducting silica gel layer 15 is arranged at the bottom side of the second rubber layer 14.
The graphene gasket is relatively brittle and easy to deform, so that the graphene gasket needs to be avoided during installation, the problem is avoided by adopting a rubber-heat-conducting silica gel installation structure, and the structural stability is improved; meanwhile, heat can be discharged from the heat-conducting silica gel layer.
In a preferred embodiment, the number of the mounting holes 100 may include four, and the geometric center line of the mounting holes 100 has a square shape.
In another preferred embodiment, the mounting grooves 101 may include four, and any one of the mounting grooves 101 is disposed between two adjacent mounting holes 100.
Generally, the first release film layer 21 and the second release film layer 24 can be selected from fluoroplastic release films.
In practical use, the thickness of the single graphene layer may be 0.02mm to 0.04 mm. The first and second copper foil layers 28 and 13 may have a thickness of 0.04mm to 0.08 mm.
One object of the present invention is: the heat conducting gasket for adjusting the contact area is provided, and the heat conducting gasket can further comprise:
the fitting ring 25, which is an elastic material, is embedded in the first release film layer 21 and/or the second release film layer 24.
Through the elastic fit ring 25, the contact area of the heat-conducting gasket can be adjusted, and the heat dissipation efficiency is improved.
In a preferred embodiment, the two sides of the thermal pad may further include:
the third heat conductive silicone layer 26 is disposed between the first release film layer 21 and the first graphene layer 22.
The fourth heat conducting silica gel layer 27 is disposed between the second release film layer 24 and the second graphene layer 23.
One object of the present invention is: there is provided an axially mounted thermally conductive spacer, the thermally conductive spacer further comprising:
and the shaft hole 30 is arranged at the geometric center of the heat-conducting gasket.
The utility model discloses compound heat conduction gasket based on graphite alkene adopts the layered heat conduction structure, solves and can't carry out the transmission of layering with the heat, the relatively poor problem of heat conduction effect; through fixed knot structure, solve the graphite alkene gasket and take place the displacement problem easily.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of additional like elements in the article or device comprising the element.
The above embodiments are merely for illustrating the technical solutions of the present invention and are not to be construed as limiting, and the present invention is described in detail with reference to the preferred embodiments. It should be understood by those skilled in the art that various modifications and equivalent substitutions may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention, and all the modifications and equivalents should be covered by the scope of the claims of the present invention.

Claims (10)

1. A compound thermal pad piece based on graphite alkene which characterized in that includes:
the mounting part (10) is of a circular ring structure and comprises a plurality of mounting holes (100) and mounting grooves (101) which are uniformly arranged;
a heat conduction portion (20) provided inside the mounting portion (10), including:
a first release film layer (21);
the first graphene layer (22) is arranged on the bottom side of the first release film layer (21) and comprises graphene layers and double-sided adhesive layers which are arranged in a staggered mode;
a first copper foil layer (28) disposed on a bottom side of the first graphene layer (22);
the second graphene layer (23) is arranged on the bottom side of the first copper foil layer (28) and comprises staggered graphene layers and double-sided adhesive layers;
and the second release film layer (24) is arranged on the bottom side of the second graphene layer (23).
2. Composite graphene-based thermally conductive gasket according to claim 1, characterized in that the mounting portion (10) comprises:
a first rubber layer (11);
the first heat-conducting silica gel layer (12) is arranged at the bottom side of the first rubber layer (11);
the second copper foil layer (13) is arranged on the bottom side of the first heat-conducting silica gel layer (12);
a second rubber layer (14) arranged at the bottom side of the second copper foil layer (13);
and the second heat-conducting silica gel layer (15) is arranged at the bottom side of the second rubber layer (14).
3. The graphene-based composite thermal gasket according to claim 1, wherein the number of the mounting holes (100) is four, and a geometric center line of the mounting holes (100) has a square shape.
4. The graphene-based composite type thermal gasket according to claim 3, wherein the number of the mounting grooves (101) is four, and any one of the mounting grooves (101) is disposed between two adjacent mounting holes (100).
5. The graphene-based composite thermal pad according to claim 1, wherein the first release film layer (21) and the second release film layer (24) are fluoroplastic release films.
6. The graphene-based composite thermal pad according to claim 1,
the thickness of the single-layer graphene layer is 0.02mm-0.04 mm.
7. The graphene-based composite thermal pad according to claim 2,
the thicknesses of the first copper foil layer (28) and the second copper foil layer (13) are both 0.04mm-0.08 mm.
8. The graphene-based composite heat conduction gasket according to claim 1, further comprising, on both sides of the graphene-based composite heat conduction gasket:
a conformable ring (25) of elastomeric material embedded in the first release film layer (21) and/or the second release film layer (24).
9. The graphene-based composite thermal gasket of claim 1, further comprising:
the third heat-conducting silica gel layer (26) is arranged between the first release film layer (21) and the first graphene layer (22);
and the fourth heat conduction silica gel layer (27) is arranged between the second release film layer (24) and the second graphene layer (23).
10. The graphene-based composite thermal gasket of claim 1, further comprising:
and the shaft hole (30) is arranged at the geometric center of the graphene-based composite heat conduction gasket.
CN202021156494.XU 2020-06-19 2020-06-19 Compound heat conduction gasket based on graphite alkene Active CN212064739U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021156494.XU CN212064739U (en) 2020-06-19 2020-06-19 Compound heat conduction gasket based on graphite alkene

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021156494.XU CN212064739U (en) 2020-06-19 2020-06-19 Compound heat conduction gasket based on graphite alkene

Publications (1)

Publication Number Publication Date
CN212064739U true CN212064739U (en) 2020-12-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021156494.XU Active CN212064739U (en) 2020-06-19 2020-06-19 Compound heat conduction gasket based on graphite alkene

Country Status (1)

Country Link
CN (1) CN212064739U (en)

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