CN209897509U - Elastic heat radiator with clip structure - Google Patents
Elastic heat radiator with clip structure Download PDFInfo
- Publication number
- CN209897509U CN209897509U CN201920151852.9U CN201920151852U CN209897509U CN 209897509 U CN209897509 U CN 209897509U CN 201920151852 U CN201920151852 U CN 201920151852U CN 209897509 U CN209897509 U CN 209897509U
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- China
- Prior art keywords
- elastic
- layer
- heat
- elastic heat
- heat sink
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- 239000010410 layer Substances 0.000 claims abstract description 45
- 238000007789 sealing Methods 0.000 claims abstract description 20
- 230000005855 radiation Effects 0.000 claims abstract description 14
- 239000002344 surface layer Substances 0.000 claims abstract description 12
- 239000012790 adhesive layer Substances 0.000 claims description 32
- 230000017525 heat dissipation Effects 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004831 Hot glue Substances 0.000 claims description 3
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 229920001821 foam rubber Polymers 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229910021382 natural graphite Inorganic materials 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 229910021383 artificial graphite Inorganic materials 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses an elastic radiator with a clip structure, which is provided with a hollow groove; the elastic heat radiator comprises an elastic filling layer, and a heat conduction layer and an outer surface layer which are sequentially coated on the periphery of the elastic filling layer. The utility model relates to an elastic heat radiator of type structure returns, through the cavity groove in elastic heat radiator has been seted up, the cavity groove can hold encapsulating of heat-generating body, and this makes after the elastic heat radiator installs, can closely laminate with the upper surface of heat-generating body, has improved elastic heat radiator's heat-sinking capability. In addition, the side sealing parts are arranged in the hollow groove, the end face sealing parts are arranged at two ends of the elastic heat radiation body, and the side sealing parts and the end face sealing parts can prevent substances in the heat conduction layer from falling off, so that the service life of the elastic heat radiation body is prolonged.
Description
Technical Field
The utility model relates to a heat radiation structure, the more specifically elasticity radiator of type structure returns that says so.
Background
With the development of the times, the demand of electronic products tends to be more and more light and thin, and thus the integration degree of electronic devices needs to be improved, but the heat dissipation problem of the electronic devices is more and more serious.
At present, there are also heat dissipation liners for dissipating heat from a heat generating body of an electronic device, but these heat dissipation liners cannot be completely attached to the heat generating body, and after the heat dissipation liners are installed above the heat generating body, there will be a certain gap between the heat dissipation liners, and the reason for this is that, general heat generating bodies, for example, CPU upper surfaces are all enveloped, that is, the heat generating body upper surface is not flat, resulting in that after the heat dissipation liners are installed, one part of the heat dissipation liners can be closely attached to the heat generating body upper surface, and the other part cannot be closely attached to the heat generating body upper surface, and therefore, the heat dissipation effect is poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art not enough, provide an elastic heat radiator of type structure returns.
In order to achieve the above purpose, the utility model adopts the following technical scheme: an elastic heat radiation body with a clip structure is provided with a hollow groove; the elastic heat radiator comprises an elastic filling layer, and a heat conduction layer and an outer surface layer which are sequentially coated on the periphery of the elastic filling layer.
The further technical scheme is as follows: the hollow groove is square in shape.
The further technical scheme is as follows: the cross sectional area of the hollow groove is 0.3-0.8 times of the cross sectional area of the elastic heat radiation body.
The further technical scheme is as follows: and a side sealing part is arranged in the hollow groove.
The further technical scheme is as follows: and end face edge sealing parts are arranged at two ends of the elastic heat radiation body.
The further technical scheme is as follows: the heat conducting layer is any one or combination of a plurality of natural graphite, artificially synthesized graphite, graphene, copper foil or aluminum foil.
The further technical scheme is as follows: the elastic filling layer is any one of polyester sponge, PU foam or rubber foam.
The further technical scheme is as follows: further comprising a first adhesive layer and a second adhesive layer; one surface of the first adhesive layer is bonded with the elastic filling layer, the other surface of the first adhesive layer is bonded with the inner surface of the heat conduction layer, one surface of the second adhesive layer is bonded with the outer surface of the heat conduction layer, and the other surface of the second adhesive layer is bonded with the outer surface layer.
The further technical scheme is as follows: the first adhesive layer and the second adhesive layer are both one of thermosetting adhesive, silicic acid gel, acrylic adhesive or polyurethane hot melt adhesive.
The further technical scheme is as follows: the outer surface layer is an insulating layer or a conducting layer.
Compared with the prior art, the utility model beneficial effect be: the utility model relates to an elastic heat radiator of type structure returns, through the cavity groove in elastic heat radiator has been seted up, the cavity groove can hold encapsulating of heat-generating body, and this makes after the elastic heat radiator installs, can closely laminate with the upper surface of heat-generating body, has improved elastic heat radiator's heat-sinking capability. In addition, the side sealing parts are arranged in the hollow groove, the end face sealing parts are arranged at two ends of the elastic heat radiation body, and the side sealing parts and the end face sealing parts can prevent substances in the heat conduction layer from falling off, so that the service life of the elastic heat radiation body is prolonged.
The foregoing is a summary of the present invention, and other objects, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments, which is provided for the purpose of illustration and understanding of the present invention.
Drawings
Fig. 1 is a cross-sectional view of an embodiment of an elastic heat sink with a clip structure according to the present invention;
fig. 2 is a schematic structural diagram of an embodiment of the elastic heat sink with a clip structure according to the present invention.
Reference numerals
1. An elastic heat sink; 11. a hollow groove; 12. end face edge sealing; 13. an elastic filling layer; 14. a first adhesive layer; 15. a heat conductive layer; 16. a second adhesive layer; 17. an outer surface layer.
Detailed Description
In order to more fully understand the technical content of the present invention, the technical solution of the present invention will be further described and illustrated with reference to the following specific embodiments, but not limited thereto.
It is to be understood that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity/action/object from another entity/action/object without necessarily requiring or implying any actual such relationship or order between such entities/actions/objects.
It should be further understood that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
As shown in fig. 1 and 2, the present invention provides an elastic heat sink with a clip structure, wherein the elastic heat sink 1 is provided with a hollow groove 11; the elastic heat radiator 1 comprises an elastic filling layer 13, a heat conduction layer 15 and an outer surface layer 17, wherein the heat conduction layer 15 and the outer surface layer 17 are sequentially coated on the periphery of the elastic filling layer 13; further comprising a first adhesive layer 14 and a second adhesive layer 16; one side of the first adhesive layer 14 is bonded to the elastic filling layer 13, the other side of the first adhesive layer 14 is bonded to the inner surface of the heat conductive layer 15, one side of the second adhesive layer 16 is bonded to the outer surface of the heat conductive layer 15, and the other side of the second adhesive layer 16 is bonded to the outer surface layer 17.
Specifically, the hollow groove 11 is located in the middle of the elastic heat sink 1, the hollow groove 11 is square, and the cross-sectional area of the hollow groove 11 is 0.3-0.8 times of the cross-sectional area of the elastic heat sink 1. The square shape is adopted, so that the whole elastic heat radiation body 1 is of a clip-shaped structure, and a heating body (such as a CPU) is conveniently encapsulated and arranged in the hollow groove 11. With such a structure, the elastic heat radiating body 1 can be closely attached to the heating body, and the heat radiating capability can be improved.
Further, the heat conducting layer 15 is any one or a combination of several of natural graphite, synthetic graphite, graphene, copper foil or aluminum foil. The thickness of the heat conduction layer 15 is 0.02-0.07 mm.
Further, the elastic filling layer 13 is any one of polyester sponge, PU foam or rubber foam. The thickness of the elastic filling layer 13 is 0.2-20 mm.
Further, a side sealing part (not shown) is provided in the hollow groove 11, and end sealing parts 12 are provided at both ends of the elastic heat sink 1. When graphite is used as the heat conduction layer 15, the side edge sealing portion and the end surface edge sealing portion 12 are provided to prevent graphite particles from falling, thereby prolonging the service life of the elastic heat sink 1.
Further, the first adhesive layer 14 and the second adhesive layer 16 are both one of thermosetting glue, silicic acid gel, acrylic glue or polyurethane hot melt glue. In other embodiments, the first adhesive layer and the second adhesive layer may use different colloids. For example, the first adhesive layer is made of thermosetting adhesive, and the second adhesive layer is made of polyurethane hot melt adhesive.
Further, the outer surface layer 17 is an insulating layer or a conductive layer. Specifically, when the insulating layer is formed, the insulating layer is one of a polyamide film, a polyethylene film, a polypropylene film, a polyvinyl chloride film, a polyester film, or polyimide. When the conductive layer is a voltage-resistant film, a metal foil film, an EMI-resistant wave-absorbing film, an antistatic film, conductive cloth or a conductive gauze, or a combination of any one or more of the above films.
In other embodiments, the side of the elastic heat dissipation body contacting the heating element is provided with an adhesive layer. The adhesive layer is convenient for fixing the elastic heat radiation body on the upper surface of the heating body.
Compared with the prior art, the utility model beneficial effect be: the utility model relates to an elastic heat radiator of type structure returns, through the cavity groove in elastic heat radiator has been seted up, the cavity groove can hold encapsulating of heat-generating body, and this makes after the elastic heat radiator installs, can closely laminate with the upper surface of heat-generating body, has improved elastic heat radiator's heat-sinking capability. In addition, the side sealing parts are arranged in the hollow groove, the end face sealing parts are arranged at two ends of the elastic heat radiation body, and the side sealing parts and the end face sealing parts can prevent substances in the heat conduction layer from falling off, so that the service life of the elastic heat radiation body is prolonged.
The technical content of the present invention is further described by the embodiments only, so that the reader can understand it more easily, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation according to the present invention is protected by the present invention. The protection scope of the present invention is subject to the claims.
Claims (10)
1. The elastic heat radiation body is characterized in that the elastic heat radiation body is provided with a hollow groove; the elastic heat radiator comprises an elastic filling layer, and a heat conduction layer and an outer surface layer which are sequentially coated on the periphery of the elastic filling layer.
2. The resilient heat sink of claim 1, wherein said hollow channel is square in shape.
3. The elastic heat sink of claim 1, wherein the cross-sectional area of the hollow groove is 0.3 to 0.8 times the cross-sectional area of the elastic heat sink.
4. The flexible heat sink of claim 1, wherein the hollow channel has a side seal.
5. The elastic heat sink of claim 1, wherein end-face sealing portions are disposed at two ends of the elastic heat sink.
6. The elastic heat sink of claim 1, wherein the heat conducting layer is made of one or a combination of natural graphite, synthetic graphite, graphene, copper foil, or aluminum foil.
7. The elastic heat sink of claim 1, wherein the elastic filling layer is made of one of polyester sponge, PU foam or rubber foam.
8. The elastic heat sink of claim 1, further comprising a first adhesive layer and a second adhesive layer; one surface of the first adhesive layer is bonded with the elastic filling layer, the other surface of the first adhesive layer is bonded with the inner surface of the heat conduction layer, one surface of the second adhesive layer is bonded with the outer surface of the heat conduction layer, and the other surface of the second adhesive layer is bonded with the outer surface layer.
9. The elastic heat dissipation body of claim 8, wherein the first adhesive layer and the second adhesive layer are both one of thermosetting adhesive, silicic acid gel, acrylic acid adhesive or polyurethane hot melt adhesive.
10. The elastic heat sink of claim 1, wherein the outer surface layer is an insulating layer or a conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920151852.9U CN209897509U (en) | 2019-01-28 | 2019-01-28 | Elastic heat radiator with clip structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920151852.9U CN209897509U (en) | 2019-01-28 | 2019-01-28 | Elastic heat radiator with clip structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209897509U true CN209897509U (en) | 2020-01-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920151852.9U Active CN209897509U (en) | 2019-01-28 | 2019-01-28 | Elastic heat radiator with clip structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209897509U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465286A (en) * | 2020-05-05 | 2020-07-28 | 深圳市慧为智能科技股份有限公司 | Ultra-thin mobile terminal heat abstractor and ultra-thin mobile terminal |
| CN113829685A (en) * | 2021-09-13 | 2021-12-24 | 深圳市鸿富诚屏蔽材料有限公司 | A kind of graphene thermal conductive gasket wrapping process and wrapping graphene thermal conductive gasket |
-
2019
- 2019-01-28 CN CN201920151852.9U patent/CN209897509U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465286A (en) * | 2020-05-05 | 2020-07-28 | 深圳市慧为智能科技股份有限公司 | Ultra-thin mobile terminal heat abstractor and ultra-thin mobile terminal |
| CN113829685A (en) * | 2021-09-13 | 2021-12-24 | 深圳市鸿富诚屏蔽材料有限公司 | A kind of graphene thermal conductive gasket wrapping process and wrapping graphene thermal conductive gasket |
| CN113829685B (en) * | 2021-09-13 | 2023-12-22 | 深圳市鸿富诚新材料股份有限公司 | Graphene heat conduction gasket edge covering process and edge covering graphene heat conduction gasket |
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| GR01 | Patent grant | ||
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