CN216749869U - Chip heat radiation structure and electronic product with same - Google Patents
Chip heat radiation structure and electronic product with same Download PDFInfo
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- CN216749869U CN216749869U CN202122821721.7U CN202122821721U CN216749869U CN 216749869 U CN216749869 U CN 216749869U CN 202122821721 U CN202122821721 U CN 202122821721U CN 216749869 U CN216749869 U CN 216749869U
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- sealing layer
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- dissipation structure
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Abstract
The utility model provides a chip heat radiation structure and an electronic product with the same, wherein the chip heat radiation structure comprises: a mounting base; the chip is arranged on the mounting seat; the first elastic sealing layer is arranged around the circumferential outer side of the chip; the heat dissipation structure is arranged on one side of the chip far away from the mounting seat, and an accommodating space is formed among the heat dissipation structure, the chip and the first elastic sealing layer; a heat transfer material disposed within the receiving space; a second elastic sealing layer disposed circumferentially outward of the first elastic sealing layer. The technical scheme of the utility model effectively solves the problem of poor sealing effect of the chip heat dissipation structure in the prior art.
Description
Technical Field
The utility model relates to the technical field of chip heat dissipation, in particular to a chip heat dissipation structure and an electronic product with the same.
Background
As a very important electronic component, a chip needs to dissipate heat. In the prior art, the whole piece of foam is arranged on the outer side of the periphery of the chip, and the upper parts of the chip and the foam are provided with heat dissipation plates with fins. However, the circuit board often has not only chips but also other electronic components, which causes different compression ratios of the foam and easily causes a leakage problem.
SUMMERY OF THE UTILITY MODEL
The utility model provides a chip heat dissipation structure and an electronic product with the same, and solves the problem that the chip heat dissipation structure in the prior art is poor in sealing effect.
In order to achieve the above object, the present invention provides a chip heat dissipation structure, including: a mounting base; the chip is arranged on the mounting seat; the first elastic sealing layer is arranged around the circumferential outer side of the chip; the heat dissipation structure is arranged on one side of the chip far away from the mounting seat, and an accommodating space is formed among the heat dissipation structure, the chip and the first elastic sealing layer; a heat transfer material disposed within the receiving space; a second elastic sealing layer disposed circumferentially outward of the first elastic sealing layer.
Further, the thickness of first elastic sealing layer is greater than the thickness of second elastic sealing layer, and chip heat radiation structure still includes electronic components, and electronic components sets up between second elastic sealing layer and mount pad.
Further, the chip heat dissipation structure further comprises a third elastic sealing layer, and the third elastic sealing layer is arranged on the circumferential outer side of the second elastic sealing layer.
Further, the chip heat dissipation structure further comprises a chip enclosure frame, and the chip enclosure frame is arranged between the third elastic sealing layer and the mounting seat.
Further, the chip heat dissipation structure further comprises first insulating paper, and the first insulating paper is arranged among the first elastic sealing layer, the second elastic sealing layer, the third elastic sealing layer and the heat dissipation structure.
Further, the chip heat dissipation structure further comprises second insulating paper, the outer side of the second insulating paper is arranged between the second elastic sealing layer and the electronic component, and the inner side of the second insulating paper is arranged between the first elastic sealing layer and the mounting seat.
Further, the heat dissipation structure is selected from any one of a heat dissipation fin, a heat pipe and a phase change heat sink; preferably, the heat dissipation structure includes a plate body and a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged on one side of the plate body away from the mounting seat at intervals.
Furthermore, the heat dissipation structure further comprises a boss, the boss is arranged on one side, close to the mounting seat, of the plate body, and the boss, the first elastic sealing layer and the chip are enclosed to form an accommodating space.
Furthermore, one side of the first elastic sealing layer, which is close to the mounting seat, is coated with a sealant, one side of the second elastic sealing layer, which is far away from the mounting seat, is coated with the sealant, or one side of the first elastic sealing layer, which is far away from the mounting seat, is coated with the sealant, and one side of the second elastic sealing layer, which is close to the mounting seat, is coated with the sealant.
Further, the chip heat dissipation structure is the above chip heat dissipation structure.
By applying the technical scheme of the utility model, the chip heat dissipation structure is provided with the first elastic sealing layer and the second elastic sealing layer, so that the two elastic sealing layers cannot be influenced by different structures between the two elastic sealing layers and the mounting seat, for example, the thickness, the material and the like of the second elastic sealing layer and the first elastic sealing layer can be set to be different according to specific conditions so as to ensure the sealing effect. The technical scheme of the utility model effectively solves the problem of poor sealing effect of the chip heat dissipation structure in the prior art.
Drawings
The above and other objects, features and advantages of exemplary embodiments of the present disclosure will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:
fig. 1 is a schematic diagram illustrating a heat dissipation structure of a chip according to a first embodiment.
Wherein the figures include the following reference numerals:
10. a mounting seat; 20. a chip; 30. a first elastomeric sealing layer; 40. a heat dissipation structure; 41. a plate body; 42. a heat sink; 50. a heat transfer material; 60. a second elastomeric sealing layer; 70. an electronic component; 80. a third elastomeric sealing layer; 90. a first insulating paper; 100. and a second insulating paper.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
Spatially relative terms, such as "above … …," "above … …," "above … … surface," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may also be oriented 90 degrees or at other orientations and the spatially relative descriptors used herein interpreted accordingly.
Exemplary embodiments according to the present disclosure will now be described in more detail with reference to the accompanying drawings. These exemplary embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. It is to be understood that these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art, in the drawings, the thicknesses of layers and regions are exaggerated for clarity, and the same devices are denoted by the same reference numerals, and thus the description thereof will be omitted.
As shown in fig. 1, the heat dissipation structure of the chip of the first embodiment includes: mount 10, chip 20, first elastomeric sealing layer 30, heat dissipation structure 40, and heat transfer material 50. The chip 20 is disposed on the mount 10. The first elastic sealing layer 30 is provided around the circumferential outer side of the chip 20. The heat dissipation structure 40 is disposed on a side of the chip 20 away from the mounting base 10, and an accommodation space is provided between the heat dissipation structure 40, the chip 20 and the first elastic sealing layer 30. The heat transfer material 50 is disposed in the accommodating space. And a second elastic sealing layer 60, the second elastic sealing layer 60 being disposed circumferentially outward of the first elastic sealing layer 30.
Use the technical scheme of this embodiment, chip heat radiation structure is provided with first elastic sealing layer and second elastic sealing layer, and the structure difference between two elastic sealing layers and the mount pad can not cause the influence to two elastic sealing layers like this yet, for example, second elastic sealing layer and first elastic sealing layer can set up thickness, material etc. to the difference according to particular case to guarantee sealed effect. The technical scheme of this embodiment has solved the not good problem of chip heat radiation structure's among the prior art sealed effect effectively.
The heat transfer material 50 may or may not undergo a phase change. For example, the heat transfer material 50 may be in a liquid state, may be in a solid state to a liquid state, may be in a liquid state to a gas state, or may be in a solid state to a gas state. Specifically, the heat transfer material 50 may be at least one of gallium, indium, tin, zinc, bismuth, lead, chromium, mercury, sodium, potassium, cesium, zinc, copper, and aluminum.
As shown in fig. 1, in the technical solution of the present embodiment, the thickness of the first elastic sealing layer 30 is greater than the thickness of the second elastic sealing layer 60, the chip heat dissipation structure further includes an electronic component 70, and the electronic component 70 is disposed between the second elastic sealing layer 60 and the mounting base 10. The electronic component 70 is located between the second elastic sealing layer 60 and the mounting seat 10, and the thickness of the first elastic sealing layer 30 is greater than that of the second elastic sealing layer 60, so that the second elastic sealing layer 60 can be set according to practical situations, and the second elastic sealing layer 60 cannot be deformed due to excessive pressing, so that poor sealing effect cannot be caused.
In the technical solution of this embodiment, the chip heat dissipation structure further includes a third elastic sealing layer 80, and the third elastic sealing layer 80 is disposed on the circumferential outer side of the second elastic sealing layer 60. The third elastic sealing layer 80 further ensures the sealing of the chip heat dissipation structure and the overall support of the system, and prevents the first elastic sealing layer and the second elastic sealing layer from being excessively compressed, and specifically, the thicknesses, materials and the like of the second elastic sealing layer 60 and the third elastic sealing layer 80 can be designed according to actual conditions, without setting the second elastic sealing layer 60 and the third elastic sealing layer 80 to be the same in thickness, the same in material, and integrally formed, or even the same in sealing adhesive limiting conditions.
In the technical solution of this embodiment, the chip heat dissipation structure further includes a chip enclosure frame, and the chip enclosure frame is disposed between the third elastic sealing layer 80 and the mounting base 10. The chip enclosure frame is provided to protect the chip 20 and the heat transfer material 50, specifically, the third elastic sealing layer 80 and the second elastic sealing layer 60 have different thicknesses, and the height of the chip enclosure frame is greater than that of the electronic component 70.
In the technical solution of this embodiment, the chip heat dissipation structure further includes a first insulating paper 90, and the first insulating paper 90 is disposed between the first elastic sealing layer 30, the second elastic sealing layer 60, and the third elastic sealing layer 80 and the heat dissipation structure 40. The first insulating paper 90 is provided to prevent conduction of static electricity and the like, thereby preventing the electronic component 70 from being damaged by static electricity.
As shown in fig. 1, in the present embodiment, the chip heat dissipation structure further includes a second insulating paper 100, an outer side of the second insulating paper 100 is disposed between the second elastic sealing layer 60 and the electronic component 70, and an inner side of the second insulating paper 100 is disposed between the first elastic sealing layer 30 and the mounting base 10. The second insulating paper 100 can prevent static electricity, and the second insulating paper 100 can prevent heat transfer material from entering the electronic component 70 area to damage the electronic component 70, even damage the electronic product using the chip heat dissipation structure. It should be noted that, in the technical solution of this embodiment, the heat transfer material 50 is in a liquid state, and the liquid heat transfer material fills the accommodating space better, so that the heat transfer effect is ensured to be better.
In the solution of the present embodiment, the heat dissipation structure 40 includes a plate body 41 and a plurality of heat dissipation fins 42, and the plurality of heat dissipation fins 42 are disposed at intervals on a side of the plate body 41 away from the mounting base 10. The structure has the advantages of low processing cost and good heat dissipation effect.
In the technical solution of this embodiment, the heat dissipation structure 40 further includes a boss, the boss is disposed on one side of the plate body 41 close to the mounting base 10, and the boss, the first elastic sealing layer 30 and the chip 20 enclose an accommodation space. The arrangement of the boss ensures the sealing of the chip heat dissipation structure of the embodiment. Specifically, the boss has a frustum-shaped structure in which the cross-sectional area increases gradually from the mounting seat 10 to the plate body 41, which contributes to sealing. The first elastic sealing layer 30 has a truncated cone shape with a cross-sectional area gradually increasing from the side close to the chip to the side away from the chip. The materials of the first elastic sealant layer 30, the second elastic sealant layer 60, and the third elastic sealant layer 80 may be the same or different. In the technical solution of this embodiment, the first elastic sealing layer 30 is foamed plastic.
As shown in fig. 1, in the first embodiment, a side of the first elastic sealant layer 30 close to the mounting seat 10 is coated with a sealant, and a side of the second elastic sealant layer 60 away from the mounting seat 10 is coated with a sealant. The above structure allows the first and second elastic sealing layers 30 and 60 to be easily detached. For a precise chip heat dissipation structure, it is desirable that the elastic sealing layer be easily removed when the elastic sealing layer is removed, and that the electronic component, the chip, and the like be not damaged.
The technical solution of the second embodiment is different from the technical solution of the first embodiment in that a side of the first elastic sealing layer 30 away from the mounting seat 10 is coated with a sealant, and a side of the second elastic sealing layer 60 close to the mounting seat 10 is coated with a sealant. So that the first and second elastomeric sealing layers 30 and 60 are easily removable. As another example, the first elastomeric sealing layer 30 may be coated with a sealant on both sides and the second elastomeric sealing layer 60 may be coated with a sealant on both sides. The sealants applied by the first and second elastic sealant layers 30 and 60 may be the same or different. The elastic sealing layer may be foamed or may be a porous and air-permeable rubber structure, which is air-permeable, and the heat transfer material 50 may not be permeable through the porous and air-permeable rubber structure.
The application also provides an electronic product, which comprises a chip heat dissipation structure.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances such that, for example, embodiments of the application described herein may be implemented in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (11)
1. A chip heat dissipation structure, comprising:
a mounting seat (10);
a chip (20), the chip (20) being disposed on the mount (10);
a first elastic sealing layer (30), wherein the first elastic sealing layer (30) is arranged around the circumferential outer side of the chip (20);
the heat dissipation structure (40) is arranged on one side, far away from the mounting seat (10), of the chip (20), and an accommodating space is formed among the heat dissipation structure (40), the chip (20) and the first elastic sealing layer (30);
a heat transfer material (50), the heat transfer material (50) being disposed within the accommodation space;
a second resilient sealing layer (60), the second resilient sealing layer (60) being disposed circumferentially outward of the first resilient sealing layer (30).
2. The chip heat dissipation structure according to claim 1, wherein the thickness of the first elastic sealing layer (30) is greater than the thickness of the second elastic sealing layer (60), the chip heat dissipation structure further comprising an electronic component (70), the electronic component (70) being disposed between the second elastic sealing layer (60) and the mounting base (10).
3. The chip heat dissipation structure according to claim 2, further comprising a third elastic sealing layer (80), wherein the third elastic sealing layer (80) is disposed circumferentially outside the second elastic sealing layer (60).
4. The chip heat dissipation structure according to claim 3, further comprising a chip enclosure frame disposed between the third elastic sealing layer (80) and the mounting base (10).
5. The chip heat dissipation structure according to claim 3, further comprising a first insulating paper (90), the first insulating paper (90) being disposed between the first, second, and third elastic sealing layers (30, 60, 80) and the heat dissipation structure (40).
6. The chip heat dissipation structure according to claim 2, further comprising a second insulating paper (100), an outer side of the second insulating paper (100) being disposed between the second elastic sealing layer (60) and the electronic component (70), and an inner side of the second insulating paper (100) being disposed between the first elastic sealing layer (30) and the mount (10).
7. The chip heat dissipation structure according to claim 1, wherein the heat dissipation structure (40) is selected from any one of a heat sink, a heat pipe, and a phase change heat sink.
8. The chip heat dissipation structure according to claim 7, wherein the heat dissipation structure (40) includes a plate body (41) and a plurality of heat dissipation fins (42), and the plurality of heat dissipation fins (42) are arranged at intervals on a side of the plate body (41) away from the mounting base (10).
9. The chip heat dissipation structure according to claim 8, wherein the heat dissipation structure (40) further comprises a boss disposed on a side of the board body (41) close to the mounting seat (10), the boss, the first elastic sealing layer (30) and the chip (20) enclosing the accommodation space.
10. The chip heat dissipation structure according to any one of claims 1 to 9, wherein a side of the first elastic sealant layer (30) close to the mounting seat (10) is coated with a sealant, and a side of the second elastic sealant layer (60) away from the mounting seat (10) is coated with a sealant, or
One side, far away from mount pad (10), of first elasticity sealing layer (30) has coated sealed glue, one side that second elasticity sealing layer (60) is close to mount pad (10) has coated sealed glue.
11. An electronic product comprising a chip heat dissipation structure, wherein the chip heat dissipation structure is the chip heat dissipation structure of any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122821721.7U CN216749869U (en) | 2021-11-17 | 2021-11-17 | Chip heat radiation structure and electronic product with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122821721.7U CN216749869U (en) | 2021-11-17 | 2021-11-17 | Chip heat radiation structure and electronic product with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216749869U true CN216749869U (en) | 2022-06-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122821721.7U Active CN216749869U (en) | 2021-11-17 | 2021-11-17 | Chip heat radiation structure and electronic product with same |
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| Country | Link |
|---|---|
| CN (1) | CN216749869U (en) |
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2021
- 2021-11-17 CN CN202122821721.7U patent/CN216749869U/en active Active
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