CN210226027U

CN210226027U - Combined elastic heat radiator

Info

Publication number: CN210226027U
Application number: CN201920146942.9U
Authority: CN
Inventors: Xusheng Wu; 伍栩生
Original assignee: Shenzhen Rui Hui New Material Co Ltd
Current assignee: Shenzhen Rui Hui New Material Co Ltd
Priority date: 2019-01-28
Filing date: 2019-01-28
Publication date: 2020-03-31
Anticipated expiration: 2029-01-28

Abstract

The utility model discloses a combined elastic radiator, which comprises a supporting substrate fixed on the heating surface of a heating element and a plurality of radiating monomers arranged at intervals on the surface of the supporting substrate; the heat dissipation monomer comprises a low-stress substrate layer, and a heat conduction layer and an outer surface layer which are sequentially wrapped on the periphery of the low-stress substrate layer. The utility model provides a pair of modular elastic heat radiator is equipped with a plurality of interval arrangement's heat dissipation monomer on same support substrate, has not only improved heat conduction efficiency, has realized the plane heat dissipation moreover, and the radiating effect is showing more.

Description

Combined elastic heat radiator

Technical Field

The utility model relates to a radiator, the more specifically modular elasticity radiator that says so.

Background

With the development of the times, the demand of electronic products tends to be more and more light and thin, and thus the integration degree of electronic devices needs to be improved, but the heat dissipation problem of the electronic devices is more and more serious.

However, the current heat dissipation pad can only conduct heat vertically, which results in poor heat dissipation effect.

Therefore, it is necessary to design a heat sink capable of conducting heat in a planar manner to improve heat dissipation efficiency.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art not enough, provide a modular elasticity radiator.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a combined elastic heat radiator comprises a support substrate fixed on the heating surface of a heating body and a plurality of heat radiating monomers arranged at intervals on the surface of the support substrate; the heat dissipation monomer comprises a low-stress substrate layer, and a heat conduction layer and an outer surface layer which are sequentially wrapped on the periphery of the low-stress substrate layer.

The further technical scheme is as follows: the supporting base material is a glue film.

The further technical scheme is as follows: the heat dissipation monomers are arranged in a matrix; the interval width of two adjacent heat dissipation monomers is greater than or equal to the thickness of the heat dissipation monomers and less than the width of the heat dissipation monomers.

The further technical scheme is as follows: the heat dissipation monomer is rectangular, square, U-shaped, square or irregular.

The further technical scheme is as follows: the sum of the thicknesses of the heat conduction layer and the outer surface layer is less than or equal to the thickness of the low-stress base material layer.

The further technical scheme is as follows: the thickness of the low-stress substrate layer is 0.2-40 mm.

The further technical scheme is as follows: the heat conducting layer is any one or a combination of a plurality of natural graphite, artificially synthesized graphite, graphene, copper foil or aluminum foil.

The further technical scheme is as follows: the heat dissipation monomer further comprises a first adhesive layer and a second adhesive layer; one surface of the first bonding layer is bonded with the low-stress base material layer, the other surface of the first bonding layer is bonded with the inner surface of the heat conduction layer, one surface of the second bonding layer is bonded with the outer surface of the heat conduction layer, and the other surface of the second bonding layer is bonded with the outer surface layer.

The further technical scheme is as follows: the first adhesive layer and the second adhesive layer are both one of thermosetting adhesive, silicic acid gel, acrylic adhesive or polyurethane hot melt adhesive.

The further technical scheme is as follows: the outer surface layer is an electric and heat conducting layer.

Compared with the prior art, the utility model beneficial effect be: the utility model provides a pair of modular elastic heat radiator is equipped with a plurality of interval arrangement's heat dissipation monomer on same support substrate, has not only improved heat conduction efficiency, has realized the plane heat dissipation moreover, and the radiating effect is showing more.

The foregoing is a summary of the present invention, and other objects, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments, which is provided for the purpose of illustration and understanding of the present invention.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of a combined elastic heat sink of the present invention;

fig. 2 is a cross-sectional view of a heat dissipating unit in an embodiment of the combined elastic heat dissipating body of the present invention.

Reference numerals

1. Supporting a substrate; 2. a heat dissipation monomer; 21. a low stress substrate layer; 22. a first adhesive layer; 23. a heat conductive layer; 24. a second adhesive layer; 25. an outer surface layer.

Detailed Description

In order to more fully understand the technical content of the present invention, the technical solution of the present invention will be further described and illustrated with reference to the following specific embodiments, but not limited thereto.

It is to be understood that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity/action/object from another entity/action/object without necessarily requiring or implying any actual such relationship or order between such entities/actions/objects.

It should be further understood that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.

As shown in fig. 1 and 2, the utility model provides a combined elastic heat sink, which comprises a supporting substrate 1 fixed on the heating surface of a heating element, and a plurality of heat dissipating single bodies 2 arranged at intervals and arranged on the surface of the supporting substrate 1; the heat dissipation monomer 2 comprises a low-stress substrate layer 21, and a heat conduction layer 23 and an outer surface layer 25 which are sequentially coated on the periphery of the low-stress substrate layer 21; the heat dissipating monomer 2 further includes a first adhesive layer 22 and a second adhesive layer 24; one surface of the first adhesive layer 22 is bonded to the low-stress substrate layer 21, the other surface of the first adhesive layer 22 is bonded to the inner surface of the heat conductive layer 23, one surface of the second adhesive layer 24 is bonded to the outer surface of the heat conductive layer 23, and the other surface of the second adhesive layer 24 is bonded to the outer surface layer 25.

Specifically, the supporting substrate 1 is an adhesive film. The rubber film is convenient to fix on the surface of the heating element. The heat dissipation monomers 2 are arranged in a matrix; the interval width of two adjacent heat dissipation monomers 2 is greater than or equal to the thickness of the heat dissipation monomer 2 and less than the width of the heat dissipation monomer 2. The heat dissipating unit 2 may have a rectangular shape, a square shape, a U-shape, a square shape, or an irregular shape.

In addition, the heat dissipation single body 2 and the adhesive film can be integrally formed, or other forms can be adopted to fix the heat dissipation single body 2 on the adhesive film, for example, an adhesive layer is arranged on the contact surface of the heat dissipation single body 2 and the adhesive film, and the heat dissipation single body 2 is bonded on the adhesive film through the adhesive layer, so that the replacement is convenient, the processing cost is lower, and the adhesive layer with better heat conductivity coefficient is selected as the adhesive layer, so as to improve the overall heat dissipation performance of the heat dissipation body.

Further, the sum of the thicknesses of the heat conduction layer 23 and the outer surface layer 25 is less than or equal to the thickness of the low-stress substrate layer 21. The thickness of the low-stress substrate layer 21 is 0.2-40 mm.

Further, the heat conducting layer 23 is any one or a combination of several of natural graphite, synthetic graphite, graphene, copper foil or aluminum foil. The thickness of the heat conduction layer 233 is 0.02 to 0.1 mm.

Further, the first adhesive layer 22 and the second adhesive layer 24 are both one of thermosetting glue, silicic acid gel, acrylic glue or polyurethane hot melt glue. In other embodiments, the first adhesive layer and the second adhesive layer may use different colloids. For example, the first adhesive layer is made of thermosetting adhesive, and the second adhesive layer is made of polyurethane hot melt adhesive.

Further, the outer surface layer 25 is an electrically and thermally conductive layer 23. Specifically, the electrically and thermally conductive layer 23 includes a heat dissipation frame, the heat dissipation frame is provided with a plurality of heat dissipation holes, and the heat dissipation holes are filled with a plurality of electrically conductive particles. The heat dissipation frame is made of one or more of natural graphite powder, artificial graphite powder, graphene and titanium dioxide. The conductive particles are one or more of copper particles, aluminum particles and silver particles. The graphite layer 3 comprises a plurality of graphite sheets laminated and bonded together. The thickness of the graphite sheet is 2-12 μm.

In other embodiments, the two ends of the heat dissipation body monomer are provided with end face sealing parts, and the end face sealing parts can prevent substances inside the heat dissipation monomer from falling, so that the service life of the heat dissipation monomer is prolonged.

The synthesis of the following steps: the utility model provides a pair of modular elastic heat radiator is equipped with a plurality of interval arrangement's heat dissipation monomer on same support substrate, has not only improved heat conduction efficiency, has realized the plane heat dissipation moreover, and the radiating effect is showing more.

The technical content of the present invention is further described by the embodiments only, so that the reader can understand it more easily, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation according to the present invention is protected by the present invention. The protection scope of the present invention is subject to the claims.

Claims

1. A combined elastic heat radiator is characterized by comprising a support base material and a plurality of heat radiating monomers, wherein the support base material is used for being fixed on the heating surface of a heating body; the heat dissipation monomer comprises a low-stress substrate layer, and a heat conduction layer and an outer surface layer which are sequentially wrapped on the periphery of the low-stress substrate layer.

2. The assembled flexible heat sink of claim 1 wherein the support substrate is an adhesive film.

3. The combined elastic heat sink of claim 1, wherein the heat dissipating units are arranged in a matrix; the interval width of two adjacent heat dissipation monomers is greater than or equal to the thickness of the heat dissipation monomers and less than the width of the heat dissipation monomers.

4. The assembled flexible heat sink of claim 1 wherein said heat sink element is rectangular, U-shaped or rectangular.

5. The combined resilient heat sink of claim 1 wherein the sum of the thicknesses of the thermally conductive layer and the outer skin is less than or equal to the thickness of the low stress substrate layer.

6. The combined elastic heat sink as claimed in claim 1, wherein the thickness of the low stress substrate layer is 0.2-40 mm.

7. The combined elastic heat sink of claim 1, wherein the heat conducting layer is one or a combination of natural graphite, synthetic graphite, graphene, copper foil or aluminum foil.

8. The combined resilient heat sink of claim 1, wherein the heat sink element further comprises a first adhesive layer and a second adhesive layer; one surface of the first bonding layer is bonded with the low-stress base material layer, the other surface of the first bonding layer is bonded with the inner surface of the heat conduction layer, one surface of the second bonding layer is bonded with the outer surface of the heat conduction layer, and the other surface of the second bonding layer is bonded with the outer surface layer.

9. The combined elastic heat sink of claim 8, wherein the first adhesive layer and the second adhesive layer are both one of thermosetting adhesive, silicic acid gel, acrylic acid adhesive or polyurethane hot melt adhesive.

10. The combined elastic heat sink of claim 1, wherein said outer surface layer is an electrically and thermally conductive layer.