CN211931124U - Soaking plate fin and soaking plate - Google Patents
Soaking plate fin and soaking plate Download PDFInfo
- Publication number
- CN211931124U CN211931124U CN201922391499.4U CN201922391499U CN211931124U CN 211931124 U CN211931124 U CN 211931124U CN 201922391499 U CN201922391499 U CN 201922391499U CN 211931124 U CN211931124 U CN 211931124U
- Authority
- CN
- China
- Prior art keywords
- plate
- soaking plate
- soaking
- fin
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a soaking plate fin, soaking plate fin surface is equipped with the copper oxide film, has intensive nanometer micropore on the copper oxide film. The copper oxide film dense nanometer micropores on the surface of the soaking plate fin form a liquid absorption core of the soaking plate fin. The nanometer micropores on the surface of the soaking plate fin are extremely small in aperture, the capillary rising height, the rising rate and the permeability of the liquid absorbing core are improved, the capillary limit of the liquid absorbing core is also improved, the capillary force on the working medium fluid is high, the flowing speed of the working medium fluid on the soaking plate fin is high, and therefore the soaking performance of the soaking plate can be greatly improved. The utility model also relates to a soaking plate.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to a soaking plate fin and soaking plate.
Background
Due to the highly integrated and tiny structure of the electronic equipment, the electronic equipment has large heat productivity during working and higher requirement on working temperature. Vapor chambers can employ phase change heat transfer over a larger area and thus are the best heat dissipation solution for electronic devices.
Working medium fluid in the common soaking plate flows on the soaking plate at a low speed, so that the temperature distribution on the soaking plate is uneven, the soaking plate is easy to generate thermal stress, and after the soaking plate is used for a long time, the thermal stress gathering part of the soaking plate is easy to break, and finally the soaking plate is scrapped.
The improved metal soaking plate in the prior art comprises an evaporating plate, a middle return-shaped plate, a condensing plate and a liquid filling pipe, wherein the evaporating plate is a metal fin with a V-shaped groove, the condensing plate, the middle return-shaped plate and the evaporating plate are sequentially superposed from top to bottom and enclose a closed containing cavity, and working medium fluid is arranged in the containing cavity. And a liquid filling pipe communicated with the containing cavity is arranged on the condensing plate, and working medium fluid can be filled into the containing cavity through the liquid filling pipe. The improved vapor chamber has the advantages that the specific surface area is increased due to the metal fins, the working medium fluid has better boiling strengthening performance in the closed containing cavity, the flowing speed of the working medium fluid on the fins is accelerated, the thermal stress of the vapor chamber is effectively reduced, and the uniform thermal performance of the vapor chamber is improved.
Although overcoming the defect of the thermal stress generated by the common soaking plate, the soaking plate in the prior art still has the following technical problems: the flow speed of the working fluid on the soaking plate fins is still not fast enough, and the soaking performance is still to be further improved.
SUMMERY OF THE UTILITY MODEL
To the technical problem who exists among the prior art, one of the purposes of the utility model is: the heat equalizing plate fin is provided, the liquid absorption core of the heat equalizing plate fin has high capillary rising height, rising rate and permeability, the capillary force on working medium fluid is high, the flowing speed of the working medium fluid on the heat equalizing plate fin is high, and the heat equalizing performance of the heat equalizing plate can be improved.
To the technical problem who exists among the prior art, the utility model discloses a second of the purpose: the vapor chamber fin liquid absorption core has high capillary rising height, rising rate and permeability, the capillary force on working medium fluid is high, the flowing speed of the working medium fluid on the vapor chamber fin is high, and the vapor chamber performance is greatly improved.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a copper oxide film is arranged on the surface of a soaking plate fin, and the copper oxide film is provided with dense nanometer micropores.
Furthermore, the aperture of the nanometer micropore is 10-100 nm.
The utility model provides a soaking plate, includes evaporating plate, middle time return shaped plate and condensing plate, and evaporating plate, middle time return shaped plate and evaporating plate from last down superpose in proper order and enclose into an inclosed appearance chamber, hold the intracavity and be equipped with working medium fluid, and the evaporating plate is first soaking plate fin, and first soaking plate fin surface is equipped with the copper oxide film, has intensive nanometer micropore on the copper oxide film.
Furthermore, the condensing plate is a second soaking plate fin, the surface of the second soaking plate fin is provided with a copper oxide film, and the copper oxide film is provided with dense nano micropores.
In general, the utility model has the advantages as follows:
the copper oxide film on the surface of the soaking plate fin is provided with dense nano micropores which form a liquid absorption core of the soaking plate fin. The nanometer micropores on the surface of the soaking plate fin are extremely small in aperture, the capillary rising height, the rising rate and the permeability of the liquid absorbing core are improved, the capillary limit of the liquid absorbing core is also improved, the capillary force on the working medium fluid is high, the flowing speed of the working medium fluid on the soaking plate fin is high, and therefore the soaking performance of the soaking plate can be greatly improved.
The evaporation plate of the soaking plate is a first soaking plate fin, the surface of the first soaking plate fin is provided with a copper oxide film, the copper oxide film is provided with dense nano micropores, the capillary rising height, the rising rate and the permeability of the liquid absorption core are improved, the capillary limit of the liquid absorption core is also improved, the capillary force of working medium fluid is higher, the flowing speed of the working medium fluid on the evaporation plate is higher, and the heat uniformity performance of the soaking plate is greatly improved.
Drawings
Fig. 1 is an exploded view of a vapor chamber.
Fig. 2 is a schematic plan view of the soaking plate fin.
Description of reference numerals:
1-condensation plate; 2-intermediate return plate; 3-evaporating plate; 4-liquid filling pipe; 5-soaking plate fin, 51-V-shaped groove.
Detailed Description
The present invention will be described in further detail below.
As shown in fig. 1 and 2, a soaking plate fin is characterized in that a copper oxide film is arranged on the surface of a soaking plate fin 5, and the copper oxide film is provided with dense nano micropores.
The copper oxide film on the surface of the soaking plate fin 5 is provided with dense nano micropores which form a liquid absorption core of the soaking plate fin 5. Because the capillary rise height, the rise rate, the permeability and the like of the liquid absorbing core influence the capillary limit of the liquid absorbing core, the pore diameter of the nanometer micropores on the surface of the soaking plate fin 5 is extremely small, the capillary rise height, the rise rate and the permeability of the liquid absorbing core are improved, the capillary limit of the liquid absorbing core is also improved, the capillary force on the working medium fluid is high, the flowing speed of the working medium fluid on the soaking plate fin 5 is high, and therefore when the soaking plate fin 5 is applied to a soaking plate, the soaking performance of the soaking plate can be greatly improved.
Specifically, the pore diameter of the nanometer micropores is 10-100 nm.
The utility model provides a soaking plate, includes evaporating plate 3, middle time return shaped plate 2 and condensing plate 1, middle time return shaped plate 2 and evaporating plate 3 from last down superpose in proper order and enclose into an inclosed appearance chamber, hold the intracavity and be equipped with working medium fluid, and evaporating plate 3 is first soaking plate fin, and first soaking plate fin surface is equipped with the copper oxide film, has intensive nanometer micropore on the copper oxide film.
Because the copper oxide film on the surface of the first soaking plate fin has the dense nano micropores, the capillary limit of the liquid absorbing core is improved by the dense nano micropores, the capillary force on the working fluid is higher, and the flowing speed of the working fluid on the evaporating plate 3 is higher, so that the heat uniformity of the soaking plate is greatly improved.
Specifically, the evaporation plate 3 is mounted on a heat source, and the heat source contacts the evaporation plate 3. One end of the evaporation plate 3 conducts heat with a heat source, and the other end conducts convection heat between the working medium liquid and the evaporation plate 3. Because the copper oxide film on the surface of the evaporation plate 3 has dense nano-micropores, the capillary limit of the liquid absorption core is improved, the capillary force on the working fluid is high, and the working fluid can quickly flow over the whole evaporation plate 3, so that the heat transfer of the evaporation plate 3 is uniform. The working fluid is heated and then vaporized into working gas, and the working gas moves towards the direction of the condensing plate 1. After the high-temperature working medium gas contacts the condensing plate 1, the high-temperature working medium gas quickly radiates heat to the condensing plate 1 and is liquefied, and then flows back to the evaporating plate 3 again to realize one-time circulation. The condensing plate 1 transfers the heat dissipation capacity of the working medium gas to the cold source, thereby realizing the high-efficiency heat transfer between the cold source and the hot source.
The condensing plate 1 is a second soaking plate fin, a copper oxide film is arranged on the surface of the second soaking plate fin, and dense nanometer micropores are formed in the copper oxide film.
The copper oxide film on the surface of the condensing plate 1 is provided with dense nano-micropores, the heat transfer area is increased by the dense nano-micropores, the capillary limit of the liquid absorbing core is improved, the capillary force on the working medium fluid is high, the high-temperature working medium gas is liquefied into the working medium fluid after contacting the condensing plate 1, the flowing speed of the working medium fluid on the condensing plate 1 is high, and the working medium fluid finally flows back to the evaporating plate 3, so that the uniform heat performance of the soaking plate is greatly improved.
The manufacturing process of the soaking plate fin 5 is as follows:
the method comprises the following steps: selecting a copper plate as a substrate of the soaking plate;
step two: clamping a plough cutter on a planer, fixing a copper plate on a vice of the planer by using a clamp, and then correcting the vertical direction of the cutter and the surface of the copper plate by using a dial indicator;
step three: adjusting the working stroke of the planer, setting a tool in the middle area of the copper plate, adjusting the cutting depth and the feeding amount, and performing one-time plowing and one-time extrusion to obtain an array fin structure with a V-shaped groove 51 in the middle of the copper plate;
step four: deburring and cleaning;
step five: 1mol/L potassium persulfate solution and 1mol/L sodium hydroxide solution are mixed according to the proportion of 1: 1 to obtain a corrosion mixed solution;
step six: soaking the soaking plate fins 5 in the etching mixed solution;
step seven: and taking out the soaking plate fins 5 after soaking for 15 minutes and cleaning the soaking plate fins 5 by using distilled water to obtain the soaking plate fins 5 with the copper oxide thin films on the surfaces.
Wherein the reaction formula is as follows:
Cu+2NaOH+K2S2O8→Cu(OH)2+K2SO4+Na2SO4；
Cu(OH)2+2OH-→[Cu(OH)4]2-；
[Cu(OH)4]2-→CuO↓+H2O+2OH-。
when the soaking plate fins 5 are not provided with the copper oxide film, the inner cavity of the liquid absorption core is smooth, the capillary rising height, the rising rate and the permeability are low, the capillary force on the working medium fluid is low, the flowing speed of the working medium fluid on the soaking plate fins 5 is low, and the soaking performance is relatively poor.
When the surface of the soaking plate fin 5 is provided with the copper oxide film, a large number of particles with holes appear in the inner cavity of the liquid absorbing core, and the hole diameters of the holes are small and are in a nanometer level. The dense nanometer micropores enable the capillary rising height, the rising rate and the permeability to be high, the capillary force on the working medium fluid to be high, the flowing speed of the working medium fluid on the soaking plate fins 5 to be high, and the soaking performance to be relatively good.
The manufacturing and mounting process of the soaking plate is as follows:
drilling a plurality of through holes on the periphery of the copper plate before the second step;
in the fifth step, if the copper plate is used as the condensation plate 1, drilling holes on the copper plate to obtain a liquid filling opening, and then deburring and cleaning;
the condensing plate 1, the middle return plate 2 and the evaporating plate 3 are welded in sequence, the liquid filling pipe 4 is welded on a liquid filling port, a closed containing cavity formed by the condensing plate 1, the middle return plate 2 and the evaporating plate 3 in a surrounding mode is vacuumized and filled with working medium fluid through the liquid filling pipe 4, and the evaporating plate 3 is fixedly connected with a heat source through a through hole by a screw.
After the condensing plate 1, the middle return plate 2 and the evaporating plate 3 are welded in sequence, the working medium fluid conducts phase change heat transfer in the closed cavity and can complete heat transfer circulation.
The utility model has the advantages of as follows:
(1) the copper oxide film of the soaking plate fin 5 has dense nanometer micropores to form a composite porous structure, the specific surface area is obviously increased, the boiling performance is enhanced, a large number of vaporization cores are provided for boiling heat transfer, the heat transfer coefficient is improved, and the effect of enhancing the heat transfer is enhanced.
(2) The capillary limit of the liquid absorption core is improved by the composite porous structure, the capillary force on the working medium fluid is high, the flowing speed of the working medium fluid on the evaporation plate 3 and the condensation plate 1 is high, and the temperature uniformity of the soaking plate is improved.
(3) The method can be widely applied to various heat dissipation fields, such as cooling and heat dissipation of semiconductor light emitting diodes, semiconductor laser and thermal-photoelectric conversion devices, computer central processing units, graphic processor chips and computer high-frequency temporary memory memories, and has wide application range.
(4) The processing procedures of the condensation plate 1 and the evaporation plate 3 with the composite porous structure are simple, can be completed only by a planer and chemical corrosion, and are simple and quick.
(5) The thickness of the soaking plate is 2.8mm, the height of the top end of the soaking plate fin 5 is 0.3mm higher than the bottom end of the V-shaped groove 51, namely 0.15mm higher than the copper plate matrix, the distance between the adjacent V-shaped grooves 51 is 0.75mm, and the soaking plate is tightly contacted with a heat source by a plurality of screws on the periphery of the copper plate matrix, so that the heat transfer is more sufficient.
The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be equivalent replacement modes, and all are included in the scope of the present invention.
Claims (3)
1. A soaking plate fin is characterized in that: the surface of the soaking plate fin is provided with a copper oxide film, the copper oxide film is provided with dense nanometer micropores, and the pore diameter of the nanometer micropores is 10-100 nm.
2. The utility model provides a soaking plate, returns shaped plate and condensing plate including evaporating plate, centre, and condensing plate, centre return shaped plate and evaporating plate follow from last down superpose in proper order and enclose into an inclosed appearance chamber, hold the intracavity and be equipped with working medium fluid, its characterized in that: the evaporation plate is a first soaking plate fin, the surface of the first soaking plate fin is provided with a copper oxide film, the copper oxide film is provided with dense nanometer micropores, and the pore diameter of the nanometer micropores is 10-100 nm.
3. A soaking plate according to claim 2, wherein: the condensing plate is a second soaking plate fin, and a copper oxide film is arranged on the surface of the second soaking plate fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922391499.4U CN211931124U (en) | 2019-12-27 | 2019-12-27 | Soaking plate fin and soaking plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922391499.4U CN211931124U (en) | 2019-12-27 | 2019-12-27 | Soaking plate fin and soaking plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211931124U true CN211931124U (en) | 2020-11-13 |
Family
ID=73325991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922391499.4U Active CN211931124U (en) | 2019-12-27 | 2019-12-27 | Soaking plate fin and soaking plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211931124U (en) |
-
2019
- 2019-12-27 CN CN201922391499.4U patent/CN211931124U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI818134B (en) | Phase change heat sink | |
| CN105716461B (en) | A kind of temperature-uniforming plate and manufacture method of the gradient porous capillary wick of in-plane | |
| WO2020155899A1 (en) | Phase change heat radiating device | |
| CN206268818U (en) | A kind of heat abstractor and the high-power LED lamp with the heat abstractor | |
| CN104634148A (en) | Flat-plate heat tube with nanometer structure | |
| CN201609005U (en) | Fin-shaped phase-change electronic radiator | |
| CN109411431A (en) | A kind of heat exchange structure and preparation method thereof | |
| TW201510460A (en) | A stereo heat-conducting device of a radiator | |
| CN207300017U (en) | Equalizing plate structure | |
| CN201839581U (en) | Equalizing thermal module | |
| CN204665997U (en) | A kind of flat-plate heat pipe liquid-sucking core with fin-Nei caulking groove | |
| CN211931124U (en) | Soaking plate fin and soaking plate | |
| CN206165061U (en) | Take phase transition cooling system of porous interior fin | |
| CN1869574B (en) | Radiator | |
| CN103344142B (en) | Vapour chamber evaporation imbibition core of fractal groove-hole structure and manufacturing method | |
| CN212587492U (en) | Immersion cooling radiator and immersion cooling radiating system | |
| CN203586895U (en) | Vapor chamber evaporating and liquid-absorbing core with stepped groove-hole structure | |
| CN110579126A (en) | heat conductor with three-dimensional grid channels inside and manufacturing method thereof | |
| CN113758328B (en) | Composite VC radiator containing copper/diamond composite-configuration liquid absorption cores and preparation method thereof | |
| CN113758326B (en) | VC radiator with built-in copper/diamond composite-configuration liquid absorption core and preparation method thereof | |
| WO2022227220A1 (en) | Heat dissipation device having flat heat pipe and cooling liquid plate composite structure and manufacturing method for heat dissipation device | |
| CN212645462U (en) | Three-dimensional radiating temperature-equalizing plate | |
| CN212409467U (en) | Ultrathin heat conduction patch | |
| CN113782452A (en) | Micro-channel structure design and preparation method for efficiently strengthening boiling heat transfer surface | |
| CN111970908A (en) | Active and passive dual-purpose liquid cooling radiator and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |