CN211786930U

CN211786930U - Computer machine case heat abstractor with water-cooling function

Info

Publication number: CN211786930U
Application number: CN202020773332.4U
Authority: CN
Inventors: 吴振庭; 王在田
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-04-30
Filing date: 2020-04-30
Publication date: 2020-10-27
Anticipated expiration: 2030-04-30

Abstract

The utility model discloses a computer case heat dissipation device with water cooling function, which comprises a case, a mainboard installation position is arranged in the case, four support legs are fixed at the bottom of the case, the middle of the case is divided into a left space and a right space by a partition plate, two hard disc frames are horizontally fixed at the right side of the partition plate, a water tank is arranged below the hard disc frames, a heat dissipation block is arranged at one side of the water tank, a copper plate B is fixed at the bottom of the water tank, a copper pipe B is connected above the copper plate B, and the copper pipe B is inserted into the water tank; the utility model has the advantages of reasonable design, with water cooling plant integration at computer machine incasement, saved the artifical process of installing water cooling structure of consumer, simplified the mounting means, this water cooling plant adopts water wind integral type heat radiation structure simultaneously, utilizes the heat absorptivity of semiconductor refrigeration piece and the transmission of the heat transferability cooperation between the metal to the transmission of water-cooling liquid on reaching the water-cooling effect that extremely sent, reducing computer hardware such as CPU's surface temperature.

Description

Computer machine case heat abstractor with water-cooling function

Technical Field

The utility model belongs to the technical field of the computer water-cooling, specifically be a computer machine case heat abstractor with water-cooling function.

Background

The computer case is used as one part of computer fittings and has the main function of placing and fixing computer fittings to play a role in supporting and protecting. Nowadays, along with the development of science and technology, more and more computer fans begin to assemble the computer that belongs to oneself, wherein, the continuous upgrading of hardware leads to its heat dissipation requirement also more and more high, ordinary air-cooled heat dissipation has been unable to satisfy computer fans' demand, therefore they often can choose more advanced water-cooling heat radiation structure for use, but current water-cooling heat radiation structure is complicated, it is inconvenient to assemble oneself, not only carry out the water-cooling to CPU sometimes, still can carry out the water-cooling to other hardware such as display card, the process of walking the pipe is comparatively complicated, especially at the narrow and small space of case deployment pipeline is difficult to add up with difficulty more.

To solve the problems in the related art, no effective solution is proposed, and therefore, a heat dissipation device with a water cooling function for a computer case is proposed.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a computer machine case heat abstractor with water-cooling function has the installation of being convenient for, advantages such as water-cooling effect is superior, has solved current computer machine case water-cooling effect poor, difficult installation scheduling problem.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a computer case heat dissipation device with a water cooling function comprises a case, a mainboard installation position is arranged in the case, four support legs are fixed at the bottom of the case, the middle of the case is divided into a left space and a right space by a partition plate, two hard disc frames are horizontally fixed at the right side of the partition plate, a water tank is arranged below the hard disc frames, a heat dissipation block is arranged on one side of the water tank, a copper plate B is fixed at the bottom of the water tank, a copper pipe B is connected above the copper plate B and inserted into the water tank, a semiconductor refrigeration sheet is arranged below the copper plate B, a first heat dissipation fan is arranged below the semiconductor refrigeration sheet, a heat dissipation block is arranged on the side of the water tank, and a second heat dissipation fan is arranged on one;

the water tank top is provided with the water pump, the water pump with through the drinking-water pipe intercommunication between the water tank, the delivery port and the outlet pipe intercommunication of water pump, the outlet pipe from baffle one side extend to left side mainboard installation position top after buckle and with the inlet tube intercommunication, inlet tube and water tank intercommunication, it has a plurality of minutes pipes and the branch pipe of intaking to equally divide on the outlet pipe of mainboard installation position top and the inlet tube, go out the branch pipe with all install the valve on the branch pipe of intaking, go out the branch pipe with it communicates through the hose to intake between the branch pipe, the intercommunication has hollow fin on the hose.

In a further improvement, the radiating block comprises a plurality of fins, two copper pipes A and a copper plate A, the copper pipes A penetrate through the fins and are connected with the copper plate A, and the copper plate A is inserted into the water tank.

In a further improvement, the heat absorbing end of the semiconductor refrigeration sheet faces the copper plate B, and the heat releasing end of the semiconductor refrigeration sheet faces the first heat dissipation fan below.

In a further improvement, silicone grease is filled between the semiconductor refrigeration sheet and the copper plate B.

In a further improvement, the surfaces of the first cooling fan and the second cooling fan are respectively provided with a dust screen.

In a further improvement, the water inlet pipe and the water outlet pipe are fixed on the case through pipe clamps.

In a further improvement, two jacks are formed in the right side of the case.

(III) advantageous effects

Compared with the prior art, the utility model provides a computer machine case heat abstractor with water-cooling function possesses following beneficial effect:

1. this kind of computer machine case heat abstractor with water-cooling function, with water cooling plant integration in computer machine incasement, saved the artifical process of installing water-cooling structure of consumer, simplified the mounting means.

2. This kind of computer machine case heat abstractor with water-cooling function, this kind of water-cooling plant adopt water wind integral type heat radiation structure, utilize the heat absorptivity of semiconductor refrigeration piece and the heat transfer nature between the metal to cooperate the transmission of water-cooling liquid to reach the extremely water-cooling effect, reduce the surface temperature of computer hardware such as CPU.

3. This kind of computer machine case heat abstractor with water-cooling function, different positions on inlet tube and outlet pipe have seted up a plurality of feed liquor and have been in charge of respectively and go out the liquid and be in charge of, can cool down the computer hardware of different positions, avoided complicated walking the pipeline way, very big improvement the flexibility of deployment use.

Drawings

FIG. 1 is a schematic view of the internal structure of the present invention;

FIG. 2 is a schematic view of the internal structure of the water tank and the heat dissipating block of the present invention;

fig. 3 is a top view of the heat dissipation block of the present invention.

In the figure: 1. a chassis; 2. a support leg; 3. a hard disk frame; 4. a jack; 5. a first heat dissipation fan; 6. a second heat dissipation fan; 7. a partition plate; 8. a mainboard mounting position; 9. a heat dissipating block; 10. a dust screen; 11. a water pump; 12. a water outlet pipe; 13. a water inlet pipe; 14. a pipe clamp; 15. a water outlet branch pipe; 16. water inlet branch pipes; 17. a valve; 18. a hose; 19. a heat sink; 20. a water pumping pipe; 21. copper pipe A; 22. a copper plate A; 23. a copper pipe B; 24. a copper plate B; 25. silicone grease; 26. a semiconductor refrigeration sheet; 27. a water tank.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a computer case heat dissipation device with a water cooling function comprises a case 1, a mainboard installation position 8 is arranged in the case 1, four support legs 2 are fixed at the bottom of the case 1, the middle of the case 1 is divided into a left space and a right space by a partition plate 7, two hard disc frames 3 are horizontally fixed at the right side of the partition plate 7, a water tank 27 is arranged below the hard disc frames 3, a heat dissipation block 9 is arranged on one side of the water tank 27, a copper plate B24 is fixed at the bottom of the water tank 27, a copper pipe B23 is connected above the copper plate B24, the copper pipe B23 is inserted into the water tank 27, a semiconductor refrigeration sheet 26 is arranged below the copper plate B24, a first heat dissipation fan 5 is arranged below the semiconductor refrigeration sheet 26, the heat dissipation block 9 is arranged on the side of the water tank 27, a second heat dissipation fan 6 is arranged on one side of the heat dissipation, water pump 11 with communicate through drinking-water pipe 20 between the water tank 27, the delivery port and the outlet pipe 12 intercommunication of water pump 11, outlet pipe 12 extends to 8 backs of left side mainboard installation position from 7 one sides of baffle and buckles and communicate with inlet tube 13, inlet tube 13 and water tank 27 intercommunication, equally divide on outlet pipe 12 and the inlet tube 13 of mainboard installation position 8 top to divide and do not communicate and have a plurality of minute of water pipes 15 and minute 16 of intaking, minute of intaking manage 15 with all install valve 17 on the minute of intaking pipe 16, minute of intaking manage 15 with it communicates through hose 18 between the minute of intaking 16, the intercommunication has hollow fin 19 on the hose 18.

As shown in fig. 2, the heat dissipation block 9 includes a plurality of fins, two copper tubes a21 and a copper plate a22, the copper tube a21 penetrates through the plurality of fins and is connected with the copper plate a22, the copper plate a22 is inserted into the water tank 27, the heat dissipation block formed by the heat dissipation fins on the side absorbs 9 the heat of the water-cooling liquid in the water tank 27, the heat absorption end of the semiconductor refrigeration piece 26 faces the copper plate B24, the heat release end faces the first cooling fan 5 below, so that the heat absorption end of the semiconductor refrigeration piece 26 generates cold air, and the copper plate B24 is cooled, the copper tube B23 at one end of the copper plate B24 is used for cooling the water-cooling liquid, silicone grease 25 is filled between the semiconductor refrigeration piece 26 and the copper plate B24, and a gap between the semiconductor refrigeration piece 26 and the copper plate B24 is filled with the silicone grease 25, so that the.

As shown in fig. 1, the surfaces of the first cooling fan 5 and the second cooling fan 6 are both provided with dust screens 10, so that the dust resistance of the cooling fan is improved, the water inlet pipe 13 and the water outlet pipe 12 are fixed on the case 1 through a pipe clamp 14, and the right side of the case 1 is provided with two jacks 4, so that the side plate of the case 1 can be conveniently installed.

A check valve is installed at the position where the water inlet pipe 13 is communicated with the water outlet pipe 12, so that the water cooling liquid is prevented from flowing back to the water inlet pipe 13.

The semiconductor refrigerating piece 26 adopts a TEC model 1-12706.

The water pump 11 is of a FROSTFLOW X120 type.

The electrical components presented in the document are electrically connected to an external master controller and 220V commercial power, and the master controller can be a conventional known device controlled by a computer or the like.

The working principle is as follows: when the water cooling device is used, the main board is arranged on the corresponding installation position, hardware such as a CPU (central processing unit) is arranged on the main board, then the radiating fins 19 on the hose 18 are fixed on the CPU, the water outlet branch pipe and the water inlet branch pipe upper valve 17 at two ends of the hose 18 are opened, water cooling liquid in the water tank 27 is pumped into the water inlet pipe 13 through the water pump 11, when the water cooling liquid enters the water inlet pipe 13, the water cooling liquid enters the hose 18 and flows through the radiating fins 19 on the hose 18, so that heat on the CPU is taken away, the taken water cooling liquid flows into the water inlet branch pipe 16 from the other end of the hose 18 and then flows into the water inlet pipe 13, and finally flows back into the water tank 27 again, the copper plate B24 is cooled by using cold air generated by the semiconductor refrigerating sheet 26 at the bottom of the water tank 27, the copper pipe B23 absorbs heat of the returned water cooling liquid, the cold air on the copper plate B24 cools the copper pipe B36, meanwhile, the heat is secondarily absorbed by the side surface through the radiating block 9 and is discharged by the second radiating fan 6 on one side, so that the effect of circulating cooling is achieved. When other hardware such as a display card is cooled, the water inlet branch pipe 16 and the water outlet branch pipe 15 at proper positions can be selected and communicated through the hose 18, the radiating fins 19 on the hose 18 are fixed on the display card, the valves 17 on the water outlet branch pipe 15 and the water inlet branch pipe 16 are opened to communicate the hose 18, at the moment, the water cooling liquid pumped by the water pump 11 enters the two hoses 18 corresponding to the CPU and the display card through the water outlet pipe 12, so that the two hardware are cooled simultaneously, and the circulated water cooling liquid enters the water inlet pipe 13 and flows back to the water tank 27 again.

In summary, the utility model has reasonable structure, the water cooling device is integrated in the computer case 1, the process of manually installing the water cooling structure by consumers is saved, and the installation mode is simplified; the water cooling device adopts a water-air integrated heat dissipation structure, and utilizes the heat absorption property of the semiconductor refrigeration sheet 26 and the heat transfer property between metals to be matched with the transmission of water cooling liquid, thereby achieving the extremely water cooling effect and reducing the surface temperature of computer hardware such as a CPU (central processing unit) and the like; a plurality of liquid inlet branch pipes and liquid outlet branch pipes are respectively arranged at different positions on the water inlet pipe 13 and the water outlet pipe 12, so that computer hardware at different positions can be cooled, a complex pipeline is avoided, and the flexibility of deployment and use is greatly improved.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a computer machine case heat abstractor with water-cooling function, includes quick-witted case (1), its characterized in that: a mainboard mounting position (8) is arranged in the case (1), four support legs (2) are fixed at the bottom of the case (1), the middle of the case (1) is divided into a left space and a right space by a partition plate (7), two hard disk frames (3) are horizontally fixed on the right side of the partition plate (7), a water tank (27) is arranged below the hard disk frame (3), a heat dissipation block (9) is arranged on one side of the water tank (27), a copper plate B (24) is fixed at the bottom of the water tank (27), a copper pipe B (23) is connected above the copper plate B (24), the copper tube B (23) is inserted into the water tank (27), a semiconductor refrigerating sheet (26) is arranged below the copper plate B (24), a first cooling fan (5) is arranged below the semiconductor refrigeration sheet (26), a heat dissipation block (9) is arranged on the side surface of the water tank (27), and a second heat dissipation fan (6) is installed on one side of the heat dissipation block (9);

a water pump (11) is arranged above the water tank (27), the water pump (11) is communicated with the water tank (27) through a water pumping pipe (20), the water outlet of the water pump (11) is communicated with a water outlet pipe (12), the water outlet pipe (12) extends from one side of the partition plate (7) to the top of the left main board mounting position (8) and then is bent and communicated with a water inlet pipe (13), the water inlet pipe (13) is communicated with the water tank (27), the water outlet pipe (12) and the water inlet pipe (13) above the mainboard mounting position (8) are respectively communicated with a plurality of water outlet branch pipes (15) and water inlet branch pipes (16), valves (17) are respectively arranged on the water outlet branch pipe (15) and the water inlet branch pipe (16), the water outlet branch pipe (15) is communicated with the water inlet branch pipe (16) through a hose (18), and the hose (18) is communicated with a hollow radiating fin (19).

2. The heat dissipation device with water cooling function for computer case according to claim 1, wherein: the radiating block (9) comprises a plurality of fins, two copper pipes A (21) and a copper plate A (22), wherein the copper pipes A (21) penetrate through the fins and are connected with the copper plate A (22), and the copper plate A (22) is inserted into the water tank (27).

3. The heat dissipation device with water cooling function for computer case according to claim 1, wherein: the heat absorption end of the semiconductor refrigeration sheet (26) faces the copper plate B (24), and the heat release end of the semiconductor refrigeration sheet faces the first heat dissipation fan (5) below.

4. The heat dissipation device with water cooling function for computer case according to claim 1, wherein: and silicone grease (25) is filled between the semiconductor refrigerating sheet (26) and the copper plate B (24).

5. The heat dissipation device with water cooling function for computer case according to claim 1, wherein: and dust screens (10) are respectively arranged on the surfaces of the first heat radiation fan (5) and the second heat radiation fan (6).

6. The heat dissipation device with water cooling function for computer case according to claim 1, wherein: the water inlet pipe (13) and the water outlet pipe (12) are fixed on the case (1) through a pipe clamp (14).

7. The heat dissipation device with water cooling function for computer case according to claim 1, wherein: two jacks (4) are formed in the right side of the case (1).