CN211671166U - Novel integrated liquid cooling board of modularization - Google Patents
Novel integrated liquid cooling board of modularization Download PDFInfo
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- CN211671166U CN211671166U CN202020170798.5U CN202020170798U CN211671166U CN 211671166 U CN211671166 U CN 211671166U CN 202020170798 U CN202020170798 U CN 202020170798U CN 211671166 U CN211671166 U CN 211671166U
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Abstract
The utility model discloses a novel integrated liquid cold plate of modularization, including the bottom plate, the division board is installed to the central authorities of bottom plate, and the bottom plate includes back timber and floorbar, and the holding tank has all been seted up to the both sides of division board, has heat conduction splint through spout sliding connection on the bottom plate, and the backward flow backing plate is installed at heat conduction splint's top, and the inside of backward flow backing plate is provided with backward flow circulation channel, and the last surface mounting of backward flow backing plate has a plurality of gaskets, and backwash pump inlet and backwash pump liquid outlet are installed respectively at the top of. The utility model discloses whole bottom plate passes through the division board to be separated, under the good condition of the required liquid cooling board cooling effect of power module, can adopt the liquid cooling board and the mode of circulative cooling bottom surface circulation in addition, guarantees that the power module bottom has good radiating effect, and does not change whole heat radiation structure's size, can be according to different power module different heat dissipation degree of regional regulation in both sides on the bottom plate, has the integrated cooling effect of unitization, convenient people's use.
Description
Technical Field
The utility model relates to a heat dissipation technical field, in particular to novel integrated liquid cooling plate of modularization.
Background
Along with the development of electronic technology, the integration level of electronic equipment is higher and higher, the heat productivity of chips or modules in the electronic equipment is larger and larger, the heat dissipation device of the electronic equipment mainly comprises an air cooling heat dissipation device and a liquid cooling heat dissipation device, and the liquid cooling heat dissipation device has stronger heat dissipation capacity than the air cooling heat dissipation device due to high heat capacity and high conductivity of liquid, so that the liquid cooling plate has good heat dissipation performance, however, the conventional liquid cooling plate has a single plate structure, the size cannot be adjusted, the light-weight cooling and heat dissipation effects are not achieved, and the corresponding heat dissipation structure is not convenient to select according to power modules with different power sizes.
Disclosure of Invention
The to-be-solved technical problem of the utility model is overcome prior art's defect, a novel integrated liquid cold plate of modularization is provided, whole bottom plate passes through the division board and separates, under the good condition of the required liquid cold plate cooling effect of power module, can adopt the liquid cold plate and the mode of circulation of the bottom surface of circulative cooling, guarantee that the power module bottom has good radiating effect, and do not change whole heat radiation structure's size, can be according to different power module different heat dissipation degree of regional regulation in both sides on the bottom plate, the integrated cooling effect of unitization has, convenient people's use.
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model relates to a novel modularized integrated liquid cooling plate, which comprises a bottom plate, wherein a division plate is arranged in the center of the bottom plate, the bottom plate comprises a top beam and a bottom beam, both sides of the division plate are provided with holding tanks, the holding tank is positioned on the surface of the bottom plate, the integrated liquid cooling pipe is arranged in the holding tank, the outer side of the top beam is provided with a liquid inlet, a liquid outlet is arranged on the outer side surface of the bottom beam, a sliding groove is arranged on the inner side wall of the bottom plate, the bottom plate is connected with a heat conducting splint in a sliding way through a sliding chute, the top of the heat conducting splint is provided with a reflux base plate, a backflow circulation channel is arranged in the backflow backing plate, a plurality of gaskets are arranged on the upper surface of the backflow backing plate, a reflux pump liquid inlet and a reflux pump liquid outlet are respectively installed at the top of the top beam, and a plurality of hose connectors are further installed on the inner wall of the top beam facing the containing groove.
As an optimal technical scheme of the utility model, the inlet is linked together through integrated liquid cooling pipe and liquid outlet.
As a preferred technical scheme of the utility model, the picture peg is installed to heat conduction splint's tip, and heat conduction splint pass through picture peg and spout sliding connection, heat conduction splint are made by heat conduction silica gel.
As an optimal technical scheme of the utility model, the inside backward flow circulation passageway of backward flow backing plate is linked together with backwash pump inlet, backwash pump liquid outlet respectively through hose nipple.
As an optimized technical scheme of the utility model, the top surface and the bottom plate upper surface of integrated liquid cooling pipe are in on same horizontal plane.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the utility model discloses whole bottom plate passes through the division board to be separated, under the good condition of the required liquid cooling board cooling effect of power module, can adopt the liquid cooling board and the mode of circulative cooling bottom surface circulation in addition, guarantees that the power module bottom has good radiating effect, and does not change whole heat radiation structure's size, can be according to different power module different heat dissipation degree of regional regulation in both sides on the bottom plate, has the integrated cooling effect of unitization, convenient people's use.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is an overall structure of the present invention;
FIG. 2 is a structural view of the internal reflux circulation channel of the reflux base plate of the present invention;
in the figure: 1. a base plate; 2. a partition plate; 3. a top beam; 4. a bottom beam; 5. accommodating grooves; 6. an integrated liquid-cooled tube; 7. a liquid inlet; 8. a liquid outlet; 9. a chute; 10. a heat conducting splint; 11. reflowing the backing plate; 12. a gasket; 13. a liquid inlet of the reflux pump; 14. a reflux pump liquid outlet; 15. a hose coupling.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention. Wherein like reference numerals refer to like parts throughout.
In addition, if a detailed description of the known art is not necessary to show the features of the present invention, it is omitted. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
Example 1
Referring to fig. 1-2, the utility model provides a novel modularized integrated liquid cooling plate, which comprises a bottom plate 1, a partition plate 2 is installed in the center of the bottom plate 1, the bottom plate 1 comprises a top beam 3 and a bottom beam 4, the top beam 3 and the bottom beam 4 are respectively oppositely located at two end parts of the bottom plate 1, both sides of the partition plate 2 are provided with holding tanks 5, and the holding tanks 5 are located on the surface of the bottom plate 1, an integrated liquid cooling pipe 6 is installed inside the holding tanks 5, a liquid inlet 7 is arranged outside the top beam 3, a liquid outlet 8 is arranged outside the bottom beam 4, a chute 9 is arranged on the inner side wall of the bottom plate 1, a heat conducting splint 10 is slidably connected with the bottom plate 1 through the chute 9, a reflux backing plate 11 is installed at the top of the heat conducting splint 10, a reflux circulation channel is arranged inside the reflux backing plate 11, a plurality of gaskets 12 are installed on the upper surface of, also mounted on the inner wall of the top beam 3 facing the receiving channel 5 are several hose connections 15.
Further, inlet 7 is linked together through integrated liquid-cooled tube 6 and liquid outlet 8, all installs the connection house steward in back timber 3 and floorbar 4 of bottom plate 1, and the coolant liquid flows through inlet 7 and connects house steward rethread integrated liquid-cooled tube 6 and circulate to the connection house steward in the floorbar 4 after, from liquid outlet 8 outflow.
The picture peg is installed to the tip of heat conduction splint 10, and heat conduction splint 10 is through picture peg and 9 sliding connection of spout, and heat conduction splint 10 is made by heat conduction silica gel, conveniently pulls out heat conduction splint 10 from bottom plate 1 upper surface, and heat conduction splint 10 has good heat conduction effect, can be with the low temperature conduction to the backing plate 11 departments of backward flow of the integrated liquid cooling pipe 6 departments in bottom, strengthens the radiating effect.
The inside backward flow circulation channel of backward flow backing plate 11 passes through hose nipple 15 respectively with backwash pump inlet 13, backwash pump liquid outlet 14 is linked together, through the external circulative cooling water pump of backwash pump inlet 13, recirculated cooling water gets into from backwash pump inlet 13, get into the inside backward flow circulation channel of backward flow backing plate 11 through hose nipple 15, then get into to hose nipple 15 from the liquid outlet of backward flow circulation channel again from backwash pump liquid outlet 14 on back timber 3 outflow, make whole backward flow backing plate 11 have panel refrigerated effect.
The top surface of integrated liquid-cooled tube 6 and the 1 upper surface of bottom plate are in same horizontal plane, place power module on bottom plate 1, can take off heat conduction splint 10, backward flow backing plate 11 from bottom plate 1, directly let power module bottom surface and the integrated cooling tube 6 in the 1 holding tank 5 of bottom plate contact, reach the cooling effect, have lightweight effect simultaneously.
Specifically, when the liquid cooling plate is used, the corresponding heat dissipation effect can be adjusted according to the size and heat of the power module, when the cooling effect of the liquid cooling plate required by the power module is good, the heat conducting clamping plate 10 can be inserted and slid into the chute 9 of the bottom plate 1 through the inserting plate, then the backflow backing plate 11 is installed on the heat conducting clamping plate 10, the power module is placed on the backflow backing plate 11, the gasket 12 plays a role of a cushion pad, cooling liquid flows through the connecting main pipe through the liquid inlet 7 and then flows to the connecting main pipe in the bottom beam 4 through the integrated liquid cooling pipe 6, flows out from the liquid outlet 8, is externally connected with a circulating cooling water pump through the liquid inlet 13 of the backflow pump, enters the backflow circulation channel in the backflow backing plate 11 through the hose joint 15, then enters the hose joint 15 from the liquid outlet of the backflow circulation channel and flows out from the backflow pump liquid outlet 14 on the top beam 3, make whole backward flow backing plate 11 have panel refrigerated effect, make whole power module bottom have high cooling effect, it is small to occupy the space simultaneously, whole bottom plate 1 separates through division board 2, make heat conduction splint 10 and the backward flow backing plate 11 on another tip of bottom plate dismantle the back, do not connect the backward flow pump outward, directly place power module on holding tank 5 of bottom plate 1, make the top surface direct contact of power module bottom surface and integrated liquid cold tube, lightweight liquid cooling effect has, whole structure passes through the division board and separates into two unit modules, can correspond the liquid cooling according to different power module.
The utility model discloses whole bottom plate 1 is separated through division board 2, under the good condition of the required liquid cooling board cooling effect of power module, can adopt the liquid cooling board and the mode of circulative cooling bottom surface circulation in addition, guarantee that the power module bottom has good radiating effect, and do not change whole heat radiation structure's size, it does not change to occupy the ground size, can be according to different power module different heat dissipation degrees of regional regulation in both sides on bottom plate 1, the integrated cooling effect of unitization has, convenient people's use.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The novel modularized integrated liquid cooling plate comprises a bottom plate (1) and is characterized in that a partition plate (2) is installed in the center of the bottom plate (1), the bottom plate (1) comprises a top beam (3) and a bottom beam (4), accommodating grooves (5) are formed in the two sides of the partition plate (2), the accommodating grooves (5) are located on the surface of the bottom plate (1), an integrated liquid cooling pipe (6) is installed inside the accommodating grooves (5), a liquid inlet (7) is arranged on the outer side of the top beam (3), a liquid outlet (8) is arranged on the outer side surface of the bottom beam (4), sliding grooves (9) are formed in the inner side wall of the bottom plate (1), a heat conducting clamping plate (10) is connected to the bottom plate (1) in a sliding mode through the sliding grooves (9), a backflow backing plate (11) is installed at the top of the heat conducting clamping plate (10), and a backflow circulation channel is, the last surface mounting of backward flow backing plate (11) has a plurality of gaskets (12), backwash pump inlet (13) and backwash pump liquid outlet (14) are installed respectively to the top of back timber (3), still install a plurality of hose nipple (15) on back timber (3) towards the inner wall of holding tank (5).
2. A novel modular integrated liquid-cooled plate as claimed in claim 1, characterized in that said inlet (7) is connected to said outlet (8) by means of an integrated liquid-cooled tube (6).
3. A novel modular integrated liquid cooling plate as claimed in claim 1, wherein an insert plate is mounted at the end of the heat conducting clamping plate (10), the heat conducting clamping plate (10) is slidably connected with the sliding groove (9) through the insert plate, and the heat conducting clamping plate (10) is made of heat conducting silica gel.
4. The novel modular integrated liquid cooling plate as claimed in claim 1, wherein the return circulation channel inside the return gasket (11) is respectively communicated with the return pump liquid inlet (13) and the return pump liquid outlet (14) through hose connectors (15).
5. A new modular integrated liquid-cooled panel according to claim 1, characterized in that the top surface of the integrated liquid-cooled tubes (6) and the upper surface of the bottom plate (1) are in the same horizontal plane.
Priority Applications (1)
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CN202020170798.5U CN211671166U (en) | 2020-02-14 | 2020-02-14 | Novel integrated liquid cooling board of modularization |
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CN202020170798.5U CN211671166U (en) | 2020-02-14 | 2020-02-14 | Novel integrated liquid cooling board of modularization |
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CN211671166U true CN211671166U (en) | 2020-10-13 |
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CN202020170798.5U Active CN211671166U (en) | 2020-02-14 | 2020-02-14 | Novel integrated liquid cooling board of modularization |
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2020
- 2020-02-14 CN CN202020170798.5U patent/CN211671166U/en active Active
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