CN212461026U - Heat abstractor and indoor P1.8 booth apart from full-color display screen module of high definition - Google Patents
Heat abstractor and indoor P1.8 booth apart from full-color display screen module of high definition Download PDFInfo
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- CN212461026U CN212461026U CN202021176953.0U CN202021176953U CN212461026U CN 212461026 U CN212461026 U CN 212461026U CN 202021176953 U CN202021176953 U CN 202021176953U CN 212461026 U CN212461026 U CN 212461026U
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- water tank
- heat
- heat dissipation
- heat conduction
- water
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 154
- 230000017525 heat dissipation Effects 0.000 claims abstract description 65
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims description 17
- 239000011324 bead Substances 0.000 claims description 10
- 238000005057 refrigeration Methods 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- 239000000110 cooling liquid Substances 0.000 abstract description 13
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
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- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a heat abstractor and indoor P1.8 booth are apart from full-color display screen module of high definition belongs to display screen technical field. The heat dissipation device comprises a lamp panel, a heat conduction assembly and a heat dissipation assembly. The heat conduction water tank is fixed on the back of the lamp panel, and the heat conduction pad is arranged between the heat conduction water tank and the lamp panel; the lower end of the heat dissipation water tank is communicated with the lower end of the heat conduction water tank; high-temperature cooling liquid at the upper end of the heat conduction water tank passes through the upper end of the heat conduction water tank and is communicated with the upper end of the heat conduction water tank, so that the high-temperature cooling liquid in the heat conduction water tank is cooled through the added semiconductor refrigerating sheet, the cooling liquid in the heat conduction water tank keeps a low-temperature state, the heat dissipation is facilitated and is continuously carried out, the heat generated by the lamp panel can be timely diffused and cooled, the possibility of burning out of the high temperature of the lamp panel is reduced, and the service life is prolonged.
Description
Technical Field
The utility model relates to a display screen technical field particularly, relates to heat abstractor and indoor P1.8 booth apart from full-color display screen module of high definition.
Background
The LED display screen is mostly formed by a lamp bead array; the lamp beads of each square of the display screen are increased in multiples, 284444 pixel points are arranged on each square of P1.8, and according to the principle that the LED lamp beads automatically emit light, the smaller the distance is, the larger the density of the display unit is, the clearer the displayed image or video is, the display screen is an iteration upgrade version which overcomes the traditional display screen, and the display module of one unit consists of the LED lamp beads (diodes), a plastic suite, an IC drive chip, a PCB circuit board, a signal socket, a power socket, a capacitor and a resistor.
Because of the lamp pearl density among the display module assembly is big, the pointolite is many, the temperature is higher when the screen body is opened, because the lamp pearl density of installation on the lamp plate is less, the heat that produces is more, the thermal diffusivity is slower, the heat dissipation is untimely will seriously influence the life of lamp pearl, the heat dissipation among the prior art uses forced air cooling more, also have radiating fin and water-cooling, but the water tank is general small, realize the heat dissipation with the help of the cooling tube that coils, but the work load is big when coiling the equipment of cooling tube, the cost is higher.
SUMMERY OF THE UTILITY MODEL
In order to compensate above not enough, the utility model provides a full-color display screen module of heat abstractor and indoor P1.8 booth apart from high definition aims at improving traditional display module thermal diffusivity slower, and the heat dissipation is untimely will seriously influence the life's of lamp pearl problem.
The utility model discloses a realize like this:
first aspect, the embodiment of the utility model provides a heat abstractor, including lamp plate, heat-conducting component and radiator unit.
The heat conduction assembly comprises a heat conduction water tank and a heat conduction pad, the heat conduction water tank is fixed on the back face of the lamp panel, and the heat conduction pad is arranged between the heat conduction water tank and the lamp panel.
The heat dissipation assembly comprises a heat dissipation water tank and semiconductor refrigeration pieces, the refrigeration surfaces of the semiconductor refrigeration pieces are connected with the heat dissipation water tank, the upper end of the heat dissipation water tank is communicated with the upper end of the heat conduction water tank, and the lower end of the heat dissipation water tank is communicated with the lower end of the heat conduction water tank.
The utility model discloses an in one embodiment, the lamp plate includes base plate and lamp pearl, the lamp pearl is provided with a plurality ofly, and is a plurality of the lamp pearl array respectively in substrate surface.
The utility model discloses an in one embodiment, the heat conduction pad one side with the laminating of lamp plate surface, the heat conduction pad another side with the laminating of heat conduction water tank surface.
The utility model discloses an in the embodiment, the heat dissipation water tank sets up perpendicularly, heat dissipation water tank upper end intercommunication has the inlet tube, the other end of inlet tube with heat conduction water tank upper end intercommunication, heat dissipation water tank lower extreme intercommunication has the outlet pipe, the other end of outlet pipe with heat conduction water tank lower extreme intercommunication.
The utility model discloses an in one embodiment, the drainage interface has been seted up to heat conduction water tank upper end, the interface of intaking has been seted up to heat conduction water tank lower extreme, the inlet tube with drainage interface connection, the outlet pipe with the interface intercommunication of intaking.
The utility model discloses an in the embodiment, heat conduction water tank fixed surface has the pump body, the outlet of the pump body with water inlet interface connection, the mouth that draws water of the pump body with go out water piping connection.
The utility model discloses an in the embodiment, the pressure balance mouth is installed to heat dissipation water tank upper end, pressure balance mouth department is provided with waterproof ventilated membrane.
In an embodiment of the present invention, the cooling surface of the semiconductor cooling plate runs through the heat radiation water tank extends to the inner surface.
The utility model discloses an in the embodiment, the water filling port has been seted up to heat dissipation water tank upper end, water filling port threaded connection has the end cap, the face of heating laminating of semiconductor refrigeration piece is fixed with radiating fin.
In a second aspect, the embodiment of the utility model provides an in addition provide an indoor P1.8 booth apart from full-color display screen module of high definition, including foretell heat abstractor and plastics external member, the plastics external member includes drain pan and face guard, the drain pan with face guard end-face fit joint, the radiator tank runs through and is fixed in the face guard lateral wall.
The utility model has the advantages that: the utility model discloses a heat abstractor that obtains through above-mentioned design, when using, will inject the coolant liquid into heat conduction water tank and heat dissipation water tank, the heat conduction water tank passes through heat conduction pad and the laminating of lamp plate surface, and the heat that is convenient for lamp plate surface to produce passes through heat conduction pad and transmits to heat conduction water tank, because hot water density reduces the volume expansion, makes the cryogenic cooling liquid in the heat dissipation water tank flow into in the heat conduction water tank from heat dissipation water tank lower extreme and heat conduction water tank lower extreme intercommunication, and heat conduction water tank upper end high temperature coolant liquid passes through heat dissipation water tank upper end and heat conduction water tank upper end intercommunication and enters into in the heat dissipation water tank, realizes the cooling of heat conduction water tank internal water circulation, changes traditional circulating pipe cooling, and security and economic nature all are promoted well; the cooling liquid in the heat radiation water tank cools the heat radiation water tank through the added semiconductor refrigeration piece, so that the cooling liquid in the heat radiation water tank keeps a low-temperature state, heat radiation is facilitated to be continuously performed, heat generated by the lamp panel can be diffused and cooled in time, the possibility of high-temperature burnout of the lamp panel is reduced, and the service life is prolonged.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of a heat dissipation device and an indoor P1.8 small-spacing high-definition full-color display screen module according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a heat-conducting water tank according to an embodiment of the present invention;
fig. 3 is a schematic view of a mask structure according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a heat dissipation assembly according to an embodiment of the present invention.
In the figure: 100-lamp panel; 110-a substrate; 130-lamp bead; 300-a thermally conductive assembly; 310-heat conducting water tank; 311-a drain interface; 313-water inlet interface; 330-heat conducting pad; 500-a heat dissipation assembly; 510-a heat radiation water tank; 511-water inlet pipe; 513-a water outlet pipe; 515-a pressure equalization port; 517-water injection port; 530-semiconductor refrigerating sheet; 550-a pump body; 570-radiating fins; 700-a plastic kit; 710-a bottom case; 730-mask.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Examples
Referring to fig. 1, the present invention provides a technical solution: the heat dissipation device includes a lamp panel 100, a heat conduction assembly 300, and a heat dissipation assembly 500.
Wherein, heat-conducting component 300 and the laminating of lamp plate 100 for derive the heat that lamp plate 100 produced, heat radiation component 500 diffuses the heat that heat-conducting component 300 derived to the outside, and then carries out cooling heat dissipation to lamp plate 100 and handles.
Referring to fig. 1-2, the heat conducting assembly 300 includes a heat conducting water tank 310 and a heat conducting pad 330, the heat conducting water tank 310 is fixed on the back of the lamp panel 100, the heat conducting pad 330 is disposed between the heat conducting water tank 310 and the lamp panel 100, and the heat conducting pad 330 may be a heat conducting silica gel gasket; wherein, lamp plate 100 includes base plate 110 and lamp pearl 130, and lamp pearl 130 is provided with a plurality ofly, and a plurality of lamp pearl 130 arrays are respectively on base plate 110 surface, and the laminating of heat conduction pad 330 one side and lamp plate 100 surface, the laminating of heat conduction pad 330 another side and heat conduction water tank 310 surface.
Referring to fig. 3-4, the heat dissipation assembly 500 includes a heat dissipation water tank 510 and a semiconductor cooling fin 530, a cooling surface of the semiconductor cooling fin 530 is connected to the heat dissipation water tank 510, an upper end of the heat dissipation water tank 510 is communicated with an upper end of the heat conduction water tank 310, a lower end of the heat dissipation water tank 510 is communicated with a lower end of the heat conduction water tank 310, a pump body 550 is fixed on a surface of the heat conduction water tank 310, a water outlet of the pump body 550 is connected to a water inlet 313, a water outlet of the pump body 550 is connected to a water outlet 513, the pump body 550 is added to accelerate circulation of cooling liquid in the heat conduction water tank 310 and the heat dissipation water tank 510 and accelerate heat dissipation effect, a pressure balancing port 515 is installed at an upper end of the heat dissipation water tank 510, a waterproof and breathable film is installed at a port of the pressure balancing port 515, air pressure generated by;
it should be noted that the heat dissipation water tank 510 is vertically disposed, the upper end of the heat dissipation water tank 510 is communicated with a water inlet pipe 511, the other end of the water inlet pipe 511 is communicated with the upper end of the heat conduction water tank 310, the lower end of the heat dissipation water tank 510 is communicated with a water outlet pipe 513, and the other end of the water outlet pipe 513 is communicated with the lower end of the heat conduction water tank 310.
In this embodiment, the upper end of the heat-conducting water tank 310 is provided with a water outlet 311, the lower end of the heat-conducting water tank 310 is provided with a water inlet 313, the water inlet pipe 511 is connected with the water outlet 311, the water outlet pipe 513 is communicated with the water inlet 313, the water outlet 311 and the water inlet 313 are additionally provided, and the heat-conducting water tank is convenient to disassemble and maintain.
In other embodiments, the refrigerating surface of the semiconductor refrigerating sheet 530 penetrates through the heat dissipation water tank 510 and extends to the inner surface, a water filling port 517 is formed in the upper end of the heat dissipation water tank 510, a plug is connected to a port of the water filling port 517 in a threaded manner, the water filling port 517 is used for adding cooling liquid, the plug connected in a threaded manner is additionally arranged so as to be opened and closed conveniently, the heating surface of the semiconductor refrigerating sheet 530 is fixedly attached with a heat dissipation fin 570, and the heat dissipation fin 570 is arranged so as to accelerate the volatilization and diffusion of the heat of the heating surface of the semiconductor.
Referring to fig. 1, an embodiment of the present invention further provides an indoor P1.8 small-spacing high-definition full-color display module, including the heat dissipation device and the plastic external member 700, the plastic external member 700 includes a bottom shell 710 and a face mask 730, the bottom shell 710 and the face mask 730 are clamped in an end-face fit manner, the substrate 110 is fixed in the face mask 730, the heat dissipation water tank 510 is fixed on a side wall of the face mask 730, and the heat dissipation fins 570 are disposed on an outer surface of the face mask 730.
The working principle of the heat dissipation device is as follows: the heat conducting water tank 310 and the heat dissipating water tank 510 are filled with cooling liquid, the heat conducting water tank 310 is attached to the surface of the lamp panel 100 through the heat conducting pad 330, so that heat generated on the surface of the lamp panel 100 is conveniently transferred to the heat conducting water tank 310 through the heat conducting pad 330, the low-temperature cooling liquid in the heat dissipating water tank 510 flows into the heat conducting water tank 310 from the communication part between the lower end of the heat dissipating water tank 510 and the lower end of the heat conducting water tank 310 due to the reduction of the volume expansion caused by the reduction of the hot water density, the high-temperature cooling liquid at the upper end of the heat conducting water tank 310 enters the heat dissipating water tank 510 through the communication part between the upper end of the heat dissipating water tank 510 and the upper end of the heat conducting water tank 310, the water circulation cooling in the heat conducting water tank 310 is realized, the cooling liquid in the heat dissipating water tank 510 is cooled by adding the semiconductor cooling fins 530, the cooling liquid in the heat dissipating water, the service life is prolonged; in addition, the bottom shell 710 and the face cover 730 which are additionally arranged are matched and clamped, the lamp panel 100 is fixed in the lamp panel, the protection effect is achieved, and the lamp panel is prevented from being damaged in the using process.
It should be noted that the specific model specifications of the lamp bead 130, the semiconductor refrigeration sheet 530 and the pump body 550 need to be determined by type selection according to the actual specification of the device, and the specific type selection calculation method adopts the prior art in the field, so detailed burdens are not needed.
The power supply and the principle of the lamp bead 130, the semiconductor cooling plate 530 and the pump body 550 are clear to those skilled in the art and will not be described in detail herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The heat sink is characterized by comprising
A lamp panel (100);
the heat conduction assembly (300) comprises a heat conduction water tank (310) and a heat conduction pad (330), the heat conduction water tank (310) is fixed on the back of the lamp panel (100), and the heat conduction pad (330) is arranged between the heat conduction water tank (310) and the lamp panel (100);
radiator unit (500), radiator unit (500) are including heat dissipation water tank (510) and semiconductor refrigeration piece (530), the refrigeration face of semiconductor refrigeration piece (530) with heat dissipation water tank (510) are connected, heat dissipation water tank (510) upper end with lead hot water tank (310) upper end intercommunication, heat dissipation water tank (510) lower extreme with lead hot water tank (310) lower extreme intercommunication.
2. The heat dissipation device of claim 1, wherein the lamp panel (100) comprises a substrate (110) and a plurality of lamp beads (130), the plurality of lamp beads (130) are arranged on the surface of the substrate (110), and the plurality of lamp beads (130) are arrayed on the surface of the substrate (110).
3. The heat dissipation device as claimed in claim 1, wherein one side of the thermal pad (330) is attached to the surface of the lamp panel (100), and the other side of the thermal pad (330) is attached to the surface of the thermal water tank (310).
4. The heat dissipation device according to claim 1, wherein the heat dissipation water tank (510) is vertically arranged, an inlet pipe (511) is communicated with the upper end of the heat dissipation water tank (510), the other end of the inlet pipe (511) is communicated with the upper end of the heat conducting water tank (310), an outlet pipe (513) is communicated with the lower end of the heat dissipation water tank (510), and the other end of the outlet pipe (513) is communicated with the lower end of the heat conducting water tank (310).
5. The heat dissipation device of claim 4, wherein a water outlet (311) is formed at an upper end of the heat conducting water tank (310), a water inlet (313) is formed at a lower end of the heat conducting water tank (310), the water inlet pipe (511) is connected with the water outlet (311), and the water outlet pipe (513) is communicated with the water inlet (313).
6. The heat dissipation device according to claim 5, wherein a pump body (550) is fixed on a surface of the heat conducting water tank (310), a water outlet of the pump body (550) is connected with the water inlet interface (313), and a water outlet of the pump body (550) is connected with the water outlet pipe (513).
7. The heat dissipation device of claim 1, wherein a pressure balance port (515) is installed at an upper end of the heat dissipation water tank (510), and a waterproof and breathable film is arranged at a port of the pressure balance port (515).
8. The heat sink as recited in claim 1, characterized in that the cooling surface of the semiconductor cooling fins (530) extends through the heat sink tank (510) to an inner surface.
9. The heat dissipation device of claim 1, wherein a water filling port (517) is formed in an upper end of the heat dissipation water tank (510), a plug is connected to a port of the water filling port (517) in a threaded manner, and a heat dissipation fin (570) is fixed to a heating surface of the semiconductor refrigeration piece (530) in a fitting manner.
10. Indoor P1.8 booth apart from full-color display screen module of high definition, a serial communication port, include
The heat dissipating device of any of claims 1-9; and
plastics external member (700), plastics external member (700) include drain pan (710) and face guard (730), drain pan (710) with face guard (730) end-face fit joint, radiator tank (510) run through to be fixed in face guard (730) lateral wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021176953.0U CN212461026U (en) | 2020-06-23 | 2020-06-23 | Heat abstractor and indoor P1.8 booth apart from full-color display screen module of high definition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021176953.0U CN212461026U (en) | 2020-06-23 | 2020-06-23 | Heat abstractor and indoor P1.8 booth apart from full-color display screen module of high definition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212461026U true CN212461026U (en) | 2021-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021176953.0U Expired - Fee Related CN212461026U (en) | 2020-06-23 | 2020-06-23 | Heat abstractor and indoor P1.8 booth apart from full-color display screen module of high definition |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212461026U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114792493A (en) * | 2022-04-13 | 2022-07-26 | 深圳市迅豹聚能科技有限公司 | Water-cooling liquid crystal display advertisement machine with TEC heat dissipation air conditioner |
-
2020
- 2020-06-23 CN CN202021176953.0U patent/CN212461026U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114792493A (en) * | 2022-04-13 | 2022-07-26 | 深圳市迅豹聚能科技有限公司 | Water-cooling liquid crystal display advertisement machine with TEC heat dissipation air conditioner |
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Granted publication date: 20210202 |