CN211768549U - Semiconductor particle vibration arraying device - Google Patents

Abstract

The utility model discloses a semiconductor particle vibration arraying device, which comprises a fixed frame, a sieve mould, a grid piece and a vibration table for generating vibration; the grid piece is detachably connected with the fixed frame, and the screen mold is detachably connected with the fixed frame; the screen mold is provided with a plurality of screen holes, the grid sheet is provided with a plurality of array holes, and the array holes correspond to the screen holes one to one. The utility model provides a semiconductor granule vibration permutation device has simple structure, low in manufacturing cost, disposable permutation's granule is in large quantity, efficient advantage such as high.

Description

Semiconductor particle vibration arraying device

Technical Field

The utility model belongs to the technical field of the semiconductor processing technique and specifically relates to a semiconductor granule vibrates permutation device is related to.

Background

The semiconductor particles are regular hexahedral cuboid particles, two opposite surfaces of the semiconductor particles are squares, the two surfaces of the semiconductor particles are required to face upwards or downwards (the front surface and the back surface of the semiconductor particles are not distinguished) when being aligned, the particles are small in size and large in quantity, and the semiconductor particles flow into the next assembling process after being arrayed at equal intervals. In the prior art, the arrangement is generally carried out in a manual mode, but the manual arrangement efficiency is low, and the labor intensity of workers is high. Therefore, in order to solve the problem of rapid alignment of semiconductor particles, the application designs a semiconductor particle vibrating alignment device, which aligns the semiconductor particles in the grid plates through conical screen holes with fixed intervals so as to facilitate the assembly of the next process.

Chinese patent application publication No. CN203997897U, published as 2014, 12 and 10 entitled "feeding device for sequentially arranging and outputting mosaic particles", discloses a feeding device for sequentially arranging and outputting mosaic particles, which comprises a feeding mechanism with a top plate formed by a spiral track, and a controller in signal connection with the feeding mechanism; the method is characterized in that: the mosaic machine also comprises a linear feeding mechanism which can convey the mosaic particles conveyed from the feeding mechanism; the linear feeding mechanism comprises a linear track connected with the outlet of the spiral track and a friction wheel arranged at the inlet of the linear track and used for pushing mosaic particles into the linear track; and the linear track is provided with a conveying roller. The utility model discloses it is rational in infrastructure, can realize mosaic granule sequence arrangement and quick output, this feedway still can effectively improve the transmission speed of mosaic granule when realizing arranging the output with mosaic granule sequence arrangement to can improve the efficiency of laying of mosaic granule, reduction in production cost.

Disclosure of Invention

The utility model discloses an overcome artifical permutation semiconductor granule inefficiency among the prior art, problem that workman intensity of labour is big provides a semiconductor granule vibration permutation device, has simple structure, low in manufacturing cost, and disposable permutation's granule is advantage such as big, efficient.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a semiconductor particle vibration arraying device comprises a fixed frame, a sieve mould, a grid sheet and a vibration table for generating vibration; the grid piece is detachably connected with the fixed frame, and the screen mold is detachably connected with the fixed frame; the screen mold is provided with a plurality of screen holes, the grid sheet is provided with a plurality of array holes, and the array holes correspond to the screen holes one to one.

By implementing the technical scheme, the semiconductor particles can be subjected to vibration alignment. Before working, the screen mould and the grid plate are sequentially arranged on a specific position of the fixed frame; during operation, semiconductor particles are poured into the sieve die, the vibrating table is started, the particles sequentially pass through the sieve holes and enter the array holes of the grid pieces to complete the array, then the sieve die and the grid pieces are taken out, and the grid pieces are moved to the next station to wait for processing. The detachable connection can be in a threaded connection mode, a clamping connection mode, a magnetic attraction connection mode and the like.

Preferably, the bottom surface of the fixing frame is provided with a positioning counter bore, and the lower end of the grid piece is matched with the positioning counter bore and is arranged in the positioning counter bore. The positioning counter bores can be used for positioning the positions of the grating sheets.

Preferably, the grid sheet is provided with a positioning pin, the positioning pin is fixed with the grid sheet, the screen mold is provided with a first positioning hole matched with the positioning pin, and one end of the positioning pin penetrates through the first positioning hole. The positioning pins can ensure the accuracy of the relative positions of the sieve mould and the grid plate, and further ensure that the array holes can correspond to sieve holes one by one.

Preferably, the bottom surface of the fixing frame is fixedly provided with a positioning pin, the screen mold is provided with a first positioning hole matched with the positioning pin, the grid sheet is provided with a second positioning hole matched with the positioning pin, and one end of the positioning pin sequentially penetrates through the second positioning hole and the first positioning hole. The positioning counter bores can simultaneously position the grid plates and the screening dies, so that the accuracy of the relative positions of the screening dies and the grid plates can be ensured, and the array holes can be in one-to-one correspondence with the screen holes.

Preferably, the sieve holes are tapered holes, and the size of the upper end of each sieve hole is larger than that of the lower end of each sieve hole. The conical holes have a guiding function, so that semiconductor particles can conveniently enter the sieve holes.

Preferably, the fixed frame is fixed on the vibrating table at a certain inclination angle, and the sieve mold and the grid pieces are arranged in an inclined manner along the same inclination direction as the fixed frame. The fixing frame, the sieve mould and the grid pieces have certain inclination angles, so that the arrangement of particles is convenient during vibration, and meanwhile, redundant semiconductor particles can conveniently slide on the lowest material receiving disc.

Preferably, the side wall of the screen mold is provided with a leakage groove. And redundant particles can conveniently slide onto the fixed frame from the leakage groove on the side wall with the lower height of the leakage groove screen mold.

Preferably, the lower side of the bottom surface of the fixing frame is provided with a leakage hole, and a receiving disc is arranged below the leakage hole. The leak hole is convenient for redundant particles to slide on the receiving tray and is convenient for recovery.

The utility model has the advantages that: (1) the semiconductor particles can be subjected to vibration alignment, and the alignment at one time has large particle quantity and high efficiency; (2) the screen mold and the grid sheet are accurately positioned and are convenient to disassemble and assemble; (3) the excess semiconductor particles can be automatically recovered.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

In the figure: the device comprises a fixed frame 1, a positioning counter bore 1.1, a leakage hole 1.2, a sieve die 2, a sieve mesh 2.1, a leakage groove 2.2, a first positioning hole 2.3, a grating sheet 3, an array hole 3.1, a second positioning hole 3.2, a vibrating table 4, a positioning pin 5 and a receiving disc 6.

Detailed Description

The invention is further described with reference to the accompanying drawings and specific embodiments.

Example 1:

as shown in fig. 1, a semiconductor particle vibrating and aligning device comprises a fixed frame 1, a screen mold 2, a grid sheet 3 and a vibrating table 4 for generating vibration; the fixed frame 1 is fixed on the vibrating table 4 at a certain inclination angle, a positioning counter bore 1.1 is arranged on the bottom surface of the fixed frame 1, the lower end of the grid sheet 3 is matched with the positioning counter bore 1.1 and is arranged in the positioning counter bore 1.1, the screen mold 2 is arranged above the grid sheet 3, a positioning pin 5 is arranged at the edge position of the grid sheet 3, the positioning pin 5 is fixed with the grid sheet 3, a first positioning hole 2.3 matched with the positioning pin 5 is arranged on the screen mold 2, and one end of the positioning pin 5 penetrates through the first positioning hole 2.3; the screen 2 and the grid segments 3 are arranged obliquely in the same oblique direction as the fixed frame 1. The sieve mould 2 is provided with a plurality of conical sieve pores 2.1, the size of the upper end of each sieve pore 2.1 is larger than that of the lower end of each sieve pore, the grid sheet 3 is provided with a plurality of array holes 3.1, and the array holes 3.1 correspond to the sieve pores 2.1 one by one; a leakage groove 2.2 is arranged on the side wall of the sieve mould 2; the lower side of the bottom surface of the fixed frame 1 is provided with a leakage hole 1.2, and a receiving disc 6 is arranged below the leakage hole 1.2.

By implementing the technical scheme, the semiconductor particles can be subjected to vibration alignment. Before working, the screen mould 2 and the grating sheet 3 are sequentially arranged on a specific position of the fixed frame 1; during operation, semiconductor particles are poured into the sieve die 2, the vibrating table 4 is started, the particles sequentially pass through the sieve holes 2.1 and enter the array holes 3.1 of the grid pieces 3 to complete the array, then the sieve die 2 and the grid pieces 3 are taken out, and the grid pieces 3 are moved to the next station to wait for processing. The fixing frame, the sieve mould and the grid pieces have certain inclination angles, so that the arrangement of particles is convenient during vibration, and meanwhile, redundant semiconductor particles can conveniently slide on the lowest material receiving disc.

Example 2:

as shown in fig. 1, a semiconductor particle vibrating and aligning device comprises a fixed frame 1, a screen mold 2, a grid sheet 3 and a vibrating table 4 for generating vibration; the fixed frame 1 is fixed on the vibrating table 4 at a certain inclination angle, a positioning pin 5 is fixed on the bottom surface of the fixed frame 1, a first positioning hole 2.3 matched with the positioning pin 5 is formed in the sieve mould 2, a second positioning hole 3.2 matched with the positioning pin 5 is formed in the grating sheet 3, and one end of the positioning pin 5 sequentially penetrates through the second positioning hole 3.2 and the first positioning hole 2.3; the screen 2 and the grid segments 3 are arranged obliquely in the same oblique direction as the fixed frame 1. The sieve mould 2 is provided with a plurality of conical sieve pores 2.1, the size of the upper end of each sieve pore 2.1 is larger than that of the lower end of each sieve pore, the grid sheet 3 is provided with a plurality of array holes 3.1, and the array holes 3.1 correspond to the sieve pores 2.1 one by one; a leakage groove 2.2 is arranged on the side wall of the sieve mould 2; the lower side of the bottom surface of the fixed frame 1 is provided with a leakage hole 1.2, and a receiving disc 6 is arranged below the leakage hole 1.2.

By implementing the technical scheme, the semiconductor particles can be subjected to vibration alignment. Before working, the screen mould and the grid plate are sequentially arranged on a specific position of the fixed frame; during operation, semiconductor particles are poured into the sieve die, the vibrating table is started, the particles sequentially pass through the sieve holes and enter the array holes of the grid pieces to complete the array, then the sieve die and the grid pieces are taken out, and the grid pieces are moved to the next station to wait for processing. The fixing frame, the sieve mould and the grid pieces have certain inclination angles, so that the arrangement of particles is convenient during vibration, and meanwhile, redundant semiconductor particles can conveniently slide on the lowest material receiving disc.

The utility model has the advantages that: the semiconductor particles can be subjected to vibration alignment, and the alignment at one time has large particle quantity and high efficiency; the screen mold and the grid sheet are accurately positioned and are convenient to disassemble and assemble; the excess semiconductor particles can be automatically recovered.

Claims (8)

1. A semiconductor particle vibration arraying device is characterized by comprising a fixing frame, a sieve mold, a grid sheet and a vibration table for generating vibration; the grid piece is detachably connected with the fixed frame, and the screen mold is detachably connected with the fixed frame; the screen mold is provided with a plurality of screen holes, the grid sheet is provided with a plurality of array holes, and the array holes correspond to the screen holes one to one.

2. The vibrating semiconductor particle arraying device as claimed in claim 1, wherein the bottom surface of the fixing frame is provided with a positioning counter bore, and the lower end of the grid plate is matched with and arranged in the positioning counter bore.

3. The apparatus as claimed in claim 2, wherein the grid plate has a positioning pin fixed thereto, the screen mold has a first positioning hole adapted to the positioning pin, and one end of the positioning pin passes through the first positioning hole.

4. The vibrating alignment device for semiconductor particles as claimed in claim 1, wherein a positioning pin is fixed to the bottom surface of the fixing frame, a first positioning hole is formed in the screen mold to be fitted with the positioning pin, a second positioning hole is formed in the grid plate to be fitted with the positioning pin, and one end of the positioning pin passes through the second positioning hole and the first positioning hole in sequence.

5. A vibratory semiconductor particle arraying device as claimed in claim 1, 2, 3 or 4 wherein said openings are tapered openings with the upper end of the openings being larger than the lower end.

6. A vibrating alignment apparatus for semiconductor particles according to claim 1, 2, 3 or 4, wherein the fixing frame is fixed to the vibrating table at a certain tilt angle, and the screen mold and the grid plate are disposed to be tilted in the same tilt direction as the fixing frame.

7. A vibratory semiconductor grain aligning apparatus as claimed in claim 6 wherein said screen mold has a plurality of notches in a side wall thereof.

8. The vibrating and aligning device for semiconductor particles as claimed in claim 6, wherein the lower side of the bottom surface of the fixing frame is provided with a hole, and a receiving tray is arranged below the hole.

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