CN211708361U - 金丝键合工装 - Google Patents
金丝键合工装 Download PDFInfo
- Publication number
- CN211708361U CN211708361U CN201922389186.5U CN201922389186U CN211708361U CN 211708361 U CN211708361 U CN 211708361U CN 201922389186 U CN201922389186 U CN 201922389186U CN 211708361 U CN211708361 U CN 211708361U
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- plate
- gold wire
- wire bonding
- pressing
- pressing plate
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- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 238000010030 laminating Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims description 102
- 239000006247 magnetic powder Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 238000012797 qualification Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000004377 microelectronic Methods 0.000 description 3
- 235000014820 Galium aparine Nutrition 0.000 description 2
- 240000005702 Galium aparine Species 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201922389186.5U CN211708361U (zh) | 2019-12-26 | 2019-12-26 | 金丝键合工装 |
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CN201922389186.5U CN211708361U (zh) | 2019-12-26 | 2019-12-26 | 金丝键合工装 |
Publications (1)
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CN211708361U true CN211708361U (zh) | 2020-10-20 |
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CN201922389186.5U Active CN211708361U (zh) | 2019-12-26 | 2019-12-26 | 金丝键合工装 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111001925A (zh) * | 2019-12-26 | 2020-04-14 | 华讯方舟科技有限公司 | 金丝键合工装及工艺 |
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2019
- 2019-12-26 CN CN201922389186.5U patent/CN211708361U/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111001925A (zh) * | 2019-12-26 | 2020-04-14 | 华讯方舟科技有限公司 | 金丝键合工装及工艺 |
CN111001925B (zh) * | 2019-12-26 | 2024-06-14 | 江西华讯方舟智能技术有限公司 | 金丝键合工装及工艺 |
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Effective date of registration: 20210630 Granted publication date: 20201020 |
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PD01 | Discharge of preservation of patent |
Date of cancellation: 20230421 Granted publication date: 20201020 |
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TR01 | Transfer of patent right |
Effective date of registration: 20230822 Address after: 518000 107, building 37, chentian Industrial Zone, chentian community, Xixiang street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Shenzhen Huaxun ark Intelligent Information Technology Co.,Ltd. Address before: 518000 1 / F and 2 / F, building 37, chentian Industrial Zone, Baoan District, Shenzhen City, Guangdong Province Patentee before: CHINA COMMUNICATION TECHNOLOGY Co.,Ltd. Patentee before: SHENZHEN HUAXUN FANGZHOU MICROELECTRONIC SCIENCE & TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231206 Address after: Building 7-6, Industrial Control Cloud Creation Port, No. 58 Hongtu Avenue, Honggutan District, Nanchang City, Jiangxi Province, 330000 Patentee after: Jiangxi Huaxun Fangzhou Intelligent Technology Co.,Ltd. Address before: 518000 107, building 37, chentian Industrial Zone, chentian community, Xixiang street, Bao'an District, Shenzhen, Guangdong Province Patentee before: Shenzhen Huaxun ark Intelligent Information Technology Co.,Ltd. |
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TR01 | Transfer of patent right |