CN211630387U - MEMS packaging structure and MEMS microphone - Google Patents
MEMS packaging structure and MEMS microphone Download PDFInfo
- Publication number
- CN211630387U CN211630387U CN202020583982.2U CN202020583982U CN211630387U CN 211630387 U CN211630387 U CN 211630387U CN 202020583982 U CN202020583982 U CN 202020583982U CN 211630387 U CN211630387 U CN 211630387U
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- mems
- circuit board
- chip
- asic chip
- packaging structure
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 34
- 230000005611 electricity Effects 0.000 claims abstract description 6
- 239000000565 sealant Substances 0.000 claims description 9
- 239000003292 glue Substances 0.000 abstract description 10
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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Abstract
The utility model discloses a MEMS packaging structure and MEMS microphone relates to microphone technical field. The utility model provides a MEMS packaging structure, includes the circuit board, set up in the circuit board and with MEMS chip and ASIC chip that the circuit board electricity is connected, and set up in be used for on the circuit board right the MEMS chip with the casing that the ASIC chip encapsulated, be provided with the mounting groove on the circuit board, the ASIC chip set up in the mounting groove, the MEMS chip with the ASIC chip respectively through the wire with the circuit board electricity is connected. The utility model discloses MEMS packaging structure and MEMS microphone have solved the problem that current MEMS microphone signal to noise ratio is low to and when the encapsulation to ASIC chip, be used for encapsulating sealed glue of ASIC chip causes the problem of pollution to the MEMS chip easily, improved the acoustic performance of MEMS microphone, guaranteed the yield of product.
Description
Technical Field
The utility model relates to a microphone technical field, concretely relates to MEMS packaging structure and MEMS microphone.
Background
The structure of the existing MEMS packaging structure is shown in FIG. 4, and the existing MEMS packaging structure comprises a circuit board 1, an MEMS chip 2, an ASIC chip 3 and a shell 4, wherein the shell 4 is welded on the circuit board 1 through solder paste 10, the MEMS chip 2 and the ASIC chip 3 are positioned between the circuit board 1 and the shell 4, one side of the MEMS chip 2, which is provided with an inner cavity, is fixedly adhered on the circuit board 1 through fixing glue 7, and a sound hole 12 is formed in the circuit board 1 at a position corresponding to the inner cavity of the MEMS chip 2; the ASIC chip 3 is fixedly adhered to the circuit board 1 through fixing glue 8 and located on the side portion of the MEMS chip 2, the MEMS chip 2 is electrically connected with the ASIC chip 3 through a lead 5, the ASIC chip 3 is electrically connected with the circuit board 1 through a lead 6, and sealant 9 is packaged on the ASIC chip 3.
The MEMS packaging structure has two cavities, wherein a cavity is formed between the circuit board 1 and the shell 4, a cavity is formed between the MEMS chip 2 and the circuit board 1, the cavity corresponding to the sound hole 12 in the two cavities is called a front cavity, the other cavity is called a back cavity (back cavity), the signal-to-noise ratio of the MEMS microphone is related to the sizes of the front cavity and the back cavity, the larger the volume of the back cavity is, the higher the signal-to-noise ratio of the MEMS microphone is, the higher the signal-to-noise ratio is, the smaller the noise is, and the better the acoustic performance of the MEMS microphone is.
In the MEMS packaging structure, the MEMS chip 2 and the ASIC chip 3 are both positioned in a cavity between the circuit board 1 and the shell 4, so that the rear cavity of the MEMS packaging structure is smaller, and the signal-to-noise ratio of the MEMS microphone is reduced; when the ASIC chip 3 is packaged, the sealant 9 for packaging the ASIC chip 3 easily climbs to the surface of the MEMS chip 2 along the lead 5, so that the MEMS chip 2 is polluted, and the yield of products is influenced.
SUMMERY OF THE UTILITY MODEL
To the above defect that prior art exists, the utility model discloses a first purpose provides a MEMS packaging structure, and this MEMS packaging structure has solved the problem that current MEMS microphone signal to noise ratio is low to and when the encapsulation to ASIC chip, be used for encapsulating sealed glue of ASIC chip causes the problem of pollution to the MEMS chip easily.
In order to solve the technical problem, the utility model discloses a technical scheme is:
the utility model provides a MEMS packaging structure, includes the circuit board, set up in the circuit board and with MEMS chip and ASIC chip that the circuit board electricity is connected, and set up in be used for on the circuit board right the MEMS chip with the casing that the ASIC chip encapsulated, be provided with the mounting groove on the circuit board, the ASIC chip set up in the mounting groove, the MEMS chip with the ASIC chip respectively through the wire with the circuit board electricity is connected.
The MEMS chip is arranged on the circuit board, wherein one side of the MEMS chip, which is provided with an inner cavity, is arranged on the circuit board, and the mounting groove is arranged at the position of the circuit board, which corresponds to the inner cavity of the MEMS chip.
And a sound hole is formed in the bottom of the mounting groove, and the ASIC chip is positioned on the side part of the sound hole.
The circuit board is provided with a sound hole corresponding to the position of the inner cavity of the MEMS chip, and the mounting groove is located on the side of the sound hole.
Wherein the mounting groove is located at a side portion of the MEMS chip.
The MEMS chip is fixedly adhered to the circuit board.
The ASIC chip is fixedly attached to the circuit board.
And the ASIC chip is encapsulated with a sealant.
Wherein the housing is soldered or glued to the circuit board.
By adopting the technical scheme, the beneficial effects of the utility model are that:
the utility model provides a MEMS packaging structure, because set up the mounting groove on the circuit board, the ASIC chip sets up in this mounting groove, compare with prior art, the utility model discloses MEMS packaging structure has increased MEMS packaging structure's back cavity volume, has improved the SNR of MEMS microphone, has improved the acoustic performance of MEMS microphone; because the MEMS chip and the ASIC chip are respectively and electrically connected with the circuit board through the wires, the pollution of sealant for packaging the ASIC chip to the MEMS chip is avoided when the ASIC chip is packaged, and the yield of products is ensured.
A second object of the present invention is to provide a MEMS microphone, which solves the problem of low signal-to-noise ratio of the existing MEMS microphone, and when packaging the ASIC chip, the sealant used for packaging the ASIC chip easily causes the pollution to the MEMS chip.
In order to solve the technical problem, the utility model discloses a technical scheme is:
an MEMS microphone has the MEMS packaging structure in the technical scheme.
The utility model provides a MEMS microphone, owing to have among the above-mentioned technical scheme MEMS packaging structure, consequently, solved the problem that current MEMS microphone signal to noise ratio is low, improved MEMS microphone's SNR, improved MEMS microphone's acoustic performance, simultaneously, avoided when to ASIC chip encapsulation for the sealed pollution that glue that encapsulates the ASIC chip led to the fact the MEMS chip has guaranteed the yield of product.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of the MEMS package structure of the present invention;
fig. 2 is a schematic structural diagram of a second embodiment of the MEMS package structure of the present invention;
fig. 3 is a schematic structural diagram of a third embodiment of the MEMS package structure of the present invention;
FIG. 4 is a schematic diagram of a prior art MEMS package structure;
in the figure: 1-circuit board, 11-mounting groove, 12-sound hole, 13-sound hole, 14-sound hole, 15-mounting groove, 16-mounting groove, 2-MEMS chip, 3-ASIC chip, 4-shell, 5-conducting wire, 6-conducting wire, 7-fixing glue, 8-fixing glue, 9-sealant and 10-tin paste.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
The first embodiment is as follows:
as shown in fig. 1, an MEMS package structure includes a circuit board 1, a MEMS chip 2 and an ASIC chip 3 disposed on the circuit board 1 and electrically connected to the circuit board 1, and a housing 4 disposed on the circuit board 1 for packaging the MEMS chip 2 and the ASIC chip 3, wherein a mounting groove 11 is disposed on the circuit board 1, and the ASIC chip 3 is disposed in the mounting groove 11. The installation groove 11 is formed in the circuit board 1, and the ASIC chip 3 is arranged in the installation groove 11, so that the volume of a rear cavity of the MEMS packaging structure is increased, the signal-to-noise ratio of the MEMS microphone is improved, and the acoustic performance of the MEMS microphone is improved.
In this embodiment, one side of the MEMS chip 2 having the inner cavity is disposed on the circuit board 1, the mounting groove 11 is disposed at a position of the circuit board 1 corresponding to the inner cavity of the MEMS chip 2, the bottom of the mounting groove 11 is provided with a sound hole 13, and the ASIC chip 3 is located at a side of the sound hole 13.
As shown in fig. 1, in the present embodiment, the MEMS chip 2 and the ASIC chip 3 are electrically connected to the circuit board 1 through wires, respectively. The MEMS chip 2 is directly electrically connected with the circuit board 1 through the lead 5, the ASIC chip 3 is directly electrically connected with the circuit board 1 through the lead 6, the MEMS chip 2 and the ASIC chip 3 are respectively electrically connected with the circuit board 1, the pollution of a sealant 9 for packaging the ASIC chip 3 to the MEMS chip 2 is avoided when the ASIC chip 3 is packaged, and the yield of products is ensured.
Since the gold wire has a high conductivity and good ductility, which is convenient for operation, the wires 5 and 6 in this embodiment are preferably gold wires, and in practical application, aluminum wires may also be used, which is not limited in this embodiment.
As shown in fig. 1, the circuit board 1 in this embodiment is a PCB circuit board, and the MEMS chip 2 is fixedly attached to the circuit board 1 by a fixing adhesive 7; the ASIC chip 3 is fixed and adhered to the circuit board 1 by a fixing glue 8, a sealing glue 9 is encapsulated on the ASIC chip 3, the housing 4 is welded or glued to the circuit board 1, and preferably, the housing 4 is welded to the circuit board 1 by a solder paste 10 in this embodiment.
Example two:
the present embodiment is substantially the same as the first embodiment, and the difference is only that:
as shown in fig. 2, one side of the MEMS chip 2 having the inner cavity is disposed on the circuit board 1, a sound hole 14 is disposed at a position of the circuit board 1 corresponding to the inner cavity of the MEMS chip 2, the mounting groove 15 is located at a side of the sound hole 14, and the ASIC chip 3 is disposed in the mounting groove 15.
Example three:
the present embodiment is substantially the same as the first embodiment, and the difference is only that:
as shown in fig. 3, one side of the MEMS chip 2 having the cavity is disposed on the circuit board 1, the sound hole 12 is disposed at a position of the circuit board 1 corresponding to the cavity of the MEMS chip 2, the mounting groove 16 is disposed on the circuit board 1 and located at a side portion of the MEMS chip 2, and the ASIC chip 3 is disposed in the mounting groove 16.
According to the first embodiment, the second embodiment and the third embodiment, the MEMS packaging structure of the present invention increases the volume of the back cavity of the MEMS packaging structure by providing the mounting groove on the circuit board and disposing the ASIC chip in the mounting groove, thereby improving the signal-to-noise ratio of the MEMS microphone and improving the acoustic performance of the MEMS microphone; the MEMS chip and the ASIC chip are respectively and electrically connected with the circuit board, so that the pollution of sealant for packaging the ASIC chip to the MEMS chip is avoided when the ASIC chip is packaged, and the yield of products is ensured.
Example four:
as shown in fig. 1 to 3, a MEMS microphone has the MEMS package structure described in the first embodiment, the second embodiment, or the third embodiment.
The utility model provides a MEMS microphone is owing to have in embodiment one, embodiment two or embodiment three MEMS packaging structure, consequently, improved MEMS microphone's SNR, improved MEMS microphone's acoustic performance, avoided when to ASIC chip encapsulation for the sealed pollution that glue that encapsulates the ASIC chip led to the fact the MEMS chip has guaranteed the yield of product.
The present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes without the labor of creation from the above conception, which falls within the protection scope of the present invention.
Claims (10)
1. The utility model provides a MEMS packaging structure, includes the circuit board, set up in the circuit board and with MEMS chip and ASIC chip that the circuit board electricity is connected, and set up in be used for on the circuit board right the MEMS chip with the casing that the ASIC chip encapsulated, its characterized in that, be provided with the mounting groove on the circuit board, the ASIC chip set up in the mounting groove, the MEMS chip with the ASIC chip respectively through the wire with the circuit board electricity is connected.
2. The MEMS packaging structure of claim 1, wherein the side of the MEMS chip having the inner cavity is disposed on the circuit board, and the mounting groove is disposed on the circuit board at a position corresponding to the inner cavity of the MEMS chip.
3. The MEMS package structure of claim 2, wherein a bottom of the mounting groove is provided with a sound hole, and the ASIC chip is located at a side of the sound hole.
4. The MEMS packaging structure of claim 2, wherein a sound hole is formed in the circuit board at a position corresponding to the inner cavity of the MEMS chip, and the mounting groove is located at a side portion of the sound hole.
5. The MEMS packaging structure of claim 1, wherein the mounting slot is located at a side of the MEMS chip.
6. The MEMS package structure of any one of claims 1 to 5, wherein the MEMS chip is fixedly attached to the circuit board.
7. The MEMS package structure of claim 6, wherein the ASIC chip is fixedly attached to the circuit board.
8. The MEMS package structure of claim 7, wherein the ASIC chip is packaged with a sealant.
9. The MEMS package structure of claim 6, wherein the housing is soldered or glued to the circuit board.
10. A MEMS microphone having the MEMS package structure of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020583982.2U CN211630387U (en) | 2020-04-17 | 2020-04-17 | MEMS packaging structure and MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020583982.2U CN211630387U (en) | 2020-04-17 | 2020-04-17 | MEMS packaging structure and MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211630387U true CN211630387U (en) | 2020-10-02 |
Family
ID=72622329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020583982.2U Active CN211630387U (en) | 2020-04-17 | 2020-04-17 | MEMS packaging structure and MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211630387U (en) |
-
2020
- 2020-04-17 CN CN202020583982.2U patent/CN211630387U/en active Active
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