CN214544786U - MEMS microphone - Google Patents
MEMS microphone Download PDFInfo
- Publication number
- CN214544786U CN214544786U CN202120877717.XU CN202120877717U CN214544786U CN 214544786 U CN214544786 U CN 214544786U CN 202120877717 U CN202120877717 U CN 202120877717U CN 214544786 U CN214544786 U CN 214544786U
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- printed circuit
- circuit board
- mems
- chip
- mems microphone
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims description 13
- 239000000428 dust Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000003292 glue Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model discloses a MEMS microphone relates to microphone technical field. The MEMS microphone comprises a first printed circuit board, a packaging shell, an MEMS pickup chip, an MEMS positioning chip and an AS IC chip, wherein the first printed circuit board and the packaging shell are enclosed to form a first sound cavity and a second sound cavity which are arranged side by side, and the MEMS pickup chip is arranged on the first printed circuit board and is positioned in the first sound cavity; the MEMS positioning chip is arranged on the first printed circuit board and is positioned in the second sound cavity; the AS IC chip is arranged in the first printed circuit board and is electrically connected with the first printed circuit board; the MEMS pickup chip and the MEMS positioning chip are electrically connected with the AS IC chip respectively. The utility model discloses MEMS microphone has both solved the problem that current MEMS microphone signal to noise ratio is low, has realized MEMS microphone's locate function again.
Description
Technical Field
The utility model relates to a microphone technical field, concretely relates to MEMS microphone.
Background
The signal-to-noise ratio of the MEMS microphone is related to the sizes of the front cavity and the rear cavity of the sound cavity, the larger the volume of the rear cavity is, the higher the signal-to-noise ratio of the MEMS microphone is, the higher the signal-to-noise ratio is, the smaller the noise is, and the better the acoustic performance of the MEMS microphone is.
According to the traditional MEMS microphone, the MEMS pickup chip and the ASIC chip are located in the same sound cavity, so that the volume of the rear cavity of the MEMS microphone is small, the signal-to-noise ratio of the MEMS microphone is reduced, and the traditional MEMS microphone does not have a positioning function.
SUMMERY OF THE UTILITY MODEL
To the above defect that prior art exists, the utility model provides a MEMS microphone, this MEMS microphone had both solved the problem that current MEMS microphone signal to noise ratio is low, had realized MEMS microphone's locate function again.
In order to solve the technical problem, the utility model discloses a technical scheme is:
the MEMS microphone comprises a first printed circuit board, a packaging shell, an MEMS pickup chip, an MEMS positioning chip and an ASIC chip, wherein the first printed circuit board and the packaging shell are enclosed to form a first sound cavity and a second sound cavity which are arranged side by side, and the MEMS pickup chip is arranged on the first printed circuit board and is positioned in the first sound cavity; the MEMS positioning chip is arranged on the first printed circuit board and is positioned in the second sound cavity; the ASIC chip is arranged in the first printed circuit board and is electrically connected with the first printed circuit board; the MEMS pickup chip and the MEMS positioning chip are electrically connected with the ASIC chip respectively.
And a first sound hole is formed in the position, corresponding to the inner cavity of the MEMS pickup chip, of the first printed circuit board.
And a first dustproof net is arranged at the position, corresponding to the first sound hole, on the first printed circuit board.
And a second sound hole is formed in the first printed circuit board at a position corresponding to the inner cavity of the MEMS positioning chip.
And a second dustproof net is arranged at the position, corresponding to the second sound hole, on the first printed circuit board.
The MEMS pickup chip is electrically connected with the ASIC chip through a first lead.
And the MEMS positioning chip is electrically connected with the ASIC chip through a second lead.
The packaging shell is a printed circuit board packaging shell, a bonding pad is arranged on the printed circuit board packaging shell, and the bonding pad is electrically connected with the ASIC chip.
The printed circuit board packaging shell comprises a second printed circuit board, a third printed circuit board and a plurality of fourth printed circuit boards, wherein the fourth printed circuit boards are connected end to form a ring shape, one side of each fourth printed circuit board is vertically arranged on the second printed circuit board, the other side of each fourth printed circuit board is vertically arranged on the first printed circuit board, and the first printed circuit board, the second printed circuit board and each fourth printed circuit board jointly enclose a mounting cavity; the third printed circuit board is arranged in the mounting cavity and divides the mounting cavity into the first sound cavity and the second sound cavity.
The first printed circuit board is provided with a first printed lead electrically connected with the ASIC chip; the bonding pad is positioned on the second printed circuit board, and a second printed lead connected with the bonding pad is arranged on the second printed circuit board; the first and second conductor tracks are electrically connected by a third conductor track on the fourth printed circuit board.
By adopting the technical scheme, the beneficial effects of the utility model are that:
the utility model provides a MEMS microphone, through setting up the ASIC chip in first printed circuit board, set up MEMS pickup chip in first sound intracavity alone, increased the back cavity volume in first sound chamber greatly, improved the SNR of MEMS microphone, improved the acoustics performance of MEMS microphone, solved the problem that current MEMS microphone signal-to-noise ratio is low, make MEMS microphone can carry out high-quality pickup conversation; by arranging the MEMS positioning chip in the second sound cavity, the MEMS microphone can accurately perform product distance positioning and signal output, and the positioning function of the MEMS microphone is realized.
Drawings
Fig. 1 is a schematic structural diagram of an MEMS microphone according to the present invention;
in the figure: a. a first acoustic chamber; b. a second acoustic cavity; 1. a first printed circuit board; 11. a first sound hole; 12. a second sound hole; 2. an MEMS pickup chip; 3. MEMS positioning chip; 4. an ASIC chip; 5. a first conductive line; 6. a second conductive line; 7. a pad; 8. a second printed circuit board; 9. a third printed circuit board; 10. a fourth printed circuit board; 101. a third printed conductor.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
As shown in fig. 1, the MEMS microphone includes a first printed circuit board 1, a package casing, a MEMS pickup chip 2, a MEMS positioning chip 3, and an ASIC chip 4, the first printed circuit board 1 and the package casing enclose a first acoustic cavity a and a second acoustic cavity b that are arranged side by side, the MEMS pickup chip 2 is arranged on the first printed circuit board 1 by fixing glue and is located in the first acoustic cavity a; the MEMS positioning chip 3 is arranged on the first printed circuit board 1 through fixing glue and is positioned in the second sound cavity b; the ASIC chip 4 is arranged in the first printed circuit board 1 in advance and is electrically connected with the first printed circuit board 1; the MEMS pickup chip 2 and the MEMS positioning chip 3 are respectively electrically connected with the ASIC chip 4.
In order to communicate the MEMS microphone chip 2 with the external environment, the present embodiment provides a first sound hole 11 on the first printed circuit board 1 at a position corresponding to the inner cavity of the MEMS microphone chip 2.
In order to prevent external dust from entering the first acoustic cavity a and polluting the MEMS pickup chip 2, the present embodiment provides a first dust screen (not shown) on the first printed circuit board 1 at a position corresponding to the first acoustic hole 11.
In order to communicate the MEMS positioning chip 3 with the external environment, the present embodiment provides a second sound hole 12 on the first printed circuit board 1 at a position corresponding to the inner cavity of the MEMS positioning chip 3.
In order to prevent external dust from entering the second acoustic cavity b and contaminating the MEMS positioning chip 3, the present embodiment provides a second dust-proof screen (not shown) on the first printed circuit board 1 at a position corresponding to the second acoustic hole 12.
The MEMS pickup chip 2 in the embodiment is electrically connected with the ASIC chip 4 through a first lead 5; the MEMS positioning chip 3 is electrically connected to the ASIC chip 4 by a second wire 6.
Specifically, the first and second conductive lines 5 and 6 are electrically connected to the ASIC chip 4 through the first printed circuit board 1, respectively.
Since the gold wire has a high conductivity, good ductility, and is convenient for operation, the first conductive wire 5 and the second conductive wire 6 in this embodiment are preferably gold wires, and in practical application, aluminum wires may also be used, which is not limited in this embodiment.
The packaging shell is used as a protection device, can play a certain role in sealing, moisture protection and external force prevention, and prolongs the service life of the MEMS pickup chip 2 and the MEMS positioning chip 3, the packaging shell in the embodiment is preferably a printed circuit board packaging shell, a bonding pad 7 is arranged on the printed circuit board packaging shell, and the bonding pad 7 is electrically connected with the ASIC chip 4.
Specifically, the printed circuit board packaging shell comprises a second printed circuit board 8, a third printed circuit board 9 and a plurality of fourth printed circuit boards 10, wherein each fourth printed circuit board 10 is welded end to end through solder paste to form a ring shape, one side of each fourth printed circuit board 10 is vertically arranged on the second printed circuit board 8, the other side of each fourth printed circuit board 10 is vertically arranged on the first printed circuit board 1, and the first printed circuit board 1, the second printed circuit board 8 and each fourth printed circuit board 10 jointly form a mounting cavity; the third printed circuit board 9 is arranged in the mounting cavity and divides the mounting cavity into a first acoustic cavity a and a second acoustic cavity b.
The first printed circuit board 1 in the present embodiment is provided with a first printed wiring (not shown in the figure) electrically connected to the ASIC chip 4; the pad 7 is located on a second printed circuit board 8, the second printed circuit board 8 being provided with second conductor tracks (not shown in the figure) connected to the pad 7; a third printed conductor 101 is arranged on the fourth printed circuit board 10; the first and second conductor tracks are electrically connected by a third conductor track 101, in particular the first conductor track is electrically connected to the third conductor track 101 by solder paste, and the third conductor track 101 is electrically connected to the second conductor track by solder paste.
The first printed circuit board 1, the third printed circuit board 9 and the fourth printed circuit board 10 in the present embodiment are soldered by solder paste, respectively; the second printed circuit board 8 is soldered to the third printed circuit board 9 and the fourth printed circuit board 10 by means of solder paste, and the third printed circuit board 9 is soldered to the corresponding fourth printed circuit board 10 by means of solder paste.
In the MEMS microphone in the embodiment, the first sound cavity a and the second sound cavity b are formed by welding and are horizontally arranged side by side, so that the manufacturing cost is saved, the volume of the MEMS microphone can be reduced, and the requirement of miniaturization development of products is met; the ASIC chip 4 is arranged in the first printed circuit board 1 in advance, and the MEMS pickup chip 2 is arranged in the first sound cavity a independently, so that the volume of the back cavity of the first sound cavity a is greatly increased, the signal-to-noise ratio of the MEMS microphone is improved, the acoustic performance of the MEMS microphone is improved, the problem of low signal-to-noise ratio of the existing MEMS microphone is solved, and the MEMS microphone can carry out high-quality pickup conversation; through set up MEMS positioning chip 3 in second sound chamber b for the MEMS microphone can be accurate carry out product distance location and signal output, has realized the locate function of MEMS microphone.
The present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes without the labor of creation from the above conception, which falls within the protection scope of the present invention.
Claims (10)
- The MEMS microphone is characterized by comprising a first printed circuit board, a packaging shell, an MEMS pickup chip, an MEMS positioning chip and an ASIC chip,the first printed circuit board and the packaging shell are enclosed to form a first sound cavity and a second sound cavity which are arranged side by side, and the MEMS pickup chip is arranged on the first printed circuit board and is positioned in the first sound cavity; the MEMS positioning chip is arranged on the first printed circuit board and is positioned in the second sound cavity; the ASIC chip is arranged in the first printed circuit board and is electrically connected with the first printed circuit board; the MEMS pickup chip and the MEMS positioning chip are electrically connected with the ASIC chip respectively.
- 2. The MEMS microphone of claim 1, wherein the first printed circuit board is provided with a first sound hole at a position corresponding to the inner cavity of the MEMS pickup chip.
- 3. The MEMS microphone of claim 2, wherein a first dust screen is disposed on the first printed circuit board at a location corresponding to the first acoustic aperture.
- 4. The MEMS microphone of claim 1, wherein a second sound hole is disposed on the first printed circuit board at a position corresponding to the inner cavity of the MEMS positioning chip.
- 5. The MEMS microphone of claim 4, wherein a second dust screen is disposed on the first printed circuit board at a position corresponding to the second sound hole.
- 6. The MEMS microphone of claim 1, wherein the MEMS pickup chip is electrically connected to the ASIC chip by a first wire.
- 7. The MEMS microphone of claim 1, wherein the MEMS positioning chip is electrically connected to the ASIC chip by a second wire.
- 8. The MEMS microphone of any one of claims 1 to 7, wherein the package is a printed circuit board package having a pad disposed thereon, the pad being electrically connected to the ASIC chip.
- 9. The MEMS microphone of claim 8, wherein the pcb package comprises a second pcb, a third pcb, and a plurality of fourth pcbs, each of the fourth pcbs being connected end-to-end in a ring shape, and each of the fourth pcbs having one side thereof vertically disposed on the second pcb and the other side thereof vertically disposed on the first pcb, the second pcb, and each of the fourth pcbs collectively defining a mounting cavity; the third printed circuit board is arranged in the mounting cavity and divides the mounting cavity into the first sound cavity and the second sound cavity.
- 10. The MEMS microphone of claim 9, wherein the first printed circuit board has a first printed wire disposed thereon that is electrically connected to the ASIC chip; the bonding pad is positioned on the second printed circuit board, and a second printed lead connected with the bonding pad is arranged on the second printed circuit board; the first and second conductor tracks are electrically connected by a third conductor track on the fourth printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120877717.XU CN214544786U (en) | 2021-04-26 | 2021-04-26 | MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120877717.XU CN214544786U (en) | 2021-04-26 | 2021-04-26 | MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214544786U true CN214544786U (en) | 2021-10-29 |
Family
ID=78276986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120877717.XU Active CN214544786U (en) | 2021-04-26 | 2021-04-26 | MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214544786U (en) |
-
2021
- 2021-04-26 CN CN202120877717.XU patent/CN214544786U/en active Active
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