CN218416675U

CN218416675U - Combined sensor

Info

Publication number: CN218416675U
Application number: CN202222788550.7U
Authority: CN
Inventors: 孙延娥; 闫文明
Original assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Current assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Priority date: 2022-10-21
Filing date: 2022-10-21
Publication date: 2023-01-31
Anticipated expiration: 2032-10-21

Abstract

The utility model discloses a combined sensor, which comprises a first substrate, an outer shell, an inner shell, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip and a pressure ASIC chip, wherein the outer shell and the first substrate form a holding cavity in a surrounding way; an outer sound through hole is formed in the first substrate, and the microphone MEMS chip is arranged on the first substrate of the first accommodating cavity corresponding to the outer sound through hole; the inner shell is provided with an inner sound through hole which is communicated with the first accommodating cavity and the second accommodating cavity, and the pressure MEMS chip is arranged on the first substrate in the second accommodating cavity; the microphone ASIC chip and the pressure MEMS chip are arranged up and down, and the microphone ASIC chip is arranged on the inner shell and is positioned in the first accommodating cavity; the microphone ASIC chip is electrically connected with the microphone MEMS chip and the first substrate respectively; the pressure ASIC chip is electrically connected with the pressure MEMS chip and the first substrate respectively. The utility model discloses combination sensor has reduced the volume, has solved the big problem of occupation space.

Description

Combined sensor

Technical Field

The utility model relates to a chip package technical field, concretely relates to combined sensor.

Background

At present, a microphone and a pressure sensor become standard fittings of partial electronic products, and in order to meet the design requirement of miniaturization of the electronic products, development of a combined sensor integrating the microphone and the pressure sensor becomes a market trend.

However, the existing combined sensor adopts a tiled structure, and the volume of the combined sensor is large, so that the occupied space is large, and the design requirement of miniaturization of electronic products cannot be met.

SUMMERY OF THE UTILITY MODEL

To the above defect that prior art exists, the utility model provides a combination sensor, this combination sensor has reduced the volume, has solved the big problem of occupation space.

In order to solve the technical problem, the utility model discloses a technical scheme be:

the combined sensor comprises a first substrate, an outer shell, an inner shell, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip and a pressure ASIC chip, wherein the outer shell is arranged on the first substrate and forms an accommodating cavity with the first substrate; the first substrate is provided with an external sound through hole for communicating the first accommodating cavity with the outside, and the microphone MEMS chip is arranged on the first substrate in the first accommodating cavity corresponding to the external sound through hole; the inner shell is provided with an inner sound through hole which is communicated with the first accommodating cavity and the second accommodating cavity, and the pressure MEMS chip is arranged on the first substrate in the second accommodating cavity; the microphone ASIC chip and the pressure MEMS chip are arranged up and down, and the microphone ASIC chip is arranged on the inner shell and is positioned in the first accommodating cavity; the microphone ASIC chip is electrically connected with the microphone MEMS chip and the first substrate respectively; the pressure ASIC chip is electrically connected with the pressure MEMS chip and the first substrate respectively.

The inner shell is made of a second substrate, the microphone ASIC chip is electrically connected with the inner shell through a first lead, and the inner shell is electrically connected with the first substrate.

The inner shell is fixed on the first substrate through a conductive connecting agent, and the inner shell is electrically connected with the first substrate through the conductive connecting agent.

The conductive connecting agent is tin paste or silver paste.

The inner shell is an insulator, and the microphone ASIC chip is electrically connected with the first substrate through a first lead.

The outer shell, the inner shell, the microphone MEMS chip, the microphone ASIC chip and the pressure MEMS chip are fixed through insulating glue respectively.

Wherein the microphone MEMS chip is electrically connected with the microphone ASIC chip through a second wire.

The pressure MEMS chip is electrically connected with the first substrate through a third lead, and the first substrate is electrically connected with the pressure ASIC chip.

Wherein, outer sound through hole and interior sound through hole all include a through-hole at least.

And the outer sound through hole and the inner sound through hole are respectively provided with a dustproof structure.

By adopting the technical scheme, the beneficial effects of the utility model are that:

the utility model discloses combination sensor has increased the inner shell in prior art relatively to with pressure ASIC chip pre-buried in first base plate, the setting up of inner shell provides the installation basis for the upper and lower layering installation of microphone ASIC chip and pressure MEMS chip, combines the pre-buried design of pressure ASIC chip simultaneously, very big reduction combination sensor's volume, solved the big problem of its occupation space, satisfied the miniaturized designing requirement of electronic product.

Drawings

Fig. 1 is a schematic structural diagram of a first embodiment of the combined sensor of the present invention;

FIG. 2 is a schematic structural diagram of a second embodiment of the combined sensor of the present invention;

in the figure: 1. a first substrate; 11. an outer sound hole; 2. a housing; 3. an inner shell; 31. an inner sound hole; 4. a microphone MEMS chip; 5. a microphone ASIC chip; 6. a pressure MEMS chip; 7. a pressure ASIC chip; 8. a first accommodating cavity; 9. a second accommodating cavity; 10. a first conductive line; 12. a second conductive line; 13. and a third conductive line.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

The first embodiment is as follows:

as shown in fig. 1, the combination sensor includes a first substrate 1, an outer shell 2 disposed on the first substrate 1 and enclosing with the first substrate 1 to form an accommodating cavity, an inner shell 3, a microphone MEMS chip 4, a microphone ASIC chip 5, a pressure MEMS chip 6, and a pressure ASIC chip 7 pre-embedded in the first substrate 1.

The inner shell 3 is fixedly arranged on the first substrate 1 in the accommodating cavity and divides the accommodating cavity into a first accommodating cavity 8 and a second accommodating cavity 9; an external sound through hole 11 for communicating the first accommodating cavity 8 with the outside is formed in the first substrate 1, and the microphone MEMS chip 4 is arranged on the first substrate 1 in the first accommodating cavity 8 corresponding to the external sound through hole 11; an inner sound through hole 31 for communicating the first accommodating cavity 8 and the second accommodating cavity 9 is formed in the inner shell 3, and the pressure MEMS chip 6 is arranged on the first substrate 1 in the second accommodating cavity 9; the microphone ASIC chip 5 and the pressure MEMS chip 6 are arranged up and down, and the microphone ASIC chip 5 is arranged at the upper part of the inner shell 1 and is positioned in the first accommodating cavity 8; the microphone ASIC chip 5 is respectively electrically connected with the microphone MEMS chip 4 and the first substrate 1; the pressure ASIC chip 7 is electrically connected to the pressure MEMS chip 6 and the first substrate 1, respectively.

The inner housing 3 in this embodiment is made of a second substrate, the microphone ASIC chip 5 is electrically connected to the inner housing 3 through a first wire 10, and the inner housing 3 is electrically connected to the first substrate 1.

Specifically, the first substrate 1 and the second substrate adopt resin substrates or ceramic substrates, so that wiring design is facilitated; the inner case 3 is fixed on the first substrate 1 by a conductive connecting agent, and the inner case 3 is electrically connected to the first substrate 1 by the conductive connecting agent, preferably, the conductive connecting agent is solder paste or silver paste.

The housing 2, the microphone MEMS chip 4, the microphone ASIC chip 5, and the pressure MEMS chip 6 in this embodiment are fixed by insulating paste, respectively.

Since the DAF film is a key material commonly used in the chip packaging process, the adhesive in the present embodiment is preferably an insulating DAF film.

The microphone MEMS chip 4 in this embodiment is electrically connected to the microphone ASIC chip 5 through a second wire 12; the pressure MEMS chip 6 is electrically connected to the first substrate 1 through the third wire 13, and the first substrate 1 is electrically connected to the pressure ASIC chip 7, that is, the pressure MEMS chip 6 is electrically connected to the pressure ASIC chip 7 through the third wire 13 and a part of internal circuits of the first substrate 1, and meanwhile, the pressure ASIC chip 7 is also electrically connected to another part of internal circuits of the first substrate 1.

The gold wires have high conductivity and good ductility, so that the first, second and

third wires

10, 12 and 13 are preferably gold wires.

In this embodiment, the outer sound hole 11 and the inner sound hole 31 both include one through hole, and in practical application, the outer sound hole 11 and the inner sound hole 31 may also adopt a structural form in which a plurality of through holes are combined, which is specifically selected according to actual requirements, which is not limited in this embodiment.

In order to prevent external dust from entering the microphone MEMS chip 4 and the pressure MEMS chip 6, the present embodiment provides a dustproof structure at both the outer sound through hole 11 and the inner sound through hole 31, specifically, the dustproof structure is a dustproof mesh (not shown in the figure).

The second embodiment:

the present embodiment is substantially the same as the first embodiment, and the difference is only that:

as shown in fig. 2, the inner case 3 in this embodiment is an insulator, and the microphone ASIC chip 5 is electrically connected to the first substrate 1 through a first wire 10.

And the outer shell 2, the inner shell 3, the microphone MEMS chip 4, the microphone ASIC chip 5 and the pressure MEMS chip 6 in this embodiment are fixed by insulating glue, respectively.

Above are two embodiments of the combined sensor of the present invention, and further more embodiments are not described herein.

According to the above two embodiments, the utility model discloses combined sensor has increased inner shell 3 compared in prior art to with pressure ASI chip 7 pre-buried in first base plate 1, inner shell 3 set up to provide the installation basis for the upper and lower layering installation of microphone ASIC chip 5 and pressure MEMS chip 6, combine pressure ASIC chip 7's pre-buried design simultaneously, very big reduction combined sensor's volume, solved the big problem of its occupation space, satisfied the miniaturized design requirement of electronic product.

The present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes without creative efforts from the above conception, and all of them fall within the protection scope of the present invention.

Claims

1. The combined sensor is characterized by comprising a first substrate, an outer shell which is arranged on the first substrate and forms an accommodating cavity with the first substrate in a surrounding way, an inner shell, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip and a pressure ASIC chip which is pre-embedded in the first substrate,

the inner shell is fixedly arranged on the first substrate in the accommodating cavity and divides the accommodating cavity into a first accommodating cavity and a second accommodating cavity; the first substrate is provided with an external sound through hole for communicating the first accommodating cavity with the outside, and the microphone MEMS chip is arranged on the first substrate in the first accommodating cavity corresponding to the external sound through hole; the inner shell is provided with an inner sound through hole which is communicated with the first accommodating cavity and the second accommodating cavity, and the pressure MEMS chip is arranged on the first substrate in the second accommodating cavity; the microphone ASIC chip and the pressure MEMS chip are arranged up and down, and the microphone ASIC chip is arranged on the inner shell and is positioned in the first accommodating cavity;

the microphone ASIC chip is electrically connected with the microphone MEMS chip and the first substrate respectively; the pressure ASIC chip is electrically connected with the pressure MEMS chip and the first substrate respectively.

2. The combination sensor of claim 1, wherein the inner housing is fabricated from a second substrate, the microphone ASIC chip being electrically connected to the inner housing by a first wire, the inner housing being electrically connected to the first substrate.

3. A combination sensor according to claim 2, wherein the inner housing is secured to the first substrate by a conductive bonding agent, and the inner housing is electrically connected to the first substrate by the conductive bonding agent.

4. A combination sensor according to claim 3, wherein the conductive connector is a solder paste or silver paste.

5. The combination sensor of claim 1, wherein the inner housing is an insulator and the microphone ASIC chip is electrically connected to the first substrate by a first wire.

6. The combination sensor of claim 5, wherein the outer housing, the inner housing, the microphone MEMS chip, the microphone ASIC chip, and the pressure MEMS chip are each secured by an insulating adhesive.

7. The combination sensor of claim 1, wherein the microphone MEMS chip is electrically connected to the microphone ASIC chip by a second wire.

8. The combination sensor of claim 1, wherein the pressure MEMS die is electrically connected to the first substrate by a third conductive line, the first substrate being electrically connected to the pressure ASIC die.

9. The combination sensor of claim 1, wherein the outer sound passage hole and the inner sound passage hole each comprise at least one through hole.

10. The combination sensor of claim 9, wherein the outer sound hole and the inner sound hole are respectively provided with a dust-proof structure.