CN217985409U

CN217985409U - Combined sensor

Info

Publication number: CN217985409U
Application number: CN202221639975.5U
Authority: CN
Inventors: 孙延娥; 闫文明
Original assignee: Weifang Goertek Microelectronics Co Ltd
Current assignee: Weifang Goertek Microelectronics Co Ltd
Priority date: 2022-06-28
Filing date: 2022-06-28
Publication date: 2022-12-06
Anticipated expiration: 2032-06-28

Abstract

The utility model discloses a combined sensor relates to chip package technical field. The combined sensor comprises a circuit board, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip and a pressure ASIC chip, wherein the microphone ASIC chip, the pressure MEMS chip and the pressure ASIC chip are stacked to form a stacked structure, the microphone MEMS chip and the stacked structure are arranged on the circuit board side by side, the microphone MEMS chip is electrically connected with the microphone ASIC chip, and the microphone ASIC chip is electrically connected with the circuit board; the pressure MEMS chip is electrically connected with the pressure ASIC chip, and the pressure ASIC chip is electrically connected with the circuit board. The utility model discloses combination sensor has reduced the volume, has solved the big problem of occupation space.

Description

Combined sensor

Technical Field

The utility model relates to a chip package technical field, concretely relates to combined sensor.

Background

At present, a microphone and a pressure sensor become standard fittings of partial electronic products, and in order to meet the design requirements of light, thin, short and small electronic products, development of a combined sensor integrating the microphone and the pressure sensor becomes a market trend.

However, the existing combined sensor adopts a flat structure, has a large volume, and cannot meet the design requirements of light, thin, short and small electronic products.

SUMMERY OF THE UTILITY MODEL

To the above defect that prior art exists, the utility model provides a combination sensor, this combination sensor has reduced the volume, has solved the big problem of occupation space.

In order to solve the technical problem, the utility model discloses a technical scheme be:

the combined sensor comprises a circuit board, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip and a pressure ASIC chip, wherein the microphone ASIC chip, the pressure MEMS chip and the pressure ASIC chip are stacked to form a stacked structure, the microphone MEMS chip and the stacked structure are arranged on the circuit board side by side, the microphone MEMS chip is electrically connected with the microphone ASIC chip, and the microphone ASIC chip is electrically connected with the circuit board; the pressure MEMS chip is electrically connected with the pressure ASIC chip, and the pressure ASIC chip is electrically connected with the circuit board.

Wherein a silicon stage is provided on the circuit board, and the microphone ASIC chip, the pressure MEMS chip, and the pressure ASIC chip are stacked on the silicon stage.

The silicon platform is provided with a mounting groove matched with the pressure ASIC chip, and the pressure ASIC chip is mounted in the mounting groove and the upper surface of the pressure ASIC chip is flush with the upper surface of the silicon platform.

Wherein the pressure MEMS chip is stacked on the pressure ASIC chip.

Wherein the microphone ASIC chip is stacked on the pressure ASIC chip or/and on the silicon stage.

And the circuit board is provided with a sound hole matched with the microphone MEMS chip at a position corresponding to the microphone MEMS chip.

The microphone MEMS chip, the microphone ASIC chip, the pressure MEMS chip and the pressure ASIC chip are all fixed through adhesives.

Wherein the adhesive is a DAF film.

The microphone MEMS chip and the microphone ASIC chip, the microphone ASIC chip and the circuit board, the pressure MEMS chip and the pressure ASIC chip and the circuit board are electrically connected through conducting wires.

The circuit board is provided with a packaging shell, and the microphone MEMS chip, the microphone ASIC chip, the pressure MEMS chip and the pressure ASIC chip are packaged in a space enclosed by the circuit board and the packaging shell.

By adopting the technical scheme, the beneficial effects of the utility model are that:

the utility model provides a combined sensor owing to rationally and ingeniously has carried out microphone ASIC chip, pressure MEMS chip and pressure ASIC chip and has piled up the setting, consequently, compares in the structural style of tiling, has dwindled combined sensor's volume greatly, has solved the big problem of its occupation space, has satisfied that electronic product is light, thin, short, little designing requirement.

Drawings

FIG. 1 is a schematic structural diagram of the combined sensor of the present invention;

FIG. 2 is a cross-sectional view of FIG. 1;

in the figure: 1. a circuit board; 2. a microphone MEMS chip; 3. a microphone ASIC chip; 4. a pressure MEMS chip; 5. a pressure ASIC chip; 6. a silicon platform; 7. and a wire.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

As shown in fig. 1 and fig. 2 together, the combination sensor comprises a circuit board 1, a microphone MEMS chip 2, a microphone ASIC chip 3, a pressure MEMS chip 4 and a pressure ASIC chip 5, wherein the microphone ASIC chip 3, the pressure MEMS chip 4 and the pressure ASIC chip 5 are stacked to form a stacked structure, the microphone MEMS chip 2 and the stacked structure are arranged side by side on the circuit board 1, the microphone MEMS chip 2 is electrically connected with the microphone ASIC chip 3, and the microphone ASIC chip 3 is electrically connected with the circuit board 1; the pressure MEMS chip 4 is electrically connected with the pressure ASIC chip 5, and the pressure ASIC chip 5 is electrically connected with the circuit board 1. The microphone ASIC chip 3, the pressure MEMS chip 4 and the pressure ASIC chip 5 are stacked, so that the volume of the combined sensor is greatly reduced, and the problem of large occupied space is solved.

In the present embodiment, the circuit board 1 is provided with a silicon stage 6, and the microphone ASIC chip 3, the pressure MEMS chip 4, and the pressure ASIC chip 5 are stacked on the silicon stage 6. Because the thermal expansion coefficient of the silicon platform 6 is close to that of the chip, the silicon platform 6 is arranged, so that the performance and the quality of the chip cannot be influenced by the difference of the thermal expansion coefficients between the chip and the silicon platform 6.

Specifically, the silicon stage 6 is provided with a mounting groove adapted to the pressure ASIC chip 5, the pressure ASIC chip 5 is mounted in the mounting groove and the upper surface of the pressure ASIC chip 5 is flush with the upper surface of the silicon stage. With this structure, the volume of the combination sensor is further reduced.

In order to avoid a gap between the pressure ASIC chip 5 and the silicon table 6 and ensure that the upper surface of the pressure ASIC chip 5 and the upper surface of the silicon table 6 are on the same plane, the pressure ASIC chip 5 is bonded on the silicon table 6 by an easily controllable adhesive in the present embodiment.

The pressure MEMS chip 4 in the present embodiment is also stacked on the pressure ASIC chip 5 by an adhesive; the microphone ASIC chip 3 is also stacked on the pressure ASIC chip 5 and on the silicon stage 6 by an adhesive.

In practical applications, if the area of the pressure ASIC chip 5 or the silicon platform 6 is large enough, the microphone ASIC chip 3 may also be stacked on the pressure ASIC chip 5 or the silicon platform 6 by using an adhesive, which is selected according to practical requirements, and this embodiment is not limited thereto.

In this embodiment, the microphone MEMS chip 2 is adhered to the circuit board 1 by an adhesive, and a sound hole matched with the microphone MEMS chip 2 is disposed at a position of the circuit board 1 corresponding to the microphone MEMS chip 2.

In order to prevent external dust from entering the microphone MEMS chip 2, the present embodiment provides a dust-proof net (not shown in the figure) at the sound hole.

Since the DAF film is a key material commonly used in the chip packaging process, the adhesive used for bonding the microphone MEMS chip 2, the microphone ASIC chip 3, the pressure MEMS chip 4, and the pressure ASIC chip 5 in this embodiment is the DAF film.

In this embodiment, the microphone MEMS chip 2 and the microphone ASIC chip 3, the microphone ASIC chip 3 and the circuit board 1, the pressure MEMS chip 4 and the pressure ASIC chip 5, and the pressure ASIC chip 5 and the circuit board 1 are electrically connected by a wire 7.

The wire 7 in this embodiment is preferably a gold wire because of its high conductivity, good ductility and easy operation.

The circuit board 1 in this embodiment is further provided with a packaging case (not shown in the figure), and the microphone MEMS chip 2, the microphone ASIC chip 3, the pressure MEMS chip 4, the pressure ASIC chip 5, the silicon platform 6 and the wire 7 are packaged in a space surrounded by the circuit board 1 and the packaging case.

The utility model discloses composite sensor's structure has been introduced in detail above, the utility model discloses composite sensor has carried out microphone ASIC chip, pressure MEMS chip and pressure ASIC chip through rationally and ingeniously and has piled up the setting, compares in the structural style that tiles, has reduced composite sensor's volume greatly, has solved the big problem of its occupation space, has satisfied that the electronic product is light, thin, short, little designing requirement.

The present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes without creative efforts from the above conception, and all of them fall within the protection scope of the present invention.

Claims

1. The combined sensor comprises a circuit board, a microphone MEMS chip, a microphone ASIC chip, a pressure MEMS chip and a pressure ASIC chip, and is characterized in that the microphone ASIC chip, the pressure MEMS chip and the pressure ASIC chip are stacked to form a stacked structure, the microphone MEMS chip and the stacked structure are arranged on the circuit board side by side, the microphone MEMS chip is electrically connected with the microphone ASIC chip, and the microphone ASIC chip is electrically connected with the circuit board; the pressure MEMS chip is electrically connected with the pressure ASIC chip, and the pressure ASIC chip is electrically connected with the circuit board.

2. The combination sensor of claim 1, wherein the circuit board has a silicon platform disposed thereon, the microphone ASIC chip, the pressure MEMS chip, and the pressure ASIC chip being stacked on the silicon platform.

3. The combination sensor of claim 2, wherein the silicon stage is provided with a mounting slot that fits the pressure ASIC chip, the pressure ASIC chip being mounted in the mounting slot with an upper surface of the pressure ASIC chip flush with an upper surface of the silicon stage.

4. The combination sensor of claim 3, wherein the pressure MEMS chip is stacked on the pressure ASIC chip.

5. A combination sensor according to claim 3, wherein the microphone ASIC chip is stacked on the pressure ASIC chip or/and on the silicon bench.

6. The combination sensor of claim 1, wherein the circuit board is provided with a sound hole corresponding to the microphone MEMS chip, and the sound hole is matched with the microphone MEMS chip.

7. The combination sensor of claim 1, wherein the microphone MEMS die, microphone ASIC die, pressure MEMS die, and pressure ASIC die are secured by an adhesive.

8. The combination sensor of claim 7, wherein the adhesive is a DAF film.

9. The combination sensor of claim 1, wherein the microphone MEMS die and the microphone ASIC die, the microphone ASIC die and the circuit board, the pressure MEMS die and the pressure ASIC die, and the pressure ASIC die and the circuit board are electrically connected by wires.

10. The combination sensor of claim 1, wherein the circuit board has a package disposed thereon, and the microphone MEMS die, the microphone ASIC die, the pressure MEMS die, and the pressure ASIC die are packaged in a space enclosed by the circuit board and the package.