CN211507899U

CN211507899U - Multilayer structure array antenna

Info

Publication number: CN211507899U
Application number: CN202020503035.8U
Authority: CN
Inventors: 许志涛
Original assignee: CETC 54 Research Institute
Current assignee: CETC 54 Research Institute
Priority date: 2020-04-08
Filing date: 2020-04-08
Publication date: 2020-09-15
Anticipated expiration: 2030-04-08

Abstract

The utility model discloses a multilayer structure array antenna belongs to antenna technical field. The feed network substrate comprises a surface substrate, a middle substrate, a bottom substrate and a feed network substrate which are arranged from top to bottom; the whole array antenna is divided into a plurality of antenna units, a hollow-out groove is formed in a middle substrate in each antenna unit, an upper radiation patch and a lower radiation patch are respectively arranged on the upper surfaces of a surface substrate and a bottom substrate at positions corresponding to the hollow-out grooves, a metal stratum is arranged on the lower surface of the bottom substrate, an active power division network is arranged on a feed network substrate, and a first metallization through hole for feeding penetrates through the bottom substrate and the feed network substrate. The utility model has the advantages of excellent electrical performance, high integration degree, low profile, simple and convenient processing flow, simple design, convenient use and the like.

Description

Multilayer structure array antenna

Technical Field

The utility model relates to an antenna technology field, concretely relates to multilayer structure array antenna.

Background

In recent years, rapid development of wireless communication technology has put increasing demands on antennas. For example, the antenna is required to have the characteristics of high gain, small volume, low profile, wide bandwidth, high directivity and the like, and a single antenna is generally difficult to meet the requirements, so that an array antenna needs to be adopted. The array antenna has wide application in the fields of radar, communication, navigation, measurement and control and the like.

Microstrip patch antennas have the advantages of compact structure, light weight, low cost, easy integration and the like, and are increasingly applied to the design of array antennas. However, as the cross-sectional size of the patch antenna decreases, the antenna performance (e.g., relative bandwidth) is affected.

Therefore, it is necessary to optimize the antenna profile height and the antenna performance, and reduce the antenna profile height as much as possible while ensuring the antenna performance.

SUMMERY OF THE UTILITY MODEL

The weak point to prior art, the utility model provides a multilayer structure array antenna, this antenna structure is simple, the functional, the processing of being convenient for.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a multilayer structure array antenna comprises a surface substrate, a middle substrate, a bottom substrate and a feed network substrate which are arranged from top to bottom; the whole array antenna is divided into a plurality of antenna units, a hollow-out groove is formed in a middle substrate in each antenna unit, an upper radiation patch and a lower radiation patch are respectively arranged on the upper surfaces of a surface substrate and a bottom substrate at positions corresponding to the hollow-out grooves, a metal stratum is arranged on the lower surface of the bottom substrate, an active power division network is arranged on a feed network substrate, and a first metallization through hole for feeding penetrates through the bottom substrate and the feed network substrate.

Furthermore, the antenna units are separated by a second metalized through hole penetrating through the surface layer substrate and the middle layer substrate.

Further, the power distribution network is a multi-stage Wilkinson power divider.

Furthermore, the first metalized through hole is located on the side face of the lower-layer radiation patch, and the top of the first metalized through hole is connected with the lower-layer radiation patch through a metal strip.

Furthermore, the upper layer radiation patch and the lower layer radiation patch are squares with the side length of 2.0 mm-5.0 mm, and the hollow groove is a square with the side length of less than 10 mm.

The utility model discloses an adopt above-mentioned technical scheme and the beneficial effect who gains does:

1. the utility model discloses array antenna simple structure, the processing of being convenient for.

2. The utility model discloses array antenna is equipped with the fretwork groove on middle base plate to make and form the air bed between upper radiation paster and the lower floor radiation paster, thereby extend the work bandwidth of antenna.

3. Further, the utility model discloses a metallized through-hole separates the antenna element, can effectively improve the cross coupling between the array element, improves the active standing wave of each port of array antenna.

4. Further, the utility model discloses with the side of first metallization through-hole setting at lower floor's radiation paster, can vacate the space of antenna element bottom, be convenient for lay electrical components in antenna element's bottom.

Drawings

Fig. 1 is a schematic structural diagram of an array antenna according to an embodiment of the present invention.

Fig. 2 is a schematic cross-sectional view of a single antenna element of fig. 1.

Fig. 3 is a schematic structural diagram of a feed network in an embodiment of the present invention.

Fig. 4 is a schematic diagram of a lamination process of the array antenna according to an embodiment of the present invention.

Fig. 5 is a graph showing simulation curves of standing waves at the port of the antenna unit according to the embodiment of the present invention.

Fig. 6 is a graph showing simulation curves of the gain of the array antenna according to the embodiment of the present invention.

Detailed Description

The present invention will be further described with reference to the accompanying drawings.

The array antenna comprises a plurality of antenna units, wherein the antenna units are arranged according to a designated unit interval, and each antenna unit comprises a surface layer dielectric substrate, a middle layer dielectric substrate, a bottom layer dielectric substrate and a feed layer dielectric substrate. The upper surface of the surface layer medium substrate is provided with a metal patch, and the lower surface of the surface layer medium substrate is exposed out of the substrate and is free of copper cladding; the upper surface and the lower surface of the middle medium substrate are exposed out of the substrate without covering copper, and the middle part of the middle medium plate is hollowed; the upper surface of the bottom layer medium substrate is provided with a metal patch, and the lower surface of the bottom layer medium substrate is provided with a metal floor; a feed network is arranged on the feed layer dielectric substrate; and metalized through holes for feeding are also arranged on the bottom layer dielectric substrate and the feeding layer dielectric substrate.

Furthermore, the surface layer dielectric substrate is made of TSM-DS3M, the thickness is 1.0 mm-1.5 mm, and the size of the square metal patch on the upper surface is 2.0 mm-5.0 mm.

The middle layer dielectric substrate is made of TSM-DS3M, the thickness is 1.0 mm-1.5 mm, the square hollow size is smaller than 10mm, and copper-clad designs are not arranged on two sides of the dielectric substrate. The middle cavity design can effectively improve the bandwidth of the antenna.

The bottom layer dielectric substrate is made of TSM-DS3M, the thickness is 0.1 mm-0.5 mm, the size of the square patch on the upper surface is 2.0 mm-5.0 mm, the lower surface is designed to be fully coated with copper, but the copper is separated from the metalized hole through a non-metalized ring, so that a coaxial feed structure is formed.

Furthermore, the metallized through holes are formed in the periphery of the antenna unit, so that mutual coupling between array elements can be effectively improved, and active standing waves of all ports of the array antenna are improved. The metalized through hole penetrates through the surface layer dielectric substrate and the middle layer dielectric substrate, and can also penetrate through the bottom layer dielectric substrate if the circuit of the feeding layer at the bottom is not influenced.

Furthermore, the feed through hole is located on the side face of the lower-layer radiation patch, and the top of the feed through hole is connected with the lower-layer radiation patch through a metal strip.

The feed network can be in a micro-strip form or a strip line form. If the microstrip mode is adopted, the feed network is a layer of dielectric substrate, and if the strip line mode is adopted, the feed network is a layer of dielectric substrate and a buried resistance process. The dielectric substrate is made of TSM-DS3M and has a thickness of 0.1 mm-0.3 mm. In order to improve the isolation between the array element antennas, the feed network can be realized by a Wilkinson power divider.

Fig. 1 shows a 4 × 4-scale array antenna, which includes a plurality of array element antennas with the same structure, each antenna has a three-layer structure, and a surface dielectric substrate, a middle dielectric substrate, and a bottom dielectric substrate are sequentially arranged from top to bottom. In order to expand the working bandwidth of the antenna, a double-layer radiation metal patch design is adopted, and a middle-layer medium substrate is adopted between the metal patches to form air. By the method, the implementation of the multilayer printed board process can be facilitated.

The size of the double-layer radiating patch can be designed according to the working frequency band of the antenna, specifically, the thickness of the surface layer dielectric substrate can be 1.016mm by selecting TSM-DS3M, the size of the upper layer radiating patch is 4.66mm, the thickness of the middle layer dielectric substrate is 1.016mm by selecting TSM-DS3M, the thickness of the bottom layer dielectric substrate is 0.508mm by selecting TSM-DS3M, and the size of the lower layer radiating patch is 4.44 mm. The antenna feed port adopts a coaxial feed mode, the diameter of the metalized through hole in the coaxial feed structure is 0.3mm, the lower surface of the bottom layer dielectric substrate is provided with a non-metalized ring surrounding the feed metalized through hole, and the outer diameter of the non-metalized ring is 1.3 mm.

As shown in fig. 3, the feed network in this example is in the form of a one-to-two wilkinson power divider, and the sum path output port is a surface-mounted SMP interface.

As shown in fig. 4, the array antenna may be manufactured by two times of pressing, where the first pressing completes the pressing and the metalized drilling of the antenna surface substrate and the middle substrate, and completes the pressing and the metalized drilling of the antenna bottom substrate and the feed network layer substrate at the same time. And then, carrying out second pressing on the two pressed plates obtained by the first pressing to obtain a final printed board.

Fig. 5 shows a simulation curve of the port standing wave of the antenna unit, which has good standing wave characteristics in a wide frequency band. Fig. 6 shows a simulation curve of the gain of the 4 × 4 array, which has good gain performance.

The utility model discloses array antenna is arranged according to specific interval by the antenna element, and every antenna array element comprises three-layer dielectric substrate, middle level dielectric substrate middle part fretwork vacuole formation, and the feed network can adopt microstrip transmission line form. The utility model discloses an overall structure adopts multilayer printing board processing technology to realize, through twice pressfitting, reduces printing board drilling technology complexity. In addition, the metalized through holes are arranged among the array elements, so that the effect of improving the isolation among the array elements is achieved. In a word, the utility model has the advantages of electric property is good, integrate the degree height, the section is low, the process flow is simple and convenient, the design is simple, convenient to use, is an important improvement to prior art.

Claims

1. The multilayer structure array antenna is characterized by comprising a surface substrate, a middle substrate, a bottom substrate and a feed network substrate which are arranged from top to bottom; the whole array antenna is divided into a plurality of antenna units, a hollow-out groove is formed in a middle substrate in each antenna unit, an upper radiation patch and a lower radiation patch are respectively arranged on the upper surfaces of a surface substrate and a bottom substrate at positions corresponding to the hollow-out grooves, a metal stratum is arranged on the lower surface of the bottom substrate, an active power division network is arranged on a feed network substrate, and a first metallization through hole for feeding penetrates through the bottom substrate and the feed network substrate.

2. The multi-layered structure array antenna as claimed in claim 1, wherein the antenna elements are separated by a second metallized via penetrating the surface substrate and the middle substrate.

3. The multi-layered structure array antenna according to claim 1, wherein the power dividing network is a multi-stage Wilkinson power divider.

4. The multi-layered structure array antenna as claimed in claim 1, wherein the first metallized through hole is located on a side surface of the lower radiation patch, and a top of the first metallized through hole is connected to the lower radiation patch through a metal strip.

5. The multi-layered structure array antenna of claim 1, wherein the upper and lower radiation patches are squares with side length between 2.0mm and 5.0mm, and the hollow-out slot is a square with side length less than 10 mm.