CN202940807U - Butler matrix used for beam forming network - Google Patents
Butler matrix used for beam forming network Download PDFInfo
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- CN202940807U CN202940807U CN 201220400595 CN201220400595U CN202940807U CN 202940807 U CN202940807 U CN 202940807U CN 201220400595 CN201220400595 CN 201220400595 CN 201220400595 U CN201220400595 U CN 201220400595U CN 202940807 U CN202940807 U CN 202940807U
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Abstract
The utility model discloses a Butler matrix used for a beam forming network, which comprises four beam ports, four antenna array ports, four directional couplers and two phase shifters, wherein each of the beam ports and each of the antenna array ports are connected by a network formed by the directional couplers and the phase shifters. Furthermore, the Butler matrix is etched on a printed circuit board, the four directional couplers and the two phase shifters are all formed by microstrip transmission lines, the printed circuit board further comprises microstrip through-holes, the microstrip transmission lines are distributed on the upper and lower surfaces of the printed circuit board, the microstrip transmission lines on the upper and lower surfaces of the printed circuit board are connected through the microstrip through-holes, and the microstrip transmission lines have no coplanar cross point. The Butler matrix used for the beam forming network has the advantages of low standing waves, high isolation, small size, low cost, good consistency and the like.
Description
Technical field
The utility model relates to the radio network technique field, relates in particular to a kind of Butler matrix for Wave-packet shaping network.
Background technology
Beam forming is the combination of antenna technology and Digital Signal Processing, purpose is used for the phasing signal transmission or receives, it is the traditional antenna technology of classics, the array signal process technique that adopts antenna diversity reception was just arranged as far back as the sixties in last century, obtained great attention in the communication equipments such as electronic countermeasures, phased array radar, sonar.Based on the adaptive array interference nulling technology that digital beam forms, can improve the antijamming capability of radar system, be the key technology that the New Generation Military radar must be used.Location of communication system obtains sound field information by microphone array, uses beam forming and power spectrum estimation principle, and signal is processed, and determines the signal arrival bearing, thereby can carry out accurate pointing to information source.Only, due to one's early years semiconductor technology also be in micron order, so it does not perform to desirable state in commercial communication.
Development along with mobile communication business, number of users, type of service are more and more diversified, frequency resource has become a major issue of Mobile Communication Development, allow the signal trace user, can greatly improve band efficiency, therefore thereby the raising power system capacity has proposed to allow the wave beam of array antenna can move and be directed to the beam forming technique of predetermined direction.Not ground roll waveguide technology combination together of beam forming technique at present exists isolation low, and consistency is poor, and volume is excessive, is unfavorable for welding, the shortcomings such as high cost.
The utility model content
The purpose of this utility model is to propose a kind of Butler matrix for Wave-packet shaping network, comprise: four beam ports, four aerial array ports, four directional couplers and two phase shifters, wherein, described four beam ports comprise first to fourth beam port, described four aerial array ports comprise first to fourth aerial array port, described four directional couplers comprise first to fourth directional coupler, and described two phase shifters comprise the first to second phase shifter;
Described the first directional coupler first end, first wave beam port and the phase shifter first end of being connected connect in twos; First directional coupler the second end, Second Wave beam port and the 4th directional coupler first end connect in twos; The second directional coupler first end, the 3rd beam port and the 3rd directional coupler the second end connect in twos; Second directional coupler the second end, the 4th beam port and the first end of phase shifter of being connected connect in twos; The first end of the 3rd directional coupler, first day linear array port and the second end of phase shifter of being connected connect in twos; The second end of the 3rd directional coupler, second day linear array port and the directional coupler first end of being connected connect in twos; The first end of the 4th directional coupler, third antenna array port are connected the second end and are connected in twos with the first wave beam port; The second end of the 4th directional coupler, the 4th aerial array port and the second end of phase shifter of being connected connect in twos.
Further, described Butler matrix is etched on a printed circuit board, described four directional couplers and two phase shifters form by microstrip transmission line, also comprise little band through hole on described printed circuit board (PCB), described microstrip transmission line is distributed in two surfaces, described printed circuit board (PCB) up and down, the described microstrip transmission line on two surfaces, described printed circuit board (PCB) up and down comes conducting by little band through hole, and described microstrip transmission line does not have coplanar crosspoint.
Further, described first to fourth beam port and described first to fourth aerial array port are positioned at the upper surface of described printed circuit board (PCB).
Further, described the first directional coupler, described the 4th directional coupler and described the first phase shifter are positioned at the upper surface of described printed circuit board (PCB).
Further, a plurality of T fonts are arranged on described microstrip transmission line, the amplitude that the length by regulating described T font and width are realized output port and the fine setting of phase place.
Further, there is erosion hollow joint gap on described microstrip transmission line both sides, to apply copper face except described microstrip transmission line and described erosion hollow joint gap on described printed circuit board (PCB), described deposited copper face ground connection, a plurality of metallization via holes are arranged on described printed circuit board (PCB), form the ground structure of upper and lower surface, consisted of co-planar waveguide.
Further, described four beam ports and described four aerial array ports are at the same face of described printed circuit board (PCB), and described four beam ports are at same row, and described four aerial array ports are at same row.
Further, described four directional couplers are the 3dB directional coupler, and described two phase shifters are 45 ° of snakelike micro belt shifting phases.
Further, there is erosion hollow joint gap described microstrip transmission line both sides, be deposited copper face on described printed circuit board (PCB) except described microstrip transmission line, described microstrip line through hole and described erosion hollow joint gap, a plurality of metallization via holes are arranged on described deposited copper face, form the ground structure of upper and lower surface, described microstrip transmission line and described deposited copper face consist of co-planar waveguide.
Further, described printed circuit board (PCB) is the printed circuit board of two-sided FR4, and dielectric constant is 4.3, and thickness is 0.4mm.
Useful technique effect of the present utility model is by adopting two-sided little band plate to print, make described Butler matrix volume for Wave-packet shaping network little, and technique is simple, and is easy to assembly, and return loss is low, and cost is low, and isolation is high.
Description of drawings
Figure 1 shows that the perspective view of the described Butler matrix of the utility model specific embodiment;
Figure 2 shows that the front elevation of the described Butler matrix of the utility model specific embodiment;
Figure 3 shows that the back view of the described Butler matrix of the utility model specific embodiment.
Wherein, description of reference numerals is as follows:
1 is front-side ground plane;
2 is back-side ground plane;
31 is the first directional coupler;
32 is the second directional coupler;
33 is the 3rd directional coupler;
34 is the 4th directional coupler;
41 is the first phase shifter;
42 is the second phase shifter;
5 is the T font on microstrip transmission line;
6 is through hole;
7 is plated-through hole;
8 is supported hole;
9 are erosion hollow joint gap;
Port one is the first wave beam port;
Port 2 is the Second Wave beam port;
Port 3 is the 3rd beam port;
Port 4 is the 4th beam port;
Port 7 is second day linear array port;
Embodiment
Described 4 * 4Butler the matrix for Wave-packet shaping network of the present embodiment is etched in a two-sided printed circuit board (PCB), makes based on microstrip line and co-planar waveguide principle.
Microstrip line is compared with metal waveguide for be fit to making the planar structure transmission line of microwave integrated circuit, and its volume is little, lightweight, service band is wide, reliability is high and low cost of manufacture etc., but loss is slightly large, and power capacity is little.Generally use the thin-film technique manufacturing, dielectric substrate is selected the material that dielectric constant is high, lossy microwave is low.Conductor should have that conductance is high, good stability, with the characteristics such as the adhesiveness of substrate is strong.
The present embodiment adopts the printed circuit board of two-sided FR4, and dielectric constant is 4.3, and thickness is 0.4mm, and applying copper face thickness is 35um, and except metallic vias and input/output port weld, the surface scribbles the anti-oxidation of green oil.
In the present embodiment, microstrip transmission line is distributed in two surfaces up and down of printed circuit board (PCB), comes conducting levels microstrip line by through hole.Described microstrip line does not have coplanar crosspoint, thereby is conducive to improve the degree of coupling, has facilitated input/output port can be arranged in the same face yet, convenient welding.All there is erosion hollow joint gap the microstrip transmission line both sides, microstrip transmission line is the center conduction band, be deposited copper face on described printed circuit board (PCB) except described microstrip transmission line, described microstrip line through hole and described erosion hollow joint gap, a plurality of metallization via holes are arranged on described deposited copper face, connect the levels ground plane and form earth strip, described microstrip transmission line and described deposited copper face consist of co-planar waveguide jointly.
Co-planar waveguide also claims Coplanar stripline, transmission be the TEM ripple, there is no cut-off frequency.Because center conductor and conductor plate are positioned at same plane, therefore, be installed in parallel components and parts very convenient on co-planar waveguide, can be made into transmission line and element all at the monolithic integrated microwave circuit of the same side with it.There are many advantages in other plane microwave transmission lines such as relatively conventional microstrip transmission line, the line of rabbet joint, for example are easy to connect with port devices, and parasitic parameter is little, are beneficial to improve circuit integration density, good dispersion characteristics etc.
Figure 1 shows that the perspective view of the described Butler matrix of the utility model specific embodiment, Figure 2 shows that the front elevation of the described Butler matrix of the utility model specific embodiment, Figure 3 shows that the back view of the described Butler matrix of the utility model specific embodiment one.Fig. 1 description of reference numerals is as follows, and port one is the first wave beam port; Port 2 is the Second Wave beam port; Port 3 is the 3rd beam port; Port 4 is the 4th beam port; Port 5 is first day linear array port; Port 6 is third antenna array port; Port 7 is second day linear array port; Port 8 is the 4th aerial array port.Fig. 2 description of reference numerals is as follows: 1 is front-side ground plane; 31 is the first directional coupler; 32 is the second directional coupler; 33 is the 3rd directional coupler; 34 is the 4th directional coupler; 41 is the first phase shifter; 5 is the T font on microstrip transmission line; 6 is through hole; 7 is plated-through hole; 8 is supported hole, and 9 are erosion hollow joint gap.Fig. 3 description of reference numerals is as follows: 2 is back-side ground plane; 42 is the second phase shifter; 32 is the second directional coupler; 33 is the 3rd directional coupler.
As Fig. 1, Fig. 2 and shown in Figure 3, described 4 * 4Butler the matrix of the present embodiment mainly comprises four beam ports, four aerial array ports, microstrip line and microstrip line through holes, described beam port is used for the received RF input signal, described aerial array port is used for exporting corresponding signal to aerial array, and described microstrip line forms four directional couplers 31,32,33 and 34 and two phase shifters 41 and 42.The 3dB directional coupler can be realized constant amplitude output and 90 ° of phase differences of straight-through end and coupled end, it is simple in structure, be widely used, 45 ° of snakelike micro belt shifting phases can be realized 45 ° of poor conversion of different port phase place, described two phase shifters can adopt 45 ° of snakelike phase shifters, and described four directional couplers can adopt the 3dB directional coupler.
Have described microstrip transmission line one determining deviation on printed circuit board (PCB) erosion hollow joint gap 9 is arranged, periphery is to apply copper face, described deposited copper face ground connection, upper surface is front-side ground plane 1, lower surface is back-side ground plane 2, and front-side ground plane 1 and back-side ground plane are communicated with by plated-through hole 7, forms earth strip, and microstrip transmission line becomes the center conduction band, has so just consisted of co-planar waveguide.Also have supported hole 9 on dielectric-slab, supported hole is also the metallization via hole, is used for fixing described printed circuit board (PCB).
For convenient welding, described first to fourth beam port and described first to fourth aerial array port are positioned on the same face of described printed circuit board (PCB), and the present embodiment is positioned at upper surface.To avoid coplanar crosspoint as principle, described coupler, phase shifter and T connector etc. can be engraved in respectively on two surfaces, up and down, described in the present embodiment the first directional coupler, as described in the 4th directional coupler and as described in the first phase shifter be positioned at as described in the upper surface of printed circuit board (PCB).
The annexation of described four beam ports, four aerial array ports, four directional couplers and two phase shifters is as follows:
The first directional coupler 31 first ends, first wave beam port and phase shifter 41 first ends of being connected connect in twos; The first directional coupler 31 second ends, Second Wave beam port and the 4th directional coupler 34 first ends connect in twos; The second directional coupler 32 first ends, the 3rd beam port and the 3rd directional coupler 33 second ends connect in twos; The second directional coupler 32 second ends, the 4th beam port and the first end of phase shifter 42 of being connected connect in twos; The first end of the 3rd directional coupler 33, first day linear array port and the second end of phase shifter 41 of being connected connect in twos; The second end of the 3rd directional coupler 33, second day linear array port and the first end of directional coupler 32 of being connected connect in twos; The first end of the 4th directional coupler 34, third antenna array port are connected the second end and are connected in twos with the first wave beam port; The second end of the 4th directional coupler 34, the 4th aerial array port and the second end of phase shifter 42 of being connected connect in twos.
Also have a plurality of T shapes 5 on microstrip line, the width of described T shape head can be used to finely tune the amplitude of output port, the length of described T shape head can be used to finely tune phase place, by amplitude and the phase place of described T shape head in order to adjust output port, makes its amplitude that is adjusted into default output port and phase place.
Have a plurality of through holes 6 on printed circuit board (PCB), positive microstrip line and the microstrip line at the back side are communicated with by described through hole 6, and described through hole 6 is the metallization via hole, so just can avoid the coplanar crosspoint of microstrip line, are conducive to improve the degree of coupling.
The described Butler matrix structure of the present embodiment has four beam ports, be respectively: port one, port 2, port 3, port 4, four aerial array ports, be respectively: port 5, port 6, port 7, port 8, four beam ports are at same row, four aerial array ports are at same row, and beam port is used for the received RF input signal, and the aerial array port is used for exporting corresponding signal to aerial array.
The phase difference number of degrees that following table produces between aerial array port 5, port 6, port 7, port 8 for each beam port of excitation:
| Port | Beam |
Beam port 2 | Beam port 3 | Beam port 4 |
| Differ | ?-45° | ?135° | ?-135° | ?45° |
As above shown in the table, if give beam port 1 excitation, can produce phase difference-45 ° at aerial array port 5, port 6, port 7,8 of ports; If give beam port 2 excitations, can produce 135 ° of phase differences at aerial array port 5, port 6, port 7,8 of ports; If give beam port 3 excitations, can produce phase difference-135 ° at aerial array port 5, port 6, port 7,8 of ports; If give beam port 4 excitations, can produce 45 ° of phase differences at aerial array port 5, port 6, port 7,8 of ports, the amplitude of output port is constant amplitude.
The Butler matrix that is used for Wave-packet shaping network that the utility model proposes is made based on microstrip line and co-planar waveguide principle, and microstrip transmission line is distributed in its two surfaces, up and down, apart from microstrip transmission line one determining deviation, erosion hollow joint gap is arranged, periphery is to apply the copper ground plane, and a plurality of metallization via holes are arranged on printed circuit board (PCB), forms the ground structure of upper and lower surface, consisted of co-planar waveguide, have low standing wave, high isolation, volume is little, cost is low, the advantages such as high conformity.
The above is only preferred embodiment of the present utility model, and is in order to limit the utility model, not all within spirit of the present utility model and principle, any modification of doing, is equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (10)
1. a Butler matrix that is used for Wave-packet shaping network, is characterized in that, comprising:
Four beam ports, four aerial array ports, four directional couplers and two phase shifters, wherein, described four beam ports comprise first to fourth beam port, described four aerial array ports comprise first to fourth aerial array port, described four directional couplers comprise first to fourth directional coupler, and described two phase shifters comprise the first to second phase shifter;
Described the first directional coupler first end, first wave beam port and the phase shifter first end of being connected connect in twos; First directional coupler the second end, Second Wave beam port and the 4th directional coupler first end connect in twos; The second directional coupler first end, the 3rd beam port and the 3rd directional coupler the second end connect in twos; Second directional coupler the second end, the 4th beam port and the phase shifter first end of being connected connect in twos; The 3rd directional coupler first end, first day linear array port and phase shifter the second end of being connected connect in twos; The 3rd directional coupler the second end, second day linear array port and the directional coupler first end of being connected connect in twos; The 4th directional coupler first end, third antenna array port are connected end and are connected in twos with the first wave beam port; The 4th directional coupler the second end, the 4th aerial array port and phase shifter the second end of being connected connect in twos.
2. the Butler matrix for Wave-packet shaping network as claimed in claim 1, it is characterized in that, described Butler matrix is etched on a printed circuit board, described four directional couplers and two phase shifters form by microstrip transmission line, also comprise little band through hole on described printed circuit board (PCB), described microstrip transmission line is distributed in two surfaces, described printed circuit board (PCB) up and down, the described microstrip transmission line on two surfaces, described printed circuit board (PCB) up and down comes conducting by little band through hole, and described microstrip transmission line does not have coplanar crosspoint.
3. the Butler matrix for Wave-packet shaping network as claimed in claim 1 or 2, is characterized in that, described first to fourth beam port and described first to fourth aerial array port are positioned at the upper surface of described printed circuit board (PCB).
4. the Butler matrix for Wave-packet shaping network as claimed in claim 3, described the first directional coupler, described the 4th directional coupler and described the first phase shifter are positioned at the upper surface of described printed circuit board (PCB).
5. the Butler matrix for Wave-packet shaping network as claimed in claim 4, is characterized in that, a plurality of T fonts are arranged on described microstrip transmission line, the amplitude that the length by regulating described T font and width are realized output port and the fine setting of phase place.
6. the Butler matrix for Wave-packet shaping network as claimed in claim 5, it is characterized in that, there is erosion hollow joint gap on described microstrip transmission line both sides, to apply copper face except described microstrip transmission line and described erosion hollow joint gap on described printed circuit board (PCB), described deposited copper face ground connection, a plurality of metallization via holes are arranged on described printed circuit board (PCB), form the ground structure of upper and lower surface, consisted of co-planar waveguide.
7. the Butler matrix for Wave-packet shaping network as claimed in claim 6, it is characterized in that, described four beam ports and described four aerial array ports are at the same face of described printed circuit board (PCB), and described four beam ports are at same row, and described four aerial array ports are at same row.
8. the Butler matrix for Wave-packet shaping network as claimed in claim 7, is characterized in that, described four directional couplers are the 3dB directional coupler, and described two phase shifters are 45 ° of snakelike micro belt shifting phases.
9. the Butler matrix for Wave-packet shaping network as claimed in claim 8, it is characterized in that, there is erosion hollow joint gap described microstrip transmission line both sides, be deposited copper face on described printed circuit board (PCB) except described microstrip transmission line, described microstrip line through hole and described erosion hollow joint gap, a plurality of metallization via holes are arranged on described deposited copper face, form the ground structure of upper and lower surface, described microstrip transmission line and described deposited copper face consist of co-planar waveguide.
10. the Butler matrix for Wave-packet shaping network as claimed in claim 9, is characterized in that, described printed circuit board (PCB) is the printed circuit board of two-sided FR4, and dielectric constant is 4.3, and thickness is 0.4mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220400595 CN202940807U (en) | 2012-08-13 | 2012-08-13 | Butler matrix used for beam forming network |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220400595 CN202940807U (en) | 2012-08-13 | 2012-08-13 | Butler matrix used for beam forming network |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102832741A (en) * | 2012-09-12 | 2012-12-19 | 宁波世通汽车零部件有限公司 | Motor and play detection device of output shaft thereof |
| CN103515700A (en) * | 2013-09-27 | 2014-01-15 | 北京邮电大学 | RFID antenna |
| CN103594802A (en) * | 2013-11-21 | 2014-02-19 | 天津中兴智联科技有限公司 | Butler matrix structure |
| WO2015089797A1 (en) * | 2013-12-19 | 2015-06-25 | 华为技术有限公司 | Directional coupler and antenna |
| CN108448221A (en) * | 2018-03-09 | 2018-08-24 | 电子科技大学 | A kind of broad band multilayer micro-strip Butler Wave-packet shaping network matrix arrangements |
| US10069215B2 (en) | 2014-05-14 | 2018-09-04 | Huawei Technologies Co., Ltd. | Multi-beam antenna system and phase adjustment method for multi-beam antenna system, and dual-polarized antenna system |
| CN109167172A (en) * | 2018-07-20 | 2019-01-08 | 电子科技大学 | A kind of broadband Butler matrix based on microstrip structure |
| CN109378593A (en) * | 2018-11-15 | 2019-02-22 | 华南理工大学 | A kind of broadband butler matrix feeding network based on frequency selectivity |
| CN111180908A (en) * | 2020-01-06 | 2020-05-19 | 电子科技大学 | Butler matrix of miniaturized SMD structure |
| CN111430937A (en) * | 2020-04-27 | 2020-07-17 | 清华大学 | Integrated multi-beam feed network based on Butler matrix |
| TWI838855B (en) | 2022-09-08 | 2024-04-11 | 啓碁科技股份有限公司 | Transmission device with phase adjustment function |
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- 2012-08-13 CN CN 201220400595 patent/CN202940807U/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102832741B (en) * | 2012-09-12 | 2015-01-21 | 宁波世通汽车零部件有限公司 | Motor and play detection device of output shaft thereof |
| CN102832741A (en) * | 2012-09-12 | 2012-12-19 | 宁波世通汽车零部件有限公司 | Motor and play detection device of output shaft thereof |
| CN103515700A (en) * | 2013-09-27 | 2014-01-15 | 北京邮电大学 | RFID antenna |
| CN103594802A (en) * | 2013-11-21 | 2014-02-19 | 天津中兴智联科技有限公司 | Butler matrix structure |
| CN103594802B (en) * | 2013-11-21 | 2015-11-18 | 天津中兴智联科技有限公司 | A kind of Butler matrix structure |
| WO2015089797A1 (en) * | 2013-12-19 | 2015-06-25 | 华为技术有限公司 | Directional coupler and antenna |
| US10069215B2 (en) | 2014-05-14 | 2018-09-04 | Huawei Technologies Co., Ltd. | Multi-beam antenna system and phase adjustment method for multi-beam antenna system, and dual-polarized antenna system |
| CN108448221A (en) * | 2018-03-09 | 2018-08-24 | 电子科技大学 | A kind of broad band multilayer micro-strip Butler Wave-packet shaping network matrix arrangements |
| CN108448221B (en) * | 2018-03-09 | 2020-12-29 | 电子科技大学 | Broadband multilayer microstrip Butler beam forming network matrix device |
| CN109167172A (en) * | 2018-07-20 | 2019-01-08 | 电子科技大学 | A kind of broadband Butler matrix based on microstrip structure |
| CN109378593A (en) * | 2018-11-15 | 2019-02-22 | 华南理工大学 | A kind of broadband butler matrix feeding network based on frequency selectivity |
| CN109378593B (en) * | 2018-11-15 | 2023-11-03 | 华南理工大学 | Broadband butler matrix feed network based on frequency selectivity |
| CN111180908A (en) * | 2020-01-06 | 2020-05-19 | 电子科技大学 | Butler matrix of miniaturized SMD structure |
| CN111430937A (en) * | 2020-04-27 | 2020-07-17 | 清华大学 | Integrated multi-beam feed network based on Butler matrix |
| TWI838855B (en) | 2022-09-08 | 2024-04-11 | 啓碁科技股份有限公司 | Transmission device with phase adjustment function |
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Owner name: GUANGDONG KENBOTONG TECHNOLOGY CO., LTD. Free format text: FORMER NAME: JIANBOTONG TELECOMMUNICATION INDUSTRIAL CO., LTD., FOSHAN CITY |
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Address after: 528031, Foshan City, Guangdong province Ji Hua Road West Chan Road, No. 2 Health Science Park Broadcom Patentee after: KENBOTONG TECHNOLOGY CO.,LTD. Address before: 528031, Foshan, Guangdong province Ji Hua Road West Chan Road, No. 2 health science and Technology Park, Foshan City Broadcom Telecommunications Industry Co., Ltd. Patentee before: FOSHAN KENBOTONG COMMUNICATION LTD. |
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| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 528031, Foshan City, Guangdong province Ji Hua Road West Chan Road, No. 2 Health Science Park Broadcom Patentee after: KENBOTONG TECHNOLOGY CO.,LTD. Address before: 528031, Foshan, Guangdong province Ji Hua Road West Chan Road, No. 2 health science and Technology Park, Foshan City Broadcom Telecommunications Industry Co., Ltd. Patentee before: KENBOTONG TECHNOLOGY CO.,LTD. |
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| CX01 | Expiry of patent term |
Granted publication date: 20130515 |
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| CX01 | Expiry of patent term |